Soldering BasicsSoldering Basics
Developed byChandra Shekhar K
Overview Introduction
Definition Equipment
Procedure Preparation Execution Finishing
Specific Techniques Desoldering Tinning
Conclusion References
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Introduction – Definition Unite two base metal items Add filler metal (solder)
Typ. < 842°F (450°C) melting point
Metal flows via capillary action
Metal bonds via wetting action
Metallurgical joint exhibits Fair mechanical strength Excellent electrical
conductivity Watertightness
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Definition
Introduction – Common Usage Electronics Plumbing Stained glasswork Jewelry Orthodontics
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Common Usage
Introduction – Equipment Solder
Joint filler metal Metallic alloy
Sn/Pb Typ. 60/40 or 63/37 mix 60/40 melts @ 374°F (190° 60/40 melts @ 364°F (183°
Pb-free EU RoHS compliance Typ. Sn/Ag/Cu alloy Melts @ 422–433°F (217–223
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Equipment
°C)°C)
223°C)
Introduction – Equipment Flux
Removes base, filler metal oxides Aids wetting process Rosin-based flux Availability
Separate paste Flux-in-core solder
Primary fume component…
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Equipment
Removes base, filler metal oxides
Introduction – Equipment Soldering Iron
Solder melting heat source Power rating
Higher power ≠ higher tip temp Higher power heat larger joints 15-35W for electronic work
Various tips available Conical, chisel types Tip width ~ 70-90% contact width
Never use ‘cold heat’ irons on electronics!
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Equipment
Higher power ≠ higher tip tempheat larger joints
90% contact width
use ‘cold heat’ irons on
Introduction – Equipment Solder wick
Braided copper strands Flux impregnated Absorbs solder when heated Remove excess solder Desolder components
Solder stand + sponge Always return iron when
unused Always clean tip
Remove burnt flux Remove excess solder
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Equipment
Introduction – Equipment Heat sink
Protect heat sensitive components Clip between component body and
iron Substitution
alligator clips Hemostat
99% alcohol + brush Clean joint residual flux Purity important
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Equipment
Protect heat sensitive componentsClip between component body and
Procedure – Preparation Clean components
Remove dirt, grease, oxidation Causes unwettability Solder tend to bead up Component leads bright, shiny Solder pads bright copper color Fine steel wool, emery cloth
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Preparation
Remove dirt, grease, oxidation
Component leads bright, shinySolder pads bright copper colorFine steel wool, emery cloth
Procedure – Preparation Prepare iron
Plug in iron Dampen sponge Clean tip w/ sponge Apply solder to iron tip (tinning) Wipe excess solder Tip should be have silvery sheen
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Preparation
Apply solder to iron tip (tinning)
Tip should be have silvery sheen
Procedure – Execution Place component
Bend leads to fit hole pattern
Insert component through correct holes
Clinch leads slightly outward to hold in place
Attach heat sink if needed
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Execution
Procedure – Execution Solder component
Wipe iron w/ sponge Apply tiny solder amount
to iron tip Not solder to form joint Helps conduct heat
properly Touch tip side to BOTH
pad and lead Add bit more solder to
form heat bridge Wait for joint to be
heated (~1-2 sec)
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Execution
Procedure – Execution Solder component (cont.)
Feed small solder amount from opposite side
Molten solder should spread and fill joint
Move solder away first Move iron away quickly Return iron to stand
Entire process ≤ 5 sec Wait additional 3-5 sec for
joint cooling
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Execution
Procedure – Inspection Inspect joint quality
Good joint Shiny Bright Smooth Concave solder fillet Good wetting
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Inspection
Procedure – Inspection Inspect joint quality (cont.)
Bad joints Balled up or spiked Dull color Crystalline or grainy
looking Convex solder fillet Dewetted
Causes Dirty leads, pads Movement during cooling Overheating
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Inspection
Procedure – Finishing Return iron to stand Cut excess lead length Clean residual flux w/
alcohol Prevent future oxidation Prevent unwanted
electrical shorts
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Finishing
Techniques - Desoldering Repair bad joints Remove solder bridges
Excess solder connects two pads, leads Unwanted electrical connection formed
Remove components Both require old solder removal
Place solder wick against solder joint Heat wick opposite side from joint Solder should wick up braid Remove braid first Remove and return iron to stand
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Desoldering
Excess solder connects two pads, leadsUnwanted electrical connection formed
Place solder wick against solder jointHeat wick opposite side from joint
Remove and return iron to stand
Techniques – Wire Tinning Must tin wires before
soldering to components, board Attach heat sink just
below insulation Heat wire end Touch solder to wire
opposite iron tip Solder should wick up wire Too much heat damages
wire insulation
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Wire Tinning
Conclusion Introduction
Definition Equipment
Procedure Preparation Execution Finishing
Specific Techniques Desoldering Tinning
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References www.curiousinventor.com/guides/How_To_Solder www.aaroncake.net/electronics/solder.htm www.qsl.net/n9zia/solder.html www.solderinguide.com itp.nyu.edu/physcomp/Tutorials/SolderingAPerfBoard www.modchipworld.co.uk www.drmsmetals.com/data/electronic/erzin.html www.hsl.gov.uk/capabilities/rosin.htm www.sparkfun.com www.howardelectronics.com www.ladyada.net www.uelectronics.info us.geocities.com/steves_workshop www.theavenuestaineglass.com
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www.curiousinventor.com/guides/How_To_Solderwww.aaroncake.net/electronics/solder.htm
itp.nyu.edu/physcomp/Tutorials/SolderingAPerfBoard
www.drmsmetals.com/data/electronic/erzin.htmlwww.hsl.gov.uk/capabilities/rosin.htm
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