PMEG2020EPK - NexperiaPMEG2020EPK crVSrwlm9k:kC382k(nnwlPiEbwrbrwMrf Nexperia PMEG2020EPK 20 V, 2 A...

PMEG2020EPK20 V, 2 A low VF MEGA Schottky barrier rectifier10 February 2014 Product data sheet

1. General descriptionPlanar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier withan integrated guard ring for stress protection, encapsulated in a leadless ultra smallDFN1608D-2 (SOD1608) Surface-Mounted Device (SMD) plastic package with visibleand solderable side pads.

2. Features and benefits• Average forward current: IF(AV) ≤ 2 A• Reverse voltage: VR ≤ 20 V• Low forward voltage VF ≤ 450 mV• Low reverse current• AEC-Q101 qualified• Solderable side pads• Package height typ. 0.37 mm• Ultra small and leadless SMD plastic package

3. Applications• Low voltage rectification• High efficiency DC-to-DC conversion• Switch mode power supply• LED backlight for mobile application• Low power consumption applications• Ultra high-speed switching• Reverse polarity protection

4. Quick reference dataTable 1. Quick reference dataSymbol Parameter Conditions Min Typ Max Unit

δ < 0.5; f = 20 kHz; Tsp ≤ 130 °C;square wave

- - 2 AIF(AV) average forwardcurrent

δ < 0.5; f = 20 kHz; Tamb ≤ 65 °C;square wave

[1] - - 2 A

VR reverse voltage Tj = 25 °C - - 20 V

VF forward voltage IF = 2 A; pulsed; tp ≤ 300 µs; δ ≤ 0.02;Tj = 25 °C

- 395 450 mV

© Nexperia B.V. 2017. All rights reserved

Nexperia PMEG2020EPK20 V, 2 A low VF MEGA Schottky barrier rectifier

PMEG2020EPK All information provided in this document is subject to legal disclaimers.

Product data sheet 10 February 2014 2 / 15

Symbol Parameter Conditions Min Typ Max Unit

IR reverse current VR = 10 V; Tj = 25 °C - 70 350 µA

Dynamic characteristics

trr reverse recovery time IR = 0.5 A; IF = 0.5 A; IR(meas) = 0.1 A;Tj = 25 °C

- 5 - ns

[1] Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint.

5. Pinning informationTable 2. Pinning informationPin Symbol Description Simplified outline Graphic symbol

1 K cathode[1]

2 A anode 1 2

Transparent top view

DFN1608D-2 (SOD1608)

sym001

1 2

[1] The marking bar indicates the cathode.

6. Ordering informationTable 3. Ordering information

PackageType number

Name Description Version

PMEG2020EPK DFN1608D-2 DFN1608D-2: leadless ultra small plastic package; 2 terminals SOD1608





7. MarkingTable 4. Marking codesType number Marking code

PMEG2020EPK 1110 0000

VENDOR CODE

MARKING CODE(EXAMPLE)

CATHODE BARREADING DIRECTION

READING DIRECTION

READING EXAMPLE:

01111011

006aac909

Fig. 1. SOD1608 binary marking code description





8. Limiting valuesTable 5. Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter Conditions Min Max Unit

VR reverse voltage Tj = 25 °C - 20 V

IF forward current Tsp ≤ 125 °C - 2.83 A

δ < 0.5; f = 20 kHz; Tsp ≤ 130 °C;square wave

- 2 AIF(AV) average forward current

δ < 0.5; f = 20 kHz; Tamb ≤ 65 °C;square wave

[1] - 2 A

IFRM repetitive peak forward current tp = 1 ms; δ = 0.25 - 4 A

IFSM non-repetitive peak forwardcurrent

tp = 8 ms; Tj(init) = 25 °C; square wave - 5 A

[2] - 415 mW

[3] - 895 mW

Ptot total power dissipation Tamb ≤ 25 °C

[1] - 1565 mW

Tj junction temperature - 150 °C

Tamb ambient temperature -55 150 °C

Tstg storage temperature -65 150 °C

[1] Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint.[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.

