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Programme at a glance
Welcome to the EMPC 2005
Scientific Programme Sunday, June 12
Scientific Programme Monday, June 13
Scientific Programme Tuesday, June 14 10
Scientific Programme Wednesday, June 15 14
General Information 17
Exhibitors 23
Proceedings 39
Author Index 609
T1B/UB Hannover 89
128 291 486
3
PROGRAMME AT A GLANCE
13.00-18 00
14.00-18.00
18.00
Registration desk open
Professional Development Courses
Welcome Reception at the Congress Centre
09.00
09.10-11.00
11 00- 11 20
11.20-13.00
13 00-14 00
14.00-15.40
15 40- 16 20
16 20-18.00
09 00-10 40
10.40-11.20
11.20-13 00
13 00-14 00
14.00-15.40
' 15 40-16 20
16.20-18.00
09.00-10.40
10.40-11 20
11.20-13.00
13.00-13.30
Ambassador
Welcome
Invited Lectures
SESSION 1
Manufacturing Technologies I
Bach Beethoven
SESSION 3
3D Packaging
SESSION 5
Interconnection Technologies
SESSION 2
Power
SESSION 4
Optoelectronics Packaging
SESSION 6
Quality and Reliability I
Marquee
Coffee Break
Lunch Break
POSTER SESSION I
Coffee Break
IMECAT SESSION
SESSION 7
Advanced Packaging
Coffee Break
SESSION 9
Applications
SESSION 11
Flexible Substrates
SESSION 13
Materials
SESSION 8
MEMS Packaging
SESSION 10
Lead-Free Materials
CM SESSION
SESSION 12
Electrical Modelling & Signal Integrity
SESSION 14
Optoelectronic Applications
Lunch Break
POSTER SESSION II
Coffee Break
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LATE PAPERS SESSION
SESSION 15
Materials & Processing
SESSION 17
Interconnection Substrates
Closing Session
SESSION 16
Quality & Reliability II
SESSION 18
Manufacturing Technologies II
Coffee Break
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05
13 00 Registration desk open
14 00 - 18 00 Professional Development Courses
Professional Development Course 1:
Adhesive technology - innovative bonding technique for microelectronicsOrganiser Helmut Schafer & Thomas Gesang, Fraunhofer IFAM, Bremen
18.00 Welcome Reception in the Marquee
Professional Development Course 2:
Enabling Technologies for RF and microwave SiP
Organiser Walter De Raedt, IMEC, Leuven
Plenary Opening Session
09 00
09 10
09 40
10 20
Welcome and Opening Remarks
Introduction to the conference location „Oud-Sint Jan" and the city of BruggeEva Tahon, Curator of Oud-Sint Jan, Memling Museum, Museum of Our Lady of the Pottene, Belgium
Keynote Address: From the hell of physics to the heaven of Ambient IntelligenceEmile Aarts, Philips Research, The Netherlands
Keynote Address: Beyond Moore's law: Package level integrationCarlo Cognetti, STMicroelectronics, Italy
11.00-11.20 i^fimm^t^m^m^^mm^m^m^
Ambassador MONDAY, JUNE 13
SESSION 1: Manufacturing Technologies I
Chairmen Gordon P (Hungary) - Kurzweil K (France)
11.20 High-resolution electroformed stencil manufacturing method for ultra fine pitch wafer
bumping technology
Pudas M \ Hagberg J \ Leppavuon S \ Vahakangas J.1, Manessis D2, Patzelt R2, Ostmann
A3, Reichl H3 -1University of Oulu, Finland, Technical University Berlin, 3Fraunhofer Institute
for Reliability and Microintegration (IZM), Germany
11 45 A study on waving mechanism and reliability of chip on film (COF) packageChung CL1, Fu SL\ Huang H2, Kuo D2, Lin SJ2, Huang HS2, Lu TB2 - 1l-Shou
University, 2ChipMOS Technologies Inc,Taiwan
12 10 Measurements and modeling of thickness distribution to improve the uniformity of
evaporated thin films
Balogh B, Farkas C, Harsanyi G, Illyefalvi-Vitez Z, Levies R - Budapest University of
Technology and Economics, Hungary
12.35 Lead-free assemblyGanesan S
,Pecht M - University of Maryland, USA
