©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 1
21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
InvenSense 7-Axis Combo SensorHigh performance IMU with barometric pressure sensorMEMS report by Stéphane ELISABETHSeptember 2017
©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 2
Table of Contents
Overview / Introduction 3o Executive Summaryo Reverse Costing Methodology
Company Profile 6o InvenSense
Physical Analysis 11
o Synthesis of the Physical Analysis
o Physical Analysis Methodology
o Package 14
Package Views & Dimensions
Package Opening
Wire Bonding Process
Package Cross-Section
o Pressure Sensor Die 23 View & Dimensions Details Views Deprocessing & Marking Delayering & Main Block ID Process Cross-Section (Substrate, Metal Pad, Cavity, TSVs)
o ASIC/MEMS Die 56 View, Dimensions & Marking MEMS Removed
o MEMS Die 62 MEMS Sensing Area Detailed MEMS Gyroscope & Accelerometer MEMS Cap
o ASIC Die 92 Overview Delayering & Main Blocks ID Die Process Cross-Section (ASIC, Sensor, Cap & Sealing) Process Characteristics
Physical Comparison with MP67B, ICM-30630 & iPhone 7 Plus OIS IMU 121
Manufacturing Process Flow 127o Global Overviewo Pressure Sensor ASIC Front-End Processo Pressure Sensor ASIC Wafer Fabrication Unito Pressure Sensor MEMS Process Flowo IMU ASIC Front-End Processo IMU MEMS/ASIC Wafer Fabrication Unito IMU MEMS Process Flowo Packaging Process Flowo Package Assembly Unit
Cost Analysis 148o Synthesis of the cost analysiso Yields Explanation & Hypotheses
o IMU MEMS/ASIC Die 153 ASIC Front-End Cost MEMS Front-End Cost ASIC/MEMS Assembly Cost MEMS Front-End Cost per process steps Total Front-End Cost ASIC/MEMS Back-End 0 : Probe Test & Dicing Wafer & Die Cost
o Pressure Sensor Die 161 ASIC Front-End Cost MEMS Front-End Cost MEMS Front-End Cost per process steps Total Front-End Cost ASIC/MEMS Back-End 0 : Probe Test & Dicing Wafer & Die Cost
o Component 168 Back-End : Packaging Cost Back-End : Final Test Cost Component Cost
Estimated Price Analysis 172
Company services 176
©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 3
Overview / Introductiono Executive Summaryo Reverse Costing
Methodology
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Executive Summary
• This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost andselling price of the ICM-20789 7-Axis Combo Sensor supplied by InvenSense.
• The ICM-20789 7-axis combo sensor released by InvenSense features a 6-axis device, incorporating a 3-axisgyroscope and a 3-axis accelerometer, and a barometric pressure sensor previously developed by Sensirion in thesame package. Compared with the stand-alone sensor hub, this approach eliminates a package and minimizesboard area requirements.
• The pressure sensor’s MEMS capacitive architecture provides the industry’s lowest noise at the lowest power.Combined with the motion-tracking 6-axis inertial sensor in a small footprint, the device is ideal for a wide range ofmotion tracking applications.
• The inertial MEMS sensor is fabricated with a minimal number of masks and is directly assembled on theapplication-specific integrated circuit (ASIC) by eutectic bonding. Using knowledge obtained by acquiringSensirion’s pressure sensor division, InvenSense was able to design its own pressure sensor. The device is shippedin a 4 mm x 4 mm x 1.37 mm land grid array (LGA) package.
• This report includes a detailed technology and cost analysis of the ICM-20789 7-axis motion tracking device. Acomparison with the previous generation of combo sensors from InvenSense is also included in the report.
©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 4
Overview / Introductiono Executive Summaryo Reverse Costing
Methodology
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
The reverse costing analysis is conducted in 3 phases:
Teardown analysis
• Package is analyzed and measured• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking• Setup of the manufacturing process.
