SITARA™ Microprocessors
Процессоры SITARA для промышленных применений
Q1 2012
Mikhail Sokolov, Texas Instruments
ARM & ARM+ portfolio
2
Video
Accelerators
+
DSP
+
ARM
DSP
+
ARM ARM • Point of Sale
• Portable Data Terminals
• Human Machine Interface
• Networked Audio
• Test and Measurement
• Power & Energy Management
• Industrial Vision & Control
• Networked Audio & Video
• Media Servers
• Video Security
• Video Conferencing
Advanced GUIs &
Displays,
Connectivity
Advanced GUIs &
Displays, Connectivity,
Intensive Signal
Processing
Advanced GUIs &
Displays, Connectivity,
Video Acceleration
SITARA
INTEGRA
DAVINCI
AM18x • 375/450MHz
• 10/100 Enet, SATA
• SDRAM / LPDDR1 /DDR2
• 10ku $5 - $8
AM37x • 800MHz/1GHz
• LPDDR1
• 10ku $12 - $24
AM35x • 600MHz
• 10/100 Enet, CAN
• LPDDR1 / DDR2
• 10ku $12 - $17
AM335x • Up to 720 MHz
• 1G-Enet switch,
TSC/ADC
• LPDDR1/DDR2/DDR3
• 10ku $8 - $20
Production Development Sampling
AM4x Next • More Interface Options
• Increased Security Features
Concept
I
C
S
S
3
D
3
D Cortex-A8
Cortex-A8
Cortex-A8
ARM9
Cortex-A9
AM2x Next • More Interface Options
• Increased Security Features
• Lower Power
Cortex-A7
AM389x • Up to 1.5 GHz
• 2x GbE, HDMI,
• 2x PCIe, 2x SATA
• 2xDDR2 / DDR3
• 10ku $29 - $31
AM387x • Up to 1.0 GHz
• GbE, HDMI, PCIe, SATA
• 2xLPDDR1 / DDR2/ DDR3
• 10ku $22 - $32 3
D
Cortex-A8 Cortex-A8
Sitara ARM® Processor Roadmap
3
D
I
C
S
S
3
D
AM2x Next • More Interface Options
• Increased Security Features
Dual Cortex-A7
Per
form
ance
+ In
tegr
atio
n
Available Now | 2012 | 2013 | 2014
= PRU Industrial Communication Sub System
= 3D Graphics Accelerator
= Recently Announced
3D
ICSS
Everything you need for Electronic Point of Service
• Enable fast, secure transactions
– High-performance ARM® microprocessors with graphics accelerators
– Integrated security features – secure boot, cryptographic accelerators,
secure middleware to support ARM® Trustzone among others
• Lower development costs and time to market
– Complete turnkey POS reference design to kick start development
– PCI pre-evaluation to reduce certification time of end product
– Cost reduction through system integration
• Scalability to customize products
– Broad portfolio of embedded processors, power management, motor
drivers, connectivity, precision analog and standard logic
– Scalable pin-to-pin compatible processors allow addition of features like
scanning (DSP), video advertising (media accelerators) etc.
ARM® MPU for EPOS today
Key Features AM37x AM335x
CPU Cortex-A8 Cortex-A8
CPU Speed 600/800/1000 MHz 600 MHz
L1D/L1p Cache (KB) 32/32 32/32
L2 Cache (KB) 256 256
Shared SRAM (KB) 64 64+128
DDR Memory Interface mDDR mDDR/DDR2
DDR Memory Clock (MHz) 200 200
DDR Memory Bus Width 32-bit 16-bit
Touchscreen Support 1 1
Ethernet - 1 Gig
SPI / I2C / UART / USB 4 / 3 / 3 / 4 2 / 3 / 6 / 2
Camera 1 (10-bit) -
Display/LCD Ctrl 24 RGB 24b RGB
Graphics Engine 3D 3D
IO Voltage 1.8v 1.8V/3.3V
Package Type BGA BGA
Temp Range (Celsius) -40° to 90° -40° to 90°
NOTE: The above is not a complete list of features
AM3715/03 Cortex™-A8 based processors
L3/L4 Interconnect
Memory Interface Connectivity
USB HS Host x3
USB OTG
I2C x3
WDT x2
NAND
Timers
MCSPI x4
McBSP x5
MMC/SD/SDIO x3
GP x12
UART w/ IrDA
HDQ/ 1-wire
UART x3
Serial Interface
LPDDR1
3D Graphics
Accelerator (AM3715 only)
Video
Processing
Front End
Video
Input
(12-bit)
Display Subsystem
10 bit DAC
10 bit DAC
LCD Controller
Video Encoder
ARM®
Cortex™-A8 800MHz/1 GHz
32K/32K L1
256K L2
64K SRAM
AM3715/03 Processors
Benefits • 2000DMIPS for OS’s like Linux, Win CE, RTOS • Up to 30% reduction in power • 20M polygons per second for robust GUIs
Sample Applications
• Smart connected devices • Patient monitoring • Single board computers • Low power PC
Power
• Dynamic Voltage and Frequency Scaling (DVFS) • Total Power: 735mW (800MHz) • Standby Power: 0.1mW (600MHz)
Schedule and packaging • Production: Now • CBP: 12x12mm PBGA, 0.4mm pitch, 515-ball,
Package on Package (PoP) • CBC: 14x14mm PBGA, 0.5mm pitch, 515-ball, PoP • CUS: 16x16mm PBGA, 0.65mm pitch. 423-ball.