9. Thermal characteristicsTable 6. Thermal characteristicsSymbol Parameter Conditions Min Typ Max Unit

[1][2] - - 300 K/W

[1][3] - - 140 K/W

Rth(j-a) thermal resistancefrom junction toambient

in free air

[1][4] - - 80 K/W

Rth(j-sp) thermal resistancefrom junction to solderpoint

[5] - - 20 K/W

[1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reversepower losses PR are a significant part of the total power losses.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.[4] Device mounted on a ceramic PCB, Al2O3, standard footprint.[5] Soldering point of cathode tab.





006aad023

tp (s)10-3 102 10310110-2 10-1

102

103

Zth(j-a)(K/W)

10

duty cycle =1

0.750.5

0.330.25

0.2

0.1

0.02

0.010

0.05

FR4 PCB, standard footprint

Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values006aad024

tp (s)10-3 102 10310110-2 10-1

102

103

Zth(j-a)(K/W)

10

duty cycle =1

0.750.5

0.330.25

0.20.1

0.020.010

0.05

FR4 PCB, mounting pad for cathode 1 cm2

Fig. 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values





006aad025

tp (s)10-3 102 10310110-2 10-1

102

Zth(j-a)(K/W)

10

duty cycle =1

0.75

0.5

0.330.25

0.20.1

0.020.010

0.05

Ceramic PCB, Al2O3, standard footprint

Fig. 4. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

10. CharacteristicsTable 7. CharacteristicsSymbol Parameter Conditions Min Typ Max Unit

IF = 100 mA; pulsed; tp ≤ 300 µs;δ ≤ 0.02; Tj = 25 °C

- 230 260 mV

IF = 500 mA; pulsed; tp ≤ 300 µs;δ ≤ 0.02; Tj = 25 °C

- 290 330 mV

IF = 1 A; pulsed; tp ≤ 300 µs; δ ≤ 0.02;Tj = 25 °C

- 330 380 mV

VF forward voltage

IF = 2 A; pulsed; tp ≤ 300 µs; δ ≤ 0.02;Tj = 25 °C

- 395 450 mV

VR = 10 V; Tj = 25 °C - 70 350 µAIR reverse current

VR = 20 V; Tj = 25 °C - 220 900 µA

VR = 1 V; f = 1 MHz; Tj = 25 °C - 105 120 pFCd diode capacitance

VR = 10 V; f = 1 MHz; Tj = 25 °C - 40 50 pF

Dynamic characteristics

trr reverse recovery time IF = 0.5 A; IR = 0.5 A; IR(meas) = 0.1 A;Tj = 25 °C

- 5 - ns

VFRM peak forward recoveryvoltage

IF = 0.5 A; dIF/dt = 20 A/µs; Tj = 25 °C - 320 - mV





006aad026

VF (V)0.0 0.60.40.2

10-2

10-3

1

10-1

10IF(A)

10-4

(1)

(2)

(3) (4) (5)

(1) Tj = 150 °C(2) Tj = 125 °C(3) Tj = 85 °C(4) Tj = 25 °C(5) Tj = −40 °C

Fig. 5. Forward current as a function of forwardvoltage; typical values

006aad02710-1

10-2

10-3

10-4

10-5

10-6

10-7

IR(A)

10-8

VR (V)0 20155 10

(1)

(2)

(3)

(4)

(1) Tj = 125 °C(2) Tj = 85 °C(3) Tj = 25 °C(4) Tj = −40 °C

Fig. 6. Reverse current as a function of reversevoltage; typical values

VR (V)0 20155 10

006aad028

100

50

150

200

Cd(pF)

