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GTK Cooling Summary of frame and cooling plate Shear tests Alessandro Mapelli Michel Morel Jerome Noel Georg Nüßle Paolo Petagna Giulia Romagnoli GigaTracKer.
Flip Chip Technology Lane Ryan. Packaging Options This presentation is going to focus on the advantages of the flip-chip method compared to wire bonding.
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IWLPC October 13-15, 2015 Dr.Kai Liu STATS ChipPAC.