ZF S-Cam4 Mono and Tri Camera - System Plus · 2019. 5. 28. · These cameras feature the...
Transcript of ZF S-Cam4 Mono and Tri Camera - System Plus · 2019. 5. 28. · These cameras feature the...
©2019 by System Plus Consulting | ZF S-Cam4 Mono Camera 1
22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
Automotive Camera for Advanced Driver Assistance Systems
System report by Wilfried THERONMay 2019 – Version 1
ZF S-Cam4 Mono and Tri Camera
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
©2019 by System Plus Consulting | ZF S-Cam4 Mono Camera 2
Table of Contents
Overview / Methodology 4
o Executive Summary
o Block diagram
o Reverse Costing Methodology
Company Profile 9
o ZF Friedrichshafen AG
Teardown Analysis 11
o Global Views of the Camera
o Views and Dimensions of the Camera
o Camera Opening
o Electronic Board
Top Side – Global view
Top Side – High definition photo
Top Side – PCB markings
Top Side – Main components markings
Top Side – Main components identification
Bottom Side – High definition photo
Bottom Side – Components identification
o Camera Module Analysis
o CMOS Image Sensor Analysis
Cost Analysis 40
o Accessing the BOM
PCB Cost
Optical Module Cost
CMOS Image Sensor Cost
BOM Cost - Electronic Board
BOM Cost - Housing
Material Cost Breakdowns
o Accessing the Added Value (AV) cost
Electronic Board and System Manufacturing Flow
Details of the Electronic Board and System AV Cost
Added-Value Cost Breakdowns
o Manufacturing Cost Breakdown
Manufacturer Price 71
o Financial ratios
o Estimation of the Manufacturer Price
Give us your Feedbacks!
Company services 76
©2019 by System Plus Consulting | ZF S-Cam4 Mono Camera 3
Overview / Introductiono Executive Summaryo Main Featureso Block Diagramo Reverse Costing
Methodologyo Glossary
Company Profile
Physical Analysis
Cost Analysis
Manufacturer Price
About System Plus
Executive Summary
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the S-Cam4 Mono and TriCamera supplied by ZF Friedrichshafen AG (website).
These cameras feature the Omnivision CMOS image sensor, which demonstrates the shift in the procurement strategies of ZF and Intel Mobileye. In fact, theuse of the latest Mobileye EyeQ4 Vision Processor allows new sensors to be used and makes the S-Cam4 one of the smallest and lightest products in itscategory.
Based on a teardown of the system, this report details a complete bill of material and describes the electronics and housing assembling. Moreover, a specificreport describes the camera’s manufacturing and packaging processes. It presents also a detailed physical analysis of the CMOS image sensor, with a cross-section of the complete camera modules.
These reports also include a comparison with the previous version in the S-Cam series, the S-Cam 3. It estimates the manufacturing cost and selling price forboth the mono and tri-camera.
The teardown and the cost analysis of the System On Chip (SOC) is available in the related report “Mobileye EyeQ4 Family”.
©2019 by System Plus Consulting | ZF S-Cam4 Mono Camera 4
Overview / Introductiono Executive Summaryo Main Featureso Block Diagramo Reverse Costing
Methodologyo Glossary
Company Profile
Physical Analysis
Cost Analysis
Manufacturer Price
About System Plus
The reverse costing analysis is conducted in several phases:
Reverse Costing Methodology
• The initialization of the analysis
Pictures of the elements to be studied.
Identification of the components.
• Description of the material in the “SYScost+” software
Creation of an “estimation project” of the studied board with SYScost+ software.
Construction of the Bill of Material (BOM).
• Assessing the material
Searching for the price of each reference among distributors and manufacturers.
Assessing the cost of the PCB and of the unaccounted references (unknown by distributors)
The BOM is valued with SYScost+ : price simulation according to the requested quantities.
• Assessing the assembling and test phases
Assembly and test lines are modeled with the SYScost+ software.
The assembly and tests costs are estimated.
• Production cost & selling price
Estimation of the production cost & selling price.
• Report
A report is edited.
SYS.cost+©, is a software tool developed by SYSTEM PLUS CONSULTING to calculate the cost of electronic boards. More information on the software can be found at www.systemplus.fr.
©2019 by System Plus Consulting | ZF S-Cam4 Mono Camera 5
Overview / Introduction
Company Profile
Physical Analysis o Views & Dimensionso System Openingo Electronic Boardo Camera & CIS Module
Cost Analysis
Manufacturer Price
About System Plus
Views and Dimensions
Views of the Camera.