0

f = 1 MHz; Tamb = 25 °C

Fig. 7. Diode capacitance as a function of reversevoltage; typical values

006aad072

IF(AV) (A)0 321

0.4

0.8

1.2

PF(AV)(W)

0

(1)

(2)

(3)

(4)

Tj = 150 °C(1) δ = 0.1(2) δ = 0.2(3) δ = 0.5(4) δ = 1

Fig. 8. Average forward power dissipation as afunction of average forward current; typicalvalues





VR (V)0 20155 10

006aad030

0.50

0.75

0.25

1.00

1.25PR(AV)

(W)

0.00

(1)

(2)(3)

(4)

Tj = 125 °C(1) δ = 1(2) δ = 0.9(3) δ = 0.8(4) δ = 0.5

Fig. 9. Average reverse power dissipation as afunction of reverse voltage; typical values

Tamb (°C)0 50 100 150 1751257525

006aad073

1

2

3

IF(AV)(A)

0

(1)

(2)

(3)

(4)

FR4 PCB, standard footprintTj = 150 °C(1) δ = 1 (DC)(2) δ = 0.5; f = 20 kHz(3) δ = 0.2; f = 20 kHz(4) δ = 0.1; f = 20 kHz

Fig. 10. Average forward current as a function ofambient temperature; typical values

Tamb (°C)0 50 100 150 1751257525

006aad074

1

2

3

IF(AV)(A)

0

(1)

(2)

(3)

(4)

FR4 PCB, mounting pad for cathode 1 cm2

Tj = 150 °C(1) δ = 1 (DC)(2) δ = 0.5; f = 20 kHz(3) δ = 0.2; f = 20 kHz(4) δ = 0.1; f = 20 kHz


Tamb (°C)0 50 100 150 1751257525

006aad075

1

2

3

IF(AV)(A)

0

(1)

(2)

(3)

(4)

Ceramic PCB, Al2O3, standard footprintTj = 150 °C(1) δ = 1 (DC)(2) δ = 0.5; f = 20 kHz(3) δ = 0.2; f = 20 kHz(4) δ = 0.1; f = 20 kHz






Tsp (°C)0 50 100 150 1751257525

006aad076

1

2

3

IF(AV)(A)

0

(1)

(2)

(3)

(4)

Tj = 150 °C(1) δ = 1 (DC)(2) δ = 0.5; f = 20 kHz(3) δ = 0.2; f = 20 kHz(4) δ = 0.1; f = 20 kHz

Fig. 13. Average forward current as a function of solder point temperature; typical values

11. Test information

time

IF

IR

trr

IR(meas)

006aad022

Fig. 14. Reverse recovery definition





001aab912

time

time

VFRM

VF

IF

VF

Fig. 15. Forward recovery definition

tptcy

P

t006aac658

duty cycle δ =

tp

tcy

Fig. 16. Duty cycle definition

The current ratings for the typical waveforms are calculated according to the equations:IF(AV) = IM × δ with IM defined as peak current, IRMS = IF(AV) at DC, and IRMS = IM × √δ withIRMS defined as RMS current.

11.1 Quality informationThis product has been qualified in accordance with the Automotive Electronics Council(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and issuitable for use in automotive applications.





12. Package outline

Dimensions in mm

1.651.55

0.04

0.850.75

0.750.67

0.400.34

0.800.72

0.400.32

11-11-21

1

2

Fig. 17. Package outline DFN1608D-2 (SOD1608)

13. Soldering

0.9 0.70.8

1.15

1.05

0.95

1.9

1.8

0.1

0.2

1 2

2.0

0.75

0.65

0.55

0.90.7 0.8

solder land

solder resist

solder land plus solder paste

solder paste deposit

Dimensions in mm

Footprint information for reflow soldering of DFN1608D-2 package SOD1608

sod1608_fr

Fig. 18. Reflow soldering footprint for DFN1608D-2 (SOD1608)





14. Revision historyTable 8. Revision historyData sheet ID Release date Data sheet status Change notice Supersedes

PMEG2020EPK v.2 20140210 Product data sheet - PMEG2020EPK v.1

Modifications: Marking code corrected.

