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Enabling Technologies forSemiconductor Manufacturing

Semiconductor manufacturing is a fiercely competitive business. To stay ahead

of the pack, you need a partner who can provide innovative materials, technical

resources and process expertise that address the challenges you face every day.

That’s where we can help.

3M offers a portfolio of products designed to meet critical market requirements,

including improved performance, lower manufacturing costs, reduced time to

market and environmentally responsible manufacturing.

All 3M electronic materials are supported by sales, technical and customer

service resources around the world – with fully-staffed tech service laboratories

in North America, Europe, Japan, Latin America and Asia. Our people are ready

to assist you in optimizing your equipment and processes to take full advantage

of all the benefits these technologies have to offer.

3M Electronic MaterialsEnabling technologies for tomorrow’s leading-edge devices

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Equipment and Tool Cleaning

3M offers a broad line of advanced chemistries that havedemonstrated outstanding performance in a wide varietyof general electronics cleaning and drying applications.

3M™ Novec™ Engineered Fluids were developed toprovide an outstanding balance of performance, safetyand environmental properties. These segregatedhydrofluoroether (HFE) products offer zero ozonedepletion potential, low global warming potential andlow toxicity. They are also nonflammable and, in theirneat form, are not classified as volatile organiccompounds (VOCs). Novec Fluids can be used neat, asazeotropes or in co-solvent processes to effectivelyremove sub-micron particulate and ionic soils fromassemblies and components. Increased solvency andlow surface tension allow these fluids to penetrate intotight spaces found in delicate electronic equipment –ensuring a complete clean. In addition, Novec Fluidsare compatible with a wide range of metals, plasticsand elastomers.

Suggested Products

3M™ Novec™ Engineered Fluid HFE-7100 –Ideal cleaning solvent in applications such as vapordegreasing, wet cleaning and FOUP cleaning.

3M™ Novec™ Engineered Fluid HFE-7100DL –A higher purity version of Novec fluid HFE-7100.Tightly-controlled for ions, metals and non-volatileresidue.

3M™ Novec™ Engineered Fluid HFE-71DE –Excellent cleaning, rinsing and drying agent. Ideal forimmersion and vapor degreasing, and for medium-dutycleaning of soils such as oils, greases and waxes.

3M™ Novec™ Engineered Fluid HFE-71DA –Ideal for immersion defluxing and degreasingapplications. Provides enhanced removal of ioniccontaminants. Suitable for use in a number of aqueoussystems.

3M™ Novec™ Engineered Fluid HFE-71IPA –Used for medium-duty precision cleaning and rinsing toremove particulate, fingerprints and light soils frommetal, plastic and glass parts. Suitable for wet cleaningof dry etcher parts.

3M™ Novec™ Engineered Fluid HFE-7200 –Used for cleaning light-duty soils, e.g. particulates,fluorolubes, light oils and fluoropolymers, inapplications such as vapor degreasing, wet cleaningand FOUP cleaning. Can be paired with co-solvents toclean heavier-duty soils.

3M™ Novec™ Engineered Fluid HFE-7200DL –A high-purity version of Novec fluid HFE-7200. Tightly-controlled for ions, metals and non-volatile residue.

3M™ Novec™ Engineered Fluid HFE-72DE – A blend of two hydrofluoroether solvents and trans-1,2-dichloroethylene (t-DCE). Safe and effective formedium- to heavy-duty cleaning of soils such as oils,greases and waxes.

3M™ Novec™ Engineered Fluid HFE-72DA – A blend of two hydrofluoroether solvents, trans-1,2-dichloroethylene (t-DCE) and isopropanol. Effective formedium- to heavy-duty degreasing and defluxingapplications.

3M™ Novec™ Engineered Fluid 7300 – Used for cleaning light-duty soils, such as particulates,fluorolubes, light oils and fluoropolymers.

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Wafer Carrier Cleaning

Dry Etcher PartsCleaning

Selected 3M™ Novec™ Engineered Fluids offer a number of important advantages in thisapplication. Because of their high efficiency, they can often eliminate or reduce the need formanual and ultrasonic cleaning – helping to save time, energy and labor costs.

3M™ Novec™ Engineered Fluids are veryeffective for particulate cleaning of all SEMI-standard 300 mm FOUPs (Front-OpeningUnified Pods) and FOSBs (Front OpeningShipping Boxes). They offer a very fast cycletime and the ability to clean and dry FOUPdoors effectively. What’s more, the highcleaning efficiency, fast, complete drying andsimplified equipment requirements of NovecFluids help deliver a lower cost of ownership,compared to aqueous cleaning.

