www.rohm.com
A141
IC PackagesICs
CONTENTS
QFP Packages ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ P. A144
SON / QFN Packages ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ P. A147
SOP Packages ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ P. A150
HSOP Packages ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ P. A152
Small Packages ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ P. A154
Non-Lead Packages ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ P. A154
Power Packages ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ P. A155
BGA Packages ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ P. A157
WL-CSP Packages ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ P. A159
LAPIS Semiconductor Packages
SOP Packages ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ P. A161
QFP Packages ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ P. A164
QFN Packages ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ P. A166
BGA Packages ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ P. A169
ROHM Packages
*�Please check the dimensions of each products in detail.
LAPIS Semiconductor products and ROHM Semiconductor dimensions
products have different although they have a same package name.
A
IC P
ackages
• When ordering, specify the part number.
• Check each code against the tables shown below.
1. A packaging specification is not required for packaging other than taping. (Ex.) BA4558F or BA4558F-DX
2. A packaging specification is required for tape packaging. (Ex.) Example of E2-oriented embossed taping: BA4558F-E2 or BA4558F-DXE2
Part No.
B A
Custom Specification codeAlphabetical symbols specify custom product.Standard product has no symbols.
54 5 -F8
Embossed tape and reel
Embossed tape and reel
Embossed tape and reel
Embossed tape and reel
Pin 1 fed last
Pin 1 fed first
Pin 1 fed last
Pin 1 fed first
EXD
Packaging and forming specification
E2
(E1)
TR
(TL)
2
For example
→Leader(first)
Reel
→Leader(first)
Reel
→Leader(first)
(E1)←1pin
Reel
(last
) E21pin→
*Take E2 as standard if no special request is made.
→Leader(first)Re
el(la
st)
(TL)1pin→
TR←1pin
*Take TR as standard if no special request is made.
Ordering information
• Fill in from the left,leaving any extra boxes empty on the right.
●Embossed tape packaging <Package specification name : E2(E1)>Package ordering
unit quantity
Non - LeadGull Wing Packages SOP Packages Power Packages QFP Packages BGA / QFN
1) *:Package specification : TR(TL) 2) Specification differ by package size of WL-CSP 3) WL-CSP Package Specification : E2 (standard)
●Tray packaging
Pin pitch: 0.8 mm Pin pitch: 0.65 mm Pin pitch: 0.5 mm Pin pitch: 0.4 mm Tray quantity
Dimensions(mm) d X e
Tomson Case dimensions(mm) A X B X C
Packageordering
unit quantity
Individualpackagequantity
QFP32 VQFP48C
QFP120
QFP44
QFP-A64, QFP80/T80
-
-
-
-
SQFP160C
SQFP56, SQFP-T52M, SQFP-T64
SQFP80, SQFP-T80C, SQFP100/T100
VQFP208
VQFP176
VQFP144 / T144
VQFP64, VQFP64M, VQFP80, TQFP64V, TQFP80V, HTQFP64V, TQFP48V
VQFP100, VQFP128, TQFP100V, HTQFP100V
- TQFP176U
UQFP160/184
UQFP120, TQFP128U
-
-
-
-
-
-
175×166
322.6×135.9
216×116
256×166
322.6×135.9
201.1×141.05
322.6×135.9
1,000
240
1,000
500
400
200
600
10
10
20
10
10
10
10
100
24
50
50
40
20
60
60×200×200
75×140×338
70×130×510
75×200×290
75×140×338
75×200×290
75×140×338
3×3mm--3,000
*SOP4, *SSOP5/6, *VSOF5, *HVSOF5/6,*MSOP8, MSOP10, *WSOF5/6/6I, *HSON8,*VSON008V2030,VSON008X2030,VSON010X3020,VSON010X3030,VSON010V3030, USON014X3020,VQFN016X3030,VQFN016V3030,WL-CSP (2.8mm□ and under)
VQFN020V4040, VQFN024V4040, VQFN028V5050,VQFN032V5050, UQFN036V5050, UQFN040V5050,WL-CSP (over 2.81mm□)
VQFN056V8080, UQFN064V8080, UQFN068V8080, UQFN088V0100
VQFN040V6060, UQFN044V6060,UQFN046V4565, UQFN048V6060
VQFN048V7070,UQFN048V7070, UQFN056V7070
TSSOP-B8
-4×4mm,5×5mm-2,500
SOP8/14/16, SSOP-A16,TSSOP-C10J, TSSOP-B14J SSOP-B8/14/16/20, SOP-J8/14,HTSSOP-B20/28, HTSOP-J8, TSSOP-B8J, HTSSOP-B8J, TSSOP-C30
6×6mm-2,000
SOP18/20/22/24, HTSSOP-B30,SSOP-A20/24/32, SSOP-B24/28/40, HTSSOP-C48,HTSSOP-B24/40, HSOP25, TSSOP-C44
*HRP5/7, TO252S-3/5,SOT223-4
--8×8mm, 9×9mm,
10×10mmQFP44, VQFP64, VQFP80, UQFP100,TQFP64V
1,000
TO220CP-3/V5,TO263-3/5- -VQFP100-500
UQFP64M, UQFP80, UQFP100, TQFP64U
- 7×7mmQFP32, VQFP48C, HTQFP48V UQFP64,TQFP64U
1,500SOP28, SSOP-A44,HTSSOP-A44/B54/A44R/B54RHSOP28/M28/M36
--5,000*SSON004X1216SSON004X1010 - -
--4,000 USON016X3315,WSON008X2120
- -
Part No. ExplanationPlease refer packages from page, A160 for LAPIS Semiconductor products.
A142
ICs
IC Packages (ROHM)
www.rohm.com
▶Part No. Explanation
A
IC P
ackages
• When ordering, specify the part number.
• Check each code against the tables shown below.
1. A packaging specification is not required for packaging other than taping. (Ex.) BA4558F or BA4558F-DX
2. A packaging specification is required for tape packaging. (Ex.) Example of E2-oriented embossed taping: BA4558F-E2 or BA4558F-DXE2
Part No.
B A
Custom Specification codeAlphabetical symbols specify custom product.Standard product has no symbols.
54 5 -F8
Embossed tape and reel
Embossed tape and reel
Embossed tape and reel
Embossed tape and reel
Pin 1 fed last
Pin 1 fed first
Pin 1 fed last
Pin 1 fed first
EXD
Packaging and forming specification
E2
(E1)
TR
(TL)
2
For example
→Leader(first)
Reel
→Leader(first)
Reel
→Leader(first)
(E1)←1pin
Reel
(last
) E21pin→
*Take E2 as standard if no special request is made.
→Leader(first)
Reel
(last
)
(TL)1pin→
TR←1pin
*Take TR as standard if no special request is made.
Ordering information
• Fill in from the left,leaving any extra boxes empty on the right.
●Embossed tape packaging <Package specification name : E2(E1)>Package ordering
unit quantity
Non - LeadGull Wing Packages SOP Packages Power Packages QFP Packages BGA / QFN
1) *:Package specification : TR(TL) 2) Specification differ by package size of WL-CSP 3) WL-CSP Package Specification : E2 (standard)
●Tray packaging
Pin pitch: 0.8 mm Pin pitch: 0.65 mm Pin pitch: 0.5 mm Pin pitch: 0.4 mm Tray quantity
Dimensions(mm) d X e
Tomson Case dimensions(mm) A X B X C
Packageordering
unit quantity
Individualpackagequantity
QFP32 VQFP48C
QFP120
QFP44
QFP-A64, QFP80/T80
-
-
-
-
SQFP160C
SQFP56, SQFP-T52M, SQFP-T64
SQFP80, SQFP-T80C, SQFP100/T100
VQFP208
VQFP176
VQFP144 / T144
VQFP64, VQFP64M, VQFP80, TQFP64V, TQFP80V, HTQFP64V, TQFP48V
VQFP100, VQFP128, TQFP100V, HTQFP100V
- TQFP176U
UQFP160/184
UQFP120, TQFP128U
-
-
-
-
-
-
175×166
322.6×135.9
216×116
256×166
322.6×135.9
201.1×141.05
322.6×135.9
1,000
240
1,000
500
400
200
600
10
10
20
10
10
10
10
100
24
50
50
40
20
60
60×200×200
75×140×338
70×130×510
75×200×290
75×140×338
75×200×290
75×140×338
3×3mm--3,000
*SOP4, *SSOP5/6, *VSOF5, *HVSOF5/6,*MSOP8, MSOP10, *WSOF5/6/6I, *HSON8,*VSON008V2030,VSON008X2030,VSON010X3020,VSON010X3030,VSON010V3030, USON014X3020,VQFN016X3030,VQFN016V3030,WL-CSP (2.8mm□ and under)
VQFN020V4040, VQFN024V4040, VQFN028V5050,VQFN032V5050, UQFN036V5050, UQFN040V5050,WL-CSP (over 2.81mm□)
VQFN056V8080, UQFN064V8080, UQFN068V8080, UQFN088V0100
VQFN040V6060, UQFN044V6060,UQFN046V4565, UQFN048V6060
VQFN048V7070,UQFN048V7070, UQFN056V7070
TSSOP-B8
-4×4mm,5×5mm-2,500
SOP8/14/16, SSOP-A16,TSSOP-C10J, TSSOP-B14J SSOP-B8/14/16/20, SOP-J8/14,HTSSOP-B20/28, HTSOP-J8, TSSOP-B8J, HTSSOP-B8J, TSSOP-C30
6×6mm-2,000
SOP18/20/22/24, HTSSOP-B30,SSOP-A20/24/32, SSOP-B24/28/40, HTSSOP-C48,HTSSOP-B24/40, HSOP25, TSSOP-C44
*HRP5/7, TO252S-3/5,SOT223-4
--8×8mm, 9×9mm,
10×10mmQFP44, VQFP64, VQFP80, UQFP100,TQFP64V
1,000
TO220CP-3/V5,TO263-3/5- -VQFP100-500
UQFP64M, UQFP80, UQFP100, TQFP64U
- 7×7mmQFP32, VQFP48C, HTQFP48V UQFP64,TQFP64U
1,500SOP28, SSOP-A44,HTSSOP-A44/B54/A44R/B54RHSOP28/M28/M36
--5,000*SSON004X1216SSON004X1010 - -
--4,000 USON016X3315,WSON008X2120
- -
Package Ordering UnitsPlease refer packages from page, A160 for LAPIS Semiconductor products.
A143
ICs
IC Packages (ROHM)
www.rohm.com
▶Package Ordering Units ▶▶Embossed tape packaging <Package specification name : E2(E1)>▶▶Tray packaging
A
IC P
ackages
SQFP <Pin Pitch : 0.65mm>
VQFP <Pin Pitch : 0.5mm>
TQFPV <Pin Pitch : 0.5mm>
QFP <Pin Pitch : 0.8mm>
S
S
S0.08
S
M
S
9.0±0.3
7.0±0.2
0.4±0.1
0.15±0.1
9.0±
0.3
7.0±
0.2
32
25 16
9
81
1724
0.15
0.4
0.8
0.05
1.45
±0.
05
14.0±0.3
0.15±0.1
0.35±0.1
10.0±0.2
14.0
±0.3
2.15
±0.1
10.0
±0.2
1 11
2333
12
2234
44
0.8
0.05 0.15
1.2
14.0±0.3
12.0±0.2
0.65±0.1 0.3±0.1
0.125±0.1
14.0
±0.3
1.4±
0.1
0.1±
0.1
12.0
±0.2
31.2±0.3
0.15±0.1
0.3±0.1
28.0±0.2
31.2
±0.3
3.3±
0.1
28.0
±0.2
32
64 17
49
48 33
1 16
0.15
0.5
4041
80121
160
120 81
0.8
0.150.1 0.65
1
0.5±
0.15
7.0±0.1
7.0
±0.1
0.5±0.1
1.0±
0.2
9.0±0.2
9.0
±0.2 2437
48
36 25
121
13
1PIN MARK
0.75
1.6M
AX
0.75
0.1
±0.0
5
10.0±0.1
10.0
±0.1
1PIN MARK
1.25
49 32
1
1.0
±0.2
64
1.25
33
1.6M
AX
0.5
±0.1
5
1.4
±0.0
5
17
0.5±0.1
12.0±0.2
12.0
±0.2
16
48
1PIN MARK
1
1.6M
AX
14.0±0.1
14.0
±0.1
1.0
±0.2
0.5
±0.1
5
0.5±0.1
26100
25
51
76
1.0
50
1.0
75
16.0±0.2
16.0
±0.2
1.4
±0.0
5
0.1
±0.0
5
72
37
1 36
144
109
73108
M0.08S0.08
20.0
±0.1
1PIN MARK
2.2M
AX
1.25
1.25
0.1
±0.0
5
20.0±0.1
2.0
±0.0
5
22.0±0.2
0.5±0.1
0.5
±0.1
5
-0.030.17 +0.05
0.2-0.04+0.05
22.0
±0.2
1.0
±0.2
176
133
132 89
1 44
45
88
1PIN MARK
1.25
1.6M
AX
1.25
26.0
±0.2
0.1
±0.0
5
24.0±0.126.0±0.2
0.5±0.1
12.0±0.3
10.0±0.2
0.2±0.1
0.125±0.1
12.0
±0.3
10.0
±0.2
1.0±
0.11.
2Max
.
0.1 ±
0.1
0.5
±0.1
524.0
±0.1
1.4
±0.0
5
1.0
±0.2
521
208
157
156 105
53
104
1.251PIN MARK
30.6±0.2
1.3
±0.2
30.6
±0.2
3.5M
AX
3.3
±0.0
5
0.5±0.1
28.0±0.1
0.1
±0.0
528
.0±0
.1
0.5
±0.1
5
1.25
S0.08
±4°
37
48
1 12
24
13
36 25
1.2M
AX
0.5
0.75
1PIN MARK0.75
0.5±
0.15
1.0 ±
0.2
9.0±0.27.0±0.1
9.0±
0.2
1.0±
0.05
0.1±
0.05
7.0±
0.1
0.1
3348
161
0.5
0.5
49
64
32
17
0.08
0.1±
0.1
1.0±
0.11.
2Max
.
0.5
80
61
1 20
21
40
4160
14.0±0.3
12.0±0.2
0.125±0.1
0.2±0.1 0.5
12.0
±0.2
14.0
±0.3
0.1
75 51
50
26
251
76
100
14.0±0.2
16.0±0.3
14.0
±0.2
16.0
±0.3
0.5
0.5
0.1±
0.1
1.0±
0.11.
2Max
. 0.125±0.1
0.2±0.1
0.145+0.05-0.03
0.2+0.05-0.04 M0.08
0.145+0.05-0.03
S0.08
1.4
±0.0
50.
1±0
.05
0.2+0.05-0.04 M0.08
+6°4°–4° +6°4°–4°
-0.030.145+0.05
M0.08
S0.080.2 -0.04
+0.05
-0.030.17 +0.05-0.030.17 +0.05
M0.080.22 -0.04+0.05
S0.08
M0.080.2 -0.04+0.05
-0.030.145+0.05
+64 –4
0.22-0.04+0.05
S0.08
M0.08
+6°4°–4°+7.5°2.5°–2.5°
0.080.081.
6MA
X
1.25
1PIN MARK1
1.4
±0.0
5
2180 0.5
±0.1
51.
0±0
.2
4061
1.25
0.1±
0.05
0.5±0.1
0.145
41
20
60
+0.05-0.03
0.2+0.05-0.04
12.0±0.1
14.0±0.2
12.0
±0.1
14.0
±0.2
72
37
1 36
144
109
73108
1PIN MARK
1.6M
AX
1.25
1.25
22.0±0.2
0.5
±0.1
5
1.4
±0.0
50.
1±0
.05
0.5±0.1
1.0
±0.222
.0±0
.2
20.0±0.1
20.0
±0.1
-0.030.17 +0.05
S0.08M0.080.2 -0.04
+0.05
+6°4°–4°
+6.5°3.5°–3.5°
+6.5°3.5°–3.5°4°
12.0±0.310.0±0.2
39 27
26
14
40
52
13
0.150.65
1
12.0
±0.
310
.0±
0.2
1.4±
0.1
0.1±
0.1
0.3±0.1
0.125±0.1
0.5
Tray:1,000pcsEmbossed carrier tape:1,500pcs
Tray:1,000pcsEmbossed carrier tape:1,000pcs
Tray:1,000pcsEmbossed carrier tape:1,000pcs Tray:1,000pcs Tray:240pcs
Tray:1,000pcsEmbossed carrier tape:1,500pcs
Tray:500pcsEmbossed carrier tape:500pcs
Tray:1,000pcsEmbossed carrier tape:1,000pcs Tray:1,000pcs
Tray:1,000pcsEmbossed carrier tape:1,500pcs
Tray:1,000pcsEmbossed carrier tape:1,000pcs
Tray:1,000pcsEmbossed carrier tape:1,000pcs
Tray:500pcsEmbossed carrier tape:500pcs Tray:600pcs Tray:600pcs
Tray:400pcs Tray:240pcs
VQFP48C VQFP64
VQFP100 VQFP144
VQFP176 VQFP208
VQFP80
VQFP-T144
QFP32 QFP44
SQFP-T52 SQFP-T64 SQFP160C
TQFP48V TQFP64V TQFP80V
TQFP100V
QFP Packages (Unit: mm)
Please refer packages from page, A160 for LAPIS Semiconductor products.
A144
ICs
IC Packages (ROHM)
www.rohm.com
▶QFP Packages ▶▶QFP<Pin Pitch:0.8mm>▶▶SQFP<Pin Pitch:0.65mm>▶▶TQFPV<Pin Pitch:0.5mm>
A
IC P
ackages
SQFP <Pin Pitch : 0.65mm>
VQFP <Pin Pitch : 0.5mm>
TQFPV <Pin Pitch : 0.5mm>
QFP <Pin Pitch : 0.8mm>
S
S
S0.08
S
M
S
9.0±0.3
7.0±0.2
0.4±0.1
0.15±0.1
9.0±
0.3
7.0±
0.2
32
25 16
9
81
1724
0.15
0.4
0.8
0.05
1.45
±0.
05
14.0±0.3
0.15±0.1
0.35±0.1
10.0±0.2
14.0
±0.3
2.15
±0.1
10.0
±0.2
1 11
2333
12
2234
44
0.8
0.05 0.15
1.2
14.0±0.3
12.0±0.2
0.65±0.1 0.3±0.1
0.125±0.1
14.0
±0.3
1.4±
0.1
0.1±
0.1
12.0
±0.2
31.2±0.3
0.15±0.1
0.3±0.1
28.0±0.2
31.2
±0.3
3.3±
0.1
28.0
±0.2
32
64 17
49
48 33
1 16
0.15
0.5
4041
80121
160
120 81
0.8
0.150.1 0.65
1
0.5±
0.15
7.0±0.1
7.0
±0.1
0.5±0.11.
0±0.
2
9.0±0.2
9.0
±0.2 2437
48
36 25
121
13
1PIN MARK
0.75
1.6M
AX
0.75
0.1
±0.0
5
10.0±0.1
10.0
±0.1
1PIN MARK
1.25
49 32
1
1.0
±0.2
64
1.25
33
1.6M
AX
0.5
±0.1
5
1.4
±0.0
5
17
0.5±0.1
12.0±0.2
12.0
±0.2
16
48
1PIN MARK
1
1.6M
AX
14.0±0.1
14.0
±0.1
1.0
±0.2
0.5
±0.1
5
0.5±0.1
26100
25
51
76
1.0
50
1.0
75
16.0±0.2
16.0
±0.2
1.4
±0.0
5
0.1
±0.0
5
72
37
1 36
144
109
73108
M0.08S0.08
20.0
±0.1
1PIN MARK
2.2M
AX
1.251.
25
0.1
±0.0
520.0±0.1
2.0
±0.0
5
22.0±0.2
0.5±0.10.
5±0
.15
-0.030.17 +0.05
0.2-0.04+0.05
22.0
±0.2
1.0
±0.2
176
133
132 89
1 44
45
88
1PIN MARK
1.25
1.6M
AX
1.25
26.0
±0.2
0.1
±0.0
5
24.0±0.126.0±0.2
0.5±0.1
12.0±0.3
10.0±0.2
0.2±0.1
0.125±0.1
12.0
±0.3
10.0
±0.2
1.0±
0.11.
2Max
.
