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Layout Recommendations for Selective Soldering Systems
ERSA VERSAFLOW , ECOSELECT , ECOCELL and SMARTFLOW
Page 2 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
General
The present document is based on long-term experience of users and shows standard situations. Special cases are not considered. Larger distances as
shown in this document are always possible.
The component clearances above and below the assembly depend on constructive circumstances and also on available options of the single systems
(e.g. center support, component hold down systems, etc.)
The clearances given in this document show the standard situation in the selective soldering systems. The dimensions in this document for Miniwave
soldering are based on a solder nozzle diameter of 6 mm. The range of Solder nozzles diameters is 4.5 – 32 mm
If there are any uncertainties please contact Ersa GmbH.
Page 3 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
Layout recommendation for selective soldering systems with Miniwave soldering units
Page 4 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
VERSAFLOW / ECOSELECT / ECOCELL / SMARTFLOW
Maximum PCB or Mask Dimension
Width
Direction of
transport
Length
If the leading edge of the PCB is chamfered, the chamfer should not exceed 1,5 x 45°
When the chamfer exceed 1,5x45° the stoppers in the machine have to be modified.This will affect the component clearance at the board edges.
The minimum and maximum dimensions of the assemblies, which can be processed in theappropriate selective soldering systems, are to be taken from the technical specification data sheets.The max. PCB or carrier thickness at the edge of the conveyor is 6mm.
Page 5 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
Keep out areas conveyor system VERSAFLOW / ECOSELECT / ECOCELL
Distance of the components to the edge of the PCB (top) side
Component height* max. 120 mm
Distance from edge min. 4 mm
Board/mask thickness max. 6 mm**
Direction of transport
BE height is measured from the bottom side of the board
Distance from edge
*
** at the conveyoredge sidesPlease see page 6
*There is a max. component height of 80 mm for SMARTFLOW and ECOCELL
Page 6 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
Keep out areas conveyor system VERSAFLOW / ECOSELECT / ECOCELL / SMARTFLOW
Distance of the components from the edge of the PCB on bottom side and their maximum height.
The max. height of the components
decreases in adjacent areas of the
selective soldering joints.
Please see page 15.
Max. component height 30 mm
Exceptions to 60 mm are possible.
Please contact Ersa in this case.
Scrap edge min. 3 mm5 mm are possible!
Please see the specification of the system
Page 7 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
Required keep out area around a selective solder joint and distance to adjacent SMT
components / smallest solder nozzles
The required keep out area around a selective solder joint depends on:
1. dimension of the solder nozzle
2. distance to adjacent SMT components
The decision of which solder nozzle to use, depends on the keep out area around the selective solder joint. For
designing new layouts the minimum dimensions of the solder nozzles, as shown in the following pages,
should always be considered !
The dimensions of the smallest solder nozzle is Ø 6mm.*
To these dimension of the outer nozzle body, a safety area for the flowing solder has to be added, to avoid wetting of
adjacent components or conveyor systems. The sketches on the following pages will show the different situations.
With the single solder nozzle of the Versaflow two possible soldering methods can be used:
1. single point soldering (single solder joint)
2. track soldering (connectors etc….)
* Smaller solder nozzles on request.
VERSAFLOW / ECOSELECT / ECOCELL / SMARTFLOW
Page 8 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
VERSAFLOW / ECOSELECT / ECOCELL / SMARTFLOW
Schematic diagram of soldering - and restricted areas
THT Solder joint
Area of soldering
Restricted area for non
selective solder joints
Area of soldering: Area which is wetted by the solder wave. It is quite possible that the real solder joint might be
smaller. The position of the solder joint within the area of soldering could be choosed. If possible a
symmetrical/central position should be strived.
Restricted area: Within this area there should be no adjacent components which are not going to be selective
soldered.
Important: Highest priority is the integrity of the restricted areas. If their size is less than specified, adjacent
SMD components may be spilled away during the selective soldering process.
Page 9 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
VERSAFLOW / ECOSELECT / ECOCELL / SMARTFLOW
Keep out area around a single solder joint / minimum condition
X1
X
Minimum diameter of the restricted area X1 is 5 mm.
Minimum distance X of the area of soldering to the next
SMD pads is 1.5 mm.
Target condition of the solder joint is the central position
within the area of soldering.