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3M™ Specialty Gases PFG-3218 (C3F8) and PFG-3480(C4F8O) are high molecular weight perfluorocarbon gasesused to clean dielectric film buildup from chemical vapordeposition (CVD) chambers. These products are designed as“drop-in” replacements for C2F6 and CF4, and offer anumber of important performance and environmentaladvantages:

• Reduced costs through reduced gas usage (up to 60%)without sacrificing etch rate

• Reduced PFC gas emissions (up to 90% with C4F8O)

• Allows use of existing gas lines and controllers

In addition, 3M can assist you with specialized services(such as on-site FTIR analysis) to help you evaluate 3MSpecialty Gases, optimize manufacturing processes, recoverand recycle spent material and document PFC abatementprograms. Use of 3M Specialty Gases can help waferprocessing fabs meet voluntary PFC emission reductiontargets.

CVD ChamberCleaning

Suggested Products

3M™ Specialty Gas PFG-3218 (C3F8) –Provides a higher etch gas utilization thanconventional C2F6, requiring 25% less material byweight, and reducing net PFC emissions.

3M™ Specialty Gas PFG-3480 (C4F8O) – Also provides a higher etch gas utilization than C2F6,requiring 60% less material by weight, and reducingnet PFC emissions upwards of 90%, compared toexisting cleaning processes.

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CMP

Fixed Abrasivesfor CMP

Suggested Products

3M™ SlurryFree™ Fixed Abrasive M3152– For direct polish STI CMP. Ceria based fixed abrasive rolls for use with Applied MaterialsReflexion CMP tools. Offers higher throughput, lower cost of ownership, compared to conventionalslurry systems.

3M™ SlurryFree™ Fixed Abrasive M3154– For direct polish STI CMP. Ceria based fixed abrasive rolls for use with Applied MaterialsReflexion CMP tools. Offers higher throughput, lower cost of ownership, compared to conventionalslurry systems. Similar performance to M3152 Fixed Abrasive, but designed for use with higheroverfill wafers.

3M™ SlurryFree™ Fixed Abrasive P6900 Subpads – Composite subpad for use with 3M™SlurryFree™ Fixed Abrasive rolls. Specific constructions sized for use on web-based CMP tools.

3M™ SlurryFree™ FixedAbrasives are a production-proven, high-performance alternative toconventional slurries, pads and conditioners.This technology consists of a composite ofcerium oxide particles, dispersed in a uniqueresin system. The uniform, microreplicated,three-dimensional polishing surface providesthe consistent interface necessary forpredictable, high-quality performance.

3M SlurryFree Fixed Abrasives offer anumber of critical advantages in theproduction of today’s more complexwafers, including: superior planarization,with low nitride erosion and trench oxidedishing; consistent process repeatability,both roll-to-roll and within each roll; and lowdefect rates. The long roll life of 3M SlurryFreeFixed Abrasives allows you to polish literally thousands ofwafers between consumable changes.

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High quality, long lasting 3M™ Diamond PadConditioners properly prepare the surface of theCMP pad, lengthening its life and enabling more

consistent wafer removal rates. Exclusive 3Msintered abrasive process and diamond-free edge

exclusion zone provide excellentdiamond retention, reducing

the possibility ofmacro-scratching and

helping to improvewafer yields.

CMP Pad Conditioning

Suggested Products

3M™ Pad Conditioner A160 – For metal and oxideapplications on Applied Materials platforms. 4.25" disk.

3M™ Pad Conditioner A165 –For metal and oxideapplications on Applied Materials platforms. 4.25" disk.Beveled edge for improved cleanliness, performance andaggressiveness control.

3M™ Pad Conditioner A4-55 – For oxideapplications on Applied Materials platforms. 4.25" disk.Features polycarbonate carrier with ring format.

3M™ Pad Conditioner E221 – For oxide applicationsusing IC series pads. Available as 360 or 260mm disk forEbara 300 or 200 mm platform.

3M™ Pad Conditioner E187 – For metalsapplications on IC series pads. Available as 360 or200mm disk for Ebara 300 or 200mm platform.

3M™ Pad Conditioner R115 – For oxide and metalsapplications on IC series pads. 10" ring for NovellusAuriga tool platform.

