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SUSS LabSpin6 LabSpin8 THE SOLUTION FOR LABORATORY COAT AND DEVELOP PROCESSES MANUAL SPIN COATERDEVELOPER 2 SUSS LabSpin6 LabSpin8 MANUAL SPIN COATERDEVELOPER SUSS MicroTec‘s…
SUSS MicroTec Spray Coating Markets MEMS Source: CIS Source: Süss MicroOptics MOEMS Advanced Packaging Compound Semiconductor Source: Intel Types of Resist Clariant AZ1500,…
Precision Wafer to Wafer Packaging Using Eutectic Metal Bonding Eutectic metal bonding of wafers is used in advanced MEMS packaging and 3D integration technologies. A unique…
1. ADVANCED MASK ALIGNER LITHOGRAPHY (AMALITH)Photolithography Enhancement for SUSS Mask AlignersSÜSS MicroTec AG, www.suss.comSUSS MicroOptics SA, www.suss.ch, [email protected]…
SUSS MicroTec Company PresentationThis presentation contains forward-looking statements relating to the business, financial performance and earnings of SUSS MicroTec SE and
IMPRINT LITHOGRAPHY MICRO- AND NANO-IMPRINT SOLUTIONS FOR SUSS MASK ALIGNERS SCIL Substrate Conformal Imprint Lithography UV-NIL UV Nanoimprint Lithography SMILE SUSS MicroTec…
SUSS TECHNOLOGY FORUM 2019 ADVANCED PHOTOMASK SOLUTIONS TOWARD 1410 NM Date: Wednesday, March 20th, 2019, 8:30am – 12:30pm Location: Jumeirah Himalayas Hotel next to Semicon…
SUSS MICROTEC INVESTOR PRESENTATION November 2018 DISCLAIMER This presentation contains forward-looking statements relating to the business financial performance and earnings…
SUSS SOLUTIONS FOR LARGE FORMAT PATTERNING UV Scanning Lithography and Excimer Laser Ablation SUSS MicroTec Kevin Yang Habib Hichri Ralph Zoberbier SÜSS MicroTec Photonic…
SUSS report ISSUE 012013 THE CUSTOMER MAGAZINE OF SUSS MICROTEC MPT Coating Service Now Available from Compugraphics Jena GmbH 3D Topography Mask Aligner Lithography Simulation…
SUSS MJB4 VERSATILE SYSTEM FOR RD APPLICATIONS AND LOW-VOLUME PRODUCTION MANUAL MASK ALIGNER 2 HIGHLIGHTS + Fast and highly accurate alignment with SUSS singlefield or splitfield…
SuSS report ISSUE 02/2012 ThE cUSTomEr magazInE of SUSS mIcroTEc LED Wafer Level Packaging – Motivation, Challenges and Solutions Ordered Arrays of Nanoporous Gold Nanoparticles…
- SUSS MicroTec confidential - MEMS PACKAGING – INFINITE VARIETY OF BONDING APPLICATION S Margarete Zoberbier, Product Manager Bonder Chemnitzer Seminar SYSTEMS INTEGRATION…
Reliability of Ultra-fine Line Multi-Redistribution Layers Enabled by Excimer Laser Dual Damascene Process for Wafer and Panel Level Packaging Dr. Habib Hichri Applications…
SUSS MicroTec SE Garching Securities Identification No. A1K023 ISIN: DE000A1K0235 We hereby invite our shareholders to the Ordinary Shareholders’ Meeting to take place…
Claudio Zanelli(1)†, Dushyanth Giridhar(1), Manish Keswani(2), Nagaya Okada(3), Jyhwei Hsu(4), Petrie Yam(1) (1)Onda Corporation, (2)University of Arizona, (3)Honda Electronics,…
- SUSS MicroTec confidential - MEMS PACKAGING – INFINITE VARIETY OF BONDING APPLICATIONS Margarete Zoberbier Product Manager Bonder Chemnitzer Seminar SYSTEMS INTEGRATION…
Company Presentation February 2011 Company Presentation May 2011 1 Disclaimer This presentation contains forward-looking statements relating to the business, financial performance…
SUSS MICROTEC INVESTOR PRESENTATION May 2012 DISCLAIMER 2 This presentation contains forward-looking statements relating to the business, financial performance and earnings…
SUSS MICROTEC INVESTOR PRESENTATION November 2018 DISCLAIMER This presentation contains forward-looking statements relating to the business financial performance and earnings…