0.1 ±
0.1
0.5
±0.1
524.0
±0.1
1.4
±0.0
5
1.0
±0.2
521
208
157
156 105
53
104
1.251PIN MARK
30.6±0.2
1.3
±0.2
30.6
±0.2
3.5M
AX
3.3
±0.0
5
0.5±0.1
28.0±0.1
0.1
±0.0
528
.0±0
.1
0.5
±0.1
5
1.25
S0.08
±4°
37
48
1 12
24
13
36 25
1.2M
AX
0.5
0.75
1PIN MARK0.75
0.5±
0.15
1.0 ±
0.2
9.0±0.27.0±0.1
9.0±
0.2
1.0±
0.05
0.1±
0.05
7.0±
0.1
0.1
3348
161
0.5
0.5
49
64
32
17
0.08
0.1±
0.1
1.0±
0.11.
2Max
.
0.5
80
61
1 20
21
40
4160
14.0±0.3
12.0±0.2
0.125±0.1
0.2±0.1 0.5
12.0
±0.2
14.0
±0.3
0.1
75 51
50
26
251
76
100
14.0±0.2
16.0±0.3
14.0
±0.2
16.0
±0.3
0.5
0.5
0.1±
0.1
1.0±
0.11.
2Max
. 0.125±0.1
0.2±0.1
0.145+0.05-0.03
0.2+0.05-0.04 M0.08
0.145+0.05-0.03
S0.08
1.4
±0.0
50.
1±0
.05
0.2+0.05-0.04 M0.08
+6°4°–4° +6°4°–4°
-0.030.145+0.05
M0.08
S0.080.2 -0.04
+0.05
-0.030.17 +0.05-0.030.17 +0.05
M0.080.22 -0.04+0.05
S0.08
M0.080.2 -0.04+0.05
-0.030.145+0.05
+64 –4
0.22-0.04+0.05
S0.08
M0.08
+6°4°–4°+7.5°2.5°–2.5°
0.080.081.
6MA
X
1.25
1PIN MARK1
1.4
±0.0
5
2180 0.5
±0.1
51.
0±0
.2
4061
1.25
0.1±
0.05
0.5±0.1
0.145
41
20
60
+0.05-0.03
0.2+0.05-0.04
12.0±0.1
14.0±0.2
12.0
±0.1
14.0
±0.2
72
37
1 36
144
109
73108
1PIN MARK
1.6M
AX
1.25
1.25
22.0±0.2
0.5
±0.1
5
1.4
±0.0
50.
1±0
.05
0.5±0.1
1.0
±0.222
.0±0
.2
20.0±0.1
20.0
±0.1
-0.030.17 +0.05
S0.08M0.080.2 -0.04
+0.05
+6°4°–4°
+6.5°3.5°–3.5°
+6.5°3.5°–3.5°4°
12.0±0.310.0±0.2
39 27
26
14
40
52
13
0.150.65
1
12.0
±0.
310
.0±
0.2
1.4±
0.1
0.1±
0.1
0.3±0.1
0.125±0.1
0.5
Tray:1,000pcsEmbossed carrier tape:1,500pcs
Tray:1,000pcsEmbossed carrier tape:1,000pcs
Tray:1,000pcsEmbossed carrier tape:1,000pcs Tray:1,000pcs Tray:240pcs
Tray:1,000pcsEmbossed carrier tape:1,500pcs
Tray:500pcsEmbossed carrier tape:500pcs
Tray:1,000pcsEmbossed carrier tape:1,000pcs Tray:1,000pcs
Tray:1,000pcsEmbossed carrier tape:1,500pcs
Tray:1,000pcsEmbossed carrier tape:1,000pcs
Tray:1,000pcsEmbossed carrier tape:1,000pcs
Tray:500pcsEmbossed carrier tape:500pcs Tray:600pcs Tray:600pcs
Tray:400pcs Tray:240pcs
VQFP48C VQFP64
VQFP100 VQFP144
VQFP176 VQFP208
VQFP80
VQFP-T144
QFP32 QFP44
SQFP-T52 SQFP-T64 SQFP160C
TQFP48V TQFP64V TQFP80V
TQFP100V
QFP Packages (Unit: mm)
Please refer packages from page, A160 for LAPIS Semiconductor products.
A145
ICs
IC Packages (ROHM)
www.rohm.com
▶QFP Packages ▶▶VQFP<Pin Pitch:0.5mm>
A
IC P
ackages
SSON-X <Pin Pitch : 0.65mm>
VSON-X <Pin Pitch : 0.5mm> / USON-X <Pin Pitch : 0.4mm>
VSON-V <Pin Pitch : 0.5mm>UQFP <Pin Pitch : 0.4mm>
TQFPU <Pin Pitch : 0.4mm>
HTQFPV <Pin Pitch : 0.5mm>
1.2
1PIN MARK
1.2
0.1
± 0.
05
1.4
± 0.
051.6M
ax.
90 61
60
31
301
91
120
14.0 ± 0.1
16.0 ± 0.2
14.0
± 0
.1
16.0
± 0
.2
0.5
± 0.
15
1.0
± 0.
2
0.4
M0.08
S0.08
0.17-0.04+0.05
M0.08
S0.08
0.17-0.04+0.05
-0.030.145+0.05
-0.030.145+0.05
1.2
1.2
1.6M
ax.
0.1
± 0.
05
1.4
± 0.
05
0.5
± 0.
151.
0 ±
0.2
40
21
201
4160
61
80
10.0 ± 0.1
12.0 ± 0.2
10.0
± 0
.1
12.0
± 0
.2
0.4
0.1
± 0.
051.2M
ax.
1
128
14.0
± 0
.1
16.0
± 0
.2
97
96
14.0 ± 0.1
16.0 ± 0.2
0.4
32
33 0.5
± 0.
15
64
65
1.0
± 0.
05
1.0
± 0.
2
0.8
0.8-0.030.145+0.05
M0.08
S0.08
0.18-0.04+0.05
0.1±
0.05
1.0±
0.051.
2Max
.
0.5
7.0
± 0.
2
9.0
± 0.
3
9.0 ± 0.3
7.0 ± 0.2
64
49
1 16
17
32
3348
0.125 ± 0.1
0.15±0.1
0.4
1.0
1.0
16.0 ± 0.2
14.0 ± 0.1
1PIN MARK
100
50
26
76
75 51
1 25
0.1
± 0.
051.0M
ax.
0.8
± 0.
0516
.0 ±
0.2
14.0
± 0
.1
0.5
± 0.
151.
0 ±
0.2
-0.030.145+0.05
0.5 ± 0.1
M0.08
S0.08
0.2 -0.04+0.05
S
1.0M
ax.
0.1
± 0.
05
0.8
± 0.
05
0.5
12.0
± 0
.2
0.5
± 0.
15
1.0
± 0.
2
10.0
± 0
.1
1.25
32
3348
49
64
11.25
16
17
12.0 ± 0.210.0 ± 0.1
1PIN MARK -0.030.145+0.05
M0.08
S0.08
0.2 -0.04+0.05
+6°4° –4°+6°4° –4°
+6°4° –4°
+6.5°3.5° –3.5°
+7°3° –3°
0.08
1.6M
AX
0.5
1PIN MARK1
1.4
±0.0
5
1764 0.6±
0.15
1.0
±0.2
3249
0.5
0.1±
0.05
0.18±0.050.4
0.145±0.055
33
16
487.0±0.1
9.0±0.2
7.0
±0.1
9.0
±0.2
+6°4°–4°
0.08
S
S0.08
S
S
S
S0.08
0.02
+0.
03-
0.02
1.0M
AX
(0.2
2)
3.0±
0.1
2.0±0.1
1PIN MARK
5
1
8
4
0.25 +0.05-0.04
1.4±
0.1
C0.25
0.25
1.5±0.1
0.5
0.3±
0.1
34
1 2
0.07
±0.1
3-C0.18
R0.05
45°
0.65±0.05
0.32
±0.1 0.4
8±0.0
5
0.48±0.05
0.25
±0.1
0.25±0.05
1.0±0.1
1.0±
0.1
1PIN MARK
0.6M
AX
S0.05
S
(0.1
2)
0.02
+0.
03-0
.02
34
21
0.65±0.1
0.75±0.1
0.2
±0.1
0.8
±0.1
0.2 +0.05-0.04
1PIN MARK
1.2±0.1
1.6
±0.1
0.6M
AX
(0.1
2)
0.02
+0.
03-0
.02
2.0 ± 0.05
2.0
± 0.
05
1PIN MARK
S0.05
S
0.02
+ 0.
03−
0.02
0.6M
AX
(0.1
2)
0.25 + 0.05− 0.04
58
41
0.3
± 0.
1
1.5 ± 0.1
1.5 ± 0.1
0.5 ± 0.1
0.8
± 0.
1
C0.25
S0.05
3.0 ± 0.1
2.0
± 0.
1
1PIN MARK
S
0.02
+ 0.
03−
0.02
0.6M
AX
(0.1
2)
0.25 + 0.05− 0.04
610
51
0.4
± 0.
1
2.0 ± 0.1
2.39 ± 0.1
0.5 ± 0.1
0.64
± 0
.1
C0.2
0.21+ 0.05− 0.04
S0.05
0.6M
AX S
0.02
+ 0.
03−
0.02
(0.1
2)
3.3 ± 0.1
1.5
± 0.
1
1PIN MARK
0.25
± 0
.1
C0.252.8 ± 0.1
2.9 ± 0.1
0.2 + 0.05− 0.04
1 8
916
0.6
± 0.
1
0.4 ± 0.1
8
1 7
14
1PIN MARK
(0.1
2)
0.3
C0.35
2.0
± 0.
1
3.0 ± 0.1
2.5 ± 0.1
0.6M
AX
.
0.8±
0.1
0.4
0.02
− 0.
02+
0.03
0.35
± 0
.1
S0.08
S
S0.08
0.6M
AX
(0.1
2)
0.02
+0.
03-
0.02
S
3.0±
0.1
2.0±0.1
1PIN MARK
5
1
8
4
0.25 +0.05-0.04
1.4 ±
0.1
C0.25
0.25
1.5±0.1
0.5
0.3±
0.1
S
S0.08
3.0 ± 0.1
3.0
± 0.
1
1PIN MARK
0.02
+ 0.
03−
0.02
1.0M
AX
(0.2
2)
610
51
0.4
± 0.
1
0.5C0.25
2.0 ± 0.1
1.2
± 0.
1
0.5 0.25 + 0.05− 0.04
3.0 ± 0.1
3.0
± 0.
1
1PIN MARK
610
51
0.4
± 0.
1
0.5C0.25
2.0 ± 0.1
1.2
± 0.
10.5 0.25 + 0.05
− 0.04
S
S0.08
0.02
+ 0.
03−
0.02
0.6M
AX
(0.1
2)
36 2524
17
121
48
37
0.751PIN MARK
9.0 ± 0.2
9.0
± 0.
2
0.8
± 0.
051.0M
AX
7.0 ± 0.1
(4.4
)
0.1
± 0.
05
7.0
± 0.
1
0.5
0.75
(4.4)
0.2 -0.04+0.05
S0.08M0.08
0.5
± 0.
15
1.0
± 0.
2
-0.030.145+0.05S
+6°4° –4°
Tray:1,000pcsEmbossed carrier tape:1,500pcs
Tray:1,000pcsEmbossed carrier tape:1,000pcs
Tray:1,000pcsEmbossed carrier tape:1,500pcs Tray:500pcs
Tray:500pcs
Tray:1,000pcsEmbossed carrier tape:1,500pcs
Tray:1,000pcsEmbossed carrier tape:1,000pcs Tray:500pcs
Embossed carrier tape:5,000pcs
Embossed carrier tape:4,000pcs Embossed carrier tape:3,000pcs Embossed carrier tape:3,000pcs
Embossed carrier tape:3,000pcs Embossed carrier tape:3,000pcs Embossed carrier tape:4,000pcs
Embossed carrier tape:5,000pcs Embossed carrier tape:3,000pcs Embossed carrier tape:3,000pcs
VSON008V2030 VSON010V3030SSON004X1010 SSON004X1216
VSON008X2030
VSON010X3030 USON014X3020 USON016X3315
UQFP120
UQFP80UQFP64M
VSON008X2020 VSON010X3020
TQFP128UTQFP64U
HTQFP100VHTQFP64VHTQFP48V
QFP Packages (Unit: mm)
Please refer packages from page, A160 for LAPIS Semiconductor products.
A146
ICs
IC Packages (ROHM)
www.rohm.com
▶QFP Packages ▶▶UQFP<Pin Pitch:0.4mm>▶▶TQFPU<Pin Pitch:0.4mm>▶▶HTQFPV<Pin Pitch:0.5mm>
A
IC P
ackages
SSON-X <Pin Pitch : 0.65mm>
VSON-X <Pin Pitch : 0.5mm> / USON-X <Pin Pitch : 0.4mm>
VSON-V <Pin Pitch : 0.5mm>UQFP <Pin Pitch : 0.4mm>
TQFPU <Pin Pitch : 0.4mm>
HTQFPV <Pin Pitch : 0.5mm>
1.2
1PIN MARK
1.2
0.1
± 0.
05
1.4
± 0.
051.6M
ax.
90 61
60
31
301
91
120
14.0 ± 0.1
16.0 ± 0.2
14.0
± 0
.1
16.0
± 0
.2
0.5
± 0.
15
1.0
± 0.
2
0.4
M0.08
S0.08
0.17-0.04+0.05
M0.08
S0.08
0.17-0.04+0.05
-0.030.145+0.05
-0.030.145+0.05
1.2
1.2
1.6M
ax.
0.1
± 0.
05
1.4
± 0.
05
0.5
± 0.
151.
0 ±
0.2
40
21
201
4160
61
80
10.0 ± 0.1
12.0 ± 0.2
10.0
± 0
.1
12.0
± 0
.2
0.4
0.1
± 0.
051.2M
ax.
1
128
14.0
± 0
.1
16.0
± 0
.2
97
96
14.0 ± 0.1
16.0 ± 0.2
0.4
32
33 0.5
± 0.
15
64
65
1.0
± 0.
05
1.0
± 0.
2
0.8
0.8-0.030.145+0.05
M0.08
S0.08
0.18-0.04+0.05
0.1±
0.05
1.0±
0.051.
2Max
.
0.5
7.0
± 0.
2
9.0
± 0.
3
9.0 ± 0.3
7.0 ± 0.2
64
49
1 16
17
32
3348
0.125 ± 0.1
0.15±0.1
0.4
1.0
1.0
16.0 ± 0.2
14.0 ± 0.1
1PIN MARK
100
50
26
76
75 51
1 25
0.1
± 0.
051.0M
ax.
0.8
± 0.
0516
.0 ±
0.2
14.0
± 0
.1
0.5
± 0.
151.
0 ±
0.2
-0.030.145+0.05
0.5 ± 0.1
M0.08
S0.08
0.2 -0.04+0.05
S
1.0M
ax.
0.1
± 0.
05
0.8
± 0.
05
0.5
12.0
± 0
.2
0.5
± 0.
15
1.0
± 0.
2
10.0
± 0
.1
1.25
32
3348
49
64
11.25
16
17
12.0 ± 0.210.0 ± 0.1
1PIN MARK -0.030.145+0.05
M0.08
S0.08
0.2 -0.04+0.05
+6°4° –4°+6°4° –4°
+6°4° –4°
+6.5°3.5° –3.5°
+7°3° –3°
0.08
1.6M
AX
0.5
1PIN MARK1
1.4
±0.0
5
1764 0.6±
0.15
1.0
±0.2
3249
0.5
0.1±
0.05
0.18±0.050.4
0.145±0.055
33
16
487.0±0.1
9.0±0.2
7.0
±0.1
9.0
±0.2
+6°4°–4°
0.08
S
S0.08
S
S
S
S0.08
0.02
+0.
03-
0.02
1.0M
AX
(0.2
2)
3.0±
0.1
2.0±0.1
1PIN MARK
5
1
8
4
0.25 +0.05-0.04
1.4±
0.1
C0.25
0.25
1.5±0.1
0.5
0.3±
0.1
34
1 2
0.07
±0.1
3-C0.18
R0.05
45°
0.65±0.05
0.32
±0.1 0.4
8±0.0
5
0.48±0.05
0.25
±0.1
0.25±0.05
1.0±0.1
1.0±
0.1
1PIN MARK
0.6M
AX
S0.05
S
(0.1
2)
0.02
+0.
03-0
.02
34
21
0.65±0.1
0.75±0.1
0.2
±0.1
0.8
±0.1
0.2 +0.05-0.04
1PIN MARK
1.2±0.1
1.6
±0.1
0.6M
AX
(0.1
2)
0.02
+0.
03-0
.02
2.0 ± 0.05
2.0
± 0.
05
1PIN MARK
S0.05
S
0.02
+ 0.
03−
0.02
0.6M
AX
(0.1
2)
0.25 + 0.05− 0.04
58
41
0.3
± 0.
1
1.5 ± 0.1
1.5 ± 0.1
0.5 ± 0.1
0.8
± 0.
1
C0.25
S0.05
3.0 ± 0.1
2.0
± 0.
1
1PIN MARK
S
0.02
+ 0.
03−
0.02
0.6M
AX
(0.1
2)
0.25 + 0.05− 0.04
610
51
0.4
± 0.
1
2.0 ± 0.1
2.39 ± 0.1
0.5 ± 0.1
0.64
± 0
.1
C0.2
0.21+ 0.05− 0.04
S0.05
0.6M
AX S
0.02
+ 0.
03−
0.02
(0.1
2)
3.3 ± 0.1
1.5
± 0.
1
1PIN MARK
0.25
± 0
.1
C0.252.8 ± 0.1
2.9 ± 0.1
0.2 + 0.05− 0.04
1 8
916
0.6
± 0.
1
0.4 ± 0.1
8
1 7
14
1PIN MARK
(0.1
2)
0.3
C0.35
2.0
± 0.
1
3.0 ± 0.1
2.5 ± 0.1
0.6M
AX
.
0.8±
0.1
0.4
0.02
− 0.
02+
0.03
0.35
± 0
.1
S0.08
S
S0.08
0.6M
AX
(0.1
2)
0.02
+0.
03-
0.02
S
3.0±
0.1
2.0±0.1
1PIN MARK
5
1
8
4
0.25 +0.05-0.04
1.4 ±
0.1
C0.25
0.25
1.5±0.1
0.5
0.3±
0.1
S
S0.08
3.0 ± 0.1
3.0
± 0.
1
1PIN MARK
0.02
+ 0.
03−
0.02
1.0M
AX
(0.2
2)
610
51
0.4
± 0.
1
0.5C0.25
2.0 ± 0.1
1.2
± 0.
1
0.5 0.25 + 0.05− 0.04
3.0 ± 0.1
3.0
± 0.
1
1PIN MARK
610
51
0.4
± 0.
1
0.5C0.25
2.0 ± 0.1
1.2
± 0.
1
0.5 0.25 + 0.05− 0.04
S
S0.08
0.02
+ 0.
03−
0.02
0.6M
AX
(0.1
2)
36 2524
17
121
48
37
0.751PIN MARK
9.0 ± 0.2
9.0
± 0.
2
0.8
± 0.
051.0M
AX
7.0 ± 0.1
(4.4
)
0.1
± 0.
05
7.0
± 0.
1
0.5
0.75
(4.4)
0.2 -0.04+0.05
S0.08M0.08
0.5
± 0.
15
1.0
± 0.
2
-0.030.145+0.05S
+6°4° –4°
Tray:1,000pcsEmbossed carrier tape:1,500pcs
Tray:1,000pcsEmbossed carrier tape:1,000pcs
Tray:1,000pcsEmbossed carrier tape:1,500pcs Tray:500pcs
Tray:500pcs
Tray:1,000pcsEmbossed carrier tape:1,500pcs
Tray:1,000pcsEmbossed carrier tape:1,000pcs Tray:500pcs
Embossed carrier tape:5,000pcs
Embossed carrier tape:4,000pcs Embossed carrier tape:3,000pcs Embossed carrier tape:3,000pcs
Embossed carrier tape:3,000pcs Embossed carrier tape:3,000pcs Embossed carrier tape:4,000pcs
Embossed carrier tape:5,000pcs Embossed carrier tape:3,000pcs Embossed carrier tape:3,000pcs
VSON008V2030 VSON010V3030SSON004X1010 SSON004X1216
VSON008X2030
VSON010X3030 USON014X3020 USON016X3315
UQFP120
UQFP80UQFP64M
VSON008X2020 VSON010X3020
TQFP128UTQFP64U
HTQFP100VHTQFP64VHTQFP48V
SON / QFN Packages (Unit: mm)
Please refer packages from page, A160 for LAPIS Semiconductor products.