3M™ Pad Conditioner R400 – For oxide and metalsapplications on IC series pads. Bar style conditioner isavailable in sizes for both Novellus Momentum and IPECtool platforms.

3M manufactures pad conditioners for all other CMPtools. Contact 3M for more information.

New 3M™ Diamond Pad ConditionerA4 Series delivers the same highperformance of our standarddiamond pad conditioners, butwith a lower cost of ownership.Exclusive polymer substrateprovides improved flatnesscontrol.

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Thermal Management

Suggested Products

3M™ Novec™ EngineeredFluid HFE-7000 – Ideal forautomated test and waferprocessing equipment thatrequires extreme lowtemperatures. Also used asan autocascade refrigerant.

3M™ Novec™ EngineeredFluid HFE-7100 – Well-suited for automated testand wafer processingequipment requiring lowtemperatures.

3M™ Novec™ EngineeredFluid HFE-7200 – Used forthermal managementapplications in a wide arrayof industries.

3M™ Novec™ EngineeredFluid 7300 – Ideal forcooling ion implanters, dryetchers and CVDmachines.

3M™ Novec™ EngineeredFluid HFE-7500 – Used ina wide range of thermalmanagement applications,including: ion implanters;dry etchers; CVD/PECVDtools; automated testequipment; electroniccomponent testing andcalibration; reactors; freezedryers; fuel cells.

3M heat transfer fluids are used in many critical semiconductor manufacturing applications,from direct contact cooling and automated testing to etching, ion implantation,photolithography and more.

These dielectric fluids require little maintenance, have high resistivity and will not damageelectronic equipment or integrated circuits in the event of a leak or other failure. Systemsusing 3M heat transfer fluids offer not only dependable performance, but in many caseshave been shown to be less costly and easier to maintain than those using DI water. Both ofthe 3M heat transfer fluid product linesdescribed below are available in a widerange of boiling and pour points, to meetspecific heat transfer requirements.

3M™ Novec™ Engineered Fluids weredeveloped to provide an outstandingbalance of performance, safety andenvironmental properties. Thesesegregated hydrofluoroether (HFE)products offer zero ozone depletionpotential, low global warming potentialand low toxicity. They are alsononflammable, and are not classified asvolatile organic compounds (VOCs).Novec Fluids are compatible with a widerange of metals, plastics and elastomers.

3M™ Fluorinert™ Electronic Liquids are part of a family of fully-fluorinated compoundsknown as perfluorocarbons, or PFCs. Fluorinert Liquids have a high dielectric constant, andare available in a wide range of boiling points. They offer good materials compatibility, lowtoxicity, nonflammability and zero ozone depletion potential. Fluorinert Liquids have highglobal warming potentials and long atmospheric lifetimes. As such, their use should becarefully managed to minimize emissions. 3M recommends that users of Fluorinert Liquidsfurther limit emissions by employing good conservation practices, and by implementingrecovery, recycling and/or proper disposal procedures.

Suggested Products

3M™ Fluorinert™ Electronic Liquid FC-72 – Excellent low temperature viscosity makes thisan ideal fluid for use in low temperature heat transfer applications.

3M™ Fluorinert™ Electronic Liquid FC-84 – Excellent thermal conductivity and viscosityperformance over a range of temperatures. Useful in an array of thermal management applications.

3M™ Fluorinert™ Electronic Liquid FC-77 – Wide liquid range makes this product ideal foruse in automated test equipment and other semiconductor process equipment.

3M™ Fluorinert™ Electronic Liquid FC-3283 – Well-suited to a variety of semiconductormanufacturing heat transfer applications, such as etchers, ion implanters, testers and more.

3M™ Fluorinert™ Electronic Liquid FC-40 – Well-suited to a variety of heat transferapplications in the electronics industry.

3M™ Fluorinert™ Electronic Liquid FC-43 – Wide liquid range and non-conductivity makethis product well-suited to a variety of heat transfer applications such as etchers, ion implanters,testers and more.

3M™ Fluorinert™ Electronic Liquid FC-70 – High boiling point and excellent heat transferproperties make this an ideal fluid for use in high temperature thermal management applications.

Direct contact cooling with 3M™ Fluorinert™Electronic Liquids helped enable thedevelopment of dense electronics, such assupercomputers.

