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HYB-MANHYBRID 3D MANUFACTURING OF SMART SYSTEMS
Johannes Hörber1, Martin Hedges1, Rob van Asselt2
1 : Neotech AMT GmbH, 2 : Philips Lighting Research
www.hybman.eu Contact: [email protected]
Hyb-Man is a project labelled by the EUREKA Cluster PENTA,supporting innovation in micro and nanoelectronics based components & systems
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THE CHALLENGE: EVOLVING ELECTRONICS MARKET
Industries like Philips Lighting are facing:
• Demand on customized and personalized products leading to increased diversity
• Request for new product designs offering improved functionality and form factors
• Need for cost effective manufacturing of small series.
• Need faster response to changes in the market.
• “Digitization” of manufacturing and users
Electronics manufacturing is still heavily relying on mass production:
• Standard products and components,rigid supply chains
• High investment cost (tooling, R&D)
• Long initial lead times (tooling, shipment)
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THE APPROACH: HYB-MAN
The Hyb-Man project will develop hybrid 3D manufacturing methodsto enable flexible first time right production of smart systems
hybrid 3D manufacturing methods, combining: • additive manufacturing/3D printing• 3D electronic structure processing• 3D assembly & interconnect
development of methods and technologies towardsflexible first time right production
integrated smart systems with optimized design and enhanced functionality
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HYB-MAN BENEFITS
Highly flexible manufacturing processes
• no product specific tooling• no large inventory of parts or products• local production• high freedom of Design Substantial business benefits
• faster response to changes in the market• cost effective manufacturing of small series
and customer-oriented solutions• new product designs offering improved
functionality and new form factors.
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OPPORTUNITIES: NEW DESIGNS
discrete electronics “boxes”
distributed electronics/sensors/light sources
form freedom, adaptable shapes
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OPPORTUNITIES: FUNCTION INTEGRATION
Part count reduction easy assembly simplified supply chain
Integration miniaturization increased performance
combination/integration of functions
and parts consolidation
Typical product architecture large quantity of parts separate parts for
separate functions complex design of
interfaces (failure risk)
housing
optics
connection to peripheral electronics
internal electronics
mechanical fixtures etc.
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3D ELECTRONICS: COMMERCIAL PROCESSES AVAILABLE
Laser Direct
Structuring (LDS)
Printing
Piezo Jetting
Tool Based
In Mould Electronics
Digital Direct Metallization
Aerosol
Ink Jet
Dispensing
Pad Printing
FFF/FDM
LDS
(ProtoPaint)
2 Shot Moulding
Plating Based Examples:
Injection moldedstructural electronics
3D MID, Laser Direct Structuring
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3D PRINTED ELECTRONICS: CHALLENGES
Courtesy:
LITE-ON Mobile
Mechanical SBG
Approaches using n x 2D processing: Full 3D processing (5+ axes):
Challenges to move beyond the state-of-the-art:
1. Combination of different technologies (Additive Manufacturing + Printed Electronics + conventional electronics)for industrial processes (reliable, cost effective) and materials for serial products and
2. First time right design and manufacturing
3. New product designs fully benefiting from the 3D integration opportunities
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HYB-MAN APPROACH: WAY OF WORKING
• Product specifications and process requirements
Ambition
Objectives1. Essential
technologies2. First time
right production3. Demonstration in innovative products
• AM/3D printing• 3D electronics processing• 3D assembly & interconnect
• Process integration• Metrology and
control platform
Work package 1
Work package 2
Work package 3
Develop hybrid 3D manufacturing methods to enable flexible first time right production of smart systems
Work package 4• Demonstrator realization
and evaluation
• Design rules
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WORK PACKAGES: COMPLEX NETWORK OF INPUTS AND OUTPUTS
WP 1: User specifications
WP 2: Technology development and integration
WP 3: Knowledge rules for designand manufacturing
WP 4: Demonstration
verificationand validation
requirementsproduction process concept
smart systemspecifications for:- LED luminaires- automotive
sensors
process design rules
product design rules production
processes
productdemonstrators
process design rulesproduct design rules
technology demonstrators
new processes
integral process flow
verification
productevaluation data
evaluation/test methods
process capabilities
WP 5: Innovation management
WP 6: Project management and coordination
modelingrequirements
product specs
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HYB-MAN PARTNERS AND ROLES
Products IndustrializationProcesses, materials& equipment
know-howmaterialsprocesses
equipment
integratedsystems
new products
Together the partners cover the required competences and serve different markets
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EXAMPLE: ENHANCEMENT OF PRODUCT PORTFOLIO
Print Platforms Print/Functionalising Tools Pre/Post-Processing
45X – Volume Manufacture Piezo Jetting CNC Machining
15X – R&D/Product Development
Aerosol Based Plasma Cleaning
(Motion 3D CAD/CAM SW) Ink Jetting Sintering (Light/Laser)
Dispensing UV Curing
FDM Adaptive Tool Path Vision System
SMD Pick & Place
SMD
components
3D Printed Circuit
structuresPrinted
Device
Substrate
Building and
Embedding
Increased capabilities and toolsintegrated in machine platform to movefrom “printing on 3D” towards “3D printed”:
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INTERACTION WITH OTHER PROJECTS - AMPECS
Aims of the Project:1. Development of fully Additive Manufacturing Process for 3D Printing Electronics with Ceramic Substrates
2. The German-Spanish consortium will develop 3D printable ceramic materials for creating the structural body
and integrate printed electronics into and onto this component.
3. End use applications will cover areas where harsh environments exists such as automotive and aerospace
as well as in mobile communications.
courtesy: FAE - FRANCISCO ALBERO S.A.U.
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SUMMARY
Huge opportunities• product design• manufacturing (local, on demand)• supply chain and business model
Many challenges• technologies for serial products• industrial processes• first time right• new product designs
Changing environment and customer demands drive the need formore flexible manufacturing methods
smaller series, customized products – design freedom – faster response to changes
Multi-disciplinary approach and partnerships needed to move forwardmaterials – processes – equipment – process control –product design – manufacturing – inspection and test
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ACKNOWLEDGEMENT
Hyb-Man is a project labelled by the EUREKA Cluster PENTA,supporting innovation in micro and nanoelectronics based
components & systems
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THANK YOU FOR YOUR ATTENTION!
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