A147
ICs
IC Packages (ROHM)
www.rohm.com
▶SON / QFN Packages ▶▶SSON-X<Pin Pitch:0.65mm>▶▶VSON-V<Pin Pitch:0.5mm>▶▶VSON-X<Pin Pitch:0.5mm>/ USON-X<Pin Pitch:0.4mm>
A
IC P
ackages
UQFN-V <Pin Pitch : 0.4mm>VQFN-X <Pin Pitch : 0.5mm>
VQFN-V <Pin Pitch : 0.5mm>
42
1 14
29
2843
56 15
1PIN MARK
Under Development
C0.2
0.50.75
1.0M
AX
(0.2
2)
8.0 ± 0.17.0 ± 0.1
8.0
± 0.
1
7.0
± 0.
1
0.02
-0.
02+
0.03
(0.2
2)
0.02
-0.
02+
0.03
5.7 ± 0.14.7 ± 0.1
5.7
± 0.
1
4.7
± 0.
1
0.4
± 0.
1
0.4
± 0.
1
0.25-0.04+0.050.25-0.04
+0.05
1 12
13
24
2536
37
48
1PIN MARK
C0.2
0.50.75
1.0M
AX
1PIN MARK
1 45
89
13
16
12
0.5C0.2
0.75
(0.2
2)1.0M
AX
3.0 ± 0.14.0 ± 0.1
3.0
± 0.
1
4.0
± 0.
1
0.02
-0.
02+
0.03
1.4 ± 0.1
0.4
± 0.
1
1.4
± 0.
1
0.25-0.04+0.05
1PIN MARK
16
20
15
6
1011
0.5
C0.2
1.0M
AX
(0.2
2)
0.02
-0.
02+
0.03
1 52.1 ± 0.1
1.0
0.4
± 0.
1
2.1
± 0.
1
0.25-0.04+0.05
4.0 ± 0.1
4.0
± 0.
1
1PIN MARK
19
24
18
7
1213
0.5
C0.2
1.0M
AX
(0.2
2)
0.02
-0.
02+
0.03
1 62.4 ± 0.1
0.75
0.4
± 0.
1
2.4
± 0.
1
0.25-0.04+0.05
24
81932
1625
17
1PIN MARK
C0.2
0.50.75
1.0M
AX
5.0 ± 0.1
5.0
± 0.
1
(0.2
2)
0.02
-0.
02+
0.03
3.4 ± 0.1
0.4
± 0.
1
3.4
± 0.
1
0.25-0.04+0.05
1 10
11
2130
31
40
20
1PIN MARK
C0.2
0.50.75
1.0M
AX
6.0 ± 0.1
6.0
± 0.
1
(0.2
2)
0.02
-0.
02+
0.03
3.7 ± 0.1
0.4
± 0.
1
3.7
± 0.
1
0.25-0.04+0.05
2333
34
44 12
1 11
22
1PIN MARK
C0.2
0.41.0
1.0M
AX
6.0 ± 0.1
6.0
± 0.
1
(0.2
2)
0.02
-0.
02+
0.03
3.7 ± 0.1
0.5
± 0.
1
3.7
± 0.
1
0.2-0.04+0.05
1
36
28
27 19
9
18
10
1PIN MARK
C0.2
0.40.9
1.0M
AX
5.0 ± 0.1
5.0
± 0.
1
(0.2
2)
0.02
-0.
02+
0.03
2.7 ± 0.1
0.5
± 0.
1
2.7
± 0.
1
0.2-0.04+0.05
Under Development
1PIN MARK
(0.2
2)
0.02
-0.
02+
0.03
0.2 -0.04+0.05
7.0 ± 0.1
7.0
± 0.
1
42 29
1 14
56
43
15
28
1PIN MARK
C0.2
0.40.9
1.0M
AX
(0.2
2)
0.02
-0.
02+
0.03
4.7 ± 0.1
0.5
± 0.
1
4.7
± 0.
1
0.2 -0.04+0.05 3348
49
64 17
32
1 16
1PIN MARK
C0.2
0.41.0
1.0M
AX
8.0 ± 0.1
8.0
± 0.
1
(0.2
2)
0.02
-0.
02+
0.03
0.2 -0.04+0.05
5.7 ± 0.1
0.5
± 0.
1 5.7
± 0.
1
1PIN MARK
S0.08S0.08
SS
S0.08S0.08S0.08
S0.08
SSS
S0.08
S
S0.08
S
S0.08
SS
S0.08
S
S0.08
S
S0.08
S
1 45
89
13
16
12
0.5R0.2
0.75
(0.1
2)0.6M
AX
3.0 ± 0.13.
0 ±
0.1
0.02
-0.
02+
0.03
1.4 ± 0.1
0.4
± 0.
1
1.4
± 0.
1
0.25-0.04+0.05
S0.08
S
1PIN MARK
5.0 ± 0.1
5.0
± 0.
1
140
31
30 21
10
20
11
C0.2
0.40.7
3.3 ± 0.1
0.4
± 0.
1
3.3
± 0.
1
0.2-0.04+0.05
1.0M
AX
(0.2
2)
0.02
-0.
02+
0.03
S0.08
S
1
23
22
44
66 45
67
88
10.0
± 0
.11.
0MA
X
C0.2
10.0 ± 0.1
0.4
± 0.
1
0.4
6.0
± 0.
1
0.8
6.0 ± 0.11
34
3551
68 18
17
52
C0.2
0.8
1PIN MARK
8.0 ± 0.1
8.0
± 0.
1
4.3 ± 0.1
4.3
± 0.
1
0.4
± 0.
1
0.4 0.2-0.04+0.05
1.0M
AX
S0.08
(0.2
2)
0.02
-0.
02+
0.03
S
10 23
321
9 24
46 33
0.4
± 0.
1
C0.2
-0.040.2 +0.05
1PIN MARK 6.5 ± 0.1
(0.2
2)
0.35
5 ±
0.1
3.1
± 0.
1
5.1 ± 0.1
0.65
0.65
0.4
1.0M
AX
+0.
03-
0.02
4.5
± 0.
1
0.02
S0.08
S
0.08 S
S
1PIN MARK
1 7
8
1422
28
1521
0.4
± 0.
1
1.0 0.5 0.25+0.05-0.04
2.7 ± 0.1
2.7
± 0.
1
C0.2
5.0
± 0.
1
5.0 ± 0.1
0.02
+0.
03-0.
02
(0.2
2)1.0M
AX
.
1 1213
2536
37
48
24
4.4 ± 0.1
1PIN MARK
1.0M
AX
.6.
0 ±
0.1
4.4
± 0.
1
0.8
(0.2
2)
C0.2
0.2 +0.05-0.04
6.0 ± 0.1
0.4
0.45
± 0
.1
0.02
+0.
03-0.
02S0.08
S
0.08 S
S
1 12
13
24
2536
37
48
0.02
+0.
03-
0.02
1PIN MARK
0.2 +0.05-0.04
C0.24.7 ± 0.1
7.0
± 0.
1
7.0 ± 0.1
0.5
± 0.
1
0.4
4.7
± 0.
1
1.3
1.0M
AX
.
(0.2
2)
Embossed carrier tape:3,000pcs
Embossed carrier tape:3,000pcs Embossed carrier tape:2,500pcs Embossed carrier tape:2,500pcs Embossed carrier tape:2,500pcs
Embossed carrier tape:2,500pcs Embossed carrier tape:2,000pcs Embossed carrier tape:1,500pcs Embossed carrier tape:1,000pcsEmbossed carrier tape:1,000pcs Embossed carrier tape:1,000pcs
Embossed carrier tape:2,500pcs Embossed carrier tape:2,500pcs Embossed carrier tape:2,000pcs Embossed carrier tape:2,000pcs
Embossed carrier tape:2,000pcs Embossed carrier tape:1,500pcs Embossed carrier tape:1,500pcs Embossed carrier tape:1,000pcs
VQFN016X3030
VQFN056V8080VQFN048V7070
VQFN016V3030 VQFN020V4040 VQFN024V4040 VQFN028V5050
VQFN032V5050 VQFN040V6060
UQFN044V6060UQFN036V5050
UQFN048V7070
UQFN040V5050
UQFN068V8080 UQFN088V0100
UQFN046V4565 UQFN064V8080UQFN056V7070
UQFN048V6060
SON / QFN Packages (Unit: mm)
Please refer packages from page, A160 for LAPIS Semiconductor products.
A148
ICs
IC Packages (ROHM)
www.rohm.com
▶SON / QFN Packages ▶▶VQFN-X<Pin Pitch:0.5mm>▶▶VQFN-V<Pin Pitch:0.5mm>
A
IC P
ackages
UQFN-V <Pin Pitch : 0.4mm>VQFN-X <Pin Pitch : 0.5mm>
VQFN-V <Pin Pitch : 0.5mm>
42
1 14
29
2843
56 15
1PIN MARK
Under Development
C0.2
0.50.75
1.0M
AX
(0.2
2)
8.0 ± 0.17.0 ± 0.1
8.0
± 0.
1
7.0
± 0.
1
0.02
-0.
02+
0.03
(0.2
2)
0.02
-0.
02+
0.03
5.7 ± 0.14.7 ± 0.1
5.7
± 0.
1
4.7
± 0.
1
0.4
± 0.
1
0.4
± 0.
1
0.25-0.04+0.050.25-0.04
+0.05
1 12
13
24
2536
37
48
1PIN MARK
C0.2
0.50.75
1.0M
AX
1PIN MARK
1 45
89
13
16
12
0.5C0.2
0.75
(0.2
2)1.0M
AX
3.0 ± 0.14.0 ± 0.1
3.0
± 0.
1
4.0
± 0.
1
0.02
-0.
02+
0.03
1.4 ± 0.1
0.4
± 0.
1
1.4
± 0.
1
0.25-0.04+0.05
1PIN MARK
16
20
15
6
1011
0.5
C0.2
1.0M
AX
(0.2
2)
0.02
-0.
02+
0.03
1 52.1 ± 0.1
1.0
0.4
± 0.
1
2.1
± 0.
1
0.25-0.04+0.05
4.0 ± 0.1
4.0
± 0.
1
1PIN MARK
19
24
18
7
1213
0.5
C0.2
1.0M
AX
(0.2
2)
0.02
-0.
02+
0.03
1 62.4 ± 0.1
0.75
0.4
± 0.
1
2.4
± 0.
1
0.25-0.04+0.05
24
81932
1625
17
1PIN MARK
C0.2
0.50.75
1.0M
AX
5.0 ± 0.1
5.0
± 0.
1
(0.2
2)
0.02
-0.
02+
0.03
3.4 ± 0.1
0.4
± 0.
1
3.4
± 0.
1
0.25-0.04+0.05
1 10
11
2130
31
40
20
1PIN MARK
C0.2
0.50.75
1.0M
AX
6.0 ± 0.1
6.0
± 0.
1
(0.2
2)
0.02
-0.
02+
0.03
3.7 ± 0.1
0.4
± 0.
1
3.7
± 0.
1
0.25-0.04+0.05
2333
34
44 12
1 11
22
1PIN MARK
C0.2
0.41.0
1.0M
AX
6.0 ± 0.1
6.0
± 0.
1
(0.2
2)
0.02
-0.
02+
0.03
3.7 ± 0.1
0.5
± 0.
1
3.7
± 0.
1
0.2-0.04+0.05
1
36
28
27 19
9
18
10
1PIN MARK
C0.2
0.40.9
1.0M
AX
5.0 ± 0.1
5.0
± 0.
1
(0.2
2)
0.02
-0.
02+
0.03
2.7 ± 0.1
0.5
± 0.
1
2.7
± 0.
1
0.2-0.04+0.05
Under Development
1PIN MARK
(0.2
2)
0.02
-0.
02+
0.03
0.2 -0.04+0.05
7.0 ± 0.1
7.0
± 0.
1
42 29
1 14
56
43
15
28
1PIN MARK
C0.2
0.40.9
1.0M
AX
(0.2
2)
0.02
-0.
02+
0.03
4.7 ± 0.1
0.5
± 0.
1
4.7
± 0.
1
0.2 -0.04+0.05 3348
49
64 17
32
1 16
1PIN MARK
C0.2
0.41.0
1.0M
AX
8.0 ± 0.1
8.0
± 0.
1
(0.2
2)
0.02
-0.
02+
0.03
0.2 -0.04+0.05
5.7 ± 0.1
0.5
± 0.
1 5.7
± 0.
1
1PIN MARK
S0.08S0.08
SS
S0.08S0.08S0.08
S0.08
SSS
S0.08
S
S0.08
S
S0.08
SS
S0.08
S
S0.08
S
S0.08
S
1 45
89
13
16
12
0.5R0.2
0.75
(0.1
2)0.6M
AX
3.0 ± 0.1
3.0
± 0.
10.
02-
0.02
+0.
03
1.4 ± 0.1
0.4
± 0.
1
1.4
± 0.
1
0.25-0.04+0.05
S0.08
S
1PIN MARK
5.0 ± 0.1
5.0
± 0.
1
140
31
30 21
10
20
11
C0.2
0.40.7
3.3 ± 0.1
0.4
± 0.
1
3.3
± 0.
1
0.2-0.04+0.05
1.0M
AX
(0.2
2)
0.02
-0.
02+
0.03
S0.08
S
1
23
22
44
66 45
67
88
10.0
± 0
.11.
0MA
X
C0.2
10.0 ± 0.1
0.4
± 0.
1
0.4
6.0
± 0.
1
0.8
6.0 ± 0.11
34
3551
68 18
17
52
C0.2
0.8
1PIN MARK
8.0 ± 0.1
8.0
± 0.
1
4.3 ± 0.1
4.3
± 0.
1
0.4
± 0.
1
0.4 0.2-0.04+0.05
1.0M
AX
S0.08
(0.2
2)
0.02
-0.
02+
0.03
S
10 23
321
9 24
46 33
0.4
± 0.
1
C0.2
-0.040.2 +0.05
1PIN MARK 6.5 ± 0.1
(0.2
2)
0.35
5 ±
0.1
3.1
± 0.
1
5.1 ± 0.1
0.65
0.65
0.4
1.0M
AX
+0.
03-
0.02
4.5
± 0.
1
0.02
S0.08
S
0.08 S
S
1PIN MARK
1 7
8
1422
28
1521
0.4
± 0.
1
1.0 0.5 0.25+0.05-0.04
2.7 ± 0.1
2.7
± 0.
1
C0.2
5.0
± 0.
1
5.0 ± 0.1
0.02
+0.
03-0.
02
(0.2
2)1.0M
AX
.
1 1213
2536
37
48
24
4.4 ± 0.1
1PIN MARK
1.0M
AX
.6.
0 ±
0.1
4.4
± 0.
1
0.8
(0.2
2)
C0.2
0.2 +0.05-0.04
6.0 ± 0.1
0.4
0.45
± 0
.1
0.02
+0.
03-0.
02S0.08
S
0.08 S
S
1 12
13
24
2536
37
48
0.02
+0.
03-
0.02
1PIN MARK
0.2 +0.05-0.04
C0.24.7 ± 0.1
7.0
± 0.
1
7.0 ± 0.1
0.5
± 0.
1
0.4
4.7
± 0.
1
1.3
1.0M
AX
.
(0.2
2)
Embossed carrier tape:3,000pcs
Embossed carrier tape:3,000pcs Embossed carrier tape:2,500pcs Embossed carrier tape:2,500pcs Embossed carrier tape:2,500pcs
Embossed carrier tape:2,500pcs Embossed carrier tape:2,000pcs Embossed carrier tape:1,500pcs Embossed carrier tape:1,000pcsEmbossed carrier tape:1,000pcs Embossed carrier tape:1,000pcs
Embossed carrier tape:2,500pcs Embossed carrier tape:2,500pcs Embossed carrier tape:2,000pcs Embossed carrier tape:2,000pcs
Embossed carrier tape:2,000pcs Embossed carrier tape:1,500pcs Embossed carrier tape:1,500pcs Embossed carrier tape:1,000pcs
VQFN016X3030
VQFN056V8080VQFN048V7070
VQFN016V3030 VQFN020V4040 VQFN024V4040 VQFN028V5050
VQFN032V5050 VQFN040V6060
UQFN044V6060UQFN036V5050
UQFN048V7070
UQFN040V5050
UQFN068V8080 UQFN088V0100
UQFN046V4565 UQFN064V8080UQFN056V7070
UQFN048V6060
SON / QFN Packages (Unit: mm)
Please refer packages from page, A160 for LAPIS Semiconductor products.
A149
ICs
IC Packages (ROHM)
www.rohm.com
▶SON / QFN Packages ▶▶UQFN-V<Pin Pitch:0.4mm>
A
IC P
ackages
SOP <Pin Pitch : 1.27mm>
SSOP-A <Pin Pitch : 0.8mm>
SSOP-B <Pin Pitch : 0.65mm>
JEDEC <Pin Pitch : 1.27mm/0.65mm/0.5mm>
28
0.11
0.3M
IN
18.5±0.2
0.15±0.1
7.5
±0.2
9.9
±0.3
2.2
±0.1
0.4±0.11.27
141
15
(MAX 18.85 include BURR)
24
0.11
0.3M
IN
1.27
121
13
15.0±0.2
0.4±0.1
0.15±0.1
5.4
±0.2
7.8
±0.3
1.8
±0.1
(MAX 15.35 include BURR)
22
0.3M
IN
1.27
111
12
13.6±0.2
0.15±0.1
0.4±0.1
5.4
±0.2
7.8
±0.3
1.8
±0.1
0.11
(MAX 13.95 include BURR)
20
0.3M
IN
1.27
101
11
12.5±0.2
0.15±0.1
0.4±0.1
7.8
±0.3
1.8
±0.1
0.11
5.4
±0.2
(MAX 12.85 include BURR)
18
0.3M
IN
1.27
91
10
11.2±0.2
0.15±0.1
0.4±0.1
7.8
±0.3
1.8
±0.1
0.11
5.4
±0.2
(MAX 11.55 include BURR)
8
16
1.270.11
1
9
0.3M
IN
10±0.2
0.15±0.1
0.4±0.11.5
±0.1
6.2
±0.3
4.4
±0.2
(MAX 10.35 include BURR)
7
14
1.270.11
1
8
0.3M
IN
8.7±0.2
0.4±0.1
0.15±0.1
1.5
±0.1
6.2
±0.3
4.4
±0.2
(MAX 9.05 include BURR)
0.9
±0.1
5
0.595
1.27
6
0.11
43
8
2
0.3M
IN
0.42±0.1
5
1
7
5.0±0.2
6.2
±0.3
1.5
±0.1
4.4
±0.2
(MAX 5.35 include BURR)
0.17-0.05+0.1
(MAX 18.85 include BURR)18.5 ± 0.2
44 23
1 22
0.36 ± 0.1
0.3M
in.
0.8
7.5
± 0
.2
9.5
± 0
.31.
7 ±
0.1 0.15 ± 0.1
0.1
1
17
16
32
0.11
0.3M
IN
0.36±0.10.8
13.6±0.2
0.15±0.1
5.4
±0.2
7.8
±0.3
1.8
±0.1
(MAX 13.95 include BURR)
24
12
0.8
13
1
10 ± 0.2
0.5
±0.2
1.2
±0.1
5
7.8
± 0
.31.
8 ±
0.1
0.1
± 0.
15.
4 ±
0.2
(MAX 10.35 include BURR)
0.17-0.05+0.1
0.38 ± 0.1
20
0.11
10
0.8
0.3M
IN
11
1
8.7±0.2
0.15±0.1
0.36±0.1
7.8
±0.3
1.8
±0.1
5.4
±0.2
(MAX 9.05 include BURR)
13
87
0.8
9
0.11
15
4 53
11
0.3M
IN
2
1216 14
61
10
6.6±0.2
0.15±0.1
0.36±0.1
1.5
±0.1
6.2
±0.3
4.4
±0.2
(MAX 6.95 include BURR)
+6°4° –4°
+6°4° –4°
11
10
20
1
0.1±
0.1
6.4
± 0.
3
4.4
± 0.
2
6.5 ± 0.2
0.15 ± 0.1
0.22 ± 0.1
0.651.15
± 0
.1
0.3M
in.
1 2 3 4
5678
0.1
0.3M
IN
0.65
(0.52)
3.0±0.2
0.15±0.1
6.4
±0.3
1.15
±0.1
4.4
±0.2
(MAX 3.35 include BURR)
0.22-0.04+0.06
M0.08
9
8
16
1
0.10
6.4
± 0.