SESSION 2: Power
Chairmen Muller J (Germany) - \la\ev S (Russia)
11 20 Properties evaluation of ALSIC TPG test product
Occhionero M A, Adams RW - Ceramics Process Systems Corp, USA
11 45 Fabrication and evaluation of miniaturized CSP power transistors
de Samher M \ van Grunsven E.\ van den Ackerveken T.\ Heyes D2 - 'Philips Center for
Industrial Technology, The Netherlands, 2Philips Semiconductors, UK
12 10 High performance power conversion using planar interconnect technologyFillion R A, Bauer C2, Delgado E \ Beaupre R.1, McConnelee P1 - 1GE Global, ^TechLead
Corp, USA
12 35 Development of low power 700°C microheater in low temperature cofire ceramic
Jones W K, Reddy S, Wang J. - Florida International University, USA
SESSION 3: 3D Packaging SESSION 4; Optoelectronic Packaging Poster Session I
Chairmen Barneah U (Israel) - Rames JC (France)
14.00 Stacked Die Technology Solutions for wCSP
Memory Packages
Liu H,Tan H B
, Chong D,Win P., Teo J., Wang C.K. -
United Test and Assembly Center Ltd, Singapore
14.25 System integration issues for stacked 3D packageKaija K
, Mantysalo M , Miettmen J,Ristolainen EO.-
Tampere University of Technology, Finland
14.50 Technology for embedding active dies
Ostmann A ', De Baets J 2, Knechbaum A3, Kostner H *,Neumann A' - Fraunhofer IZM, 2IMEC, 3AT&S,"Datacon, "TU Berlin, Germany
15.15 Advanced-chip-to-wafer technology: enabling tech¬
nology for volume production of 3D system integra¬tion on wafer level
Scheiring C ', Kostner H ', Lindner P2, Pargfneder S.2 -
'Datacon Semiconductor Equipment, Austria; 2EV
Group
Chairmen. Delrosso G (Italy) - Smnadurai N (UK)
14 00 Die-to-wafer molecular bonding for optical inter¬
connects and packagingKostrzewa M.\ Di Cioccio L \ Zussy M1, Roussin J C \Fedeli J M1, Kernevez N \ Regreny P.2 - 'CEA-DRT-LETI / DIHS-CEA / GRE; 2Ecole centrale de Lyon,France
14 25 In-situ fabrication of micro-optical elements in
transparent encapsulants with excimer laser-abla¬tion
Naessens K,Rits O
,Bockstaele R
,Baets R. - Ghent
University, Belgium
14.50 Low-cost optoelectronic packages: development of
a fast alignment technique and a stable bondingprocess for single-mode optical fibers
PliskaAC, Kunde J \ Grossmann S\ Bosshard Ch.\Battig R2, Pawlik S2, Saintenoy S2, Schmidt B2 -
'CSEM SA, 2Bookham, Switzerland
15.15 Packaging solution with a 3-dimensional couplingscheme for direct optical interconnects to the chipRits O., Bockstaele R., Naessens K, Baets R - Ghent
University, Belgium
Chairmen- Bruinsma N (The Netherlands) - De Baets J (Belgium)A tour of the posters will be made. The poster presenterswill give further comments on their work
1 Low stress, high strength isotropic conductive film adhesive
for large area bonding of thermally mismatched substratesCollins A , Schuermans J2 - 'Emerson & Cuming, USA, 2Emerson& Cuming, ICI Belgium N V, Belgium
2 Development of silicon ball grid array packageRudakovVI1, PlisN I2, MochalovB V, RomanovA.A2-'Russian
Academy of Sciences, MSC «Angstrem», Russia
3 Steady state electro-thermal simulations of digital CMOScircuits
Golda A, Kos A - AGH University of Science and Technology,Poland
4 Thermomechamcal stressing of microelectronic structures
Novotny M - Brno University ofTechnology, Czech Republic
5 Ball-bonding process robustification with regard to space
applicationsUbon S P, Paelmck P, Goffin B -Alcatel ETCA, Belgium
6 Effect of two different thermal cycle profiles on the reliabilitybehavior of lead-free solder jointsAndersson C'2, Andersson DR", Tegehall PE'3, Liu J'" -