Xx m
m
Xx mm
Xx mm
©2019 by System Plus Consulting | ZF S-Cam4 Mono Camera 6
Overview / Introduction
Company Profile
Physical Analysis o Views & Dimensionso System Openingo Electronic Boardo Camera & CIS Module
Cost Analysis
Manufacturer Price
About System Plus
Camera Opening
System opening
Camera Image Sensor (CIS)
Lens Module
Screw TorxM2x6mm (x2)
Electronic Board(Top side)
©2019 by System Plus Consulting | ZF S-Cam4 Mono Camera 7
Overview / Introduction
Company Profile
Physical Analysis o Views & Dimensionso System Openingo Electronic Boardo Camera & CIS Module
Cost Analysis
Manufacturer Price
About System Plus
Electronic Board – Top Side – Main Components Markings
©2019 by System Plus Consulting | ZF S-Cam4 Mono Camera 8
Overview / Introduction
Company Profile
Physical Analysis
Cost Analysiso Accessing the BOMo PCBs Costo Optical Module & CMOS
Costo BOM Cost – Electronicso Housing Parts Estimationo BOM Cost - Housingo Material Cost Breakdowno Added-Value Costo Manufacturing Cost
Manufacturer Price
About System Plus
BOM Cost – Electronic Board (1/3)
©2019 by System Plus Consulting | ZF S-Cam4 Mono Camera 9
Overview / Introduction
Company Profile
Physical Analysis
Cost Analysiso Accessing the BOMo PCBs Costo Optical Module & CMOS
Costo BOM Cost – Electronicso Housing Parts Estimationo BOM Cost - Housingo Material Cost Breakdowno Added-Value Costo Manufacturing Cost
Manufacturer Price
About System Plus
Details of System Added Value (AV) Cost
The assembly steps of the system are assumed to be done in xxx.
For each operation, we have considered the time of realization and quantified the manufacturing cost depending on the country where thesystem is manufactured.
For the complete system, the total manufacturing time is xxx seconds, which is the necessary time for assembling and testing thesystem. The assembly and test cost is of $xxx.
©2019 by System Plus Consulting | ZF S-Cam4 Mono Camera 10
Overview / Introduction
Company Profile
Physical Analysis
Cost Analysiso Accessing the BOMo PCBs Costo Optical Module & CMOS
Costo BOM Cost – Electronicso Housing Parts Estimationo BOM Cost - Housingo Material Cost Breakdowno Added-Value Costo Manufacturing Cost
Manufacturer Price
About System Plus
Manufacturing Cost Breakdown
The Total Manufacturing Cost is estimated to $xxxx including $xxx for Material Cost (xx%) and $xxx for Added Value Cost (xx%).
©2019 by System Plus Consulting | ZF S-Cam4 Mono Camera 11
Overview / Introduction
Company Profile
Physical Analysis
Cost Analysis
Manufacturer Priceo Financial Ratioso Manufacturer Price
About System Plus
Estimation of the Manufacturer Price
The bill of material (BOM) cost is estimated to $xxxx for the Camera.
To this, we must add some scrap costs and component supplying costs to obtain the totalmaterial cost of $xxxx.
The assembly cost is estimated to $xxxx, so the manufacturing cost is $xxxx.
With estimated costs of R&D, G&A and Profit, the average selling price can be estimatedat $xxxx when using the estimated economic parameters of ZF.
©2019 by System Plus Consulting | ZF S-Cam4 Mono Camera 12
22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
Cameras in ZF S-Cam4 Mono & TriCIS and Camera Module AnalysisSP19457 - IMAGING report by Audrey LAHRACH
PHYSICAL ANALYSIS done by Guillaume CHEVALIERMay 2019 – version 1
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
©2019 by System Plus Consulting | ZF S-Cam4 Mono Camera 13
Table of Contents
Overview / Introduction 4
o Executive Summary
o Reverse Costing Methodology
o Glossary
Company Profile 8
o Omnivision
Lens Modules Physical & Cost Analysis 10
o S-Cam4 Mono Camera
Cross-Section
Cost Estimation
o S-Cam4 Mono Camera
Camera #1 Cross-Section
Camera #1 Cost Estimation
Camera #2 Cross-Section
Camera #2 Cost Estimation
Camera #3 Cross-Section
Camera #3 Cost Estimation
Physical Analysis 30
o CMOS Image Sensor
Sensor Die View & Dimensions
Sensor Delayering & main Blocs
Sensor Die Process
Sensor Die Cross-Section
Sensor Die Process Characteristic
S-Cam3 Sensor Comparison 47
Sensor Manufacturing Process 50
o Wafer Front-End Process & Fabrication Unit
o Sensor Die Front-End Process Flow
o CIS Packaging Fabrication Unit & Process Flow
Cost Analysis 59
o Summary of the cost analysis
o Yields Explanation & Hypotheses
o Sensor die
Wafer Front-End Cost
BSI Front-End Cost
Color Filters & Microlenses FE Cost
Sensor Die Wafer Cost
o Packaged Component
Packaging Cost
Component Probe Test & Dicing
Component Cost
Estimated Selling price 74
Feedbacks 78
SystemPlus Consulting services 80
©2019 by System Plus Consulting | ZF S-Cam4 Mono Camera 14
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
The reverse costing analysis is conducted in 3 phases:
Teardown analysis
• Package is analyzed and measured• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking• Setup of the manufacturing process.