PMEG2020EPK v.1 20120425 Product data sheet - -





15. Legal information

15.1 Data sheet statusDocumentstatus [1][2]

Productstatus [3]

Definition

Objective[short] datasheet

Development This document contains data fromthe objective specification for productdevelopment.

Preliminary[short] datasheet

Qualification This document contains data from thepreliminary specification.

Product[short] datasheet

Production This document contains the productspecification.

[1] Please consult the most recently issued document before initiating orcompleting a design.

[2] The term 'short data sheet' is explained in section "Definitions".[3] The product status of device(s) described in this document may have

changed since this document was published and may differ in case ofmultiple devices. The latest product status information is available onthe Internet at URL http://www.nexperia.com.

15.2 DefinitionsPreview — The document is a preview version only. The document is stillsubject to formal approval, which may result in modifications or additions.Nexperia does not give any representations or warranties as tothe accuracy or completeness of information included herein and shall haveno liability for the consequences of use of such information.

Draft — The document is a draft version only. The content is still underinternal review and subject to formal approval, which may result inmodifications or additions. Nexperia does not give anyrepresentations or warranties as to the accuracy or completeness ofinformation included herein and shall have no liability for the consequencesof use of such information.

Short data sheet — A short data sheet is an extract from a full data sheetwith the same product type number(s) and title. A short data sheet isintended for quick reference only and should not be relied upon to containdetailed and full information. For detailed and full information see therelevant full data sheet, which is available on request via the local Nexperiasales office. In case of any inconsistency or conflict with theshort data sheet, the full data sheet shall prevail.

Product specification — The information and data provided in a Productdata sheet shall define the specification of the product as agreed betweenNexperia and its customer, unless Nexperia andcustomer have explicitly agreed otherwise in writing. In no event however,shall an agreement be valid in which the Nexperia productis deemed to offer functions and qualities beyond those described in theProduct data sheet.

15.3 DisclaimersLimited warranty and liability — Information in this document is believedto be accurate and reliable. However, Nexperia does not giveany representations or warranties, expressed or implied, as to the accuracyor completeness of such information and shall have no liability for theconsequences of use of such information. Nexperia takes noresponsibility for the content in this document if provided by an informationsource outside of Nexperia.

In no event shall Nexperia be liable for any indirect, incidental,punitive, special or consequential damages (including - without limitation -lost profits, lost savings, business interruption, costs related to the removalor replacement of any products or rework charges) whether or not suchdamages are based on tort (including negligence), warranty, breach ofcontract or any other legal theory.

Notwithstanding any damages that customer might incur for any reasonwhatsoever, Nexperia’s aggregate and cumulative liability towardscustomer for the products described herein shall be limited in accordancewith the Terms and conditions of commercial sale of Nexperia.

Right to make changes — Nexperia reserves the right tomake changes to information published in this document, including withoutlimitation specifications and product descriptions, at any time and withoutnotice. This document supersedes and replaces all information supplied priorto the publication hereof.

Suitability for use in automotive applications — This Nexperiaproduct has been qualified for use in automotiveapplications. Unless otherwise agreed in writing, the product is not designed,authorized or warranted to be suitable for use in life support, life-critical orsafety-critical systems or equipment, nor in applications where failure ormalfunction of a Nexperia product can reasonably be expectedto result in personal injury, death or severe property or environmentaldamage. Nexperia and its suppliers accept no liability forinclusion and/or use of Nexperia products in such equipment orapplications and therefore such inclusion and/or use is at the customer's ownrisk.

Quick reference data — The Quick reference data is an extract of theproduct data given in the Limiting values and Characteristics sections of thisdocument, and as such is not complete, exhaustive or legally binding.

