CMOS Logic Circuit Design, 2002, John P. Uyemura
Chapter 2 Modern CMOS technology 1.Introduction. 2.CMOS process flow. 1 NE 343: Microfabrication and thin film technology Instructor: Bo Cui, ECE, University.
Sedra42021 AppA
Process Flow Steps Steps –Choose a substrate Add epitaxial layers if needed –Form n and p regions –Deposit contacts and local interconnects –Deposit.
Chapter 2 Modern CMOS technology 1.Introduction. 2.CMOS process flow (continued). 1 NE 343: Microfabrication and thin film technology Instructor: Bo Cui,
1 VLSI Fabrication Technology. Microelectronic Circuits - Fifth Edition Sedra/Smith2 Copyright 2004 by Oxford University Press, Inc. Figure A.1 Silicon.
Chapter 2 Modern CMOS technology