Costing analysis
• Setup of the manufacturing environment• Cost simulation of the process steps
Selling price analysis
• Supply chain analysis• Analysis of the selling price
Reverse Costing Methodology
©2019 by System Plus Consulting | ZF S-Cam4 Mono Camera 15
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Camera Module Cross-Section
Package Cross-section plane #1©2019 by System Plus Consulting
Cross-section plane #1
#1
©2019 by System Plus Consulting | ZF S-Cam4 Mono Camera 16
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Cost Estimation – Optical Module
The Optical Module is estimated at $xxx.
©2019 by System Plus Consulting | ZF S-Cam4 Mono Camera 17
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
CIS Package Views & Dimensions
Package Top View©2019 by System Plus Consulting
Package Bottom View©2019 by System Plus Consulting
Package Side View©2019 by System Plus Consulting
xxx mm
xxx
mm
xxx
mm
• Package: xxxxxx
• Dimensions: xxx x xxx x xxx mm
• Pin Pitch: xxx mm
©2019 by System Plus Consulting | ZF S-Cam4 Mono Camera 18
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
CIS Package Cross-Section
Package Top View©2019 by System Plus Consulting
Package Cross-Section – SEM View©2019 by System Plus Consulting
©2019 by System Plus Consulting | ZF S-Cam4 Mono Camera 19
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
CIS Die Views & Dimensions
• Die Area: xxxx mm²
(xxxx x xxxx mm)
xxxx mm
xxxx mm
xxx
mm
Die Overview©2019 by System Plus Consulting
• Pad number: xxxx
xxm
m
Lens Tiltled SEM View©2019 by System Plus Consulting
©2019 by System Plus Consulting | ZF S-Cam4 Mono Camera 20
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
CIS Die Process – xxx Memory
Die Delayering – Optical View©2019 by System Plus Consulting
xxx memory is present on the circuit.
Die Process – xxxx Memory – SEM View©2019 by System Plus Consulting
©2019 by System Plus Consulting | ZF S-Cam4 Mono Camera 21
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Packaging Process Flow (1/2)
©2019 by System Plus Consulting | ZF S-Cam4 Mono Camera 22
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Total Wafer Cost
The Wafer front-end cost for the CIS circuit is estimated at $xxx in2019.
The largest portion of the manufacturing cost is due to the WaferFront-End cost at xx%.
We estimate a gross margin of xxx% for the foundry supplier xxxx,which result in a Wafer price at $xxxxx in xxxx. This correspond to theselling price to Omnivision.
Cost Breakdown
Wafer Front-End Cost $409.34 55.0%
BSI Front-End Cost $268.29 36.0%
CF + Spacer + ML Front-End Cost $67.27 9.0%
Total Wafer Cost $744.90 100%
TSMC Gross Profit $762.99 50.6%
Total Wafer Price $1,507.89
2018
©2019 by System Plus Consulting | ZF S-Cam4 Mono Camera 23
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Packaging Cost
The packaging cost is estimated at $xxxx in 2019.
The largest portion of the manufacturing cost is represented by the equipmentcost at xx%.
We estimate a gross margin of xx% for xxxxx, which result in a packaging price at$xxx in 2019. This corresponds to the selling price to Omnivision.
©2019 by System Plus Consulting | ZF S-Cam4 Mono Camera 24
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Component Cost
By adding the probe test, the Package and the dicing cost, the CISWafer cost is estimated at $xxxx in 2019.
The number of good dies per wafer is estimated at xxx in 2019,which results in a die cost at $xxx.
The component cost is estimated at $xxxx in 2018.
o The CIS die represents xx% of the component cost.
o The package assembly represent xx% of the component cost.
o Probe Test, Dicing, Final test and yield losses represent xx % ofthe component cost.
©2019 by System Plus Consulting | ZF S-Cam4 Mono Camera 25
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Estimated Manufacturer Price
We estimate that Omnivision realizes a grossmargin of xx% on the CIS, which results in afinal component price estimated at $xxx.
This corresponds to the selling price for 1Mquantity to OEMs.
©2019 by System Plus Consulting | ZF S-Cam4 Mono Camera 26
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
About System Pluso Company serviceso Related reportso Contacto Legal
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©2019 by System Plus Consulting | ZF S-Cam4 Mono Camera 28
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
About System Pluso Company serviceso Related reportso Contacto Legal
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©2019 by System Plus Consulting | ZF S-Cam4 Mono Camera 29
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
About System Pluso Company serviceso Related reportso Contacto Legal
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