3
4.4
± 0.
2
5.0 ± 0.2
0.15 ± 0.1
0.22 ± 0.1
0.65
1.15
± 0
.1
0.3M
in.
0.22 ± 0.10.65
0.15 ± 0.1
0.5
± 0.
2
7.8
± 0.
3
5.4
± 0.
2
1.8
± 0.
1
0.1
1
40
20
21
13.6 ± 0.2
(MAX 13.95 include BURR)
M0.08
0.15 ± 0.1
0.11.15
± 0
.1
1
0.65
7.6
± 0.
3
5.6
± 0.
2
28
(MAX 10.35 include BURR)10 ± 0.2
0.3M
in.
14
15
0.22 ± 0.1
0.15 ± 0.1
1.15
± 0
.1
0.1
1
0.65
(MAX 8.15 include BURR)7.8 ± 0.2
7.6
± 0.
3
5.6
± 0.
2
24
0.3M
in.
12
13
0.22 ± 0.1
71
814(Max 9.0 include BURR)
1.05
±0.2
1PIN MARK
3.9
±0.1
0.515
1.65
MA
X1.
375
±0.0
75
0.17
5±0
.075
8.65±0.1
0.65
±0.1
5
6.0
±0.2
1.27
8
71
14
(Max 5.35 include BURR)
0.1±
0.05
1PIN MARK
1.0±
0.2
6.4±
0.2
0.65
0.5±
0.15
4.4±
0.1
1.2M
AX
1.0±
0.05
0.55
5.0±0.1
1 2 43 5
68910 7
(Max 3.35 include BURR)
4.9
± 0.
2
0.95
± 0
.2
0.1
± 0.
050.
85 ±
0.0
5
0.45
± 0
.15
3.0
± 0.
1
0.5
1.1M
AX
1PIN MARK
3.0 ± 0.1
0.5
(MAX 3.35 include BURR)
578
1 2 4
6
3.0
±0.1
1PIN MARK
0.95
±0.2
0.65
4.9
±0.2
3.0±0.1
0.45
±0.1
5
0.85
±0.0
50.
1±0.
05
0.525
1.1M
AX
3
2 3 4
8 7 6 5
1
1.0
±0.0
5
1PIN MARK0.525
0.65
0.1
±0.0
51.2M
AX
3.0±0.1
4.4
±0.1
6.4
±0.2
0.5
±0.1
51.
0±0
.2
(MAX 3.35 include BURR)4°± 4°
0.45
Min
.
0.42±0.1
4.9±0.2(MAX 5.25 include BURR)
8 5
41 2 3
1.27
0.545
7 6
0.2±0.1
0.17
5
6.0±
0.3
3.9±
0.2
1.37
5±0.
1
4 -4+6
+6°4° –4°4°± 4°4°± 4°
0.10.1
0.10.10.1
0.10.1
0.1 S
S
0.1
0.1
0.10.1
0.1
0.1
S
S0.1 0.1
S0.10.10.1
0.42-0.04+0.05
M0.08
S
S0.08
0.22-0.03+0.05
0.245-0.04+0.05
M0.08
S
S0.08
0.145-0.03+0.05
0.22-0.04+0.05
M0.08
S
S0.08
0.145-0.03+0.05
S
S
0.145-0.03+0.05
0.32-0.04+0.05
M0.08
S0.08
S0.145-0.03
+0.05
0.245-0.04+0.05
M0.08
SS
0.080.1
+6°4° –4°
1
44 23
22
(MAX 11.65 include BURR) +6°-4°
0.1±
0.05
11.3±0.1
1.0±
0.2
0.22 -0.04+0.05
6.4±
0.2
0.17 +0.05-0.03
0.4
1.2M
AX
4.4±
0.1
0.5
1.0±
0.05
4°
0.5±
0.15
1PIN MARK
�
M0.08�0.08
+6°-4°
1 15
1630
0.5
1PIN MARK0.4
0.5±
0.15
1.2M
AX6.
4±0.
24.
4±0.
1
7.8±0.11.
0±0.
054゜
0.22 -0.04+0.05
0.145+0.05-0.03
0.1±
0.05
1.0±
0.2
(MAX 8.15 include BURR)
M0.08�0.08
�
8
7
14
1
0.10
6.4
± 0.
3
4.4
± 0.
2
5.0 ± 0.2
0.22 ± 0.1
1.15
± 0
.1
0.65
0.15 ± 0.1
0.3M
in.
0.1
SOP28SOP24
SOP22SOP20
SOP16SOP14SOP8
SOP18
SSOP-A44SSOP-A32
SSOP-A24SSOP-A20SSOP-A16
SSOP-B20SSOP-B8 SSOP-B16
SSOP-B40SSOP-B28SSOP-B24
SSOP-B14
SOP-J14
TSSOP-B14JTSSOP-C10JTSSOP-B8J
TSSOP-B8SOP-J8
TSSOP-C44TSSOP-C30
Embossed carrier tape:2,500pcs Embossed carrier tape:2,500pcs Embossed carrier tape:2,500pcs
Embossed carrier tape:2,000pcs Embossed carrier tape:2,000pcs
Embossed carrier tape:2,000pcs Embossed carrier tape:1,500pcs
Embossed carrier tape:2,000pcs
Embossed carrier tape:2,500pcs Embossed carrier tape:2,000pcs
Embossed carrier tape:2,000pcs Embossed carrier tape:1,500pcs
Embossed carrier tape:2,000pcs
Embossed carrier tape:2,500pcs
Embossed carrier tape:2,000pcs
Embossed carrier tape:2,500pcs Embossed carrier tape:2,500pcs Embossed carrier tape:3,000pcs
Embossed carrier tape:2,500pcs Embossed carrier tape:2,500pcs Embossed carrier tape:2,500pcs
Embossed carrier tape:2,500pcs Embossed carrier tape:2,000pcs
Embossed carrier tape:2,000pcs Embossed carrier tape:2,000pcs
Embossed carrier tape:2,500pcs Embossed carrier tape:2,500pcs Embossed carrier tape:2,500pcs
SOP Packages (Unit: mm)
Please refer packages from page, A160 for LAPIS Semiconductor products.
A150
ICs
IC Packages (ROHM)
www.rohm.com
▶SOP Packages ▶▶SOP<Pin Pitch:1.27mm>▶▶SSOP-A<Pin Pitch:0.8mm>
A
IC P
ackages
SOP <Pin Pitch : 1.27mm>
SSOP-A <Pin Pitch : 0.8mm>
SSOP-B <Pin Pitch : 0.65mm>
JEDEC <Pin Pitch : 1.27mm/0.65mm/0.5mm>
28
0.11
0.3M
IN
18.5±0.2
0.15±0.1
7.5
±0.2
9.9
±0.3
2.2
±0.1
0.4±0.11.27
141
15
(MAX 18.85 include BURR)
24
0.11
0.3M
IN
1.27
121
13
15.0±0.2
0.4±0.1
0.15±0.1
5.4
±0.2
7.8
±0.3
1.8
±0.1
(MAX 15.35 include BURR)
22
0.3M
IN
1.27
111
12
13.6±0.2
0.15±0.1
0.4±0.1
5.4
±0.2
7.8
±0.3
1.8
±0.1
0.11
(MAX 13.95 include BURR)
20
0.3M
IN
1.27
101
11
12.5±0.2
0.15±0.1
0.4±0.1
7.8
±0.3
1.8
±0.1
0.11
5.4
±0.2
(MAX 12.85 include BURR)
18
0.3M
IN
1.27
91
10
11.2±0.2
0.15±0.1
0.4±0.1
7.8
±0.3
1.8
±0.1
0.11
5.4
±0.2
(MAX 11.55 include BURR)
8
16
1.270.11
1
9
0.3M
IN
10±0.2
0.15±0.1
0.4±0.11.5
±0.1
6.2
±0.3
4.4
±0.2
(MAX 10.35 include BURR)
7
14
1.270.11
1
8
0.3M
IN
8.7±0.2
0.4±0.1
0.15±0.1
1.5
±0.1
6.2
±0.3
4.4
±0.2
(MAX 9.05 include BURR)
0.9
±0.1
5
0.595
1.27
6
0.11
43
8
2
0.3M
IN
0.42±0.1
5
1
7
5.0±0.2
6.2
±0.3
1.5
±0.1
4.4
±0.2
(MAX 5.35 include BURR)
0.17-0.05+0.1
(MAX 18.85 include BURR)18.5 ± 0.2
44 23
1 22
0.36 ± 0.1
0.3M
in.
0.8
7.5
± 0
.2
9.5
± 0
.31.
7 ±
0.1 0.15 ± 0.1
0.1
1
17
16
32
0.11
0.3M
IN
0.36±0.10.8
13.6±0.2
0.15±0.1
5.4
±0.2
7.8
±0.3
1.8
±0.1
(MAX 13.95 include BURR)
24
12
0.8
13
1
10 ± 0.2
0.5
±0.2
1.2
±0.1
5
7.8
± 0
.31.
8 ±
0.1
0.1
± 0.
15.
4 ±
0.2
(MAX 10.35 include BURR)
0.17-0.05+0.1
0.38 ± 0.1
20
0.11
10
0.8
0.3M
IN
11
1
8.7±0.2
0.15±0.1
0.36±0.1
7.8
±0.3
1.8
±0.1
5.4
±0.2
(MAX 9.05 include BURR)
13
87
0.8
9
0.11
15
4 53
11
0.3M
IN
2
1216 14
61
10
6.6±0.2
0.15±0.1
0.36±0.1
1.5
±0.1
6.2
±0.3
4.4
±0.2
(MAX 6.95 include BURR)
+6°4° –4°
+6°4° –4°
11
10
20
1
0.1±
0.1
6.4
± 0.
3
4.4
± 0.
2
6.5 ± 0.2
0.15 ± 0.1
0.22 ± 0.1
0.651.15
± 0
.1
0.3M
in.
1 2 3 4
5678
0.1
0.3M
IN
0.65
(0.52)
3.0±0.2
0.15±0.1
6.4
±0.3
1.15
±0.1
4.4
±0.2
(MAX 3.35 include BURR)
0.22-0.04+0.06
M0.08
9
8
16
1
0.10
6.4
± 0.
3
4.4
± 0.
2
5.0 ± 0.2
0.15 ± 0.1
0.22 ± 0.1
0.65
1.15
± 0
.1
0.3M
in.
0.22 ± 0.10.65
0.15 ± 0.1
0.5
± 0.
2
7.8
± 0.
3
5.4
± 0.
2
1.8
± 0.
1
0.1
1
40
20
21
13.6 ± 0.2
(MAX 13.95 include BURR)
M0.08
0.15 ± 0.1
0.11.15
± 0
.1
1
0.65
7.6
± 0.
3
5.6
± 0.
2
28
(MAX 10.35 include BURR)10 ± 0.2
0.3M
in.
14
15
0.22 ± 0.1
0.15 ± 0.1
1.15
± 0
.1
0.1
1
0.65
(MAX 8.15 include BURR)7.8 ± 0.2
7.6
± 0.
3
5.6
± 0.
2
24
0.3M
in.
12
13
0.22 ± 0.1
71
814(Max 9.0 include BURR)
1.05
±0.2
1PIN MARK
3.9
±0.1
0.515
1.65
MA
X1.
375
±0.0
75
0.17
5±0
.075
8.65±0.1
0.65
±0.1
5
6.0
±0.2
1.27
8
71
14
(Max 5.35 include BURR)
0.1±
0.05
1PIN MARK
1.0±
0.2
6.4±
0.2
0.65
0.5±
0.15
4.4±
0.1
1.2M
AX
1.0±
0.05
0.55
5.0±0.1
1 2 43 5
68910 7
(Max 3.35 include BURR)
4.9
± 0.
2
0.95
± 0
.2
0.1
± 0.
050.
85 ±
0.0
5
0.45
± 0
.15
3.0
± 0.
1
0.5
1.1M
AX
1PIN MARK
3.0 ± 0.1
0.5
(MAX 3.35 include BURR)
578
1 2 4
6
3.0
±0.1
1PIN MARK
0.95
±0.2
0.65
4.9
±0.2
3.0±0.1
0.45
±0.1
5
0.85
±0.0
50.
1±0.
05
0.525
1.1M
AX
3
2 3 4
8 7 6 5
1
1.0
±0.0
5
1PIN MARK0.525
0.65
0.1
±0.0
51.2M
AX
3.0±0.1
4.4
±0.1
6.4
±0.2
0.5
±0.1
51.
0±0
.2
(MAX 3.35 include BURR)4°± 4°
0.45
Min
.
0.42±0.1
4.9±0.2(MAX 5.25 include BURR)
8 5
41 2 3
1.27
0.545
7 6
0.2±0.1
0.17
5
6.0±
0.3
3.9±
0.2
1.37
5±0.
1
4 -4+6
+6°4° –4°4°± 4°4°± 4°
0.10.1
0.10.10.1
0.10.1
0.1 S
S
0.1
0.1
0.10.1
0.1
0.1
S
S0.1 0.1
S0.10.10.1
0.42-0.04+0.05
M0.08
S
S0.08
0.22-0.03+0.05
0.245-0.04+0.05
M0.08
S
S0.08
0.145-0.03+0.05
0.22-0.04+0.05
M0.08
S
S0.08
0.145-0.03+0.05
S
S
0.145-0.03+0.05
0.32-0.04+0.05
M0.08
S0.08
S0.145-0.03
+0.05
0.245-0.04+0.05
M0.08
SS
0.080.1
+6°4° –4°
1
44 23
22
(MAX 11.65 include BURR) +6°-4°
0.1±
0.05
11.3±0.1
1.0±
0.2
0.22 -0.04+0.05
6.4±
0.2
0.17 +0.05-0.03
0.4
1.2M
AX
4.4±
0.1
0.5
1.0±
0.05
4°
0.5±
0.15
1PIN MARK
�
M0.08�0.08
+6°-4°
1 15
1630
0.5
1PIN MARK0.4
0.5±
0.15
1.2M
AX6.
4±0.
24.
4±0.
1
7.8±0.1
1.0±
0.05
4゜
0.22 -0.04+0.05
0.145+0.05-0.03
0.1±
0.05
1.0±
0.2
(MAX 8.15 include BURR)
M0.08�0.08
�
8
7
14
1
0.10
6.4
± 0.
3
4.4
± 0.
2
5.0 ± 0.2
0.22 ± 0.11.
15 ±
0.1
0.65
0.15 ± 0.1
0.3M
in.
0.1
SOP28SOP24
SOP22SOP20
SOP16SOP14SOP8
SOP18
SSOP-A44SSOP-A32
SSOP-A24SSOP-A20SSOP-A16
SSOP-B20SSOP-B8 SSOP-B16
SSOP-B40SSOP-B28SSOP-B24
SSOP-B14
SOP-J14
TSSOP-B14JTSSOP-C10JTSSOP-B8J
TSSOP-B8SOP-J8
TSSOP-C44TSSOP-C30
Embossed carrier tape:2,500pcs Embossed carrier tape:2,500pcs Embossed carrier tape:2,500pcs
Embossed carrier tape:2,000pcs Embossed carrier tape:2,000pcs
Embossed carrier tape:2,000pcs Embossed carrier tape:1,500pcs
Embossed carrier tape:2,000pcs
Embossed carrier tape:2,500pcs Embossed carrier tape:2,000pcs
Embossed carrier tape:2,000pcs Embossed carrier tape:1,500pcs
Embossed carrier tape:2,000pcs
Embossed carrier tape:2,500pcs
Embossed carrier tape:2,000pcs
Embossed carrier tape:2,500pcs Embossed carrier tape:2,500pcs Embossed carrier tape:3,000pcs
Embossed carrier tape:2,500pcs Embossed carrier tape:2,500pcs Embossed carrier tape:2,500pcs
Embossed carrier tape:2,500pcs Embossed carrier tape:2,000pcs
Embossed carrier tape:2,000pcs Embossed carrier tape:2,000pcs
Embossed carrier tape:2,500pcs Embossed carrier tape:2,500pcs Embossed carrier tape:2,500pcs
SOP Packages (Unit: mm)
Please refer packages from page, A160 for LAPIS Semiconductor products.
A151
ICs
IC Packages (ROHM)
www.rohm.com
▶SOP Packages ▶▶SSOP-B<Pin Pitch:0.65mm>▶▶JEDEC<Pin Pitch:1.27mm/0.65mm/0.5mm>
A
IC P
ackages
HTSOP-J <Pin Pitch : 1.27mm> HTSSOP-C <Pin Pitch : 0.5mm>
HTSSOP-A <Pin Pitch : 0.8mm>
HSOP <Pin Pitch : 0.8mm> HTSSOP-B <Pin Pitch : 0.65mm>
1 24
48 25
12.5±0.1
1PIN MARK
(4.2
)
0.5
0.5
1.0M
AX
0.85
±0.0
58.
1±0.
2
(5.0)
0.5±
0.15
0.08
±0.0
86.
1±0.
1
1.0±
0.2
(MAX 12.85 include BURR)
-0.040.22+0.05M0.08
0.17-0.03+0.05
2 3 4
568
(MAX 5.25 include BURR)
7
1
0.545 1PIN MARK
(3.2)
4.9±0.1
6.0
±0.2
(2.4
)
1.0M
AX
0.85
±0.0
5
1.27
1.05
±0.2
0.08
±0.0
83.
9±0
.1
0.65
±0.1
5
1 27
2854
(MAX 22.35 include BURR)
0.36±0.1
11.4
±0.2
2.2
±0.1
22.0±0.2
0.15±0.1
0.3M
IN
0.8
0.1±
0.1
13.4
±0.3
6.0±0.2
4.0
±0.2
1 22
2344
(MAX 18.85 include BURR)
7.5
± 0.
10.
08 ±
0.0
50.
85 ±
0.0
59.
5 ±
0.2
1.0M
AX
0.5
± 0.
151.
0 ±
0.2
0.8
0.85
18.5 ± 0.1
(6.0)
(5.0
)
1PIN MARK
M0.08M0.08
0.17−0.03+0.05 0.17−0.03
+0.05
0.37−0.04+0.05
0.37−0.04+0.05
(5.0
)
(6.0)
18.5±0.1
0.85
9.5±
0.2
1PIN MARK
7.5±
0.1
44 23
221
0.8
1.0M
AX
0.85
±0.0
50.
08±0
.05
1.0±
0.2
0.5±
0.15
(MAX 18.85 include BURR)
10.85
1936
(MAX 18.75 include BURR)
18
18.5±0.1
9.9
±0.2
2.2
±0.0
5
0.1
±0.0
5
7.5
±0.1
0.5
±0.1
5
1.2
±0.2
27
101PIN MARK
0.8
9
2.4M
AX
2.77±0.1
28
M0.080.8
7.5±
0.2
15
5.15±0.1
0.11
1.25
2.2
±0.1
1
18.5±0.2
0.5
±0.2
0.37±0.1
9.9±
0.3
28
1.2
±0.1
5
14
(MAX 18.85 include BURR)
(MAX 18.85 include BURR)
0.8
7.5
±0.2
15
5.15±0.1
0.11
1.25
2.2
±0.1
1
18.5±0.2
0.5
±0.2
0.37±0.1
9.9
±0.3
28
1.2
±0.1
5
14
7.8
± 0.
3
5.4
± 0.
2
2.75 ± 0.1
1.95 ± 0.1
25 14
1 13
0.111.
9 ±
0.1
0.36 ± 0.1
12.0 ± 0.2
0.3M
in.
0.25 ± 0.1
13.6 ± 0.2
0.8
(MAX 13.95 include BURR)
+6°4° –4°
+6°4°–4°+6°4°–4°
+6°4°–4°
0.27−0.05+0.1
0.27−0.05+0.1
+6°4°–4°
+6°4°–4°
0.27−0.045+0.055
0.37−0.04+0.05
+6°4°–4°
+6°4° –4°
54 28
271
18.5±0.1
(5.0
)
(6.0)
9.5±
0.2
1PIN MARK
1PIN MARK
0.8
7.5±
0.1
(MAX 18.85 include BURR)
1.0±
0.2
0.5±
0.15
0.65
1.0M
ax.
0.85
±0.0
50.
08±0
.05
M0.08
M0.08
2010.625
7.8±
0.2
13.6±0.1
(8.4)
(3.2
)
5.4±
0.1
2140
(MAX 13.95 include BURR)
0.5
± 0.
15
1.2
± 0.
2
0.65
0.85
±0.0
5
0.08
±0.0
51.0M
ax.
