Chapter 6 Thermal Oxidation _ I Bo Cui
Chapter 2 Modern CMOS technology 1.Introduction. 2.CMOS process flow. 1 NE 343: Microfabrication and thin film technology Instructor: Bo Cui, ECE, University.
1.Introduction and application. 2.Dopant solid solubility and sheet resistance. 3.Microscopic view point: diffusion equations. 4.Physical basis for diffusion.
Extreme UV (EUV) lithography 1.Overview, why EUV lithography? 2.EUV source (hot and dense plasma). 3.Optics (reflection mirrors). 4.Mask (absorber on mirrors).
1 March 2007 NAEFS Upgrade Yuejian Zhu, Richard Wobus, Mozheng Wei, Bo Cui and Zoltan Toth Environmental Modeling Center NOAA/NWS/NCEP Acknowledgements:
Chapter 9 Thin film deposition 1.Introduction to thin film deposition. 2.Introduction to chemical vapor deposition (CVD). 3.Atmospheric Pressure Chemical.
1.Introduction and application. 2.Ion implantation tools. 3.Dopant distribution. 4.Mask thickness and lateral distribution. 5.Effect of channeling. 6.Damage.
1.SiO 2 properties and applications. 2.Thermal oxidation basics. 3.Manufacturing methods and equipment. 4.Measurement methods. 5.Deal-grove model (linear.
Chapter 9 Thin Film Deposition _ I
Chapter 5 Lithography _ III
1.Introduction to etching. 2.Wet chemical etching: isotropic. 3.Anisotropic etching of crystalline Si. 4.Dry etching overview. 5.Plasma etching mechanism.