'Swedish Microsystem Integration Technology (SMIT) Center,aCfia/mers University of Technology, Mo/ndal, Sweden, 3lVF
Industnal Research and Development Corporation, Sweden
7 Needs and challenges for partnerships and joint develop¬ments in advanced packagingPieters P - IMEC, Belgium
8 New investigations of high performance 'PCB' structures for
signal integrity complianceCodreanu N D, Svasta P, lonescu C - Politehnica University of
Bucharest, Romania
9 Tantalum and niobium capacitors: technology and character¬istic parameters comparisonSikula J ', Sedlakova V1, Hoesch P2, Sita Z3, Zednicek T3 - 'Brno
University of Technology, 2Charles University, 3AVX, Czech
Republic
10 Investigation of lead-free solder joints reliability by thermal
modellingBulva J, Szendiuch ! - Brno University of Technology, Czech
Republic
SESSION 5: Interconnection Technologies SESSION 6: Quality & Reliability I IMECAT SESSION
Chairmen: Codreanu N. (Romania) - van Veen C. (The Netherlands)
16.20 Lead free assembly of fine pitch wafer level CSPs
Boulanger R., Meilunas M., Borgesen P. - Universal
Instruments Corp., USA
16.45 Development and evaluation of photodefined ele¬
ments for microwave modules in LTCC for space
applications
Perrone R., Driie K.H., Thust H., Trabert J., Hein M. -
TU llmenau, Germany
17.10 Ultra-fine pitch flip chip for high I/O die
Bauer C.E.\ Neuhaus H.J.2, Jain W.F.3, Taran A.4 -
'TechLead Corp.; 2Scitv1axx Solutions Inc., USA;
3Chipbond Technology Corp., Taiwan; "Microelectronic
Assembly Innovations, Russia
17.35 Packaging approach for nano CMOS wiringBalachandran J.1, Brebels S.\ Carchon G.\ De Raedt
W.1, Nauwelaers B.2, Beyne E.' - 'IMEC; 2Katholieke
Universiteit Leuven, Belgium
Chairmen: Detemmerman D. (Belgium) - Nemeth P. (Hungary)
16.20 Essential new process control tools for scanningacoustic microscopyHoward A.M.', Clement A.2, Vanderstraeten D.3,Waldron F.4 - Towcester Technical Services, UK;2STMicroelectronics, France; SAMI Semiconductor,Belgium; "National Microelectronics Research Centre,Ireland
16.45 Electrical characteristics of an epoxy resin at hightemperatures (400°C), and their dependence on
thermal agingGonon P., Boudefel A., Nemamcha M. - Lab. for
Electrostatics and Dielectric Materials, French National
Center for Scientific Research and University of
Grenoble, France
17.10 High temperature degradation of wire bonds in
commercial plastic encapsulated microcircuits
Teverovsky A., Sharma A. - NASA/GSFC, USA
17.35 A novel test data acquisition system for vibration
testing of daisy chained assemblies
Urbanski K.\ Falat T.', Felba J.', Ganesan S.2, Pecht
M.z - 'Wroclaw University of Technology, Poland;
University of Maryland, USA
Chairman: Vanfleteren J. (Belgium)
FP5-CSG-IMECAT: introduction and highlights of
an EC funded project on lead-free materials and
assembly development technologiesVanfleteren J. - lMEC/TFCG Microsystems, Belgium
Development of a lead-free solder paste
Wiese J. - W.C. Heraeus GmbH & Co KG, Germany
Technological advancements in lead-free wafer-
bumping using stencil printing technologyManessis D.1, Patzelt R.\ Ostmann A.2, Aschenbrenner
R.2, Reichl H.\ Wiese J.3, Modes C.3 - TU Berlin,
Germany; 2Fraunhofer Institute for Reliability and
Microintegration, Germany; 3W.C. Heraeus GmbH &
Co.KG, Germany
Lead-free Flip Chip: a comparison between lead-
free solder and adhesives
Vandecasteele B.', Vanfleteren J.', Manessis D.2,
Ostmann A.2, Hagedom H.W.3, Wiese J.3 - 'IMEC /
TFCG Microsystems, Belgium; 2Fraunhofer Institute for
Reliability and Microintegration, Germany; 3W.C.