THT-Solder joint
Area of soldering
Restricted area for non
selective solder joints
For smaller distances, contact ERSA !
Page 10 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
VERSAFLOW / ECOSELECT / ECOCELL / SMARTFLOW
Explanation - Keep out area around a single solder joint / area of soldering
Minimum condition:
• diameter of the restricted area (yellow) is 5 mm
• diameter of the area of soldering (blue) calculated: 5 mm – (1.5+1.5 mm) = 2 mm
• Diameter of the pads (red) e.g. 1.2 mm
If the pad is smaller than the area of soldering then the solder joint can be positioned within the solder area freely.
The central position within the area of soldering is to be aimed.
Page 11 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
VERSAFLOW / ECOSELECT / ECOCELL / SMARTFLOW
Keep out area around single row – multiple pin solder joints / minimum conditions
Minimum width of restricted area X is 6 mm.
Length of restricted area Y depends on pin count of
the component.
Minimum distance X1 of the soldering area to the
next SMD pads is 2 mm.
Minimum distance Y1 of the soldering area to the
next SMD pads is 2 mm.
Target condition is the central position of the solder
joint within the area of soldering.
Restricted area for non
selective solder joints
Area of soldering
THT Solder joint
Page 12 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
VERSAFLOW / ECOSELECT / ECOCELL / SMARTFLOW
Keep out area around multi row – multiple pin solder joints / minimum conditions / pitch > 2 mm
Restricted area for non
selective solder joints
Area of soldering
THT Solder joint
Minimum width of restricted area X is 6 mm
Length of restricted area Y depends on pin count of the
component.
Minimum distance X1 of the soldering area to the next SMD
pads is 1 mm.
Minimum distance Y1 of the soldering area to the next SMD
pads is 3 mm, better is the half of the width of the soldering
area.
Target condition is the central position of the solder joint
within the area of soldering.For smaller distances, contact ERSA !
Page 13 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
VERSAFLOW / ECOSELECT / ECOCELL / SMARTFLOW
Keep out area around single row – multiple pin solder joints / minimum conditions / pitch > 2 mm
This page intentionally left blank
Page 14 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
VERSAFLOW / ECOSELECT / ECOCELL / SMARTFLOW
Keep out area around the conveyor edge / minimum conditions
All restricted areas may touch the conveyor clearance B.
Specification of the conveyor clearance B. see page 6
For smaller keep out areas please contact Ersa!
Page 15 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
VERSAFLOW / ECOSELECT / ECOCELL / SMARTFLOW
Component height at the solder side of the PCB around the selective solder joint
The maximum component height X on the solder side is 30 mm (page 6).
Directly around the solder nozzle and the nitrogen guide, the the component height X is limited
For dimension of the nitrogen guide see page 16
*If you need higher components on the solder side please contact ERSA!
Page 16 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
VERSAFLOW / ECOSELECT / ECOCELL / SMARTFLOW
Clearance around solder nozzle 6 - 14 mm
The clearance is rotation-symmetrical.
Page 17 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
VERSAFLOW / ECOSELECT / ECOCELL / SMARTFLOW
Thermal impact area around the solder nozzle
The exhausting nitrogen, which forms the protective atmosphere for the solder process, leads to a higher thermal
load of components in the area around the solder wave.
Depending on the mass of the components temperatures > 130°C can be easily reached.
Page 18 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
Layout recommendation for selective dip soldering with Multiwave soldering units
Page 19 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
Clearances for all dip soldering systems with multiwave
Maximum PCB or Mask Dimension
Width
Direction of
transport
Length
If the leading edge of the PCB is chamfered, the chamfer should not exceed 1,5 x 45°
When the chamfer exceed 1,5x45° the stoppers in the machine have to be modified.This will affect the component clearance at the board edges.
The minimum and maximum dimensions of the assemblies, which can be processed in theappropriate selective soldering systems, are to be taken from the technical specification data sheets.The max. PCB or carrier thickness at the edge of the conveyor is 6mm.
Page 20 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
Component height* max. 80 mm
Distance from edge min. 4 mm
Board/mask thickness** max. 6 mm
Direction of transport
Component height is measured from the bottom side of the board
Distance from edge
Clearances for all dip soldering systems with multiwave
*
Distance of the components to the edge of the PCB (top) side
** at the conveyoredge sidesPlease see page 21
Page 21 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
Max. component height 25 mm*
Clearances for all dip soldering systems with multiwave
* The max. component height on the solder side
of the PCB depend on several factors. Therefore
it can deviate from 25 mm.