1528
1410.625 1PIN MARK
4.4±
0.1
6.4±
0.2
0.5±
0.15
1.0±
0.2
0.65
1.0M
AX
0.85
±0.0
50.
08±0
.05
(2.9
)
9.7±0.1
(5.5)
(MAX 10.05 include BURR)
-0.040.24+0.05M0.08
0.17-0.03+0.05
24 13
1 12
0.325
0.65
(3.4
)
1PIN MARK
(5.0)
1.0M
AX
7.8±0.1
7.6
±0.2
0.85
±0.0
5
0.08
±0.0
55.
6±0
.1
1.0
±0.2
0.53
±0.1
5
(MAX 8.15 include BURR)
-0.040.24+0.05M0.08
0.17-0.03+0.05
1120
1 10
(MAX 6.85 include BURR)
0.65
1.0
±0.2
6.5±0.1
(2.4
)
4.4±
0.1
0.08
±0.0
5
0.325
6.4±
0.2
0.85
±0.0
5
(4.0)
0.5
±0.1
5
1.0M
AX
-0.040.24+0.05
0.17-0.03+0.05
+6°4° –4°
+6°4° –4°
0.24−0.04+0.05
0.22−0.04+0.05
0.17−0.03+0.05
0.17−0.03+0.05
+6°4°–4°
+6°4°–4°
S0.08
S
0.42-0.04+0.05
M0.08
S
S0.08
0.17-0.03+0.05
0.1S0.08S0.08
S S
S0.08
S
S
S0.1
S0.1
S
S0.1
S0.08
S0.08
S
SS0.08
S
S0.08
S
S0.08
SS
0.145-0.03+0.05
+6°4° –4°
0.95
±0.2
0.45
±0.1
5
78
1 2 4
(MAX 3.35 include BURR)
6 5
3
3.0±
0.1
(1.8
)
1PIN MARK
4.9±
0.2
3.0±0.1
(1.8)
0.525
S0.08
0.32-0.04+0.05
M0.080.650.85
±0.0
50.
1±0.
051.1M
AX
0.17 -0.03+0.05
S
+6°4° –4°
1.0±
0.2
0.5 ±
0.15
15
(5.8)16
10.45
30
(MAX 10.35 include BURR)
(3.7
)
7.6±
0.2
10.0±0.1
5.6±
0.1
1PIN MARK
S0.080.24-0.04
+0.05M0.080.65
0.85
±0.0
50.
08±0
.051.0M
AX
Embossed carrier tape:2,000pcs Embossed carrier tape:1,500pcs
Embossed carrier tape:1,500pcs
Embossed carrier tape:2,500pcs
Embossed carrier tape:1,500pcs Embossed carrier tape:1,500pcs
Embossed carrier tape:2,000pcs
Embossed carrier tape:1,500pcs
Embossed carrier tape:2,500pcs Embossed carrier tape:2,500pcs Embossed carrier tape:2,000pcs
Embossed carrier tape:2,500pcs
Embossed carrier tape:1,500pcs
Embossed carrier tape:2,000pcs Embossed carrier tape:2,000pcs
HTSSOP-C48HTSOP-J8
HSSOP-A54HTSSOP-A44RHTSSOP-A44
HSOP-M36HSOP-M28
HSOP28HSOP25 HTSSOP-B24HTSSOP-B20HTSSOP-B8J
HTSSOP-B54
HTSSOP-B40HTSSOP-B28 HTSSOP-B30
HSOP Packages (Unit: mm)
Please refer packages from page, A160 for LAPIS Semiconductor products.
A152
ICs
IC Packages (ROHM)
www.rohm.com
▶HSOP Packages ▶▶HSOP<Pin Pitch:0.8mm>▶▶HTSOP-J<Pin Pitch:1.27mm>▶▶HTSSOP-C<Pin Pitch:0.5mm>▶▶HTSSOP-A<Pin Pitch:0.8mm>
A
IC P
ackages
HTSOP-J <Pin Pitch : 1.27mm> HTSSOP-C <Pin Pitch : 0.5mm>
HTSSOP-A <Pin Pitch : 0.8mm>
HSOP <Pin Pitch : 0.8mm> HTSSOP-B <Pin Pitch : 0.65mm>
1 24
48 25
12.5±0.1
1PIN MARK
(4.2
)
0.5
0.5
1.0M
AX
0.85
±0.0
58.
1±0.
2
(5.0)
0.5±
0.15
0.08
±0.0
86.
1±0.
1
1.0±
0.2
(MAX 12.85 include BURR)
-0.040.22+0.05M0.08
0.17-0.03+0.05
2 3 4
568
(MAX 5.25 include BURR)
7
1
0.545 1PIN MARK
(3.2)
4.9±0.1
6.0
±0.2
(2.4
)
1.0M
AX
0.85
±0.0
5
1.27
1.05
±0.2
0.08
±0.0
83.
9±0
.1
0.65
±0.1
5
1 27
2854
(MAX 22.35 include BURR)
0.36±0.1
11.4
±0.2
2.2
±0.1
22.0±0.2
0.15±0.1
0.3M
IN
0.8
0.1±
0.1
13.4
±0.3
6.0±0.2
4.0
±0.2
1 22
2344
(MAX 18.85 include BURR)
7.5
± 0.
10.
08 ±
0.0
50.
85 ±
0.0
59.
5 ±
0.2
1.0M
AX
0.5
± 0.
151.
0 ±
0.2
0.8
0.85
18.5 ± 0.1
(6.0)
(5.0
)
1PIN MARK
M0.08M0.08
0.17−0.03+0.05 0.17−0.03
+0.05
0.37−0.04+0.05
0.37−0.04+0.05
(5.0
)
(6.0)
18.5±0.1
0.85
9.5±
0.2
1PIN MARK
7.5±
0.1
44 23
221
0.8
1.0M
AX
0.85
±0.0
50.
08±0
.05
1.0±
0.2
0.5±
0.15
(MAX 18.85 include BURR)
10.85
1936
(MAX 18.75 include BURR)
18
18.5±0.1
9.9
±0.2
2.2
±0.0
5
0.1
±0.0
5
7.5
±0.1
0.5
±0.1
5
1.2
±0.2
27
101PIN MARK
0.8
9
2.4M
AX
2.77±0.1
28
M0.080.8
7.5±
0.2
15
5.15±0.1
0.11
1.25
2.2
±0.1
1
18.5±0.2
0.5
±0.2
0.37±0.1
9.9±
0.3
28
1.2
±0.1
5
14
(MAX 18.85 include BURR)
(MAX 18.85 include BURR)
0.8
7.5
±0.2
15
5.15±0.1
0.11
1.25
2.2
±0.1
1
18.5±0.2
0.5
±0.2
0.37±0.1
9.9
±0.3
28
1.2
±0.1
5
14
7.8
± 0.
3
5.4
± 0.
2
2.75 ± 0.1
1.95 ± 0.1
25 14
1 13
0.111.
9 ±
0.1
0.36 ± 0.1
12.0 ± 0.2
0.3M
in.
0.25 ± 0.1
13.6 ± 0.2
0.8
(MAX 13.95 include BURR)
+6°4° –4°
+6°4°–4°+6°4°–4°
+6°4°–4°
0.27−0.05+0.1
0.27−0.05+0.1
+6°4°–4°
+6°4°–4°
0.27−0.045+0.055
0.37−0.04+0.05
+6°4°–4°
+6°4° –4°
54 28
271
18.5±0.1
(5.0
)
(6.0)
9.5±
0.2
1PIN MARK
1PIN MARK
0.8
7.5±
0.1
(MAX 18.85 include BURR)
1.0±
0.2
0.5±
0.15
0.65
1.0M
ax.
0.85
±0.0
50.
08±0
.05
M0.08
M0.08
2010.625
7.8±
0.2
13.6±0.1
(8.4)
(3.2
)
5.4±
0.1
2140
(MAX 13.95 include BURR)
0.5
± 0.
15
1.2
± 0.
2
0.65
0.85
±0.0
5
0.08
±0.0
51.0M
ax.
1528
1410.625 1PIN MARK
4.4±
0.1
6.4±
0.2
0.5±
0.15
1.0±
0.2
0.65
1.0M
AX
0.85
±0.0
50.
08±0
.05
(2.9
)
9.7±0.1
(5.5)
(MAX 10.05 include BURR)
-0.040.24+0.05M0.08
0.17-0.03+0.05
24 13
1 12
0.325
0.65
(3.4
)
1PIN MARK
(5.0)
1.0M
AX
7.8±0.1
7.6
±0.2
0.85
±0.0
5
0.08
±0.0
55.
6±0
.1
1.0
±0.2
0.53
±0.1
5
(MAX 8.15 include BURR)
-0.040.24+0.05M0.08
0.17-0.03+0.05
1120
1 10
(MAX 6.85 include BURR)
0.65
1.0
±0.2
6.5±0.1
(2.4
)
4.4±
0.1
0.08
±0.0
5
0.325
6.4±
0.2
0.85
±0.0
5
(4.0)
0.5
±0.1
5
1.0M
AX
-0.040.24+0.05
0.17-0.03+0.05
+6°4° –4°
+6°4° –4°
0.24−0.04+0.05
0.22−0.04+0.05
0.17−0.03+0.05
0.17−0.03+0.05
+6°4°–4°
+6°4°–4°
S0.08
S
0.42-0.04+0.05
M0.08
S
S0.08
0.17-0.03+0.05
0.1S0.08S0.08
S S
S0.08
S
S
S0.1
S0.1
S
S0.1
S0.08
S0.08
S
SS0.08
S
S0.08
S
S0.08
SS
0.145-0.03+0.05
+6°4° –4°
0.95
±0.2
0.45
±0.1
5
78
1 2 4
(MAX 3.35 include BURR)
6 5
3
3.0±
0.1
(1.8
)
1PIN MARK
4.9±
0.2
3.0±0.1
(1.8)
0.525
S0.08
0.32-0.04+0.05
M0.080.650.85
±0.0
50.
1±0.
051.1M
AX
0.17 -0.03+0.05
S
+6°4° –4°
1.0±
0.2
0.5 ±
0.15
15
(5.8)16
10.45
30
(MAX 10.35 include BURR)
(3.7
)
7.6±
0.2
10.0±0.15.
6±0.
1
1PIN MARK
S0.080.24-0.04
+0.05M0.080.65
0.85
±0.0
50.
08±0
.051.0M
AX
Embossed carrier tape:2,000pcs Embossed carrier tape:1,500pcs
Embossed carrier tape:1,500pcs
Embossed carrier tape:2,500pcs
Embossed carrier tape:1,500pcs Embossed carrier tape:1,500pcs
Embossed carrier tape:2,000pcs
Embossed carrier tape:1,500pcs
Embossed carrier tape:2,500pcs Embossed carrier tape:2,500pcs Embossed carrier tape:2,000pcs
Embossed carrier tape:2,500pcs
Embossed carrier tape:1,500pcs
Embossed carrier tape:2,000pcs Embossed carrier tape:2,000pcs
HTSSOP-C48HTSOP-J8
HSSOP-A54HTSSOP-A44RHTSSOP-A44
HSOP-M36HSOP-M28
HSOP28HSOP25 HTSSOP-B24HTSSOP-B20HTSSOP-B8J
HTSSOP-B54
HTSSOP-B40HTSSOP-B28 HTSSOP-B30
HSOP Packages (Unit: mm)
Please refer packages from page, A160 for LAPIS Semiconductor products.
A153
ICs
IC Packages (ROHM)
www.rohm.com
▶HSOP Packages ▶▶HTSSOP-B<Pin Pitch:0.65mm>
A
IC P
ackages
POWER-3PIN
Optical Non-Lead
POWER-4PIN
SOP Type
Non-Lead
2.1±
0.2
0.05
1.3
2.0±0.2
1 2
4 3
1.25
+0.2
−0.1
0.27
±0.1
5
0.13 +0.05−0.03
0.13 +0.05−0.03
0.9±
0.05
0.05
±0.0
5
1.05
Max
.
0.32+0.05−0.04
0.42+0.05−0.04
0.42 +0.05−0.04
0.2M
in.
1 2 3
6 5 4
2.9±0.2
2.8±
0.2
1.6
+0.2
−0.1
0.95
1.1±
0.05
0.05
±0.0
5
1.25
Max
.
4.0
±0.2
8
1PIN MARK
3
2.8
±0.1
1
6
2.9±0.1
0.4754
57
(MAX 3.25 include BURR)
2
0.6
±0.2
0.29
±0.1
5
+0.05−0.030.145
0.9M
AX
0.75
±0.0
5
0.65
0.08
±0.0
5
0.22+0.05−0.04
+6°4° –4°
0.13 +0.05−0.03
1.1±
0.05
0.05
±0.0
5
0.42 +0.05−0.04
0.95
1.25
Max
.
2.9±0.2
1.6
2.8±
0.2
+0.2
−0.1
5 4
1 2 3
0.2M
in.
+6°4° –4°
+6°4° –4°+6°4° –4°
4
321
321
5
45
0.2M
AX
(0.0
5)
1.6±0.05
1.0±0.05
1.6
±0.0
5
1.2
±0.0
5
0.13±0.05
(MAX
1.28
inclu
de B
URR)
0.22±0.05
0.6M
AX
+0
.03
-0
.02
0.02
0.5
(0.8)
(0.9
1)
(0.3)
(0.4
1)
6 5 4
6 5 4
2 31
2 31
(MAX1.8 include BURR)
(MAX
2.8
incl
ude
BUR
R)
2.6±
0.1
0.3
1.6±0.1
3.0±
0.1
0.145±0.051PIN MARK
0.75
MA
X
0.5 0.22±0.05
(0.4
5)(0
.15)
(1.5
)
(1.2)
1 2 3
10.0+0.3-0.1φ 3.2 ± 0.1
0.82 ± 0.1
(0.585)
1.32.542.46
2.8+0.2-0.1
+0.
4-0
.215
.25.
61 ±
0.2
12.0
± 0
.21.
0 ±
0.2
8.0
± 0
.2
4.5 ± 0.1
2.85
0.42 ± 0.1
FIN
11 2
0.650.75
332
C0.5
0.27±0.1
5.1-0.1+0.2
2.3
0.6±0.2
0.95
0.8
1.0
±0.2
9.5
±0.3
2.5
±0.1
5
6.5±0.2 1.2±0.1
0.27±0.1
1.5
±0.2
5.5
±0.2
0.35
±0.1
0.65±0.1
+6°4° –4°
FIN
9.5
±0.5
2.51.5
0.5±0.11.0±0.2
5.1-0.1+0.2 2.3±0.2
6.5±0.2
2.3±0.2 2.3±0.2
0.5±0.1C0.5
1.5
±0.2
5.5
±0.2
0.8
1.2
±0.0
5
4
3
1.0±0.05
1
0.6M
AX
0.22±0.050.5
5
1.6±0.05
0.13±0.05
0.2M
AX
2
1.6
±0.0
5
(MAX
1.28
inclu
de B
URR) 4
321
321
5
45
0.2M
AX
(0.0
5)
1.6±0.05
1.0±0.05
1.6
±0.0
5
1.2
±0.0
5
0.13±0.05
(MAX
1.28
inclu
de B
URR)
0.22±0.05
0.6M
AX
+0
.03
-0
.02
0.02
0.5
(0.8)
(0.9
1)
(0.3)
(0.4
1)
(1.2)
(1.4)
(1.5
)
(0.4
5)(0
.15)
0.22±0.05
0.75
Max
.
0.5
0.145±0.05321
321
456
456
3.0±
0.1
2.6±
0.1
(MAX
2.8
incl
ude
BUR
R)
1.6±0.1(MAX 1.8 include BURR)
431 2
431 2
0.13+0.1-0.051PIN MARK
8 7 6 5
8 7 6 5
2.8
±0.1
2.9±0.1
3.0
±0.2
(MAX 3.1 include BURR)
0.475
0.02
+0.
03-0
.020
.6M
AX
0.32±0.10.65
(0.2
)(1
.8)
(0.1
5)
(2.2)
(0.3
)
(0.4
5)
(0.2
) (0.05)
0.22±0.05
0.75
MA
X
(0.4
5)
(0.1
5)
0.30.275
(1.2)
(1.5
)
0.30.3
(MAX1.8 include BURR)
(MAX
2.8
incl
ude
BUR
R)
1.6±0.1
0.145±0.05
3.0±
0.1
0.27±0.05
2.6±
0.1
6 5 4
6 5 4
1 2 3
1 2 3
0.50.5
0.50.525
0.650.65
S0.08
S
S0.1
S
S0.1
S
0.1
S
M0.08
S0.08
S
M0.08
S0.08
S
M0.08
S0.1
S
M0.08
S0.1S
S0.1
S
M0.08
S0.1
S
M0.08
S0.08
2 3 51 4
9 8 610 7
4.0
±0.2
2.8
±0.1
2.9±0.1(MAX 3.25 include BURR)
1PIN MARK0.45
+6°4° –4°
0.6
±0.2
0.29
±0.1
5
+0.05−0.030.145
S
0.9M
AX
0.75
±0.0
5
0.08
±0.0
5
0.5 0.22+0.05−0.04 M0.08
S0.08
2.9±0.2
0.2M
in.
+0.05−0.030.13
2.8±
0.2
1.6
3
10.95
1.9
2
+0.2
−0.1
S
1.1±
0.05
0.05
±0.0
5+0.050.42 −0.04
1.25
Max
.
S0.1
+6°4° –4°
21 3
3°±2°
2.0R
EF
–0.1
+0.
131.
27
4°±4°
7°±2°
0.1+0.15–0.1
9.15
±0.1
+0.13–0.174.57
1.27±0.05
2.30
±0.3
10.16±1.0
3°±2°
2.54BSC
15.1
0±0.
47°±2°
2.69±0.1
1.295±0.0650.835±0.065
0.25BSC
1 4
58
2.1±
0.1
2.0±0.1
0.5C0.25
0.25
(0.1
2)
1.5±0.1
0.75
±0.1
0.35
±0.1
0.2+0.05-0.04
0.02
+0.
03-
0.02
1PIN MARK
0.60
MA
X.
S
S0.05
0.06
±0.
04
2.3±0.05
6.53±0.05
1.8M
AX
.
+4.0°-4.0°
7.0±
0.2
0.325±0.025
1.0±
0.2
3.025±0.065
4°
3.43
±0.
1
4.6±0.1
1.78
0.71±0.05S0.08
0.10
S
1 2 3
1.6
±0.1
WSOF5(Clear Type) WSOF6 (Clear Type) WSON008X2120 (Clear Type)WSOF6I
TO220CP-3 TO252S-3 TO252-3 TO263-3
SOT223-4
SOP4 SSOP3 SSOP5
SSOP6 MSOP8 MSOP10
VSOF5 HVSOF5 HVSOF6 HSON8
Embossed carrier tape:3,000pcs Embossed carrier tape:3,000pcs
Embossed carrier tape:3,000pcs
Embossed carrier tape:3,000pcs Embossed carrier tape:3,000pcs Embossed carrier tape:3,000pcs Embossed carrier tape:3,000pcs
Embossed carrier tape:3,000pcs Embossed carrier tape:3,000pcs
Embossed carrier tape:500pcs
Embossed carrier tape:2,000pcs
Embossed carrier tape:2,000pcs Embossed carrier tape:2,000pcs Embossed carrier tape:500pcs
Embossed carrier tape:3,000pcs Embossed carrier tape:3,000pcs Embossed carrier tape:3,000pcs Embossed carrier tape:4,000pcs
Small Packages (Unit: mm)
Non-Lead Packages (Unit: mm)
Please refer packages from page, A160 for LAPIS Semiconductor products.
A154
ICs
IC Packages (ROHM)
www.rohm.com
▶Small Packages ▶▶SOP Type▶Non-Lead Packages ▶▶Non-Lead
A
IC P
ackages
POWER-3PIN
Optical Non-Lead
POWER-4PIN
SOP Type
Non-Lead
2.1±
0.2
0.05
1.3
2.0±0.2
1 2
4 3
1.25
+0.2
−0.1
0.27
±0.1
5
0.13 +0.05−0.03
0.13 +0.05−0.03
0.9±
0.05
0.05
±0.0
5
1.05
Max
.
0.32+0.05−0.04
0.42+0.05−0.04
0.42 +0.05−0.04
0.2M
in.
1 2 3
6 5 4
2.9±0.2
2.8±
0.2
1.6
+0.2
−0.1
0.95
1.1±
0.05
0.05
±0.0
5
1.25
Max
.