Heraeus GmbH & Co.KG, Germany
Thermo-mechanical FEM analysis of lead free and
lead containing solder for Flip Chip applicationsGonzalez M.\ Vandevelde B.\ Vanfleteren J.2,
Manessis D.3 - 'IMEC, Belgium; 2IMEC/INTEC/TFCG,
Belgium; TU Berlin, Germany
Lead-free soldering development for assembly of
complex telecom boards
Schildermans I., Willems G. - Alcatel Bell, Belgium
Lead-free electronic assembly for automotive appli¬cations
Mango M. - Centra Ricerche FIAT, Italy
Development of the lead free soldering process for
portable applications
Maattanen J.'2, Maakannas G.1 - 1Elcoteq Network Co;Tampere University of Technology, Finland
Ambassador
TUESDAY. JUNE 14
Beethoven
SESSION 7: Advanced Packaging
Chairmen Rames JC (France) - van Veen C (The Netherlands)
SESSION 8: MEMS Packaging
Chairmen-Barneah U (Israel) - Valev S (Russia)
09.00 The cross-talk reduction in an RF System on Chip 09.00 Development and verification of a standard packa-through waferscale packaging ging library for advanced MEMS designvan Veen C
,de SamberM.1, Bergveld H J', Whitmore Schropfer G', Keiji Y.2, Maekoba H.2, da Silva M.2 -
M.2, Bartek M.3, Teomim D.4, Ostmann A.5 - 'Philips, The 'Coventor Sari, France, 2Coventor Inc, USA
Netherlands, 2DEK Printing Company Ltd, UK; TU
Delft, The Netherlands, "Shellcase, Israel; TU Berlin,
Germany
09.25 Vertical integration of RF passive components in 09.25 Plasma activated wafer bonding for polymer based
stacked wafer-level packages //-fJuidic MEMS applicationsBartek M, Sinaga S.M., Burghartz J.N. - Delft Pelzer R.L, Farrens S. - EV Group, Austria
University of Technology, The Netherlands
09.50 FCOB: packaging issues for RF-MEMS applications 09.50 Benchmarking different substrates for thick-film
and reliability study sensors of mechanical quantitiesStoukatch S \ Webers T.', Winters C.\ Ratchev P.', Belavic D.\ Hrovat M.2, Santo Zarnik M.\ Cilensek J.2,
Baert K1, Beyne E.\ Oya Y.2, Okubora A.2 - 'IMEC, Jaroslaw K.3, Golonka L3, Dziedzic A.3, Smetana W.4,
Belgium; 2SONY Corp , Japan Homolka H.4, Reicher R.4 - 'HIPOT-R&D; 2Jozef Stefan
Institute, Slovenia; 3Wroclaw University of Technology,Poland; "Vienna University of Technology, Austria
10.15 A new concept for packaging of silicon biosensors 10.15 Hermeticity investigation of sealed 0-level packagesNellissen T, Weekamp W., van Delft J., Ansems W., based on the damping characteristics of the MEMS
Janssen E.
