Resident faculty with labs30
Affiliated faculty~70MATSE, Phys, Chem, MecSE, ECE, BioE, Aero
Business OfficeFinancial operationsGrants application / support
Computer FacilitiesEngineering IT
Store roomLab/office suppliesShipping/receiving
Lab safety engineerCoordination with CoE safety and DRS
MRL central research facilitiesOpen user access, 24/7/365Shared instrumentation20 staff140 instruments> $ 50M set of tools
Main instrumentation cores:• Electron Microscopy• Nanofabrication • Scanning Probe• Surface Science• Optical Spectroscopy• X‐ray• Soft Materials Lab
IllionoisMaterials Research Laboratory
College of EngineeringUniversity of Illinois at Urbana‐Champaign
NanoMFG nodeWorkshop
Feb 26‐27, 2019
MRL – Central Research Facilities instrumentation cores:
Electron Microscopy(including bio analysis services)
Micro/Nanofabrication facility(including mask fabrication services)
Scanning Probe
Microscopy
X‐ray analysis
Laser and spectroscopy
facility
Surface Analysis Thermal Properties and
Soft Materials Analysis
MRL – Central Research Facilities:
FY 2018: • 949 active users• 76,646 hours of instrument time
Grad students(552)
Undergrad students
(142)
Senior researchers(255)
Educational missionResearch trainingResearch support
24/7 open accessTraining, staff assist20 research scientist, 3 engineersLowest user fees in the countryBioMaker, MRSEC, IQUIST
Laser & Spectroscopy: Keyence VX1000 Laser Confocal 3D optical profiler Neaspec AFM/IR System Nanophoton Confocal Raman Microscope Zeiss Live 7 high-speed scanning confocal microscope Woollam V-VASE Spectroscopic Ellipsometer Gaertner L116C Ellipsometer Ti: sapphire Laser Pump/probe systems for Time-Domain
Thermo Reflectance Witec AFM/SNOM/Confocal Microscope Thermo Nexus 670 FTIR Optronic Laboratories OL750 Spectroradiometer (solar cell
and light detector QE measurement system) Agilent Cary 5000 Spectrophotometer Varian Cary 5G Spectrophotometer Polarizing/DIC Inverted Materials Microscope Time-resolved/Low Temperature Photoluminescence Sum Frequency Generation Rame-Hart Model 260 Contact Angle Goniometer Solar Simulator (based on a 300W Xe lamp)
NanophotonConfocal Raman 11 Microscope
Neaspec AFM/FTIR NSOM
~ 10‐500 Mb
~ 3‐5 Mb
~ 1‐5 Mb
~ 0.1‐10 Mb
~ 0.5‐100 Mb
~ 10‐100 Kb
~ 100 Kb
<50 Kb
<5 Kb
<10 Kb
<300 Kb
Accelerators: NEC Pelletron (RBS analysis) HV van de Graaf (ion implantation)
Surface Analysis: Kratos AXIS ULTRA XPS (2 systems) PHI 5400 XPS PHI Trift III TOF-SIMS PHI 660 Auger Spectrometer CAMECA LEAP 5000 XS Atom Probe
Tomography (soon)
NEC Pelletron accelerator for RBS
PHI 660 Auger system
Kratos XPS
PHI TOF-SIMS
< 1 Mb
~ 500 Mb
Nd O
Nd distribution near grain boundary in CeO2:NdD.R. Diercks et al, J. Mat. Chem A4, 5167 (2016)
Coming soon to theMRL Central Research Facilities
CAMECA LEAP 5000XS
Atom Probe Tomography
• 3D image + chemical composition at atomic scale
• Resolution: 0.3‐0.5 nm lateral, 0.1‐0.3 nm depth
www.cameca.com
www.cameca.comNiFeAlCr‐based superalloy
Malvern Zetasizer633 nm laser, reflective lightparticle sizes 0.6 nm – 6 m (in solution)
TA Q50 Thermogravimetric Analysis (TGA)Weight change vs. temperature, timeBalance sensitivity 0.1 mg. capacity 1 gfrom RT up to 1000 oC, inert or reactive gas
TA D2500 Differential Scanning Calorimeter (DSC)Heat flow difference between sample and reference heated at same temperaturesPhase transitions, chemical reactions, glass transitions, crystallization, melting, cure kinetics-150 oC to 400 oC (TGA analysis required first)
Shimadzu DTA50 Differential Thermal Analyzer (DTA)Temperature difference between sample and reference, same heat conditionsfrom RT up to 1400 oC, under nitrogen gas(TGA analysis required first)
TA Q800 Dynamical Mechanical Analysis (DMA)Young’s module, viscosity vs. temperature, timeTensile or cantilever bending testing-150 oC to 600 oC
Tosoh HLC‐8320 Size Exclusion Chromatography (SEC, GPC)Molecular mass analysis, from RT up to 50oCRI refractive index change detectorSolvents THF, DMF, NMP, etc.