4.0
±0.2
8
1PIN MARK
3
2.8
±0.1
1
6
2.9±0.1
0.4754
57
(MAX 3.25 include BURR)
2
0.6
±0.2
0.29
±0.1
5
+0.05−0.030.145
0.9M
AX
0.75
±0.0
5
0.65
0.08
±0.0
5
0.22+0.05−0.04
+6°4° –4°
0.13 +0.05−0.03
1.1±
0.05
0.05
±0.0
5
0.42 +0.05−0.04
0.95
1.25
Max
.
2.9±0.2
1.6
2.8±
0.2
+0.2
−0.1
5 4
1 2 3
0.2M
in.
+6°4° –4°
+6°4° –4°+6°4° –4°
4
321
321
5
45
0.2M
AX
(0.0
5)
1.6±0.05
1.0±0.05
1.6
±0.0
5
1.2
±0.0
5
0.13±0.05
(MAX
1.28
inclu
de B
URR)
0.22±0.05
0.6M
AX
+0
.03
-0
.02
0.02
0.5
(0.8)
(0.9
1)
(0.3)
(0.4
1)
6 5 4
6 5 4
2 31
2 31
(MAX1.8 include BURR)
(MAX
2.8
incl
ude
BUR
R)
2.6±
0.1
0.3
1.6±0.1
3.0±
0.1
0.145±0.051PIN MARK
0.75
MA
X
0.5 0.22±0.05
(0.4
5)(0
.15)
(1.5
)
(1.2)
1 2 3
10.0+0.3-0.1φ 3.2 ± 0.1
0.82 ± 0.1
(0.585)
1.32.542.46
2.8+0.2-0.1
+0.
4-0
.215
.25.
61 ±
0.2
12.0
± 0
.21.
0 ±
0.2
8.0
± 0
.2
4.5 ± 0.1
2.85
0.42 ± 0.1
FIN
11 2
0.650.75
332
C0.5
0.27±0.1
5.1-0.1+0.2
2.3
0.6±0.2
0.95
0.8
1.0
±0.2
9.5
±0.3
2.5
±0.1
5
6.5±0.2 1.2±0.1
0.27±0.1
1.5
±0.2
5.5
±0.2
0.35
±0.1
0.65±0.1
+6°4° –4°
FIN
9.5
±0.5
2.51.5
0.5±0.11.0±0.2
5.1-0.1+0.2 2.3±0.2
6.5±0.2
2.3±0.2 2.3±0.2
0.5±0.1C0.5
1.5
±0.2
5.5
±0.2
0.8
1.2
±0.0
5
4
3
1.0±0.05
1
0.6M
AX
0.22±0.050.5
5
1.6±0.05
0.13±0.05
0.2M
AX
2
1.6
±0.0
5
(MAX
1.28
inclu
de B
URR) 4
321
321
5
45
0.2M
AX
(0.0
5)
1.6±0.05
1.0±0.05
1.6
±0.0
5
1.2
±0.0
5
0.13±0.05
(MAX
1.28
inclu
de B
URR)
0.22±0.05
0.6M
AX
+0
.03
-0
.02
0.02
0.5
(0.8)
(0.9
1)
(0.3)
(0.4
1)
(1.2)
(1.4)
(1.5
)
(0.4
5)(0
.15)
0.22±0.05
0.75
Max
.
0.5
0.145±0.05321
321
456
456
3.0±
0.1
2.6±
0.1
(MAX
2.8
incl
ude
BUR
R)
1.6±0.1(MAX 1.8 include BURR)
431 2
431 2
0.13+0.1-0.051PIN MARK
8 7 6 5
8 7 6 5
2.8
±0.1
2.9±0.1
3.0
±0.2
(MAX 3.1 include BURR)
0.475
0.02
+0.
03-0
.020
.6M
AX
0.32±0.10.65
(0.2
)(1
.8)
(0.1
5)
(2.2)
(0.3
)
(0.4
5)
(0.2
) (0.05)
0.22±0.05
0.75
MA
X
(0.4
5)
(0.1
5)
0.30.275
(1.2)
(1.5
)
0.30.3
(MAX1.8 include BURR)
(MAX
2.8
incl
ude
BUR
R)
1.6±0.1
0.145±0.05
3.0±
0.1
0.27±0.05
2.6±
0.1
6 5 4
6 5 4
1 2 3
1 2 3
0.50.5
0.50.525
0.650.65
S0.08
S
S0.1
S
S0.1
S
0.1
S
M0.08
S0.08
S
M0.08
S0.08
S
M0.08
S0.1
S
M0.08
S0.1S
S0.1
S
M0.08
S0.1
S
M0.08
S0.08
2 3 51 4
9 8 610 7
4.0
±0.2
2.8
±0.1
2.9±0.1(MAX 3.25 include BURR)
1PIN MARK0.45
+6°4° –4°
0.6
±0.2
0.29
±0.1
5
+0.05−0.030.145
S
0.9M
AX
0.75
±0.0
5
0.08
±0.0
5
0.5 0.22+0.05−0.04 M0.08
S0.08
2.9±0.2
0.2M
in.
+0.05−0.030.13
2.8±
0.2
1.6
3
10.95
1.9
2
+0.2
−0.1
S
1.1±
0.05
0.05
±0.0
5
+0.050.42 −0.04
1.25
Max
.
S0.1
+6°4° –4°
21 3
3°±2°
2.0R
EF
–0.1
+0.
131.
274°±4°
7°±2°
0.1+0.15–0.1
9.15
±0.1
+0.13–0.174.57
1.27±0.05
2.30
±0.3
10.16±1.0
3°±2°
2.54BSC
15.1
0±0.
47°±2°
2.69±0.1
1.295±0.0650.835±0.065
0.25BSC
1 4
58
2.1±
0.1
2.0±0.1
0.5C0.25
0.25
(0.1
2)
1.5±0.1
0.75
±0.1
0.35
±0.1
0.2+0.05-0.04
0.02
+0.
03-
0.02
1PIN MARK
0.60
MA
X.
S
S0.05
0.06
±0.
04
2.3±0.05
6.53±0.05
1.8M
AX
.
+4.0°-4.0°
7.0±
0.2
0.325±0.025
1.0±
0.2
3.025±0.065
4°
3.43
±0.
1
4.6±0.1
1.78
0.71±0.05S0.08
0.10
S
1 2 3
1.6
±0.1
WSOF5(Clear Type) WSOF6 (Clear Type) WSON008X2120 (Clear Type)WSOF6I
TO220CP-3 TO252S-3 TO252-3 TO263-3
SOT223-4
SOP4 SSOP3 SSOP5
SSOP6 MSOP8 MSOP10
VSOF5 HVSOF5 HVSOF6 HSON8
Embossed carrier tape:3,000pcs Embossed carrier tape:3,000pcs
Embossed carrier tape:3,000pcs
Embossed carrier tape:3,000pcs Embossed carrier tape:3,000pcs Embossed carrier tape:3,000pcs Embossed carrier tape:3,000pcs
Embossed carrier tape:3,000pcs Embossed carrier tape:3,000pcs
Embossed carrier tape:500pcs
Embossed carrier tape:2,000pcs
Embossed carrier tape:2,000pcs Embossed carrier tape:2,000pcs Embossed carrier tape:500pcs
Embossed carrier tape:3,000pcs Embossed carrier tape:3,000pcs Embossed carrier tape:3,000pcs Embossed carrier tape:4,000pcs
Non-Lead Packages (Unit: mm)
Power Packages (Unit: mm)
Please refer packages from page, A160 for LAPIS Semiconductor products.
A155
ICs
IC Packages (ROHM)
www.rohm.com
▶Non-Lead Packages ▶▶Optical Non-Lead▶Power Packages ▶▶POWER-3PIN
▶▶POWER-4PIN
A
IC P
ackages
VBGA-T <Pin Pitch : 0.5mm>
VBGA-B <Pin Pitch : 0.5mm>
POWER-5PIN
POWER-7PIN
UBGA-W <Pin Pitch : 0.4mm>
B
A
S
Mφ0.05 ABS
S0.08
B
A
S
M0.05 ABS
S0.08
B
A
S
M0.05 ABS
S0.08
S
S0.08
S
M0.08
S0.08
B
A
S
M0.05 ABS
S0.08
B
A
S
M0.05 ABS
S0.08
1.2M
AX
0.23
4.0±
0.1
4.0±0.11Pin MARK
CBA
DEF
321 456
P=0
.5x5
0.75
±0.10.75±0.1 P=0.5x5
0.535−φ0.3±0.05
1PIN MARK8.0±0.1
8.0
±0.1
1.2M
AX
0.5
0.23
±0.1
P=0.5x13
P=
0.5
x13
0.75±0.1
0.75
±0.1
195-φ0.3±0.05
G
12345678910
1112
1314
FEDCB
HJKLMNP
A
1.2M
AX
0.230.75±0.1 P=0.5x11
0.5 143−φ0.3±0.05
P=0
.5x1
10.
75±0
.1
JHGFEDCBA
KLM
98
76
54
32
110
1112
7.0±
0.1
7.0±0.11Pin MARK
(MAX 9.745 include BURR)
54321
(6.5)
8.82 ± 0.1
9.395 ± 0.125
(7.4
9)
8.0
± 0.
131.
017
± 0.
2
1.2575
1.905 ± 0.1
0.83
5 ±
0.2
1.52
3 ±
0.15
10.5
4 ±
0.13
−0.05+0.10.27
0.73 ± 0.1
1.72
0.08
± 0
.05
1 23
54
0.8
0.71
C0.5
6.5±0.2
5.1−0.1+0.2
5.5±
0.2
1.5±
0.2
0.27±0.1
1.0±
0.2
2.5±
0.15
9.5±
0.3
1.2±0.1
0.27±0.1
0.6±0.2
0.27±0.11.270.
35±0
.1
FIN16
.92
φ3.2±0.1
4.5±0.1
8.0
±0.2
12.0
±0.2
4.92
±0.2
10.0 +0.3-0.1
2.8+0.2-0.1
13.6
0
15.2
-0.
2+
0.4
1.0
±0.2
(1.0
)
0.92
0.82±0.1
0.5±0.1
2.85
1.58
0.42±0.11.778
1.444
4.12
(2.85)
+6°4° –4°
+5.5°4.5°–4.5°
10.0 +0.3
1.2
1.778
1 2 3 4 5
0.6
-0.1 4.5 +0.3-0.1
2.8+0.2-0.17.0 +0.3
-0.1
1.8±
0.2
12.0
±0.2
0.85
±0.2
8.0±
0.2
0.7
13.5
MIN
17.0
-0.
2+
0.4
φ3.2±0.1
6.5±0.2 2.3±0.2
0.5±0.1
0.5±0.11.0±0.2
FIN
0.5
1 2 4 5
3
1.27
1.5±
0.2
5.5±
0.2
9.5±
0.5
2.5
1.5
0.8
5.1+0.2-0.1
2
FG
8
E
H
D
5
C
31
0.5
7
0.5
BA
0.23
5.0±0.1
5.0
±0.1
4 6
1PIN MARK
1.2M
AX
63-φ0.3±0.05
P=0.5x70.75±0.1
P=
0.5
x70.
75±0
.1
1.2M
AX
0.23
6.0±
0.1
6.0±0.11Pin MARK
GFEDCBA
HJK
76
54
32
18
910
P=0
.5x9
0.5
0.75
±0.10.75±0.1 P=0.5x9
0.599−φ0.3±0.05
S
M ABSφ0.05
0.08 S
A
B
1PIN MARK
0.23
1 3
P=0.5X7
F
7
P=
0.5X
7
4
G
48-φ0.3±0.05 0.5
5.0±0.1
5
0.75
±0.1
8
H
B
1.2M
AX
C
6
A
0.75±0.1
D
2
5.0±
0.1
E
M ABSφ0.05
0.08 S
S
A
B
3
0.5±
0.1
1PIN MARK
10
P=0.5X10
E
5
C
F
9
6.0±
0.1
P=
0.5X
10
6
0.23
2
1.2M
AX
6.0±0.1
0.5±0.1
8
120-φ0.295±0.05
D
G
4
A
11
LK
B
1
HJ
7 1 3 4 5 78 9 112 6 10 12
MLKJHGFEDCBA
7.0±
0.1
0.5
0.75±0.1
P=
0.5X
111.
2MA
X
0.5
0.75
±0.1
7.0±0.1
P=0.5X11131-φ0.3±0.05
0.23
M
0.08 S
ABSφ0.05
S
A
B
1PIN MARK
S
M ABSφ0.05
0.08 S
A
B
ABCDEFGHJKLMN
1 2 3 654 789
P
10111213 14
0.23
0.5
0.75
±0.1
8.0±0.1
1.2M
AX
P=
0.5X
13
0.75±0.1
8.0±
0.1
161-φ0.3±0.05
P=0.5X13
1PIN MARK
S
M ABSφ0.05
0.08 S
A
BR
T UV
AB C
EDF GH JKM N
L
P
31 7 111315172 6
98
54 10121416 18
256-φ0.3±0.05P=0.5X17
10.0
±0.1
0.75±0.1
0.23
0.5
10.0±0.1
0.75
±0.1
1.2M
AX
P=
0.5X
17
1PIN MARK
S
S0.08
7654321
0.8875
(MAX 9.745 include BURR)9.395 ± 0.125
8.82 ± 0.1
(6.5)
1.01
7 ±
0.2
8.0
± 0.
13
(7.4
9)
1.905 ± 0.1
0.83
5 ±
0.2
1.52
3 ±
0.15
10.5
4 ±
0.13
0.27
4.5°
−0.05+0.1
−4.5°+5.5°
0.73 ± 0.1
1.27
0.08
± 0
.05
0.27±0.1
0.6±0.20.27±0.1
1.2±0.1
S
1.0±
0.2
2.5±
0.15
9.5±
0.3
4°−4°+6°
0.35
±0.1
S0.080.8
M0.080.27±0.1
1234567
FIN
6.5±0.2
+0.2-0.15.1
1.5±
0.2
5.5±
0.2
C0.5
0.85
C0.5
1 2 3 4 5 6 7 8 9 1011ABCDEFG
1213
HJKLMN
0.5 ±
0.1
P=0
.5x1
2
0.5±0.1 P=0.5x12
B
A
S
M0.05 ABS
S0.08
1.0M
AX
0.23
145−φ0.3±0.05
7.0±
0.1
7.0±0.11Pin MARK
3
P=0.4x5
6
E
3.0±0.1
P=0
.4x5
0.9M
AX
52
0.5±0.1
0.1
F
4
0.4
C
3.0±
0.1
0.4
B
D
1
0.5±
0.1
A
B
A
S
S0.08
1Pin MARK
φ0.05 A B35−φ0.2±0.05
10.16 ± 1.01.27±0.5
15.1
0 ±
0.4
2.30
± 0
.32.69 ± 0.1
7°±2°
7°±2°
3°
4°±4°0.25BSC
3°±2°
9.15
± 0
.1
0.835 ± 0.0651.70BSC
2.0R
EF
1.27
+0.
13–0
.1
4.57+0.13–0.17
0.1+0.15–0.1
1 2 3 4 5
FIN
10.1
0±0.
3
4°±4°
1.8R
EF
0.8±
0.20
+0.11–0.105.33 –0.10
5°±2°
+0.08
1.07
5±0.
175
2.9
0.53±0.03
1.5
1.2±
0.3
6.6±0.1
5°±2°
–0.1
0
2.30
1.14±0.1
6.1±
0.1
+0.
20
0.53±0.03
0.635±0.065
3°±2°
1 2 4
3
5
HRP7 TO252S-7+
TO220CP-V5 TO252S-5TO220FP-5
HRP5 TO263-5 TO252-J5TO252-5
VBGA048T050VBGA035T040 VBGA063T050 VBGA099T060
VBGA131T070VBGA120T060 VBGA143T070 VBGA161T080
VBGA195T080
VBGA145B070
VBGA256T100
UBGA035W030
Embossed carrier tape:500pcs
Embossed carrier tape:2,000pcs
Embossed carrier tape:2,000pcs Embossed carrier tape:2,000pcs
Embossed carrier tape:2,600pcs Embossed carrier tape:500pcs Embossed carrier tape:2,000pcs
Contaner tube:500pcs Embossed carrier tape:2,000pcs
Embossed carrier tape:2,500pcs Embossed carrier tape:2,000pcs
Embossed carrier tape:3,000pcs
Power Packages (Unit: mm)
Please refer packages from page, A160 for LAPIS Semiconductor products.
A156
ICs
IC Packages (ROHM)
www.rohm.com
▶Power Packages ▶▶POWER-5PIN▶▶POWER-7PIN
A
IC P
ackages
VBGA-T <Pin Pitch : 0.5mm>
VBGA-B <Pin Pitch : 0.5mm>
POWER-5PIN
POWER-7PIN
UBGA-W <Pin Pitch : 0.4mm>
B
A
S
Mφ0.05 ABS
S0.08
B
A
S
M0.05 ABS
S0.08
B
A
S
M0.05 ABS
S0.08
S
S0.08
S
M0.08
S0.08
B
A
S
M0.05 ABS
S0.08
B
A
S
M0.05 ABS
S0.08
1.2M
AX
0.23
4.0±
0.1
4.0±0.11Pin MARK
CBA
DEF
321 456
P=0
.5x5
0.75
±0.10.75±0.1 P=0.5x5
0.535−φ0.3±0.05
1PIN MARK8.0±0.1
8.0
±0.1
1.2M
AX
0.5
0.23
±0.1
P=0.5x13
P=
0.5
x13
0.75±0.1
0.75
±0.1
195-φ0.3±0.05
G
12345678910
1112
1314
FEDCB
HJKLMNP
A
1.2M
AX
0.230.75±0.1 P=0.5x11
0.5 143−φ0.3±0.05
P=0
.5x1
10.
75±0
.1
JHGFEDCBA
KLM
98
76
54
32
110
1112
7.0±
0.1
7.0±0.11Pin MARK
(MAX 9.745 include BURR)
54321
(6.5)
8.82 ± 0.1
9.395 ± 0.125
(7.4
9)
8.0
± 0.
131.
017
± 0.
2
1.2575
1.905 ± 0.1
0.83
5 ±
0.2
1.52
3 ±
0.15
10.5
4 ±
0.13
−0.05+0.10.27
0.73 ± 0.1
1.72
0.08
± 0
.05
1 23
54
0.8
0.71
C0.5
6.5±0.2
5.1−0.1+0.2
5.5±
0.2
1.5±
0.2
0.27±0.1
1.0±
0.2
2.5±
0.15
9.5±
0.3
1.2±0.1
0.27±0.1
0.6±0.2
0.27±0.11.270.
35±0
.1
FIN
16.9
2
φ3.2±0.1
4.5±0.1
8.0
±0.2
12.0
±0.2
4.92
±0.2
10.0 +0.3-0.1
2.8+0.2-0.1
13.6
0
15.2
-0.
2+
0.4
1.0
±0.2
(1.0
)
0.92
0.82±0.1
0.5±0.1
2.85
1.58
0.42±0.11.778
1.444
4.12
(2.85)
+6°4° –4°
+5.5°4.5°–4.5°
10.0 +0.3
1.2
1.778
1 2 3 4 5
0.6
-0.1 4.5 +0.3-0.1
2.8+0.2-0.17.0 +0.3
-0.1
1.8±
0.2
12.0
±0.2
0.85
±0.2
8.0±
0.2
0.7
13.5
MIN
17.0
-0.
2+
0.4
φ3.2±0.1
6.5±0.2 2.3±0.2
0.5±0.1
0.5±0.11.0±0.2
FIN
0.5
1 2 4 5
3
1.27
1.5±
0.2
5.5±
0.2
9.5±
0.5
2.5
1.5
0.8
5.1+0.2-0.1
2
FG
8
E
H
D
5
C
31
0.5
7
0.5
BA
0.23
5.0±0.1
5.0
±0.1
4 6
1PIN MARK
1.2M
AX
63-φ0.3±0.05
P=0.5x70.75±0.1
P=
0.5
x70.
