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  • AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Fabriksgasse13 | A-8700 Leoben Tel +43 (0) 3842 200-0 | E-mail [email protected]

    www.ats.net

    PCB materials for Automotive applications

    iNEMI / SMTA Automotive Electronics Workshop October 5th, 2015

  • 2

    Short Overview about AT&S

    Material basics + qualification process

    Product examples with advanced material requirements

    High frequency materials for automotive radar

    Agenda

  • AT&S Group

    AT&S is currently the Technology Leader in HDI* and Any-Layer Boards

    Highest automated HDI factory in China

    No. 1 - ECP®** supplier with real commercial and industrial set up

    Largest European PCB supplier

    Largest PCB producer in India

    Supplier of the Top Players in each targeted segment

    * HDI = High Density Interconnect ** ECP = Embedded Component Packaging

    3

  • 4

    AT&S Locations

    Production facilities in Europe and Asia Headquarters in Leoben, Austria Procurement center in Hong Kong, China

    Design center in Düren, Germany Sales network spanning three continents About ~8000 employees

    BU IA Plant Leoben, Austria Headquarters Staff: ~ 900 Customer Orientation: 9% Automotive 91% Industrial

    BU IA Plant Fehring, Austria Staff: ~350 Customer Orientation: 44% Automotive 56% Industrial

    BU MS Plant Shanghai, China Staff: ~4.500 Customer Orientation: 84% Mobile Devices 14% Automotive 2% Industrial

    BU IA Plant Ansan, Korea Staff: ~250 Customer Orientation: 13% Automotive 47% Industrial 40% Mobile Devices

    BU IA Plant Nanjangud, India Staff: ~1.100 Customer Orientation: 60% Automotive 40% Industrial

    BU MS Plant Chongqing, China under construction Staff: ~1000

    AT&S AG Headquarters

    Leoben, Austria

    BU MS Headquarters

    Hong Kong, China

    AT&S AG Headquarters Sales Offices /Representations Business Unit Mobile Devices & Substrates (BU MS) Business Unit Industrial & Automotive (BU IA)

  • 5

    AT&S plants / installed capacity [m²]*

    * Maximum capacity of plants Source: AT&S

    AT&S plants

    Technology: DS-PTH, Flex

    Volume: low-mid

    Market: IND / AUT

    Technology: Standard ML

    Volume: mid-high

    Market: IND / AUT

    Technology: HDI

    Volume: high

    Market: MD / IND / AUT

    Technology: HDI / Standard ML,

    Flex

    Volume: Samples, Prototyps

    low-mid

    Market: IND / AUT

    Technology: Flex / ridid-flex

    Volume: mid-high

    Market: MD / IND / AUT

    380k

    120k 300k

    130k ~ 200k

    Nanjangud Shanghai Seoul (Korea) Leoben Fehring Chongqing

    710k

    Under Construction

    IC-substrates

  • 6

    Material: Prepreg, Core, copper foils

    6

    Carrier- und Isolation material with increasing requirements

    Electrical Performance (Impedance, Signalspeed-/loss, higher frequencies…)

    Thermal Performance

    (TCT performance , Thermal stress, thermal conductivity…)

    Physical Performance (Miniaturisation, Rigidity, Flexibility, Peel Strength, …)

  • • Prepreg: Glass cloth with resin; pre-cured; different types of glass clothes available,

    • Core:

    Prepreg with copper on top and bottom (CCL = copper clad laminate); fully cured

    • RCC:

    Resin Coated Copper; used only for HDI (laser drilling); no glass cloth, pre-cured

    Base material introduction

    7

  • Base material introduction

    8

  • Base material introduction

    1037

    106

    1080

    2116

    9

  • Base material introduction

    10

    Warp and weft (Grain direction )- glass fibers – different number of fibers in one bundle - different number of glass bundles per centimeter.

  • 11

    …currently used resin systems

    • FR4 halogenated / halogen-reduced (e.g. R1755M, R1755V, R1566WN, 370HR …)

    • FR4 high TG / halogen reduced / high speed (e.g. EM888, R1577, …)

    • PPE Polyphenylether (low Dk Df) (e.g. Megtron7, Megtron 6, Megtron 4S, …)

    • HF Hydrocarbon / Ceramics (low Dk Df) (e.g. RO4000 …)

    • PI Polyimid (PI-glass , PI flex) (e.g. 35N, N7000, P96, DuPont, UBE, ..)

    • LCP Liquid Crystal Polymer (flex, low water abs., low Dk Df) (e.g.FR-705T)

    • PTFE Polytetrafloureten (Teflon) (e.g. RO3003, …)

    • Substrate (Low CTExy, ..) (e.g. MCL E700, …)

  • 12

    Customer requirements

    • IPC-class sheet defined

    • RoHS conform (environmental feature)

    • Halogen reduced (environmental feature)

    • Lead free solder compatible (thermal reliability)

    • CAF resistant

    • TG (temperature related reliability)

    • TCTxyz, CTExyz (temperature cycle reliability)

    • Er (Dk) , Df (electrical signal performance)

    • Degradiation Temperature (thermal reliability)

    • T260 , T288 (time to delamination, thermal reliability)

    • High thermal conductivity (heat transfer)

    • Mechanical properties (Drop Test, stiffness, etc.)