Pnns M, Megens M , Wimberger-Friedl R., device
van lersel B - Philips. The Netherlands Jourdain A \ De Coster J.2, De Moor P.1, Puers R.2,
Tilmans H.A.C - 'IMEC; 2KULeuven, Belgium
GLOBAL BUSINESS COUNCIL SESSION
Chairmen- Detemmerman D (Belgium) - Smnadurai N (UK)
09.00 Creating start-up companies in microelectronic
packaging and interconnection technologyDr. Jos Peeters, Capricorn Venture Partners, Belgium
09.25 The role of Europe in a global microelectronics
economy
Hutton M. - BPA, UK
09.50 Contract manufacturing in Europe - a formula for
success
Barnwell P - Custom Interconnect, UK
10.15 The growing market for SiP
Vardaman EJ. - TechSearch International, USA
10.40-11.20 ^^7^1**̂ ^>c* j*^W *
SESSION 9. Applications SESSION 10. Lead-Free Materials THE CERAMIC INDUSTRY INITIATIVE SESSION
Chairmen GolonkaL (Poland) - MullerJ (Germany)
11 20 Packaging issues for a medical monitoring device
incorporated in a tooth prosthesisVan Ham J ', Claes W' De Cooman M ', Naert I', Van
Lierde C 2 Beckers J L3, Puers R' - 1KU Leuven,
Materialise, 3Uni-Dent N V, Belgium
11 45 A silicon based system in package technologyvan Grunsven E', de Samber M', Burghoom M',Bunel C 2 Chevne D2, Ledam S 2
- 'Philips Centre for
Industrial Technology The Netherlands, 2PhilipsSemiconductors, France
12 10 24 GHZ radar sensor integrates patch antenna and
frontend module in single multilayer LTCC sub¬
strate
Kulke R \ Gunner C', Holzwarth S \ Kassner J \ Lauer
A1, Rittweger M', Uhlig P\ Weigand P2 - 1IMST,2DuPont de Nemours, Germany
12 35 Structuration of micro-fluidic devices based on
LTCC technologyBirol H
,Maeder T, Jacq C
,Straessler S
, Ryser P -
Ecole Polytechnique Federate de Lausanne,Switzerland
Chairmen Gordon P (Hungary) - Osterwinter H (Germany)
11 20 A study of brittle to ductile fracture transition tem¬
peratures in bulk PB-free solders
Ratchev P\ Loccufier T1, Vandevelde B ', Teliszewski
S2, Werkhoven D2, Verhnden B3 - 'IMEC, 2lnterflux
Electronics, 3Katholieke Universitert Leuven, Belgium
11 45 Investigation of the influence of UBM on lead free
flip chip solder fatigue life by explicit finite element
modeling of intermetallic layersLimaye P12, Vandevelde B1, Labie R', Ratchev P',
Beyne E', Vandepitte D2, Verhnden B2 - 'IMEC,2Katholieke Universiteit Leuven, Belgium
1210 On lead-free soldering of QFP, BGA components on
PCBs with different finishes for industrial applica¬tions
Biglan M Jr \ Gernts G2, van Helvoort M3, Sloof W G \Peekstok E', Biglan M H' - 1Mat-Tech BV, 2NewaysAdvanced Applications BV, 3Phi(ips Medical Systems,"Delft University of Technology, The Netherlands
Chairmen Kurzweil K (France) - Muckett S (UK)
11 20 A digital beam-forming antenna module for a
mobile multimedia terminal in LTCC multilayer
technique
Uhlig P et al - IMST, Germany
11 45 MCM-C for 10Gbps optical transmitters
Muukkonen E,Hietala J - Asperation Oy, Finland
12 10 Active cooling technology in packaging of missile
electronic
Refol M - MBDA-F, France
12 35 Effects of joint structures and materials on the reli¬
ability of LTCC/PCB/BGA interconnections
Vahakangas J et al - University of Oulu, Finland