Costing analysis
• Setup of the manufacturing environment• Cost simulation of the process steps
Selling price analysis
• Supply chain analysis• Analysis of the selling price
Reverse Costing Methodology
©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 5
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Pressure Sensor Dieo PS Die Cross-Sectiono ASIC/MEMS Dieo MEMS Dieo ASIC Dieo ASIC/MEMS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Synthesis of the Physical Analysis
©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 6
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Pressure Sensor Dieo PS Die Cross-Sectiono ASIC/MEMS Dieo MEMS Dieo ASIC Dieo ASIC/MEMS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package View & Dimensions
4.0 mm
4.0
mm
1.3
7 m
m
• Package: LGA 24-pin
• Dimensions: 4.0 x 4.0 x 1.37 mm
• Pin Pitch: 0.5 mm
• Marking:
IC2789E
AK559LA1
1722
Package Top View©2017 by System Plus Consulting
Package Bottom View©2017 by System Plus Consulting
Package Side View©2017 by System Plus Consulting
©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 7
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Pressure Sensor Dieo PS Die Cross-Sectiono ASIC/MEMS Dieo MEMS Dieo ASIC Dieo ASIC/MEMS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package Opening
©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 8
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Pressure Sensor Dieo PS Die Cross-Sectiono ASIC/MEMS Dieo MEMS Dieo ASIC Dieo ASIC/MEMS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package Cross-Section
©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 9
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Pressure Sensor Dieo PS Die Cross-Sectiono ASIC/MEMS Dieo MEMS Dieo ASIC Dieo ASIC/MEMS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Pressure Sensor – Die View & Dimensions
©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 10
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Pressure Sensor Dieo PS Die Cross-Sectiono ASIC/MEMS Dieo MEMS Dieo ASIC Dieo ASIC/MEMS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Pressure Sensor – Die Details
©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 11
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Pressure Sensor Dieo PS Die Cross-Sectiono ASIC/MEMS Dieo MEMS Dieo ASIC Dieo ASIC/MEMS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Pressure Sensor – Die Cross-Section – TSVs
©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 12
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Pressure Sensor Dieo PS Die Cross-Sectiono ASIC/MEMS Dieo MEMS Dieo ASIC Dieo ASIC/MEMS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Pressure Sensor – Die Cross-Section – Sensor
©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 13
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Pressure Sensor Dieo PS Die Cross-Sectiono ASIC/MEMS Dieo MEMS Dieo ASIC Dieo ASIC/MEMS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
IMU 6-Axis – Die View & Dimensions
©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 14
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Pressure Sensor Dieo PS Die Cross-Sectiono ASIC/MEMS Dieo MEMS Dieo ASIC Dieo ASIC/MEMS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
IMU 6-Axis – MEMS Sensing Area – Gyroscope
©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 15
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Pressure Sensor Dieo PS Die Cross-Sectiono ASIC/MEMS Dieo MEMS Dieo ASIC Dieo ASIC/MEMS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
MEMS Die Cross-Section – Sealing
©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 16
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison o Packageo ASIC Dieo MEMS Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Comparison with MP67B, ICM-30630 & 6-Axis IMU in iPhone 7 Plus
©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 17
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flowo Global Overviewo Pressure Sensor Processo ASIC Front-End Processo MEMS Front-End Processo Packaging Process
Cost Analysis
Selling Price Analysis
About System Plus
Pressure Sensor MEMS/ASIC Front-End Process Flow
©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 18
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flowo Global Overviewo Pressure Sensor Processo ASIC Front-End Processo MEMS Front-End Processo Packaging Process
Cost Analysis
Selling Price Analysis
About System Plus
Pressure Sensor MEMS – Sensor Process Flow 1/3
©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 19
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flowo Global Overviewo Pressure Sensor Processo ASIC Front-End Processo MEMS Front-End Processo Packaging Process
Cost Analysis
Selling Price Analysis
About System Plus
MEMS Front-End Process Flow
©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 20
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yieldso ASIC/MEMS Wafer & Die
Costo Pressure sensor Wafer &
Die Costo Back-End Costo Component Cost
Selling Price Analysis
About System Plus
ASIC/MEMS Wafer & Die Cost
©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 21
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yieldso ASIC/MEMS Wafer & Die
Costo Pressure sensor Wafer &
Die Costo Back-End Costo Component Cost
Selling Price Analysis
About System Plus
Pressure Sensor ASIC Front-End Cost
©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 22
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yieldso ASIC/MEMS Wafer & Die
Costo Pressure sensor Wafer &
Die Costo Back-End Costo Component Cost
Selling Price Analysis
About System Plus
Pressure Sensor Wafer & Die Cost
©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 23
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yieldso ASIC/MEMS Wafer & Die
Costo Pressure sensor Wafer &
Die Costo Back-End Costo Component Cost
Selling Price Analysis
About System Plus
Component Cost
©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 24
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysiso Financial Ratioso Manufacturer Price
About System Plus
InvenSense 7-Axis Combo Sensor Estimated Manufacturer Price
©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 26
COMPANYSERVICES
©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 27
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Pluso Company serviceso Feedbackso Contacto Legal
Business Models Fields of Expertise
Custom Analyses(>130 analyses per year)
Reports(>40 reports per year)
Costing Tools
Trainings
©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 28
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Pluso Company serviceso Feedbackso Contacto Legal
Contact
Headquarters21 rue La Noue Bras de Fer44200 NantesFRANCE+33 2 40 18 09 [email protected]
Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]
America Sales OfficeSteve [email protected]
www.systemplus.fr
Asia Sales OfficeTakashi [email protected]
Mavis WANGGREATER [email protected]
NANTESHeadquarter
FRANKFURT/MAINEuropa Sales Office
LYONYOLE HQ
TOKYOYOLE KK
GREATER CHINAYOLE
PHOENIXYOLE Inc.
KOREAYOLE
Top Related