  • 13

    „Standard“ FR4

    Material definition at AT&S

    Halogenated (ROHS) or Halogen reduced materials

    TG 150 , 170 , …

    Reliability: Leadfree soldering , Low CTE z for temperature cycle tests

    High Speed , Low Loss

    HF/PPE (Hydrocarbon Ceramics, Polyphenylenether, …)

    PTFE , LCP , …

    Low CTE x y , Special Modulus Materials

    BT / CE / ..Blend (Bismaleinimid-Triazin resin , Cyanatester)

    CTE x y Reliability solutions

    13

  • 14

    AT&S material Analysis To protect special technology requirements (material and final application):

    • Reflow [thermal stability, delamination]

    • Scanning Measuring Machine [accurate overall Dimensional Panel behaviour]

    • SEM: Scanning Electron Microscope [check Filler, roughness, etc.]

    • EDX: Energy Dispersive X-ray spectrometer [element analysis]

    • FTIR: Fourier Transforming Infra-Red Spectroscope [footprint resin system]

    • DSC: Differential Scanning Calorimeter [TG]

    • MFK: Model Free Kinetic (DSC) [required energy to cure B-stage resin]

    • TGA: Thermo Gravimetry [Degradiation]

    • TMA: Thermo Mechanical Analysis [TG mechanical, CTE, TTD time to delamination]

    • DMA: Dynamic Mechanic Analysis [TG , thermomechanic behaviour]

    • Rheometer / Viscosimeter [viscosity and curing behaviour of resin system]

    • Peel Strength Tester [Cu peel strength, all sorts of peel strength]

    • TCT – Tester [temperature cycle test e.g. -40/+125° 1000 Cycles]

    • HAST (CAF/SIR) [High Accelerated Stress Test , Conductive Anodic Filament, Surface Insulation Resistance]

    • Laboratory Press [resin flow, prepreg cure]

    • Climatic Chamber [humidity, temperature simulations]

    • Drop Test

    • Bending Test [Flex, Semiflex application]

  • Prototyping asap, define risk managment with the customer

    Process parameter qualification app. 3 months

    UL Qualification Flammability, Full Recognition app. 6 months

    15

    Material Qualification + UL Listing

    - Technology requirements , qualification time and cost will define the material selection - Check existing material portfolio New Technologies and new materials on the market require ongoing material qualifications

  • 16

    Standard qualification

    Qualification process

    Resin assignment

    Process parameter definition

    Reliability Tests

    Reliability Qualification

    Special , increased Reliability Requirements

    Temperatur Cycle Test x y z direction (smaller packages)

    HAST

    CAF requirements / Design

    … let us know your requirements ?

    New applications will require adjusted reliability tests

    Laboratory equipment and AT&S Know How allow sophisticated customer solutions

    Quelle: foto: lowe ggk

    Quelle: foto: lowe ggk

  • Radar

    Short range radar 24 GHz (79GHz) and long range radar 77 GHz AT&S produces standard multilayer controller boards as well as hybrid multilayer boards implementing high-frequency materials addressing the requirements for modern automotive radar systems.

    Cameras are increasingly supported by radar technology for blind spot detection, rear pre-crash, rear cross traffic alert, vehicle assistant and lane change assistant systems.

  • Frequency Allocation Dilemma

    18

    Source: ANALOG DEVICES

  • RF Roadmap RF Stack up Material (Dk / Df) 2014 2015 2016 2017 2018 2019

    30 GHz Homogeneous Stack up FR4 < 3,6 / 0,01

    45 GHz Asymmetric Hybrid FR4 < 3,4 / 0,004

    80 GHz Asymmetric Hybrid + PTFE (…) FR4 / PTFE < 3 / 0,002

    > 80 GHz Homogeneous Stack up with PTFE (…) PTFE < 3 / 0,002

    R&D Implementation Ramp / Volume

    Homogeneous Stack up Asymmetric Hybrid Stack up

    19

  • Dk (Dielectric Constant) Df (Dissipation Factor)

    Material

    20

    < 5 GHz

    < 20 GHz

    < 30 GHz

    35-90 GHz

    Frequency Speed

    ~ 1,5 GB/s

    ~ 7 GB/s

    ~ 10 GB/s

    ~12-30 GB/s Very Low DK

    PTFE (Teflon), LCP

    Dk 2.0-3.0 Df 4 Df > 0.015

  • Losses due to the influence of copper foil treatment: Skin Effect 1

    Design & PCB Optimization

    21

    Treatment Rz= 5 – 7 µm @ 17µm Treatment Rz= 4 µm @ 17µm

    Impact of treatment with increasing frequency!

    21

  • Concept 1 Concept 2 Concept 3 Line Shape

    Trace Geometric

    Design & PCB Optimization

    22

    Losses based on the PCB structuring : Skin Effect 2

    Smooth Line Shape & Trace Geometry reduce losses! 22

    Skin Depth

  • Contact Information

    In case of any questions…

    23

    Michael Gössler Engineering Manager Fabriksgasse 13 8700 Leoben Tel: +43/3842/200/5687 Mobile: +43/676/89555687 E-Mail: [email protected]

    PCB materials for Automotive applications � �iNEMI / SMTA Automotive Electronics Workshop October 5th, 2015Slide Number 2AT&S GroupAT&S LocationsSlide Number 5Slide Number 6Base material introductionSlide Number 8Slide Number 9Base material introductionSlide Number 11Slide Number 12Slide Number 13Slide Number 14Slide Number 15Slide Number 16RadarFrequency Allocation DilemmaSlide Number 19Slide Number 20Slide Number 21Slide Number 22Contact Information