The new 3M™ Wafer Support System uses a unique,UV-curable 3M adhesive to bond wafers to a rigid,uniform support surface that minimizes stress on thewafer as silicon is removed. A proprietary Light-to-HeatConversion (LTHC) layer is employed for thedemounting process. The system enables conventional

backgrinding equipment to produce wafers with afinal thickness as low as 20 microns, with less

cracking, edge chipping and increased die yields.For wafer thicknesses between 50 and 100

microns, faster grinding speeds and higher pressurescan be used, resulting in shorter process times. Thesystem includes all the equipment andconsumables necessary for mounting, demountingand removing adhesive from the wafer.

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Wafer Thinning

Support Glass

UV-Cured Liquid Adhesive

Backgrind Line

Light-to-Heat Conversion (LTHC) Layer

Wafer

Wafer is supportedon the entire face and the edges.

The new 3M™ Wafer Support System enablesconventional backgrinding equipment to producewafers as thin as 20 microns.

Wafer Support System

EtchingSurfactants for BOE

Suggested Products

3M™ Novec™ Electronic Surfactant 4200 – Anionicfluorochemical surfactant in water, 25% active. Suitable foruse in Buffered Oxide Etch (BOE), aqueous solutions.

A variety of 3M surfactants are available for otherapplications. Contact 3M for details.

3M™ Electronic Surfactants are intended to improvewetting in buffered HF (BHF) and metal etch solutions.Formulated using a sustainable, non-PFOS/non-PFOAchemistry, they offer excellent solubility, easy mixingand low metals content. They are also shown towithstand continuous filtration.

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3M™ Novec™ 1230 Fire Protection Fluid sets a new standard for halon replacement.Combining outstanding extinguishing performance with an excellent environmentalprofile – zero ozone depletion potential, a low global warming potential of one and

short atmospheric lifetime – and high safety margins, Novec 1230 Fluid is a long-term, sustainable technology for special hazards fire protection. Novec

1230 Fluid is non-conductive and evaporates quickly, withoutleaving residue that could damage sensitive components. Thismakes it ideal for protecting critical assets such as controlrooms, computer rooms and media storage areas where such

vital assets would be damaged by water or dry chemical agents.

Fire Protection

IC Package Testing

Suggested Products

3M™ Fluorinert™ Electronic Liquid FC-40 – Ideal for a variety of applications such asetchers, ion implanters, testers and others. Conforms to Mil-Specs for hermetic seal/gross leak andthermal shock testing.

3M™ Fluorinert™ Electronic Liquid FC-43 – Used in liquid burn-in testing, environmentalstress screening, electronic quality and reliability tests. Conforms to Mil-Specs for hermeticseal/gross leak and thermal shock testing.

The thermal stability and non-reactivity of 3M™ Fluorinert™ Electronic Liquids make themideal for electronic quality control testing. Their high dielectric strength – in excess of35,000 volts across a 0.1 inch gap – allows sensitive electronics to be tested both physicallyand electrically while immersed in the liquid. They dry quickly, without residue –

eliminating the need for post-test cleaning.

Fluorinert Liquids are thermally and chemically stable;compatible with sensitive materials, including metals,

plastics and elastomers; non-flammable; and practicallynon-toxic.

Fluorinert Liquids are useful in electronic reliability, hermetic seal,gross leak and thermal shock testing over a wide temperature range.

PAG Anions 3M™ PAG Anions are experimental non-PFOS photo-acid generator anions designedespecially for use in semiconductor photoresists. When combined with various cations, these

anions offer high acid strength, excellent solubility in resins and solvents, highpurity, high thermal stability and low volatility. In principle, any photo-active

cation may be combined with any 3M anion.

Suggested Products

A variety of 3M PAG anions are available tomeet your specific requirements. Contact 3Mfor details.

Photo-Acid Generators (PAGs)

Long-Term,Sustainable Technology for FireProtection

DielectricLiquids forGross LeakTesting

Clean Room Tapes

Ultra-High PurityFluoropolymers from Dyneon

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Clean Room Products

Suggested Products

3M™ Cleanroom Vinyl Tape 1251 – Generalpurpose plastic film tape with a rubber adhesive.Ideal for many cleanroom applications includingcolor coding, sealing, wrapping, lane marking andconstruction, as well as in-process applications.

3M™ Cleanroom Very High-Tack Tape 1254– Polyester film tape with very high adhesion tomost surfaces. Ideal for cleanroom construction andmaintenance applications.