Utilizes Via Channel™ array technology with 0.8mm pitch plus design rules
Peripheral limitations may apply among different packages
Some features may require third party support
All speeds shown are for commercial temperature range only
7
AM335x Cortex™-A8 based processors
Benefits • High performance Cortex-A8 at ARM9/11 prices • Rich peripheral integration reduces complexity and cost
Sample Applications
Software and development tools • Linux, Android, WinCE and drivers direct from TI • StarterWare enables quick and simple programming of and
migration among TI embedded processors • RTOS (QNX, Wind River, Mentor, etc) from partners • Full featured and low cost development board options
Power Estimates • Total Power: 600mW-1000mW • Standby Power: ~25mW • Deep Sleep Power: ~5-7mW Schedule and packaging • Samples: October 31, 2011; Production: 2Q’12 • Dev. Tools: Order open October 31, 2011 • Prelim docs: available today • Packaging: 13x13, 0.65mm via channel array
15x15, 0.8mm
• Home automation
• Home networking
• Gaming peripherals
• Consumer medical
appliances
• Printers
• Building automation
• Smart toll systems
• Weighing scales
• Educational consoles
• Advanced toys
• Customer premise equipment
• Connected vending machines
Availability of some features, derivatives, or packages may be delayed from initial silicon
availability
Peripheral limitations may apply among different packages
Some features may require third party support
All speeds shown are for commercial temperature range only
* 720 MHz only available on 15x15 package. 13x13 is planned for 500 MHz.
** Use of TSC will limit available ADC channels.
SED: single error detection/parity
ARM® Cortex-A8
up to 720* MHz
L3/L4 Interconnect
Serial Interface
32K/32K L1 w/SED
256K L2 w/ECC
64K RAM
64K Shared
RAM
Display
24 bit LCD Ctrl (WXGA)
Touch Scr. Ctrl.**
Security
w/ crypto acc. PRU SS
PRU x2 200 MHz
12K RAM w/SED
Peripherals 8K P. w/SED
8K D. w/SED
System
Memory Interface
LPDDR1/DDR2/DDR3
NAND/NOR (16b ECC)
Parallel
EDMA
Timers x8
WDT
RTC
eHRPWM x3
eQEP x3
eCAP x3
JTAG/ETB
ADC (8ch)
12-bit SAR**
UART x6
SPI x2
I2C x3
McASP x2
(4ch)
CAN x2
(2.0B)
MMC/SD/
SDIO x3
GPIO
USB 2.0 OTG
+ PHY x2
EMAC 2port
10/100/1G
w/1588 &
switch
(MII,RMII, RGMII)
Graphics
PowerVR
SGX
3D Gfx
EPOS: ARM® MPU Roadmap Increased Integration to reduce system cost
Security IC from 3rd Party
TODAY: 2-Chip Solution w/ External Security Controller
• TI ARM® Cortex-A8 MPU
• Non-TI Security Controller
Available Today
In 2012: 1-Chip Solution w/ Integrated Security Controller
• TI ARM® Cortex-A9 MPU with
integrated security
Available in 2012
AM37x
AM35x Security
Controller
Integrated Security
AMxxx
NEXT
Enables scaling of application features across platform of products
EPOS Reference Design Kit (RDK) Modular Point of Sale reference design with support for NFC
KEY FEATURES TI’s ARM Cortex®-A8 microprocessor (up to 1 GHz)
WindowsCE6, Linux and Android OS support
Multiple Card interfaces
Magnetic Stripe Reader (MSR)
IC Card (Smart Card) Interface
RFID/NFC reader
1D/2D bar code scanner
Thermal Printer
WLAN and WWAN Modem (2.5G/3G)
3.5” LCD with touch screen
Production hardware
PCI-PTS pre-evaluation by RFI Global (accredited lab)
Security Software License from ViewAt ( NRE or
Royalty)
Availability: Now (WinCE6)
January 2012 (Linux)
February 2012 (Android)
Pre-evaluated to pass PCI-PTS certification!