75±0
.1
1.2M
AX
0.23
6.0±
0.1
6.0±0.11Pin MARK
GFEDCBA
HJK
76
54
32
18
910
P=0
.5x9
0.5
0.75
±0.10.75±0.1 P=0.5x9
0.599−φ0.3±0.05
S
M ABSφ0.05
0.08 S
A
B
1PIN MARK
0.23
1 3
P=0.5X7
F
7
P=
0.5X
7
4
G
48-φ0.3±0.05 0.5
5.0±0.1
5
0.75
±0.1
8
H
B
1.2M
AX
C
6
A
0.75±0.1
D
2
5.0±
0.1
E
M ABSφ0.05
0.08 S
S
A
B
3
0.5±
0.1
1PIN MARK
10
P=0.5X10
E
5
C
F
9
6.0±
0.1
P=
0.5X
10
6
0.23
2
1.2M
AX
6.0±0.1
0.5±0.1
8
120-φ0.295±0.05
D
G
4
A
11
LK
B
1
HJ
7 1 3 4 5 78 9 112 6 10 12
MLKJHGFEDCBA
7.0±
0.1
0.5
0.75±0.1
P=
0.5X
111.
2MA
X
0.5
0.75
±0.1
7.0±0.1
P=0.5X11131-φ0.3±0.05
0.23
M
0.08 S
ABSφ0.05
S
A
B
1PIN MARK
S
M ABSφ0.05
0.08 S
A
B
ABCDEFGHJKLMN
1 2 3 654 789
P
10111213 14
0.23
0.5
0.75
±0.1
8.0±0.1
1.2M
AX
P=
0.5X
13
0.75±0.1
8.0±
0.1
161-φ0.3±0.05
P=0.5X13
1PIN MARK
S
M ABSφ0.05
0.08 S
A
BR
T UV
AB C
EDF GH JKM N
L
P
31 7 111315172 6
98
54 10121416 18
256-φ0.3±0.05P=0.5X17
10.0
±0.1
0.75±0.1
0.23
0.5
10.0±0.1
0.75
±0.1
1.2M
AX
P=
0.5X
17
1PIN MARK
S
S0.08
7654321
0.8875
(MAX 9.745 include BURR)9.395 ± 0.125
8.82 ± 0.1
(6.5)
1.01
7 ±
0.2
8.0
± 0.
13
(7.4
9)
1.905 ± 0.1
0.83
5 ±
0.2
1.52
3 ±
0.15
10.5
4 ±
0.13
0.27
4.5°
−0.05+0.1
−4.5°+5.5°
0.73 ± 0.1
1.27
0.08
± 0
.05
0.27±0.1
0.6±0.20.27±0.1
1.2±0.1
S
1.0±
0.2
2.5±
0.15
9.5±
0.3
4°−4°+6°
0.35
±0.1
S0.080.8
M0.080.27±0.1
1234567
FIN
6.5±0.2
+0.2-0.15.1
1.5±
0.2
5.5±
0.2
C0.5
0.85
C0.5
1 2 3 4 5 6 7 8 9 1011ABCDEFG
1213
HJKLMN
0.5 ±
0.1
P=0
.5x1
2
0.5±0.1 P=0.5x12
B
A
S
M0.05 ABS
S0.08
1.0M
AX
0.23
145−φ0.3±0.05
7.0±
0.1
7.0±0.11Pin MARK
3
P=0.4x5
6
E
3.0±0.1
P=0
.4x5
0.9M
AX
52
0.5±0.1
0.1
F
4
0.4
C
3.0±
0.1
0.4
B
D
1
0.5±
0.1
A
B
A
S
S0.08
1Pin MARK
φ0.05 A B35−φ0.2±0.05
10.16 ± 1.01.27±0.5
15.1
0 ±
0.4
2.30
± 0
.32.69 ± 0.1
7°±2°
7°±2°
3°
4°±4°0.25BSC
3°±2°
9.15
± 0
.1
0.835 ± 0.0651.70BSC
2.0R
EF
1.27
+0.
13–0
.1
4.57+0.13–0.17
0.1+0.15–0.1
1 2 3 4 5
FIN
10.1
0±0.
3
4°±4°
1.8R
EF
0.8±
0.20
+0.11–0.105.33 –0.10
5°±2°
+0.08
1.07
5±0.
175
2.9
0.53±0.03
1.5
1.2±
0.3
6.6±0.1
5°±2°
–0.1
0
2.30
1.14±0.1
6.1±
0.1
+0.
20
0.53±0.03
0.635±0.065
3°±2°
1 2 4
3
5
HRP7 TO252S-7+
TO220CP-V5 TO252S-5TO220FP-5
HRP5 TO263-5 TO252-J5TO252-5
VBGA048T050VBGA035T040 VBGA063T050 VBGA099T060
VBGA131T070VBGA120T060 VBGA143T070 VBGA161T080
VBGA195T080
VBGA145B070
VBGA256T100
UBGA035W030
Embossed carrier tape:500pcs
Embossed carrier tape:2,000pcs
Embossed carrier tape:2,000pcs Embossed carrier tape:2,000pcs
Embossed carrier tape:2,600pcs Embossed carrier tape:500pcs Embossed carrier tape:2,000pcs
Contaner tube:500pcs Embossed carrier tape:2,000pcs
Embossed carrier tape:2,500pcs Embossed carrier tape:2,000pcs
Embossed carrier tape:3,000pcs
BGA Packages (Unit: mm)
Please refer packages from page, A160 for LAPIS Semiconductor products.
A157
ICs
IC Packages (ROHM)
www.rohm.com
▶BGA Packages ▶▶VBGA-T<Pin Pitch:0.5mm>▶▶VBGA-B<Pin Pitch:0.5mm>▶▶UBGA-W<Pin Pitch:0.4mm>
A
IC P
ackages
VBGA035W040 VBGA048W040 VBGA063W050 VBGA080W050
VBGA099W060 VBGA143W070
SBGA063T060 SBGA099T070 SBGA120T080
SBGA024W040 SBGA063W060 SBGA120W080SBGA099W070
VCSP <Pin Pitch : 0.5mm>
UCSP <Pin Pitch : 0.4mm>
VCSP85H VCSP50L VCSP35L VCSP30L
UCSP75M UCSP50L UCSP35L UCSP30L
1×1 6×6
0.5
0.85
0.25
~
~
0.5
0.50
0.1
1×1 6×6
~
~ 1×1
0.5 0.1
0.35
3×3
~
~ 1×1
0.5 0.08
0.30
3×3
~
~
0.4
0.75
0.15
0.8×0.8 6×6
~
~
0.4
0.50
0.1
0.8×0.8 6×6
~
~ 0.8×0.8 3×3
0.4
0.35
0.1
~
~ 0.8×0.8 3×3
0.4
0.30
0.08
~
~
SBGA-W <Pin Pitch : 0.65mm>
SBGA-T <Pin Pitch : 0.65mm>
VBGA-W <Pin Pitch : 0.5mm>
B
A
S
Mφ0.05 ABS
S0.08
B
A
S
M0.05 ABS
S0.08
B
A
S
Mφ0.08 AB
S0.08
B
A
S
Mφ0.08 ABS
S0.10
B
A
S
Mφ0.08 ABS
S0.10
B
A
S
Mφ0.05 ABS
S0.10
B
A
S
M0.08 ABS
S0.10
B
A
S
Mφ0.08 ABS
S0.10
B
A
S
Mφ0.08 ABS
S0.10
B
A
S
φ0.05 BA
S0.08
B
A
S
M0.05 ABS
S0.08
B
A
S
Mφ0.05 ABS
S0.08
B
A
S
S0.08
M0.05 ABS
0.5
0.5
0.1
0.9M
AX
6.0±0.1
6.0
±0.
1
P=0.5x90.75±0.1
P=
0.5
x90.
75±
0.1
99-φ0.295±0.05
310
E
5
C
F
962 8
D
G
4
A
K
B
1
HJ
7
0.9M
AX
0.10
1PIN MARK7.0±0.1
7.0
±0.
1
143-φ0.285±0.05P=0.5x110.75±0.1
0.5
0.5
P=
0.5
x11
0.75
±0.
1
E
C
F
D
G
A
LM
K
B
HJ
310 12
5 962 84
111 7
1PIN MARK
0.7±0.1
3
4.0±0.1
C
24-φ0.33±0.05
P=0.65x4
0.7±
0.1
D
P=
0.65
x40.
08
4.0
±0.
1
A
0.65
E
0.65
2
0.9M
AX
51 4
B
F
8
0.725±0.1
3
C
63-φ0.33±0.05
0.9M
AX
P=0.65x7
0.72
5±0.
1D
G
0.65
6.0±
0.1
A P=
0.65
x7
E
0.65
762
6.0±0.1
H
51
0.08
4
B
12
58
9106
74
3
KJHGFEDCBA
7.0±
0.1
7.0±0.1
0.575±0.1P=0.65x9
0.65 99-φ0.33±0.05
0.65
0.9M
AX
0.08
0.57
5±0.
1P=
0.65
x9
1PIN MARK
120-φ0.33±0.05
8.0±0.1
8.0±
0.1
0.08
0.9M
AX
P=0.65x10 0.75±0.1
P=
0.65
x10
0.75
±0.1
0.65
0.65
1 3 5 7 9 112 4 6 8 10
ABCDEFGHJKL
1.2M
AX
0.23
6.0±
0.1
6.0±0.1
EDCBA
FGH
54321 678
63−φ0.33±0.05
P=0
.65x
7
0.65
0.72
5±0.
1
0.725±0.1P=0.65x7
0.65
7.0±
0.1
7.0±0.1
1Pin MARK
1.2M
AX
0.23
GFEDCBA
HJK
7654321 8910
P=0
.65x
9
0.65
0.57
5±0.
1
0.575±0.1P=0.65x9
0.65
99−φ0.33±0.05
0.75±0.1P=0.65x10
0.65
P=
0.65
x10
0.65
120−φ0.33±0.05
0.75
±0.1
DEFGHJKL
CBA
1.2M
AX
0.23
8.0±
0.1
8.0±0.1
45
67
8910
1132
1
1PIN MARK
1Pin MARK
1PIN MARK
1PIN MARK1PIN MARK
0.1
0.5
0.9M
AX
1PIN MARK 5.0±0.1
5.0
±0.
1
5.0±0.1
5.0
±0.
1P=0.5x8
P=
0.5
x8
80-φ0.295±0.05
2 8531 97
4 6
5.0±0.1
0.1
P=0.5x7
0.5
5.0±
0.1
63-φ0.295±0.05 0.75
±0.10.75±0.1
0.9M
AX
0.5
P=
0.5x
7
48-φ0.295±0.05 0.5
0.9M
AX
4.0±0.1
4.0
±0.
1
P=0.5x6
P=
0.5
x6
0.5
0.10
0.5±0.1
0.5
±0.
1
E
4
GF
312
BA
7
C
6
D
5
4.0±0.1
4.0
±0.
10.
1
0.9M
AX
0.50.75±0.1 P=0.5x5
0.75
±0.
1
0.5
34
562
1
ABCDEF
35 - φ 0.295±0.05
P=
0.5x
5
FG
E
H
DCBA
J
F
5
C
3 7
D
G
4 6
E
1
A
2
H
8
B
1PIN MARK1PIN MARK1PIN MARK
Embossed carrier tape:2,500pcs
Embossed carrier tape:2,000pcs
Embossed carrier tape:2,500pcs Embossed carrier tape:2,500pcs Embossed carrier tape:2,500pcs
2.8mm□ and under : 3,000pcsOver 2.8mm□ : 2,500pcs
2.8mm□ and under : 3,000pcsOver 2.8mm□ : 2,500pcs
2.8mm□ and under : 3,000pcsOver 2.8mm□ : 2,500pcs
2.8mm□ and under : 3,000pcsOver 2.8mm□ : 2,500pcs
2.8mm□ and under : 3,000pcsOver 2.8mm□ : 2,500pcs
2.8mm□ and under : 3,000pcsOver 2.8mm□ : 2,500pcs
2.8mm□ and under : 3,000pcsOver 2.8mm□ : 2,500pcs
2.8mm□ and under : 3,000pcsOver 2.8mm□ : 2,500pcs
BGA Packages (Unit: mm)
Please refer packages from page, A160 for LAPIS Semiconductor products.
A158
ICs
IC Packages (ROHM)
www.rohm.com
▶BGA Packages ▶▶VBGA-W<Pin Pitch:0.5mm>▶▶SBGA-T<Pin Pitch:0.65mm>
A
IC P
ackages
VBGA035W040 VBGA048W040 VBGA063W050 VBGA080W050
VBGA099W060 VBGA143W070
SBGA063T060 SBGA099T070 SBGA120T080
SBGA024W040 SBGA063W060 SBGA120W080SBGA099W070
VCSP <Pin Pitch : 0.5mm>
UCSP <Pin Pitch : 0.4mm>
VCSP85H VCSP50L VCSP35L VCSP30L
UCSP75M UCSP50L UCSP35L UCSP30L
1×1 6×6
0.5
0.85
0.25
~
~
0.5
0.50
0.1
1×1 6×6
~
~ 1×1
0.5 0.1
0.35
3×3
~
~ 1×1
0.5 0.08
0.30
3×3
~
~
0.4
0.75
0.15
0.8×0.8 6×6
~
~
0.4
0.50
0.1
0.8×0.8 6×6
~
~ 0.8×0.8 3×3
0.4
0.35
0.1
~
~ 0.8×0.8 3×3
0.4
0.30
0.08
~
~
SBGA-W <Pin Pitch : 0.65mm>
SBGA-T <Pin Pitch : 0.65mm>
VBGA-W <Pin Pitch : 0.5mm>
B
A
S
Mφ0.05 ABS
S0.08
B
A
S
M0.05 ABS
S0.08
B
A
S
Mφ0.08 AB
S0.08
B
A
S
Mφ0.08 ABS
S0.10
B
A
S
Mφ0.08 ABS
S0.10
B
A
S
Mφ0.05 ABS
S0.10
B
A
S
M0.08 ABS
S0.10
B
A
S
Mφ0.08 ABS
S0.10
B
A
S
Mφ0.08 ABS
S0.10
B
A
S
φ0.05 BA
S0.08
B
A
S
M0.05 ABS
S0.08
B
A
S
Mφ0.05 ABS
S0.08
B
A
S
S0.08
M0.05 ABS
0.5
0.5
0.1
0.9M
AX
6.0±0.1
6.0
±0.
1
P=0.5x90.75±0.1
P=
0.5
x90.
75±
0.1
99-φ0.295±0.05
310
E
5
C
F
962 8
D
G
4
A
K
B
1
HJ
7
0.9M
AX
0.10
1PIN MARK7.0±0.1
7.0
±0.
1
143-φ0.285±0.05P=0.5x110.75±0.1
0.5
0.5
P=
0.5
x11
0.75
±0.
1
E
C
F
D
G
A
LM
K
B
HJ
310 12
5 962 84
111 7
1PIN MARK
0.7±0.1
3
4.0±0.1
C
24-φ0.33±0.05
P=0.65x4
0.7±
0.1
D
P=
0.65
x40.
08
4.0
±0.
1
A
0.65
E
0.65
2
0.9M
AX
51 4
B
F
8
0.725±0.1
3
C
63-φ0.33±0.05
0.9M
AX
P=0.65x7
0.72
5±0.
1D
G
0.65
6.0±
0.1
A P=
0.65
x7
E
0.65
762
6.0±0.1
H
51
0.08
4
B
12
58
9106
74
3
KJHGFEDCBA
7.0±
0.1
7.0±0.1
0.575±0.1P=0.65x9
0.65 99-φ0.33±0.05
0.65
0.9M
AX
0.08
0.57
5±0.
1P=
0.65
x9
1PIN MARK
120-φ0.33±0.05
8.0±0.1
8.0±
0.1
0.08
0.9M
AX
P=0.65x10 0.75±0.1
P=
0.65
x10
0.75
±0.1
0.65
0.65
1 3 5 7 9 112 4 6 8 10
ABCDEFGHJKL
1.2M
AX
0.23
6.0±
0.1
6.0±0.1
EDCBA
FGH
54321 678
63−φ0.33±0.05
P=0
.65x
7
0.65
0.72
5±0.
1
0.725±0.1P=0.65x7
0.65
7.0±
0.1
7.0±0.1
1Pin MARK
1.2M
AX
0.23
GFEDCBA
HJK
7654321 8910
P=0
.65x
9
0.65
0.57
5±0.
1
0.575±0.1P=0.65x9
0.65
99−φ0.33±0.05
0.75±0.1P=0.65x10
0.65
P=
0.65
x10
0.65
120−φ0.33±0.05
0.75
±0.1
DEFGHJKL
CBA
1.2M
AX
0.23
8.0±
0.1
8.0±0.1
45
67
8910
1132
1
1PIN MARK
1Pin MARK
1PIN MARK
1PIN MARK1PIN MARK
0.1
0.5
0.9M
AX
1PIN MARK 5.0±0.1
5.0
±0.
1
5.0±0.1
5.0
±0.
1P=0.5x8
P=
0.5
x8
80-φ0.295±0.05
2 8531 97
4 6
5.0±0.1
0.1
P=0.5x7
0.5
5.0±
0.1
63-φ0.295±0.05 0.75
±0.10.75±0.1
0.9M
AX
0.5
P=
0.5x
7
48-φ0.295±0.05 0.5
0.9M
AX
4.0±0.1
4.0
±0.
1
P=0.5x6
P=
0.5
x6
0.5
0.10
0.5±0.1
0.5
±0.
1
E
4
GF
312
BA
7
C
6
D
5
4.0±0.1
4.0
±0.
10.
1
0.9M
AX
0.50.75±0.1 P=0.5x5
0.75
±0.
1
0.5
34
562
1
ABCDEF
35 - φ 0.295±0.05
P=
0.5x
5
FG
E
H
DCBA
J
F
5
C
3 7
D
G
4 6
E
1
A
2
H
8
B
1PIN MARK1PIN MARK1PIN MARK
Embossed carrier tape:2,500pcs
Embossed carrier tape:2,000pcs
Embossed carrier tape:2,500pcs Embossed carrier tape:2,500pcs Embossed carrier tape:2,500pcs
2.8mm□ and under : 3,000pcsOver 2.8mm□ : 2,500pcs
2.8mm□ and under : 3,000pcsOver 2.8mm□ : 2,500pcs
2.8mm□ and under : 3,000pcsOver 2.8mm□ : 2,500pcs
2.8mm□ and under : 3,000pcsOver 2.8mm□ : 2,500pcs
2.8mm□ and under : 3,000pcsOver 2.8mm□ : 2,500pcs
2.8mm□ and under : 3,000pcsOver 2.8mm□ : 2,500pcs
2.8mm□ and under : 3,000pcsOver 2.8mm□ : 2,500pcs
2.8mm□ and under : 3,000pcsOver 2.8mm□ : 2,500pcs
BGA Packages (Unit: mm)
WL-CSP Packages (Unit: mm)
Please refer packages from page, A160 for LAPIS Semiconductor products.
A159
ICs
IC Packages (ROHM)
www.rohm.com
▶BGA Packages ▶▶SBGA-W<Pin Pitch:0.65mm>▶WL-CSP Packages ▶▶VCSP<Pin Pitch:0.5mm>
▶▶UCSP<Pin Pitch:0.4mm>
A
IC P
ackages
SOP
SSOP
Product names are assigned to our semiconductor devices using the following convention, starting with the character "M".
The following shows the convention of item name assignment for conventional products.・The actual package profile is not shown here.
Device code
Option classification symbol
Z
Option code
000-000000000M
DRAM
P2ROMTM , OTPROM
SRAM
Gate array, standard cell
Logic
Module, chip set
Driver
The device functions are classified as follows:
MD
MR
MS
MG
ML
MK
MT
Derived code
Character symbol Package symbolDevice function
Circuit category
SJ70566M
Analog
Bi-CMOS, multi-chip product
A
C
Bipolar logic
MOS
L
M
Process classification
S M
Package profile
The device code expresses a function speci c to a device using a combination of numbers and alphanumeric characters.
The character symbol is added to indicate the modi cation of an existing product, to emphasize a speci cation that differs from the standard speci cation of an existing product, or to indicate a design standard.
The derived code indicates the speed ranking for DRAM products and is used as a derived code for logic products.
The option code indicates a symbol that identi es the speci cation of a product with an option.
The package symbol expresses the type and lead bending pro le of a package in two digits.
The option classi cation symbol is used to distinguish between the option symbol and the package symbol.
SOP8 SOP16 SOP44
SSOP16 SSOP20
P-SSOP30-56-0.65-Z6K P-SSOP30-56-0.65-K6 SSOP32
SOP24
P-SSOP30-56-0.65-ZK
2.50±0.15
0.25
7.50±0.10
0.88±0.15
0.17±0.05
LAPIS Semiconductor LSI package list
LAPIS Semiconductor LSI Part No. Explanation
These package size are an example. For details, please inquire to the sales.