SESSION 11: Flexible Substrates SESSION 12: Electrical Modelling & Signal Integrity Poster Session II
Chairmen Collander P (Finlandl - Norlyng S (Denmark) Chairmen CodreanuN (Romania) - SikulaJ (Czech Republic)
14.00 C1RCONFLEX: an ultra-thin and flexible technology 1400 Electrical characterization of high performancefor RF-ID tagsDekker R ', Dumling M 2, Fock J -H 3, Gourhant 0.",Kubnn R 2, MichielsenTM ', Pohlmann H 3, SchnrttW.3,Tombeur A M H ', Zoumpoulidis T2 - 'Philips Research,The Netherlands; Technical University Hamburg-Harburg "Philips Semiconductors, Germany, "EcoleNationale Supeneure de Physique de Grenoble, France
14 25 ACF flip chip joints on LCP substrates with thin 14.25
chipsFrisk L, Ristoiainen E - Tampere University of
Technology, Finland
memory FBGA BOC packageGospodinova M
,Nan G
,Thomas J
, Subraya R., HeldJ - Infineon Technologies AG, Germany
Lead free assembly: novel electrically conductive
adhesives compatible with 100 % Sn metallisations
Dreezen G, Luyckx G - Emerson & Cuming, (CI
Belgium N.V, Belgium
14.50 Investigation of a laser assisted 3D bending tech- 14.50 Analysis of via structures in 3D packagenology for high density flexible circuits Mantysalo M
,Ristoiainen E O - Tampere University of
Berenyi R, Balogh B
,Gordon P - Budapest University Technology, Finland
of Technology and Economics, Hungary
15.15 High performance, high power, high I/O chip-on-flex 15 15 On-chip RF isolation in stacked wafer-level pack-packaging agesFillion R ', Bauer C E2 - 'GE Global Research Center; Sinaga S M
,Bartek M
, Burghartz J.N - Delft UniversityTechLead Corp ,
USA of Technology, The Netherlands
10
11
Chairmen De Mey G. (Belgium) - Van Daele P (Belgium)
Atour of the posters will be made. The poster presenterswill give further comments on their work.
A micro fluidic electrochemical cell based on micro systempackaging technologies applicable for biosensor developmentpurposes
Harsanyi G, Santha H Berenyi R Balogh B - Budapest UniversityofTechnology and Economics, Hungary45° out-of-plane turning mirrorsfor optical printed circuit boardsVan Steenberge G, Geennck P Van Put S, Hendnckx N, BosnianE, Ottevaere H, Thienpont H, Van Daele P - Ghent University,Belgium
Prediction ofthe radiated emission of an 32 bits microcontrollerBen Dhia S', Sicard E'2, Bouhouch L3, Stemecke T" -
'LESIA/INSA/DGEI; 2EADS CCR, France, 3Ensaof Agadir, Morocco,"Infineon, Germany
Genetic algorithms based methodology for optimizing thermal
performances of micro-channel cooling systems on chipCodreanu C, Codreanu I, Obreja V - National Institute for Researchand Development in Microtechnologies (IMT), Romania
Properties and stability of thick-film resistors with low process¬
ing temperatures - effect of composition and processing
parametersMenot-Vionnet S, Gnmaldi C, Jacq C , Maeder T, Ryser P - Ecole
Polytechnique Federate de Lausanne (EPFL), Switzerland
Surface-mount assembly ofintegrated LTCC micrc-fluidic mod¬
ules - an SMT flow sensor
Foumier Y Birol H,Jacq C, Corradini G, Maeder T, Ryser P -
Ecole Polytechnique Federale de Lausanne (EPFL), Switzerland
Integration of light detection in LTCC fluidic microsystemsStefanow M , Golonka L, Radojewski J, Roguszczak H, Zawada T- Wroclaw University of Technology, Poland