Customize to your needs: Counter-top POS Terminal (w/o Barcode)
Mobile POS (w/ Cellular Support)
Portable Data Terminal (No Financial Transactions)
Full featured POS-PDT Terminal
Developed, sold and supported by TI partner ViewAt
MSRP: US$ 998
For more info: ti.com/epos
EPOS RDK: Software Architecture
Board Support Package
OS Kernel
• Linux – Open Source – TI
supported
• Android – Open Source – TI
supported
• Windows Embedded CE – TI
Supported
AM3715 Hardware with SGX530 and NEON
Application Level Software
User Interface “Applications”
Security SW
• Secure Keypad
• Secure Smart
Card
• Secure
Magnetic Card
• Secure LCD
• SW crypto algo
• Secure Boot
Application Framework – API Layer
“Applications”`
System
• WIFI
• USB
• Camera
• RFID/NFC
• 3G/WCDMA
• Serial
• Memory
• Printer
• Power Mgmt
TI Base SW/Components
3rd party/Customer
Secure Kernel
MAXQ1850 Secure
Execution
Environment
• System Secure Boot
• Self Checking
• Hardware Crypto cores
• Key Management
• Tamper prevention
MAXQ1850* HW
* MAXQ1850 is a Maxim Security Microcontroller
What is a Thin Client?
Sink (Client)
Source (Server) Thin Client A thin client is a small centrally
managed computer, typically
without HDD. Processing is
done remotely in the cloud.
Thin Client Benefits • Enhanced Security
• Enhanced Manageability
• Reduced Cost of Ownership
• Lower Power
Many industries including
healthcare, finance and
education require this level of
security and control.
Tomorrow’s Thin-Client Features
• Today Thin Clients are mainly based on x86 architecture,
many will move to ARM solution
– Today dominated by VIA, Intel, AMD
– Local OS: Windows Embedded, Linux
• Uncompromised computing experience with security and
convenience of cloud-based computing
– Responsive
– Multimedia enabled
– Power-efficient http://it.umsicht.fraunhofer.de/PCvsTC/index_en.html
– Secure
– Cost-effective
– Small
Thin Client TI Platforms: DM814x and AM387x (DSP Accelerated, 3D capable)
Now :
Thin Client – Zero Client
Next Generation Remote desktop (Virtual Desktop)
Ultra low power, Full multimedia, Full 3D graphic , High resolution, Multiple screens.
Switched Central Resource (SCR)
Peripherals
Memory Interfaces
DM8148
USB
2.0
x2
GPIO GMAC
Switch
PCIe McASP
x6
SPDIF
McBSP
I2C/
SPI
x4
UART
x6 DCAN
x2
DDR3
x2
SDIO
/SD
x3
Async
EMIF/
NAND
SATA2
Display
On-Screen
Display
Resizer
SD DAC (x2)
HDMI PHY
HD Video I/O (x2)
Video I/O
HD Video
Coprocessor
(x1)
3D Graphics
Engine
(not in
DM8147)
ARM micro-
processor
Fixed/ Floating
point DSP
ARM
Cortex
A8 TM
C674x
DSP
Core
(not in
DM8146)
DM814x Processor Cores
ARM Cortex A8™ (MPU) up to 1 GHz C674x™ Floating Point DSP Core up to 720 MHz
Memory ARM: 32KB L1I-Cache, 32KB L1 D-Cache, 256K L2 DSP: 32KB L1I-Cache, 32KB L1 D-Cache, 256K L2 Two DDR-800 Controllers
Coprocessors/Subsystem HD VICP 2.0 Accelerator at 320 MHz
– Real-Time HD Encode /Decode 3D Graphics engine Display Subsystem
Peripherals
Gigabit EMAC Switch USB 2.0 Ctlr/PHY x 2 PCIe 2.0
SATA 3.0Gbps DDR3 – 800 x2 SD/SDIO x3 McASP x6, McBSP SPI, GPIO, I2C, UART, DCAN
Power Total Power – Typical 3 W
Package 23x23, 0.8mm pitch, 684 ball BGA
• Via Channels enable low cost design rules -- 4 mil traces and 10/20 mil escape vias
Video accelerators:
• 1080p60 HD capability
• DSP fully available for Analytics and other
data processing
Back to: DM roadmap | product positioning