Applications — Applications that are described herein for any of theseproducts are for illustrative purposes only. Nexperia makes norepresentation or warranty that such applications will be suitable for thespecified use without further testing or modification.

Customers are responsible for the design and operation of theirapplications and products using Nexperia products, and Nexperiaaccepts no liability for any assistance with applications orcustomer product design. It is customer’s sole responsibility to determinewhether the Nexperia product is suitable and fit for thecustomer’s applications and products planned, as well as for the plannedapplication and use of customer’s third party customer(s). Customers shouldprovide appropriate design and operating safeguards to minimize the risksassociated with their applications and products.

Nexperia does not accept any liability related to any default,damage, costs or problem which is based on any weakness or defaultin the customer’s applications or products, or the application or use bycustomer’s third party customer(s). Customer is responsible for doing allnecessary testing for the customer’s applications and products using Nexperiaproducts in order to avoid a default of the applicationsand the products or of the application or use by customer’s third partycustomer(s). Nexperia does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined inthe Absolute Maximum Ratings System of IEC 60134) will cause permanentdamage to the device. Limiting values are stress ratings only and (proper)operation of the device at these or any other conditions above thosegiven in the Recommended operating conditions section (if present) or theCharacteristics sections of this document is not warranted. Constant orrepeated exposure to limiting values will permanently and irreversibly affectthe quality and reliability of the device.

Terms and conditions of commercial sale — Nexperiaproducts are sold subject to the general terms and conditions of commercialsale, as published at http://www.nexperia.com/profile/terms, unless otherwiseagreed in a valid written individual agreement. In case an individualagreement is concluded only the terms and conditions of the respectiveagreement shall apply. Nexperia hereby expressly objects toapplying the customer’s general terms and conditions with regard to thepurchase of Nexperia products by customer.

http://www.nexperia.com/profile/terms





No offer to sell or license — Nothing in this document may be interpretedor construed as an offer to sell products that is open for acceptance or thegrant, conveyance or implication of any license under any copyrights, patentsor other industrial or intellectual property rights.

Export control — This document as well as the item(s) described hereinmay be subject to export control regulations. Export might require a priorauthorization from competent authorities.

Translations — A non-English (translated) version of a document is forreference only. The English version shall prevail in case of any discrepancybetween the translated and English versions.

15.4 TrademarksNotice: All referenced brands, product names, service names andtrademarks are the property of their respective owners.





16. Contents1 General description ............................................... 12 Features and benefits ............................................13 Applications ........................................................... 14 Quick reference data ............................................. 15 Pinning information ...............................................26 Ordering information .............................................27 Marking ................................................................... 38 Limiting values .......................................................49 Thermal characteristics .........................................410 Characteristics .......................................................611 Test information ..................................................... 911.1 Quality information ............................................. 1012 Package outline ................................................... 1113 Soldering .............................................................. 1114 Revision history ...................................................1215 Legal information .................................................1315.1 Data sheet status ............................................... 1315.2 Definitions ...........................................................1315.3 Disclaimers .........................................................1315.4 Trademarks ........................................................ 14

© Nexperia B.V. 2017. All rights reservedFor more information, please visit: http://www.nexperia.comFor sales office addresses, please send an email to: [email protected] Date of release: 10 February 2014

1. General description2. Features and benefits3. Applications4. Quick reference data5. Pinning information6. Ordering information7. Marking8. Limiting values9. Thermal characteristics10. Characteristics11. Test information12. Package outline13. Soldering14. Revision history15. Legal information

PMEG2020EPK - NexperiaPMEG2020EPK crVSrwlm9k:kC382k(nnwlPiEbwrbrwMrf Nexperia PMEG2020EPK 20 V, 2 A...

Documents

Transcript of PMEG2020EPK - NexperiaPMEG2020EPK crVSrwlm9k:kC382k(nnwlPiEbwrbrwMrf Nexperia PMEG2020EPK 20 V, 2 A...