In case of doubt please contact Ersa.
Distance of the components from the edge of the PCB on bottom side and their maximum height.
Scrap edge min. 3 mm5 mm are possible!
Please see the specification of the system
Page 22 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
General Requirements to Selective Solder Joints
Wire/Lead Clinches
It is important to pay close attention when bending (clinching) the wire/lead, that the bent portion of the lead
does NOT extend past the outer limit of the TH pad. If this, however, must be the case, please contact ERSA
for approval.
target condition contact Ersa
The clinch angle β is a non-critical factor for soldering
Clearances for all dip soldering systems with multiwave
Page 23 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
Required keep out area around a selective solder joint and distance to adjacent SMT
components / smallest solder nozzles
The required keep out area around a selective solder joint depends on:
1. dimension of the solder nozzle
2. distance to adjacent SMT components
The decision of which solder nozzle to use, depends on the keep out area around the selective solder joint. For
designing new layouts the minimum dimensions of the solder nozzles, as shown in the following pages,
should always be considered !
To these dimension of the outer nozzle body, a safety area for the flowing solder has to be added, to avoid wetting of
adjacent components or conveyor systems. The sketches on the following pages will show the different situations.
Clearances for all dip soldering systems with multiwave
Page 24 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
Schematic diagram of soldering - and restricted areas
THT Solder joint
Area of soldering
Restricted area for non
selective solder joints
Area of soldering: Area which is wetted by the solder wave. It is quite possible that the real solder joint might be
smaller. The position of the solder joint within the area of soldering could be choosed. If possible a
symmetrical/central position should be strived.
Restricted area: Within this area there should be no adjacent components which are not going to be selective
soldered.
Important: Highest priority is the integrity of the restricted areas. If their size is less than specified, adjacent
SMD components may be spilled away during the selective soldering process.
Clearances for all dip soldering systems with multiwave
Page 25 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
Keep out area around a single solder joint / minimum condition
THT Solder joint
Area of soldering
Restricted area for non
selective solder joints
For smaller distances, contact ERSA !
Minimum distance X of the area of soldering
to the next SMD pads is 3 mm.
Minimum diameter of the restricted area Y
is 10 mm.
The smallest solder area is Ø 4mm.
Target condition is the central position of the
solder joint within the area of soldering.
Clearances for all dip soldering systems with multiwave
Page 26 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
Explanation - Keep out area around a single solder joint / area of soldering
Minimum condition:
• Diameter of the restricted area (yellow) is 10 mm
• Diameter of the area of soldering (blue) calculated: 10 mm – (3+3 mm) = 4 mm
• Diameter of the pads (red) e.g. 1.5 mm
If the pad is smaller than the area of soldering, the solder joint can be positioned within the solder area freely. The
central position within the area of soldering is to be aimed.
Clearances for all dip soldering systems with multiwave
Page 27 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
Keep out area around multiple pin solder joints / minimum conditions
THT Solder joint
Area of soldering
Restricted area for non
selective solder joints
For smaller distances, contact ERSA !
The minimum size of the restricted area
X x Y is 10 x 10 mm².
The min. distance X1/Y1 of the area of soldering to adjacent
SMT pads is 3 mm
The smallest solder area is 4x4 mm². The position of the
solder joint within the area of soldering is not relevant.
With multiple row components the measure X is to be raised
by the grid measure.
The measure Y depend on the length of the connector.
The schematic can be applied for single and multiple row components
Clearances for all dip soldering systems with multiwave
Page 28 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
Keep out area around multipolar soldering / minimum requirement for non-wettable nozzles with
drain holes (Ersa – standard)
For smaller distances, contact ERSA !
X
X1Y
Y1
The component height X1 within close proximity of the
solder nozzle is 4.5 mm and depend on the position Y
of the drain hole.
The standard measure of Y is 7.5 mm, in special
cases, to be modified.
The min. distance Y1 is from the nozzle to the next
component without height restriction is 15 mm.
Clearances for all dip soldering systems with multiwave
The schematic can be applied for single and multiple row components
Page 29 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
Clearances for all dip soldering systems with multiwave
Keep out area around the transport edge / minimum conditions
For smaller keep out areas please contact Ersa!