Up to 2000 Dhrystone MIPS
• Utilize ARM for OS and application
processing & networking
Display Subsystem • Up to two HD and one SD simultaneous outputs
with 2D/3D graphics
3240 MFLOPS
• Natively supports single/
double-precision floating
point
AM387x Cortex™-A8 based processors Differentiated Features and Benefits • Gigabit Ethernet Switch with 2x MACS and
IEEE1588 support enables fast and reliable
network connectivity
• PCIe gen2 with integrated PHY enables a
5.0GT/s connection to backplanes, FPGAs,
or expansion cards like USB 3.0 or 802.11n
• Connect to abundant storage with SATA2.0
support at 3.0Gbps, PHY included
• Video output for two different displays at up
to 1080p60 each, and HDMI out
• 2W power consumption for fan-less, heat
sink-less, enclosed designs
Software and development tools • Linux, WinCE, and Android drivers direct
from TI
• RTOS (QNX, Green Hills, etc) from partners
Schedule and packaging • Samples and Dev. Tools: Now
• Production: 4Q’11
• Packaging: 23x23, 0.8 mm, 684 ball
* Initial sampling will be for the XAM3874BCYE at 720 MHz
** Annex D only
ARM® Cortex-A8 800 MHz/ 1.0 GHz*
L3/L4 Interconnect
Serial Interface
32K/32K L1
512K L2
Display
Display processor
Resizer
System
Memory Interface
Parallel
EDMA x4
Timers x8
WDT
UART x6
SPI x4
I2C x4
McASP x6
CAN x2
MMC/SD/
SDIO x3
GPIO
USB 2.0 + PHY x2
(host & device)
EMAC 2port
10/100/1G
w/1588** &
switch
(GMII, MII, RMII,
RGMII)
Graphics (AM3874 only)
PowerVR
SGX
3D Gfx
Security
AES, 3DES
RNG
PCIe (2.0)
McBSP
SPDIF
LPDDR1/DDR2/3 x2 SATA (3Gbps)
Async EMIF/NAND
HS OSD SD OSD
SD Encoder SD DAC x2
HDMI Xmit
(w/HDCP) HDMI PHY
HD Video I/O x2
64K RAM 128K
Shared RAM
HD Encoder
DM8148’s Provides Value for Thin Clients Single platform supports multiple VDI protocols
• Performance – TI’s Powerful 750Mhz C6x DSP processor and HDVICP
accelerate VDI (Virtual Desktop Infrastructure) performance
– Citrix HDX – 24fps @ 720p with accelerated multimedia redirection (H.264,VC-1)
– RemoteFX – 15000+ Rectangles Per Second (RPS) which equals
1920x1280x25fps
• Programmable – Future proofs clients for long term deployments
– RemoteFX for Win8 in development (Q4 2012)
– Could add support for other emerging protocols
• Integration – Display subsystem drives dual displays (1920x1280x2)
– Additional interfaces for GigE Switch, USB, PCIe, SATA, UART, DDR3
• Low Power consumption ARM Cortex A8 based SoC enables
<5 watt client – can support POE power supplies, fanless design
• Size Small form factor – easily embedded in monitors, projectors, and other
end equipments
Thin Client RDK Hardware: Updated Information
• Ultra-compact fanless design
• DM8148, 1Ghz
• 1GB DDR3
• 4 USB ports
• Dual Display: DVI-D + DVI-I
• Optional WiFi Module
• Supports VESA mount and Kensington
lock
• ErP 2013 Specification off mode 0.5W
• 6 Layer PCB
• Available May 2012
Dimension : 15.5 x 13.3 x 2.9 cm
( 6.1 x 5.23 x 1.12 inch)
Volume: 598 ml
All in One
• One HW platform can support all thin client SW
• TI is the partner with all of them
• VMWARE available from partners
20
RemoteFX
Thin Client with TI Processor
Partners
TI has been working to identify several partners who could help in the solution development:
Canonical (integration, Linux RDP, Linux OS, Support, Updates) Cloudium (integration, Linux RDP, complete application) iTap (integration, Linux RDP) ThinLinx (integration, Linux RDP)
