Gallium NitrideGallium Nitride
Presented by
Rakesh Sohal
Supervision
Prof. Dieter Schmeißer
Research & Development
OutlineOutline
•Introduction•GaN - Physics•Crystal Growth MOVPE MBE•Substrates & Buffer layers•Recent Advances•Applications
GaN - Research & Development
Why GaN ?Why GaN ?
Semiconductor with Direct and Wide Bandgap•Optoelectronics Devices•Blue & Blue/green light emitters•Transistors withstand extreme heat and•High frequencies and power levels•More efficient amplifiers at base stations•Si-only 10% power used and 90% wasted as heat
GaN - Research & Development
GaN PhysicsGaN Physics
a
Crystal Structure
Zince BlendeWurtzite
GaN - Research & Development
GaN PhysicsGaN PhysicsEnergy band Structure
GaN - Research & Development
GaN comparisonGaN comparison
Silicon cannot provide the power-bandwidth product for military applications
GaN - Research & Development
GaN-Crystal GrowthGaN-Crystal Growth
First epilayer by vapour transport - Murusk and Tietjen (1969) Growth rate - 0.5µm/min. High background n-type carrier concentrations ~1019 cm-3
Modern Technique - MOVPE by Nakamura Key aspect : downward subflow of He and N2
Claim - Improves the interaction of the reactant gases with the substrate
Shortcomings High Substrate temperature Thermal mismatch strain & defects
MOVPE Approach
GaN - Research & Development
GaN-Crystal GrowthGaN-Crystal GrowthMBE Approach
N - supplied by µ-wave plasma excitation provided by compact ECR Limited N-flux lower growth rate(GR) ~ 500Å/hr.
GR can be increased by higher power Degraded Material Quality
GaN - Research & Development
GaN-Crystal GrowthGaN-Crystal GrowthSubstrates for Epigrowth
Baule Growth efforts are ongoingTill date - not possible
The only Option - Heteroepitaxy
The most Stringent Issue/Barrier
GaN - Research & Development
GaN-Crystal GrowthGaN-Crystal GrowthSubstrates for Epigrowth
650nm650nm
650nm
650nm
650nm
AlN
BN
MgO3C-SiC
6H-SiC
AlN
BN
GaNGaN
InN
Sapphire
Lattice Constant / Å
Ban
d ga
p / e
V 4.5
5.5
3.5
2.5
1.5
6.5
2 2.5 3 3.5 4 4.5 5 5.5
ZnOHexagonalCubic
Thermal & lattice mismatch - Strain and Defects
GaN - Research & Development
GaN-Crystal GrowthGaN-Crystal GrowthSubstrates for Epigrowth
Thermal & lattice mismatch - Strain and Defects
GaN - Research & Development
GaN - Research & Development
GaN-Crystal GrowthGaN-Crystal GrowthInterfacial buffer layer
AlN GaN
- Akashaki - Nakamura
Large lattice and thermal mismatch
Strained and sometime cracked layers
GaN-AdvancesGaN-Advances
Three major hurdles has been cleared
• Heteroepitaxy - via buffer layer• Control of n (Si) & p(Mg)-type doping• Reduction in dislocation density
Residual e-concentrations - --- due to N-vacancies(earlier) Van de Walle showed - energy required for Nv too high--- due to O incorporation
GaN - Research & Development
GaN-AdvancesGaN-AdvancesUse for patterned SiO2
Robert F. Davis, Proceedings of the IEEE, Vol. 90, No. 6, 2002
GaN - Research & Development
Comparison - bulbs & LEDsComparison - bulbs & LEDsGaN - Research & Development
New two flow MOCVDNew two flow MOCVDNakamura‘s Method
GaN - Research & Development
Pioneer of Nakamura Pioneer of Nakamura • 1989-Started III-V nitride research.• 1990-Develops new ‘two-flow’ MOCVD equipment for growth of
high quality single crystal GaN layers.• 1992-begins to grow InGaN single crystal layers for the production
of double heterostructures.• 1993-Succeeded in developing a blue LED with a luminous
intensity as high as 2cd using III-V nitride materials.• 1995-Developed high-brightness SQW structure blue/green LEDs
with a luminous intensity of 2 cd and 10 cd, and developed a violet laser diode using III-V nitride materials for the first time.
• 1996-The first current infection III-V nitride based LDs were fabricated.
• 1996-Announces the first CW blue GaN based injection laser at room temperature.
GaN - Research & Development
The thickness of the GaN buffer layer was varied between 100Å and 1200Å
The substrate was heated to 1050oC in a stream of hydrogen
The substrate temperature was elevated to between 1000oC and 1030oC to grow the GaN
film.
The substrate temperature was lowered to between 450oC and 600oC to grow the GaN
buffer layer.
The total thickness of the GaN film was about 4 m,and the growth time was 60 min.
Steps to grow crystalline GaNSteps to grow crystalline GaNNakamura‘s Method
GaN - Research & Development
Buffer layer thicknessBuffer layer thickness
The value of the FWHM is almost constant between 200Å and 1200Å thickness.The optimum thickness of the GaN buffer layer was around 200Å
GaN - Research & Development
GAN - PotentialGAN - PotentialGaN - Research & Development
• Large scale displays (large outdoor television screens)
• Smaller full-color flat panel display screens
(inside trains or subway stations)
• Full-color scanners
• Full-color photocopying machines
• Full-color FAX machines
• Traffic lights
• LED white lamps
ApplicationsApplicationsGaN - Research & Development
ApplicationsApplications
2 inch dia blue LED wafer on GaN-on-sapphire
GaN - Research & Development
Thanks for
your attention!
GaN - Research & Development
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