No PKG type Title TRAY T&R TUBE
1 SOP SOP8 2500
2 SOP SOP16 1600 1000
3 SOP SOP24 1280 1000 3000
4 SOP SOP44 400 600 1700
5 SSOP SSOP16 4760 2500
6 SSOP SSOP20 3600 2500
7 SSOP SSOP30-56-0.65 2000 2000
8 SSOP SSOP32 1280 1000 3000
9 SSOP SSOP60 600 600
10 SSOP SSOP70 630 600
11 SSOP TSSOP20 4160
12 TSOP TSOP(Ⅰ)28 1950
13 TSOP TSOP(Ⅰ)32 800 1000
14 TSOP TSOP(Ⅰ)48 960 1000
15 TSOP TSOP(Ⅰ)56 960 1000
16 TSOP TSOP(Ⅱ)26/20 1600 1600
17 TSOP TSOP(Ⅱ)26/24 1600 1000
18 TSOP TSOP(Ⅱ)28 800 1000
19 TSOP TSOP(Ⅱ)44/40 1350 1000
20 TSOP TSOP(Ⅱ)44 1350 1000
21 TSOP TSOP(Ⅱ)50/44 1170 1000
22 TSOP TSOP(Ⅱ)50 1170 1000
23 TSOP TSOP(Ⅱ)54 1080 1000
24 TSOP TSOP(Ⅱ)70 1350 1000
25 TSOP TSOP(Ⅱ)86 1080 1000
26 QFP QFP44 1440 1000
27 QFP QFP56 1440 1000
28 QFP QFP64-1420-1.00 600
29 QFP QFP64-1414-0.80 840
30 QFP P-QFP80-1414-0.65 840
31 QFP QFP80-1420-0.80 600
32 QFP QFP100-1420-0.65 600
33 QFP QFP100-1414-0.50 750
34 QFP QFP128-1420-0.50 420
35 QFP QFP128-2828-0.80 240
No PKG type Title TRAY T&R TUBE
36 QFP QFP208 240
37 QFP LQFP144 600
38 QFP LQFP176 400
39 QFP TQFP44 1600
40 QFP TQFP52 1600 1000
41 QFP TQFP80-1414-0.65 900
42 QFP TQFP100 900
43 QFP TQFP120 750
44 QFP TQFP128 900 1500
45 QFN WQFN12 6240 1000
46 QFN WQFN16-0303-0.50 6240 1000
47 QFN WQFN16-0404-0.50 4900 1000
48 QFN WQFN20 4900 1000
49 QFN WQFN24 4900 1000
50 QFN WQFN28-0404-0.40 4900 1000
51 QFN WQFN28-0404-0.50 4900 1000
52 QFN WQFN32-0505-0.50 4030 1000
53 QFN WQFN36 4900 2000
54 QFN WQFN40-0505-0.40 4030 1000
55 QFN WQFN40-0606-0.50 4900 2500
56 QFN WQFN48 2500 2000
57 QFN WQFN52 2500 2000
58 QFN WQFN64 2600 3000
59 QFN WQFN80 2600 3000
60 QFN C-TQFN18 4030 1000
61 BGA LFBGA48 4160
62 BGA LFBGA84 2600
63 BGA LFBGA144 1760
64 BGA LFBGA324 840
65 BGA TFBGA60 3360
66 BGA TFBGA64 4160
67 BGA TFBGA90 1710
68 BGA P-TFBGA144 1760
69 BGA TFBGA208-0909-0.50 2600
70 BGA TFBGA208-1212-0.65 1680
*Regarding an unstated package, please inquire to the sales.
A160
ICs
LAPIS Semiconductor LSI Packages
www.rohm.com
▶LAPIS Semiconductor LSI package list▶LAPIS Semiconductor LSI Part No. Explanation
A
IC P
ackages
SOP
SSOP
Product names are assigned to our semiconductor devices using the following convention, starting with the character "M".
The following shows the convention of item name assignment for conventional products.・The actual package profile is not shown here.
Device code
Option classification symbol
Z
Option code
000-000000000M
DRAM
P2ROMTM , OTPROM
SRAM
Gate array, standard cell
Logic
Module, chip set
Driver
The device functions are classified as follows:
MD
MR
MS
MG
ML
MK
MT
Derived code
Character symbol Package symbolDevice function
Circuit category
SJ70566M
Analog
Bi-CMOS, multi-chip product
A
C
Bipolar logic
MOS
L
M
Process classification
S M
Package profile
The device code expresses a function speci c to a device using a combination of numbers and alphanumeric characters.
The character symbol is added to indicate the modi cation of an existing product, to emphasize a speci cation that differs from the standard speci cation of an existing product, or to indicate a design standard.
The derived code indicates the speed ranking for DRAM products and is used as a derived code for logic products.
The option code indicates a symbol that identi es the speci cation of a product with an option.
The package symbol expresses the type and lead bending pro le of a package in two digits.
The option classi cation symbol is used to distinguish between the option symbol and the package symbol.
SOP8 SOP16 SOP44
SSOP16 SSOP20
P-SSOP30-56-0.65-Z6K P-SSOP30-56-0.65-K6 SSOP32
SOP24
P-SSOP30-56-0.65-ZK
2.50±0.15
0.25
7.50±0.10
0.88±0.15
0.17±0.05
SOP Packages (Unit: mm)
These package size are an example. For details, please inquire to the sales.
A161
ICs
LAPIS Semiconductor LSI Packages
www.rohm.com
▶SOP Packages ▶▶SOP▶▶SSOP
A
IC P
ackages
SSOP
TSOP(TypeⅡ)
TSOP(TypeⅠ)
TSOP(TypeⅡ)
TSOP(Ⅰ)28 TSOP(Ⅰ)32 TSOP(Ⅰ)48 TSOP(Ⅰ)56
TSSOP20
TSOP(Ⅱ)26/20 TSOP(Ⅱ)26/24 TSOP(Ⅱ)28
TSOP(Ⅱ)44/40 TSOP(Ⅱ)44 TSOP(Ⅱ)50/44
TSOP(Ⅱ)50 TSOP(Ⅱ)54 TSOP(Ⅱ)66
TSOP(Ⅱ)70 TSOP(Ⅱ)86
SSOP60 SSOP70
SOP Packages (Unit: mm)
These package size are an example. For details, please inquire to the sales.
A162
ICs
LAPIS Semiconductor LSI Packages
www.rohm.com
▶SOP Packages ▶▶SSOP▶▶TSOP(TypeⅠ)▶▶TSOP(TypeⅡ)
A
IC P
ackages
SSOP
TSOP(TypeⅡ)
TSOP(TypeⅠ)
TSOP(TypeⅡ)
TSOP(Ⅰ)28 TSOP(Ⅰ)32 TSOP(Ⅰ)48 TSOP(Ⅰ)56
TSSOP20
TSOP(Ⅱ)26/20 TSOP(Ⅱ)26/24 TSOP(Ⅱ)28
TSOP(Ⅱ)44/40 TSOP(Ⅱ)44 TSOP(Ⅱ)50/44
TSOP(Ⅱ)50 TSOP(Ⅱ)54 TSOP(Ⅱ)66
TSOP(Ⅱ)70 TSOP(Ⅱ)86
SSOP60 SSOP70
TSOP Packages (Unit: mm)
These package size are an example. For details, please inquire to the sales.
A163
ICs
LAPIS Semiconductor LSI Packages
www.rohm.com
▶SOP Packages ▶▶TSOP(TypeⅡ)
A
IC P
ackages
LQFP
TQFP
QFP
LQFP144 LQFP176
TQFP44 TQFP48 TQFP52 TQFP64
P-TQFP80-1010-0.40 P-TQFP80-1212-0.50
QFP44 QFP56 QFP64-P-1420-1.00 P-QFP64-1414-0.80
P-QFP80-1414-0.65 QFP80-P-1420-0.80 P-QFP100-1420-0.65-TK QFP100-P-1420-0.65-BK
P-QFP100-1414-0.50-K P-QFP128-1420-0.50 QFP128-P-2828-0.80 QFP208 P-TQFP-80-1414-0.65 TQFP100
0.16
0.10
0.13
0.10
QFP Packages (Unit: mm)
These package size are an example. For details, please inquire to the sales.
A164
ICs
LAPIS Semiconductor LSI Packages
www.rohm.com
▶QFP Packages ▶▶QFP
A
IC P
ackages
LQFP
TQFP
QFP
LQFP144 LQFP176
TQFP44 TQFP48 TQFP52 TQFP64
P-TQFP80-1010-0.40 P-TQFP80-1212-0.50
QFP44 QFP56 QFP64-P-1420-1.00 P-QFP64-1414-0.80
P-QFP80-1414-0.65 QFP80-P-1420-0.80 P-QFP100-1420-0.65-TK QFP100-P-1420-0.65-BK
P-QFP100-1414-0.50-K P-QFP128-1420-0.50 QFP128-P-2828-0.80 QFP208 P-TQFP-80-1414-0.65 TQFP100
0.16
0.10
0.13
0.10
QFP Packages (Unit: mm)
These package size are an example. For details, please inquire to the sales.
A165
ICs
LAPIS Semiconductor LSI Packages
www.rohm.com
▶QFP Packages ▶▶LQFP▶▶TQFP
A
IC P
ackages
WQFN
VQFN
WQFN
TQFP
WQFN24 P-WQFN28-0404-0.40-63
P-WQFN28-0404-0.50-63 P-WQFN32-0505-0.50-63 P-WQFN32-0505-0.50-A63
WQFN36 P-WQFN40-0505-0.40 P-WQFN40-0606-0.50
VQFN32VQFN28 VQFN48
WQFN12 WQFN16-0303-0.50 WQFN16-0404-0.50
WQFN20TQFP120 TQFP128
16
16
QFP Packages (Unit: mm)
QFN Packages (Unit: mm)
These package size are an example. For details, please inquire to the sales.
A166
ICs
LAPIS Semiconductor LSI Packages
www.rohm.com
▶QFP Packages ▶▶TQFP▶QFN Packages ▶▶VQFN
▶▶WQFN
A
IC P
ackages
WQFN
VQFN
WQFN
TQFP
WQFN24 P-WQFN28-0404-0.40-63
P-WQFN28-0404-0.50-63 P-WQFN32-0505-0.50-63 P-WQFN32-0505-0.50-A63
WQFN36 P-WQFN40-0505-0.40 P-WQFN40-0606-0.50
VQFN32VQFN28 VQFN48
WQFN12 WQFN16-0303-0.50 WQFN16-0404-0.50
WQFN20TQFP120 TQFP128
16
16
QFN Packages (Unit: mm)
These package size are an example. For details, please inquire to the sales.
A167
ICs
LAPIS Semiconductor LSI Packages
www.rohm.com
▶QFN Packages ▶▶WQFN
A
IC P
ackages
TFBGAC-TQFN
LFBGAWQFN
TFBGA60 TFBGA64 TFBGA84
WQFN52 WQFN56
WQFN64 WQFN80
LFBGA48 LFBGA84 LFBGA144
LFBGA324
WQFN48
C-TQFN12 C-TQFN18
S0.20
1PIN INDEX(Marking)
1PIN INDEX MARK
0.35+0.10-0.15
0.50+0.10-0.15
0.50+
0.10
-0.
15
0.20±0.05
0.23±0.05
0.23±0.05
0.2±0.05
(0.04)
(0.3
0)
5.60TYP
5.60
TYP
48
6480
80
48
SEATING PLANE
1
1
7.00
9.00
9.00
0.05
7.00 (0
.50~
0.55
)0.
20
0.80MAX
0.75
0.750.05Ⓜ0.50
0.05Ⓜ 0.05Ⓜ
0.25±0.05
0.40±0.10
0.05Ⓜ
0.20 S B
S
A
0.15 S B
S
0.15S
A
A
B
0.20S
B0.8
φ0.10Ⓜ
φ0.50±
0.1S
AB
φ0.15Ⓜ
SA
B
1PIN INDEX(Marking)
0.35+0.10-0.15
0.4+0.10-0.15
0.16±0.05
5.60TYP
5.60
TYP
52 56
56
SEATING PLANE
11
7.00
0.05
7.00
0.50±
0.10
8.00±0.05
0.4±0.1
(0.7)
(0.7)
1
ABCD
EFGH
2 3 4 5 6 7 8
IND
EX
MA
RK
IND
EX
MA
RK
1.5MAX
0.38±0.051.50MAX.
8.00±
0.05
0.20
0.80MAX
1.10
0.40
0.05Ⓜ1.10
0.05
0.15IN
DE
X M
AR
K
IND
EX
MA
RK
IND
EX
MA
RK
×4
0.10×4
0.15×4
0.10
S0.15
S0.10 S
0.10
SS S
S
B
A0.8
0.9
0.9 0.80(0.70)
φ0.50±
0.1
φ0.46±
0.05
φ0.10Ⓜ
SA
B
0.50±0.10
φ0.10Ⓜ
SA
B
ABCD
EFJ
KGH
ABCD
EFJ
KGH
MNL
1 2 3 4 5 6 7 8 9 10
1 2 3 4 5 6 7 8 9 10
11
B
B
0.20
S0.10
S0.20
1PIN INDEX MARK
(0.5
0~0.
55)
0.20
0.80MAX
SEATING PLANE
1PIN INDEX(Marking)
6.40TYP 6.40
TYP
0.75
0.75
7.0
19.0
(1.10)
(1.10)
0.80
0.80
19.0
0.20 S B
0.20S
A
11.0
9.0
7.0
0.50
11
52
1PIN INDEX MARK
0.05
0.05
SEATING PLANE DETAIL A
DETAIL B
1 1
1PIN INDEX(Marking) (0
.50~
0.55
)0.
20
0.80
MA
X
0.80
MA
X
DETAIL A
DETAIL B
INDEX MARK
6.80TYP
6.80
TYP
0.75
0.750.50
164
9.00
0.7
0.40.7
9.00
1PIN INDEX(Marking)
SEATING PLANE
1PIN INDEX MARK1
(0.5
0~0.
55)
0.20
7.50TYP
6.80
TYP
0.4±0.11.5MAX.
0.4±0.11.5MAX.
0.15×4
IND
EX
MA
RK
ABCD
EFJ
KGH
MNL
PRV
WT
UAA
ABY
1 2 3 4 5 6 7 8 9 10
11
12
13
14
15
16
17
18
19
20
21
22
0.05
4.00±0.150.73±0.07
4-R0.20
4-R0.15
4-0.50
4-1.00P×3±0.0512-□0.40(Au plating)
6 54
3
2
11211
9
8
7
4-0.
35
1.05
1.05
3.70±
0.15
INDEX(No plating)
2.84
3.40
10INDEX
(No plating)
0.05
5.00±0.15
5.00±
0.15
1.20±
0.15
17-
0.70±
0.15
0.90
0
1.12±0.05
(0.175)
Au plating
0.18±0.03 0.94±0.0518-0.45±0.05
1.300
3 2 1 18
9 101112
7
54
8
1514
1617
18 1 2 3
4
65
78
9101112
13
INDEX
SEATING PLANE
0.80
4.60
0.80
614
1617
13
15
IND
EX
MA
RK
9.0
11.0
0.15 S A
0.15S
B
12
13
A
QFN Packages (Unit: mm)
These package size are an example. For details, please inquire to the sales.
A168
ICs
LAPIS Semiconductor LSI Packages
www.rohm.com
▶QFN Packages ▶▶WQFN▶▶C-TQFN
A
IC P
ackages
TFBGAC-TQFN
LFBGAWQFN
TFBGA60 TFBGA64 TFBGA84
WQFN52 WQFN56
WQFN64 WQFN80
LFBGA48 LFBGA84 LFBGA144
LFBGA324
WQFN48
C-TQFN12 C-TQFN18
S0.20
1PIN INDEX(Marking)
1PIN INDEX MARK
0.35+0.10-0.15
0.50+0.10-0.15
0.50+
0.10
-0.
15
0.20±0.05
0.23±0.05
0.23±0.05
0.2±0.05
(0.04)
(0.3
0)
5.60TYP
5.60
TYP
48
6480
80
48
SEATING PLANE
1
1
7.00
9.00
9.00
0.05
7.00 (0
.50~
0.55
)0.
20
0.80MAX
0.75
0.750.05Ⓜ0.50
0.05Ⓜ 0.05Ⓜ
0.25±0.05
0.40±0.10
0.05Ⓜ
0.20 S B
S
A
0.15 S B
S
0.15S
A
AB
0.20S
B0.8
φ0.10Ⓜ
φ0.50±
0.1S
AB
φ0.15Ⓜ
SA
B
1PIN INDEX(Marking)
0.35+0.10-0.15
0.4+0.10-0.15
0.16±0.05
5.60TYP
5.60
TYP
52 56
56
SEATING PLANE
11
7.00
0.05
7.00
0.50±
0.10
8.00±0.05
0.4±0.1
(0.7)
(0.7)
1
ABCD
EFGH
2 3 4 5 6 7 8
IND
EX
MA
RK
IND
EX
MA
RK
1.5MAX
0.38±0.051.50MAX.
8.00±
0.05
0.20
0.80MAX
1.10
0.40
0.05Ⓜ1.10
0.05
0.15IN
DE
X M
AR
K
IND
EX
MA
RK
IND
EX
MA
RK
×4
0.10×4
0.15×4
0.10
S0.15
S0.10 S
0.10
SS S
S
B
A0.8
0.9
0.9 0.80(0.70)
φ0.50±
0.1
φ0.46±
0.05
φ0.10Ⓜ
SA
B
0.50±0.10
φ0.10Ⓜ
SA
B
ABCD
EFJ
KGH
ABCD
EFJ
KGH
MNL
1 2 3 4 5 6 7 8 9 10
1 2 3 4 5 6 7 8 9 10
11
B
B
0.20
S0.10
S0.20
1PIN INDEX MARK
(0.5
0~0.
55)
0.20
0.80MAX
SEATING PLANE
1PIN INDEX(Marking)
6.40TYP 6.40
TYP
0.75
0.75
7.0
19.0
(1.10)(1.10)
0.800.80
19.0
0.20 S B
0.20S
A
11.0
9.0
7.0
0.50
11
52
1PIN INDEX MARK
0.05
0.05
SEATING PLANE DETAIL A
DETAIL B
1 1
1PIN INDEX(Marking) (0
.50~
0.55
)0.
20
0.80
MA
X
0.80
MA
X
DETAIL A
DETAIL B
INDEX MARK
6.80TYP
6.80
TYP
0.75
0.750.50
164
9.00
0.7
0.40.7
9.00
1PIN INDEX(Marking)
SEATING PLANE
1PIN INDEX MARK1
(0.5
0~0.
55)
0.20
7.50TYP
6.80
TYP
0.4±0.11.5MAX.
0.4±0.11.5MAX.
0.15×4
IND
EX
MA
RK
ABCD
EFJ
KGH
MNL
PRV
WT
UAA
ABY
1 2 3 4 5 6 7 8 9 10
11
12
13
14
15
16
17
18
19
20
21
22
0.05
4.00±0.150.73±0.07
4-R0.20
4-R0.15
4-0.50
4-1.00P×3±0.0512-□0.40(Au plating)
6 54
3
2
11211
9
8
7
4-0.
35
1.05
1.05
3.70±
0.15
INDEX(No plating)
2.84
3.40
10INDEX
(No plating)
0.05
5.00±0.15
5.00±
0.15
1.20±
0.15
17-
0.70±
0.15
0.90
0
1.12±0.05
(0.175)
Au plating
0.18±0.03 0.94±0.0518-0.45±0.05
1.300
3 2 1 18
9 101112
7
54
8
1514
1617
18 1 2 3
4
65
78
9101112
13
INDEX
SEATING PLANE
0.80
4.60
0.80
614
1617
13
15
IND
EX
MA
RK
9.0
11.0
0.15 S A
0.15S
B
12
13
A
BGA Packages (Unit: mm)
These package size are an example. For details, please inquire to the sales.
A169
ICs
LAPIS Semiconductor LSI Packages
www.rohm.com
▶BGA Packages ▶▶LFBGA▶▶TFBGA
A
IC P
ackages
TFBGA
TFBGA90 P-TFBGA144 TFBGA176
P-TFBGA208-0909-0.50 P-TFBGA208-1212-0.65
1 3 5 7 9 111315172 4 6 8 10121416
1 3 5 7 9 1113 15 172 4 6 8 10 12 14 16
BGA Packages (Unit: mm)
These package size are an example. For details, please inquire to the sales.
A170
ICs
LAPIS Semiconductor LSI Packages
www.rohm.com
▶BGA Packages ▶▶TFBGA
A
IC P
ackages
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