Industrial communications is the heart of industrial automation – Connect to Control
• Industrial Automation System = HMI + PLC + Sensors + Motor
Control
• Connectivity is the heart of automation for greater productivity
• TI is uniquely positioned to provide efficient & scalable system
solutions HW (Analog & Processor) + SW (communications &
applications)
TI solves the complex communications problem by integrating multi-protocol support in the ARM SoCs
Host
Interface
MCU Or
MPU
Ind Comm ASIC/FPGA
AM1810 (Profibus) AM3357/9 (Multi-
protocols)
ARM CPU
Shared Memory
PRU
Subsystem
PRU
UART/MII
Timer
• MCU/MPU for application
• External ASIC/FPGA for communications (especially for slave)
Typical Solution – Today
• System BOM savings (>40%) by eliminating the external ASIC
• Supports multiple protocols using the same hardware (PRU is completely programmable)
• Easily adapt to changing standards or create own (myProtocol)
• Scalable solution for HMI, PLC and I/O devices
TI’s ARM + PRU solution = 4
benefits
EtherCAT Slave
Devices
• AM335x
Features
• ARM Cortex A8
• Beckhoff EtherCAT stack – Free production license for ETG members (ETG membership is free)
• Compatible with other third party EtherCAT stacks
• Uses SYS/BIOS RTOS from TI
• TLK100/TLK110 Industrial Ethernet transceiver
Benefits
• Lower ASIC cost and reduced PCB area
• EtherCAT Master /slave integrated on application processor
Availability
• AM335x sampling NOW
• Guaranteed long term availability
25
MII AM3357-
275MHz MPU
EtherCA
T
Availability
2010 2011 2012
TLK100
EtherCAT
Slave Stack
TLK100
TLK110 Ethernet
PHY
AM335x
MII
EtherCA
T
TLK100
TLK110 Ethernet
PHY
EtherCAT Master
Devices
• AM18xx
• AM35xx
• AM335x
• Several other Sitara devices with Ethernet peripheral
SW
• Master stack from 3Ps - 3S/CoDeSys or ETG
• Linux and other HLOS support from TI
• Compatible with third party OS/RTOS
Benefits
• Lower cost and power and PCB area
• EtherCAT Master/Slave integrated on application processor
Support
• TI’s Industrial SDK with Linux
• 3rd party free/commercial protocol stack
Availability
• AM18xx and AM35xx available now
• AM335x sampling NOW
• Guaranteed long term availability
26
MII
AM18xx
AM35xx
AM335x
EtherCA
T
Availability
2010 2011 2012
AM18xx
TLK100
AM35xx
TLK100
TLK110
AM335x
Industrial Fieldbus Engine (ICE)
Sensor & Ethernet Module
Host Interface USB JTAG
Power
Temp
Sensor
SPI
Flash
MMC
TPS65910
24V I/O 8 x LEDs DDR2 TLK110
6 x LEDs
DPRAM
NOR FLASH
70
mm
90mm
TI PLC/6LowPAN Data Concentrator Platform (PRIME and G3)
AM1808
UART(3)
ARM926
RJ45
AFE03x
F28069
Octave
EMAC
SCI-A
To Core Network
To PLC Network
2-Chip Solution: ARM926 based AM180x or L138 as application processor, TMS320F28069+AFE03x as PLC
PHY+lowerMAC sub-system
3-phase reference design system built on field proven PLC PHY+MAC
Support both G3 and PRIME standards
NIB Management to handle 1200s PLC service nodes, 256 switches and 3600 connections (PRIME)
Linux OS 2.6x on ARM926 to support MAC and above SW stack
Convergence to both IPv6 (G3 and PRIME) and IEC61334-4-32 (PRIME)
COSEM/DLMS demo application framework*
30
PLC / 6LowPAN Data Concentrator EVM
EVM Price ~ $695
Production May 2011
<1Ghz RF
Zigbee
802.15.4
USB
Prime
PLC module
GPS
header
OMAP
L138
AIC34
Analog
I/O x2
Ethernet
DDR
LCD
Connector
• 3-phase power system:
• 3 current and voltage
Inputs plus neutral.