All restricted areas may touch the conveyor clearance B.
Specification of the conveyor clearance B. see page 21
Page 30 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
Not Adjustable support pins on the nozzle plate
The diameter of the restricted area on the PCB is 4-8 mm, it depends on the height of the adjacent components. See dimensional drawing.Supporting pins may be required to compensate for possible bending or warpage of the assembly during soldering when e.g. tends by heavy components and / or due to their size to sag.The restricted areas for these pins should be distributed as possible in a uniform , square - symmetrical grid , depending on weight and size of the PCB.
Clearances for all dip soldering systems with multiwave
Special shapes possible on request.
Page 31 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
Adjustable support pins on the nozzle plate (for custom pallets or solder masks)
The diameter of the restricded area on the
circuit board is 10 mm.
Supporting pins may be required to compensate for possible bending or warpage of the assembly during soldering when
e.g. tends by heavy components and / or due to their size to sag.
The restricted areas for these pins should be distributed as possible in a uniform , square - symmetrical grid , depending
on weight and size of the PCB.
Clearances for all dip soldering systems with multiwave
Page 32 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
General Layout Recommendations for
Selective Soldering
Page 33 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
Use of custom pallets / solder masks
By the using of custom pallets/solder masks is to be paid attention to the fact that the level of the conveyor
system is identical with the level of the soldering side of the assembly.
Divergences only make sense in special cases. Please match with ERSA.
Conveyor level A = PCB bottom side B +/- 0,05 mm
PCB rest thickness C 2 mm
General recommendations
custom pallet
Page 34 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
Use of custom pallets / solder masks
The edges of the pallet, which show into the direction of transport should show a chamfer. The chamfer should
not to be chosen too largely otherwise the position of the pallet for soldering, when hitting the board stop, may
move by the chamfer and may cause an offset for the soldering process.
Chamfer max. 1,5 x 45° Radius max. R1,5
General layout recommendations
Page 35 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
Orientation of adjacent SMT components to selective solder joints
Tangential Orientation
Parallel Orientation brings the disadvantage
that in case of a wetting of the reflow
soldered SMT component, the component is
washed away immediately.
Radial Orientation
In-line Orientation is much better, as the wetting
of the reflow soldered pad is improbable and the
component will not be washed away so easily.
General layout recommendations
Page 36 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
General Layout Recommendations
Layout for connectors
short Pins small pads large pads wrong ground connection
Long pins
Conclusion:
Layout impacts
on Quality !
Page 37 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
General Layout Recommendations
Capillary Effect during Selective Soldering / Ratio of Pin- Hole Diameter
capillary gap
To increase the transfer of heat into the plated through-hole, it is recommended to work on the upper limit of
the capillary gap at PCBs/components with large heat capacities.
The heat up gradient of the solder joint is a function of the solder volume in the gap of the plated through hole.
Page 38 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
General Layout Recommendations
Thermal relieve/heat trap for connecting a PTH to a massive copper layer
The „spoke design“ reduce the heat flow into the copper layer, therefore more of the available heat can remain in
the metallization of the through hole. This geometry is recommended on the primary and secondary side of the
board as well as for internal copper layers.
The longer and narrower the spokes are, the more effective for soldering they will be.
Page 39 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
General Layout Recommendations
Thermal relieves in power electronic assemblies
Page 40 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
General Layout Recommendations
The impact of massive components
If components guard the solder joints against the effect from top
side heating's, all the necessary heat energy must be supplied
for the heat up of the solder joints exclusively from below.
To guarantee a quick heat up of the solder joint, heat energy is
transferred to the top side of the assembly by additional vias
around the PTH.
Page 43 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
General Layout Recommendations
Through Hole Filling
FhG ISIT
The wrong PCB design (missing “spokes”) on the left picture causes a insufficient through filling.
The insufficient through filling on the right picture is caused by the heavy mass component.
Page 44 © by Ersa GmbH| VF3_LAYOUT ENG_V503.pptx | 23.05.2017
General Requirements to Selective Solder Joints
Mechanical connections and fixations in components/ snap-ins
Very often connectors are equipped with plastic pins for additional mechanical fixation to the PCB. If the
board locks may not come in contact with molten solder, they have to be treated like SMT components, and
the same layout-specs have to be applied.
Keep out area not ok Keep out area ok
General Layout Recommendations
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