Integration of sensors and electronics in textile foruse in infant
medicine
Hermans B, Coosemans J, Puers R - K U Leuven, Belgium
Quantification and optimization of environmental stability ofTyrePressure Sensors (TPMS) using physico-chemical methods
Tavemier S', Chen J2 van der Wiel A2 'Karel de Grote
Hogeschool vzw, 2Melexis, BelgiumA method to evaluate internal cavity pressure of sealed MEMSdevices
De CosterJ', Jourdain A2, Puers R ' Tilmans H A C2 - 'KULeuven,2!MEC, Belgium
Influence of different types of surfaces of pads on mechanical
properties of electrically conductive adhesives and solders
Duraj A, Mach P - Czech Technical University, Czech Republic
SESSION 13 Materials SESSION 14: Optoelectronic Applications LATE PAPERS SESSION
Chairmen BelavicD (Slovenia) -MuckettS (UK) Chairmen Delrosso G (Italy) - Golonka L (Poland) Chairmen Puers R (Belgium) - Van Daele P (Belgium)
16 20 Photo-resist technology for wafer level packaging 16 20 LTCC-based optical elements for opto-electronic 16 20 Customised thin film goes PCB and high density
and MEMS applications
Topper M, Lopper Ch
,Hauck K, Roder J
,
Baumgartner T, Reichl H - Fraunhofer IZM, Germany
applicationsBuss W', Schreiber P\ Brode W2, Heymel A2,
Bechtold F3, Muller E 3, Bartnitzek T3, Pawlowski B",
Kaschlik K s- 'Fraunhofer Institute IOF, 2SIEGERTTFT,
3VIA Electronic, "Hermsdorfer Institute for Technical
Ceramics, 5Mikrotechnik+Sensonk, Germany
Kaegi D - Reinhardt Microtech, Switzerland
16.45 Dielectric properties of an epoxy/silver nanocom- 16 45 Multilayer optical interconnections integrated on a 16 45 Thermal characterization of pulse-activated micro-
posite for embedded capacitors
Boudefel A, Gonon P, Nemamcha M - Lab for
Electrostatics and Dielectric Materials, French National
Center for Scientific Research, University of Grenoble,
France
printed circuit board
Hendnckx N,Van Steenberge G ,
S., Bosman E, Van Daele P
Belgium
Geennck P, Van Put
- Ghent University,
electronic devices by thermoreflectance-based sur¬
face temperature scanning
Komarov P L, Burzo M G,Raad P E - Southern
Methodist University, USA
1710 Development and processing of an anodic bond-
able LTCC tapeMuller E
,Pawlowski B
,Rothe P, Ehrt R
, Heymel A ,
Weiland A,Kaschlik K - VIA Electronic, Germany
1710 Indium solder bump technology for ultra high den¬
sity interconnects in hybrid image sensors
John J ', de Moor P\ Colin T2, Borgers T1, HooylaertsP2, Van Hoof C '
- 'IMEC, 2XenlCs, Belgium
1710 High performance chip scale package solutions for
image sensor device
Chao YC,Liu J
,Lee YJ
, Chang J, Wang J
,Chou A.,
Yang E,Lu A - ChipMOS Technologies Inc
,Taiwan
17 35 Integrated thick-film hybrid microelectronics 17 35
applied on different material substrates
Jacq C 1 Vionnet-Mennot S \ Maeder T12, Ryser P1 -
'Ecole Polytechnique Federate de Lausanne, 2Sensile
Technologies SA, Switzerland
Direct write technologies for integrated optics
Hughes PJ, Tyndall National Institute, Ireland
17 35 C4NP. next generation lead-free solder bumpingTonnies D - Suss MicroTec Germany
19.00
20 00
Sec>Jf/oW%«/ieTo|wr%f ^§^%.
