ZIC2410 User Guide PCB Implementation 0005-05-08-14- · PDF file2 PCB FOOTPRINT DIMENSIONS ......
9
ZIC2410 Series ZIC2410 User Guide PCB Implementation Guide 0005-05-08-14-001 (Rev D)
Transcript of ZIC2410 User Guide PCB Implementation 0005-05-08-14- · PDF file2 PCB FOOTPRINT DIMENSIONS ......
ZIC2410 Series
ZIC2410 User Guide PCB Implementation Guide
0005-05-08-14-001 (Rev D)
ZIC2410 PCB Implementation Guide
Rev D Document No. 0005-05-08-14-001 Page 2 of 9
Table of Contents 1 INTRODUCTION ................................................................................ 3
1.1 REFERENCED DOCUMENTS ............................................................................ 3
2 PCB FOOTPRINT DIMENSIONS ..................................................... 3
2.1 ZIC2410QN48 .................................................................................................. 3 2.2 ZIC2410FG72 ................................................................................................... 4
3 PLACEMENT GUIDE USING DISCRETE BALUN ......................... 4
3.1 ZIC2410QN48 MATCHING AND PLACEMENT ............................................. 4 3.2 ZIC2410FG72 MATCHING AND PLACEMENT ............................................. 5 3.3 CLEARANCE RULES ...................................................................................... 5 3.4 LAYER DEFINITION ........................................................................................ 6 3.5 RF MATCHING CIRCUIT ................................................................................ 6 3.6 GROUND COPPER (1) ........................................................................................ 7 3.7 GROUND COPPER (2) ........................................................................................ 7
4 HIGHLY INTEGRATED 2 LAYER EXAMPLE CIRCUIT ................. 8
4.1 SCHEMATIC ........................................................................................................ 8 4.1 LAYOUT OF TWO-LAYER EXAMPLE CIRCUIT. ........................................... 8
5 REVISION HISTORY ......................................................................... 9
ZIC2410 PCB Implementation Guide
Rev D Document No. 0005-05-08-14-001 Page 3 of 9
1 INTRODUCTION This is the user manual for the implementation of PCB designs for the ZIC2410QN48 and the ZIC2410FG72.
1.1 REFERENCED DOCUMENTS Category filename [.pdf] Document Name
Datasheet zic2410 ZIC2410 Datasheet Hardware References zicm03_evb3_hwref ZICM2410-EVB3 Evaluation Board Hardware Reference
Guide
2 PCB FOOTPRINT DIMENSIONS
2.1 ZIC2410QN48
Figure 1 – QN48 Package Footprint (top view)
● CAUTIONS
(1) The size of the ground pad on the top layer of the PCB should be less than or equal to the size (5.14 x 5.14) of the ground pad on the bottom of the device.
(2) Ground vias should be placed in the ground pad to provide DC and RF grounding. Take care to assure that via holes do not ‘short’ to any of the pads. It is recommended that a soldermask grid pattern be implemented so that the ground vias are not located in the solder paste pattern.
ZIC2410 PCB Implementation Guide
2.2 ZIC2410FG72
Figure 2 – FG72 Package Footprint (dimensions in mm)
3 PLACEMENT GUIDE Using Discrete Balun
3.1 ZIC2410QN48 MATCHING AND PLACEMENT
Figure 3 – QN48 package RF Matching Circuit (PCB Pattern)
ZIC2410 PCB Implementation Guide
Rev D Document No. 0005-05-08-14-001 Page 5 of 9
Important: A voltage-stable capacitor (Tantalum 10μF or greater) should be located near the analog 1.5V Regulator Output Pin (PIN6) of the ZIC2410QN48.
3.2 ZIC2410FG72 MATCHING AND PLACEMENT
Figure 4 – FG72 package RF Matching Circuit (PCB Pattern)
Important: A voltage-stable capacitor (Tantalum 10μF or greater) should be located near the analog 1.5V Regulator Output Pins (F1, F2) of the ZIC2410FG72.
3.3 CLEARANCE RULES
Figure 5 – Clearance Rules (dimensions in mm)
ZIC2410 PCB Implementation Guide
Rev D Document No. 0005-05-08-14-001 Page 6 of 9
3.4 LAYER DEFINITION Figure 6 shows 4-Layer Definition.
Figure 6 – 4-Layer Definition
3.5 RF MATCHING CIRCUIT
Figure 7 – RF Matching Circuit, Details (dimensions in mm)
ZIC2410 PCB Implementation Guide
Rev D Document No. 0005-05-08-14-001 Page 7 of 9
3.6 Ground Copper (1)
Figure 8 – 4-Layer View, SMA and Impedance Line
3.7 Ground Copper (2)
Figure 9 – 4-Layer View, Impedance Matching Circuit
Note: For more detailed information, refer to the schematics in the schematics contained in both the “ZIC2410 Datasheet” as well as the “ZICM2410-EVB3 Evaluation Board Hardware Reference Guide”.
ZIC2410 PCB Implementation Guide
Rev D Document No. 0005-05-08-14-001 Page 8 of 9
4 HIGHLY INTEGRATED 2 LAYER EXAMPLE CIRCUIT
4.1 Schematic
The following schematic is an example of a highly integrated solution which takes advantage of the Johanson Technology LTCC Balun with filter and a Johanson Technology antenna. In this example only the Port pins needed to demonstrate functionality were brought out. The pins that are mapped to the thru-hole pads are Power, Ground, ISP (used for loading firmware), P1_0 & P1_1 which are the UART connections. Additional ports are connected to top side test points. The discrete balun is replaced by Johanson Technology Integrated Filter and Balun Part Number 2450BM15B0009. This specific component is match specifically for the ZIC transceiver. The matching was optimized for both transmit and receive performance. This is followed by a shunt/series matching components which feeds a Johanson chip antenna. As can be seen by the layout of this example circuit, the RF design portion of the circuit has been significantly simplified.
4.1 LAYOUT OF TWO-LAYER EXAMPLE CIRCUIT. The plots below show the component placement, the top side copper, and the bottom side copper for the two layer example circuit. The total board area is (1.150” x 0.8”). The design was implemented on FR4 with a 0.062” thickness. Further reduction in space may be accomplished by rotating the antenna. However, the user must realize that antenna radiation patterns and performance are highly dependent on layout, ground planes, and nearby objects. If implementing a chip antenna approach, it is recommended the user consult with the chip antenna manufacturer.
ZIC2410 PCB Implementation Guide
Rev D Document No. 0005-05-08-14-001 Page 9 of 9
5 REVISION HISTORY Revision Date Description
A 3Sep08 Released
B 13Jan09 Revised Table in Section 1.1; added filename for references documents; added “dimensions” to captions for Figure 2, Figure 5, and Figure 7
C 11Jun09 Replaced EVB1 references with the datasheet and EVB3. D Nov10 Added 2 Layer Example using Johanson Tech. components
Item Qty Reference VALUE Manufacturer1 1 U1 ZIC2410 48 Pin QFN Package CEL2 1 U2 Balun & Filter Johanson Technology Inc3 1 JA1 2.45 GHz Chip Antenna Johanson Technology Inc4 3 C10 C24‐25 10nF MURATA5 7 C5 C7 C12‐14 C16 C19 10pF MURATA6 1 C15 1nF MURATA7 1 C9 22uF MURATA8 2 C6 C11 4.7uF MURATA9 2 L5 L7 82nH TDK10 3 R1‐3 150K YAGEO11 1 XTAL1 16M :3225M, CL=9pF RALTRON