Bio services:microtoming, embedding, staining, sample prep including cryo EMOptical and electron microscopy
TA Instruments Discovery 2500 DSC
Soft Materials Analysis:
Malvern Zetasizer
TA Q800 DMA
Tosoh EcoGPC
~ 1 Mb
~ 100 Kb
~ 3 Mb
~ 1 Mb
~ 1 Mb
~ 1 Mb
Scanning Probe Microscopy:
Asylum Cypher AFM Max: lateral 30 x 30 m2, depth 5 mviscoelasticity maps, PFM, blueDrive photothermal, STM
Asylum Research MFP‐3D AFM (2)Max: lateral 90 x 90 m2, depth 15 mClosed fluid cell, heater up to 300 oC, scanning microwave impedance
Hysitron TI‐950 Tribo‐IndenterLoads: ~ mN to 2.8 N; displacements up to 90 mIndentation, scratch test, nanoECR, fractureRT up to 400 oC
Optics11 Piuma indenter for soft materialsLoads: ~ 10 Pa – 1 GPa, displacements up to 20 mOperates in air or in fluids
Sloan Dektak3 ST profilersurface profiler using a diamond-tipped stylusmeasurable height range: few nm to 105 m
Asylum Research Cypher AFM
< 5 Mb
PANalytical X’PertMRD XRD
X-ray Scattering:
Bruker D8 Advance with Eiger2 areal detector and HKT1200N hot stage RT to 1200oC
PANalytical X’pert MRD (2)
DHS900 dome hot stage for X’pert systems
Siemens/Bruker D5000 powder XRD
Dexco Multi-wire Real Time Laue
Forvis Small Angle X-ray Scattering with Pilatus 300 Detector and in-situ capabilities
Shimadzu 7000 ED x-ray fluorescence system
Bruker D8 Advance
Forvis SAXS/WAXS
< 1 Mb
Nanoscribe Photonic ProGT 3D printer
Micro/Nanofabrication facility: 1500 sq. ft. class-100 clean room with spinners, optical aligners
and facilities for optical lithography. Raith eLine e-beam lithography system 600 sq. ft. class-100 clean room for e-beam lithography preparation Nanoscribe 3D printer with sub-micron resolution Sputtering deposition systems (4) E-beam evaporators (3) ALD systems (2) PECVD (2) Reactive Ion Etching (4) Furnaces and RTA facilities Mask fabrication facilities and services Low-temperature device testing and parameter analyzer
AJA Orion-8 Magnetron Sputtering System
Kurt J. Lesker Nano36 thermal evaporator
Raith eLine E-beam Lithography System
< 10 Mb
< 10 Mb
< 20 Mb
~ 100 Kb
Transmission Electron Microscopy: FEI Themis Z analytical (S)TEM Hitachi H-9500 DE-TEM JEOL 2200FS (S)TEM JEOL 2010F STEM JEOL 2100 Cryo TEM JEOL 2010 LaB6 TEM Hitachi H600 TEM
Scanning Electron Microscopy: JEOL 6060LV SEM Hitachi S-4800 SEM Hitachi S-4700 SEM JEOL 7000F Analytical SEM FEI Helios Nanolab 600i Dual Beam FIB FEI Scios 2 Dual Beam FIB FEI Strata 235 Dual Beam FIB
Sample Prep tools: Gatan PECSII Pro ion beam polisher Gatan PIPS ion miller (2) FEI Vitrobot Leica Cryo Ultramicrotome UC6/FC6 Ultramicrotomes and bio services SEM/TEM sample prep labs (3)
Hitachi H9500 DETEM
ThermoScios 2DB FIB
ThermoThemis Z TEM/STEM
~ Tb
~ 1 – 30 Mb
~ 10 – 100 Mb
Microfluidics synthesis of gene silencing cubosomes
Lipide/ethanol
Staggered Herringbone Mixer Microfluidics device fabricated in the MRL Microfab(MRL in‐house mask fabrication service, then cleanroom work using Su‐8 photoresist, MJB3 mask aligner, UV exposure, Harrick Plasma cleaner, PDMS mold, etc.)
EthanolRemoval
~ 200 m
Small monodisperseethanol‐in‐water droplets
Monodisperse small ~ 200 nm cubosomes in t<15min
H. Kim, J. Sung, Y. Chang, A. Alfeche, C. Leal ACS Nano (2018)
Cubosomes: lipid‐based NPs where membranes and pores form a cubic lattice
Cryo‐EM of gene silencing cubosomes H. Kim, J. Sung, Y. Chang, A. Alfeche, C. Leal ACS Nano (2018)
MRL Cryo TEM images for various times “t” of ethanol removal:
50 nm dropletsmonodispersive
emulsion
Droplets fusingin strings and
clusters
Membranes fused. NPs rim of lipid bilayer structure
Ethanol‐depleted membranes in primitive cubic
structure.
Cubosomes: cubic cell in a lipid leafletYellow: bilayer midplanesBlue: water channels
SAXS
Cryo‐EM of gene silencing cubosomes H. Kim, J. Sung, Y. Chang, A. Alfeche, C. Leal ACS Nano (2018)
MRL Cryo TEM: gene‐silencing siRNA with Au NP conjugates (markers)
Cryo‐TEM images and electron density maps show that cubosomes can be loaded with siRNA without disrupting the structure. Au‐NP used as markers to
Ordered liquid membrane (green) in a square lattice, and water channels (red)
siRNA‐AuNP
siRNA‐AuNP
Detection limits vs. spot size
Detection limits vs. spot size
Multi‐tools, techniques challenges & opportunities:
‐ Work flow starting from design‐ Integration of steps: design, fabrication, processing, modification and analysis‐ Complementarity of techniques: wider view vs. potential conflicts
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