3M™ Cleanroom High Temperature ESDTape 1258 – Translucent, polyimide film tape withsilicone adhesive, offering unique electrostaticdischarge properties. Applications include soldermasking during wave and reflow solder operationsand other very high temperature maskingprocesses.

Suggested Products

Dyneon™ PFA UHP – Excellent chemical andtemperature resistance. Widely used in liquidchemical and ultra-pure water tubing and heatexchange applications.

Dyneon™ TFM™ UHP PTFE – Optimal chemicalresistance, high temperature resistance and verylow permeation. Ideal for fluid handling equipmentand complex shapes, including basins, cleaningsystems and wafer handling equipment.

Dyneon™ THV™ UHP Fluoroplastic –Exceptional clarity, flexibility and flame resistance.Used for sensor protection film, windows, UVphotolithography films.

Dyneon™ PFA-FLEX UHP – Improvedenvironmental stress crack resistance overconventional PFA.

Dyneon™ PVDF – Economical, high purity.Provides high mechanical strength for UPW pipingsystems and fluid handling components.

Dyneon™ Fluoropolymers are manufactured and sold by Dyneon LLC,a 3M subsidiary, and/or its subsidiaries and affiliates. Please contactDyneon for information about or to buy Dyneon products

Tools, equipment, piping and other components madefrom Dyneon™ Ultra High Purity (UHP)Fluoropolymers are used in a variety of semiconductormanufacturing processes to reduce the chance ofcontaminants (such as metal extractables) being releasedinto the cleanroom environment. Equipment designersand component manufacturers choose DyneonFluoropolymers for their design flexibility, purity andoutstanding chemical and temperature resistance.

Dyneon Fluoropolymers are proven effective insemiconductor fluid transport systems including piping,tubing, pumps and valves. They are also extensivelyused in the manufacture of wafer handling equipmentsuch as carriers and boats, chemical distributionmanifolds and flame-resistant clear window panels.

Specialized film tapes for a variety of uses in cleanroomenvironments. To maintain cleanroom integrity, theseproducts are cleaned and packaged in a cleanroom; rolls are wound onto plastic cores and bagged with Class 100clean film.

5076(HB)© 2005 3M 60-5002-0083-1

3M, SlurryFree, Novec, Fluorinert, Dyneon, TFM and THV are trademarks of 3M Company.Used under license by 3M subsidiaries and affiliates.

Issued: 10/05

3M Electronics Markets Materials DivisionBuilding 21-W-10900 Bush AvenueSt. Paul, MN 55106

1-800-251-8634651-736-3068If you are located outside the U.S. call: 1-800-3M-HELPSor 651-737-6501

www.3m.com/electronicmaterials

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Important Notice to Purchaser: All statements, technical information and recommendations contained in thisdocument are based on tests or experience that 3M believes are reliable. However, many factors beyond 3M’s controlcan affect the use and performance of a 3M product in a particular application, including conditions under which theproduct is used and the time and environmental conditions in which the product is expected to perform. Since thesefactors are uniquely within the user’s knowledge and control, it is essential that the user evaluate the 3M product todetermine whether it is fit for a particular purpose and suitable for the user’s method of application.

Warranty and Limited Remedy: Unless stated otherwise in 3M’s product literature, packaging inserts or productpackaging for individual products, 3M warrants that each 3M product meets the applicable specifications at the time 3Mships the product. Individual products may have additional or different warranties as stated on product literature, packageinserts or product packages. 3M MAKES NO OTHER WARRANTIES, EXPRESS OR IMPLIED, INCLUDING BUT NOTLIMITED TO, ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE ORANY IMPLIED WARRANTY ARISING OUT OF A COURSE OF DEALING, CUSTOM OR USAGE OF TRADE. User isresponsible for determining whether the 3M product is fit for a particular purpose and suitable for user’s application. If the3M product is shown to be nonconforming within the warranty period,your exclusive remedy and 3M’s sole obligation willbe, at 3M’s option, to replace the product or refund the purchase price.

Limitation of Liability: Except where prohibited by law, 3M will not be liable for any loss or damage arising from the 3Mproduct, whether direct, indirect, special, incidental, or consequential regardless of the legal theory asserted, includingwarranty, contract, negligence or strict liability..

Dyneon LLC6744 33rd Street North

Oakdale, MN 55128Toll-Free: +1 800 723 9127

Phone: +1 651 733 5353Fax: +1 651 737 7686