Precision Machining
January 2013 1
Extreme Tolerances Exotic Materials (SiC, Sapphire, Ceramics, Hard Materials Sub-micron precision, small and large parts MEMs scale parts and features by direct machining
CNC Milling Wire EDM micro EDM Grinding Wafer Dicing Wafer Thinning Lapping, CMP Precision Tooling Diamond Turning* (fly cutting at sister shop, internally soon)
High Speed High Accuracy CNC Milling
January 2013 2
• Linear Motors• 14 in stages• .25 um accuracy• High Speed• Ceramics• Hard Metals
Grinding
January 2013 5
• 4 surface grinders• Tropel flatness measurement• Air bearing spindles• Sub-micron flatness
Wafer Dicing
January 2013 6
Lapping & Polishing
• Sub-mircon position accuracy• Silicon• Compound Semi• Ceramics• Glass
• Diamond and other compounds• Hard and soft plates and pads• ELG (electronic lapping guides)• CMP
Complex Wafer Chuck
January 2013 7
Metrology
Light-weighted Zerodur backside Post Cr thin film transmission test
Precision sub-micro accuracy CNC machining of Zerodur glass
Semiconductor Wafer Tooling Examples
January 2013 8
SiC Wafer-to-Wafer Bonding Plates – Upper and Lower Pair
Zerodur Glass 300mm Wafer Chuck
SiC Vacuum Chuck Tools
January 2013
400 um x 200 um deep vacuum channels
800 um vacuum thru holes in 6 mm thick SiC
Lower Substrate Vacuum Chuck
Upper Bond Arm Pick Up Chuck for rectangular chip
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