Ambassador WEDNESDAY, JUNE 15
SESSION 15: Materials & Processing
Chairmen Nemeth P (Hungary) - Norlyng S (Denmark)
09.00 Mesoscale deposition technology
Hedges M,Renn M.2, Kardos M.2 - 'Neotech Services MTP, Germany; 2Optomec Inc,
USA
09.25 Variable Frequency Microwave (VFM) curing of die attach and underfill materials
Fontana F\ Casati D\ Balen E\ Hicks K2, Ahmad I.2 - 'Celestica, Italy, lambda
Technologies, USA
09.50 MyraniteTM for electronics encapsulation and Electro-Magnetic Compatibility
(EMC)Sinnadurai N - ATTAC, UK
10.15 Wafer backside coating of die attach adhesives
Winster A', Hamstra A2, Groenhuis R.2 - 'Ablestik, UK; 2Philips Semiconductors, The
Netherlands
SESSION 16: Quality & Reliability II
Chairmen-DziedzicA (Poland) - Sikula J (Czech Republic)
09.00 Shear property and intermetallic compound (IMC) growth of the Al/electroless
nickel gold under bump metallurgy (UBM)/Iead free solder bumps with multiple
reflow effect
Mohd Salleh M.\ Ahmad I.1, Jalar A1, Omar G.2 - 'Universiti Kebangsaan, 2ON
Semiconductor, Malaysia
09.25 Long-term reliability of "x"BGA solder joints drastically depends on PCB raw
material and design: uvias in pad
Bnzoux M,Leclerc A - Thales Research and Technology, France
09.50 Effect of thick-film materials on the mechanical integrity of high-strength ceramic
substrates
Maeder T., Jacq C, Corradini G, Ryser P - Ecole Polytechnique Federate de Lausanne,
Switzerland
10 15 Electro-migration behaviour of Pb-free flip chip bumps
Labie R, Beyne E - IMEC, Belgium
«L40-11.20 Coffee Break (Marquee)
i^H^MIWW
SESSION 17: Interconnection Substrates
Chairmen: Belavic D. (Slovenia) - Collander P. (Finland)
11.20 DBC (Direct Bonded Copper) substrate with integrated flat heat pipeSchulz-Harder J.*, Dezord J.B.2, Schaeffer C.3, Avenas Y", Puig O.5, Rogg A.', Exel K.1
- 'Curamik, Germany; 2Alcatel Space; 3LEG; 4LEG-ENSIEG; 5CNES
11.45 Development and evaluation of fine line structuring methods for microwave pack¬
ages in satellite applications
Reppe G.\ Muller J.2, Pohlner J.2, Thust H.3, Perrone R.3 - 'RHe Microsystems; 2Micro
Systems Engineering; TU llmenau, Germany
12.10 LTCC modules for a multiple phase shifter with RF-MEMS-switch integrationBartnitzekT, van Dijk Raymond, Muller E. - VIA Electronic Hermsdorf, Germany; TNO-
FEL, The Netherlands
12.35 The 2004 International Electronics Manufacturing Initiative (iNEMI) technologyroadmaps
Aschenbrenner R.', Pfahl R.C.2, Bird J.M.3 - 'Fraunhofer IZM, Germany; 2iNEMI; 3Amkor
Technology Inc
SESSION 18: Manufacturing Technologies II
Chairmen: Dziedzic A. (Poland) - Osterwinter H. (Germany)
11.20 A novel method of fabrication of mixed LTCC-solid ceramics systemsKita J., Rettig R, Moos R. - University of Bayreuth, Germany
11.45 Precise drilling and structuring of LTCC materials using a 355nm YAG-laser
Drue K.H. - Technische Universitat llmenau, Germany
12.10 Integrated magnetics on silicon for power supply on chipO'Mathuna C.\ O'Donnell T.\ Wang N.\ Rinne K.2, O'Sullivan D.3 - 'Tyndall National
Institute; "University of Limerick; "University College Cork, Ireland
12.35 Low cost electronics packaging via 3-D MEMS ink jetSchoeppler M.W., Creach L.T. - Spectra Inc, USA
13.00
13.15
Closing Session
Presentation of best paper and best poster awards
Closing remarks by the Organising Committee and the IMAPS-Europe Liaison Committee
Ul
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