• Isolation to prevent damage
from high voltages, currents
• OMAP-L138 processor • Integra DSP + ARM for
Control, communications and
Signal processing.
• Full Linux BSP supported by TI
• High performance AIC provides
16-bit sampling at low SNR.
• Supports control and data
communications • Ethernet, PLC, <1Ghz RF
• RS232, CAN
Hardware Features
• Designed to best practices
for high-speed systems • Good Ref design for passing
ESD system tests.
•8 Power Inputs (4 current/4 voltage)
RS232
RS232
CAN
TI wireless connectivity: Your best choice
Find the right connectivity solution
• Industry’s broadest portfolio of proven wireless connectivity
solutions
• Support for a wide array of applications
Get to market quickly
• Complementary connectivity solutions for TI embedded
processors
• “Out-of-the-box” tools and software solutions
• Extensive support infrastructure for hassle-free development
Leverage TI’s proven experience
• 10+ years connectivity experience with over 1 billion units
shipped
• Broad industry knowledge across various technologies and
markets
• Ongoing technology and product investments
Bluetooth
®
technology
Bluetooth
® LE
technology
Wi-Fi
NFC
ZigBee®
technology 6LoWPAN
GPS
IEEE
802.15.4
ANT
RFID
ZigBee®
RF4CE
Sub-1 GHz Sub-2.4
GHz
PurePath
™
Wireless
…and
more to
come!
WL1271 Features and Benefits
Best-in-class coexistence
More connections in
parallel
Simplified design process
Best-in-class Wi-Fi
idle-connect current and
Bluetooth power
Access to cutting-edge
features
Simplified design process
Reduced operating costs
and time to market
Best in class link budget
Increased range
Dense combo integration : Wi-Fi 802.11a/b/g/n,
Bluetooth 2.1 + EDR
Enhanced WiFi/Bluetooth inter-core communication prioritizes
packet scheduling
Enhanced Low Power (ELP) mechanism allows sleeping
between WiFi beacons (0.7mA avg power), and fast wakeup time
Low power scan results in 1/3rd the Bluetooth power consumption
(145uA) than traditional reception window scan
Open source compliant driver (mac802.11)
Roadmap to new features (e.g. WiFi Direct, BLE)
Fully integrated, pre-certified modules available
Pre-integration of module and host controller, including hardware
reference design, software stack, and application code
Coexistence
Low Power
Software
System Integration
Typical WLAN transmit power: +12.5dBm, 65Mbps, OFDM (n)
Typical WLAN receiver sensitivity: -73dBm, 65Mbps
+9.5dBm increased Bluetooth transmit power
-92dBm Bluetooth receiver sensitivity
Performance
First widely available platform to support Wi-Fi Direct™
Wi-Fi Direct enables users to connect directly with each others’ devices
to share content or display it on a nearby screen for easy viewing.
Devices can directly connect to each other, regardless of whether an
infrastructure network is available.
The
performance
of Wi-Fi, with
the ability to
directly
connect!
Other WL1271 Markets
Portable Consumer
eBook, Portable media player,
Internet radio
Industrial and Home Automation Smart metering, Thermostat, Control tablets
Video Camera, Conferencing, Console
Portable Enterprise Portable data terminal, Education tablets
Smart Machines Vending machines, Toll systems, Printers
36
SDIO
Applications
AM335x ARM Cortex A8
WL12xx Driver
Wi-Fi Management
(mac80211 Driver)
Security
Supplicant
User Mode
Kernel Mode
TCP/IP Stack
DHCP Client
DNS
MPU SDIO Driver
(Wi-Fi)
Socket API
WL1271 RF
Front
End
38.4MHz
Oscillator
WL1271-TypeTN
BlueZ Stack and Profiles
UART
Open OBEX
MPU UART Driver
(Bluetooth)
• TI Platforms enable complete system integration of module and host MPU
• Primary WL1271 engagement model is through TI Platforms
• WL1271-TypeTN platform includes AM335x
WL1271 MPU Platform block diagram
DC/DC Converter
Filter
ECS Partner Network
Low cost WiFi modules
Porting and customer support
GPS modules
Platform support
Low-cost WiFi Modules
Processor porting and support
WinCE Platform Support Customization
BT Platform Support
BT Customization
Linux Platform Support
Customization
Bluetooth modules
Bluetooth Stack and Profile provider
Catalog WiFi/BTH modules On-board design services
Modules, customization
support, design services
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