X4-2B_HW_TOI_AUG_2013_Rev_02

Sun Confidential: Need to Know

X4-2B Services TOI Architecture and features Revision 0.2

Wei Lu

2012 Oracle Corporation. - Proprietary and Confidential 3

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Note

The following is intended to outline our general product direction. It is intended for information purposes only, and may not be incorporated into any contract. It is not a commitment to deliver any material, code, or functionality, and should not be relied upon in making purchasing decisions. The development, release, and timing of any features or functionality described for Oracles products remains at the sole discretion of Oracle.


Agenda

Mensa Overview

Intel Romley Platform

Mensa Architecture

Mensa Components

Mensa Remote Management

Appendix


Mensa Overview

X4-2Bserver module (Mensa+) for

the Sun Blade 6000 chassis:

A90-B-N (aka C10+)

A90-D (aka C10 M2)

Sun Blade 6000 chassis can hold

up to ten server modules


Oracle X4-2B Blade Server

Compute

2x Intel Ivy Bridge-EP CPUs

1x PCH southbridge

24x DDR3 RDIMMs

Up to 768 GB of memory

I/O

2x PCIe 2.0 EM slots (8x lane per EM)

2x PCIe 2.0 FEM slots (8x Lane per FEM)

2x GbE ports (Powerville)

1x REM Slot (8x lane/slot)

4x USB 2.0 (two front, two internal)

2x USB 2.0 dongle

1x VGA

AST2300 BMC with remote KVMS

1x Serial Port

4x hot swap 2.5 SAS/SSD drive bays

4x SAS ports (REM)

2-Socket, 24DIMM Enterprise-Class System Blade


Mensa Board Layout


Mensa vs Mensa+

Mensa

Sandy Bridge-EP CPU

Socket R

Max N of cores - 8

24 DDR3 DIMMs, 384GB Max

Mensa+

Ivy Bridge-EP CPU

Socket R

Max N of cores - 12

24 DDR3 DIMMs, 768GB Max


Intel Product Name Decoder

Before Launch Date After Launch Date

Ivy Bridge-EP Socket R

Intel(R) Xeon(R) E5-2697 v2 12-core 2.7GHz 130W Intel(R) Xeon(R) E5-2690 v2 10-core 3.0GHz 130W Intel(R) Xeon(R) E5-2650 v2 8-core 2.6 GHz 95W Intel(R) Xeon(R) E5-2630 v2 6-core 2.6GHz 60W Intel(R) Xeon(R) E5-2609 v2 4-core 2.5GHz 60W

Patsburg - J Intel(R) C600 series chipset

Powerville I350-AM2

Romley-EP Platform Intel(R) Xeon(R) processor E5-2600 v2 product family


Mensa+ Architecture


Mensa Block Diagram 2 Socket Configuration


Mensa Front View

1 Locate Button and LEDWhite

2 Ready to Remove LEDBlue

3 Fault- Service Action Required LEDAmber

4 PowerOK LEDGreen

5 On/Standby Power button

6 NMI Reset button (Service only)

7 RFID tag (with serial number)

8 USB ports (2)

9 Universal Connector Port (UCP)

10 Hard Disk Drive (HDD0) *




14 Ejector levers

* HDDs are optional


Mensa Rear View

1 Power connector

2 I/O Connector

3 Rear cover (remove before

inserting into chassis)

4 USB flash drives 2, 3


Mensa - Top View

REM

Powerville

PCH

USB (Internal)

FEM Slots

CPU1

CPU0

FPGA REM

SAS

Disk

Bays


Mensa+ Components


Mensa Components

1 HDD/SSD

2 REM

3 CPU

4,6 Heatsink

5 FEM

7 USB stick

8 DIMM

9 Battery

10 Enclosure


CRU vs. FRU, Hot vs. Cold

Hot service CRUs: Drives

EMs

Cold service CRUs DIMMs or fillers

REM

FEMs

System Battery

SAS Cable

Internal USB sticks

FRUs Motherboard

Processor and heat sink


Memory Architecture

Each processor has 4 DDR3 memory channels (A,B,C,D)

Each DDR3 memory channel supports up to 3 DIMMs for a total of 12 DIMMs per processor

X4-2B supports 1 DIMM per channel, 2 DIMMs per channel, and 3 DIMMs per channel across both sockets.


Mensa Memory Bank Layout


Supported DIMMs

DDR3 LVDIMMs (1.35V)

8 GB DDR3-1600 DIMM

16 GB DDR3-1600 DIMM

DIMM slot filler panels

32 GB DDR3-1600 LRDIMM (Post RR)

(1DPC:1600 2DPC:1600 3DPC:1066)


Memory Population


Memory Fillers (No Need in X4-2B)


REMs

Niwot REM (LSI) (SG-SAS6-R-REM-Z)

SAS Eight Port (2 X4) 6Gb RAID PCI-E Gen2 HBA, Coyote Replacement (RAID 0, 1, 10, 5, 6)

Erie REM (LSI) (SG-SAS6-REM-Z)

SAS Eight Port (2 X4) 6Gb RAID PCI-E Gen2 HBA.


FEMs

Dual 10Gb Ethernet, PCIe 2.0 (Intel Niantic - X4871A-Z)

Required to support OPUS

Passthru FEM: (aka Hunter - X4263A-N)

Nalia FEM (7100283- ATO, 7100633 - PTO)

For SOL_NEM


PEMs PEMs

Combo GbE/FC Emulex 2-port 8Gb FC, 2-port GbE

Qlogic 2-port 8Gb FC, 2-port GbE

10GbE/1GbE Quad GbE Copper / Fiber PCIe 2.0 (Intel, Powerville)

Intel 2-port SFP+ 10GbE NIC

Intel Niantic Copper: Dual port 10GbE Twinville

SAS2 Erie-EM (No RAID. Uses IT fw)

IB PCI-E QDR IB-HCA PCI-E Gen2 Mellanox ConnectX-2

Based

FC/FcoE (Ganymede) Emulex 2 Port 16Gb FC or 10Gb FcoE

Qlogic 2 Port 16Gb FC or 10Gb FcoE


NEMs

Sun Blade 6000 10-Port GbE Pass-Thru NEM (X4250A-N)

Sun Blade 6000 Ethernet Switched NEM 24p 10GE (OPUS - X2073A-N)

Sun Blade 6000 Virtualized 40GbE NEM (SOL_NEM - 7100090)


Internal Storage - HDDs

Mensa supports up to 4 Internal HDDs

300GB/600GB/1.2TB 10000 rpm 2.5-inch SAS2 HDDs with Marlin bracket

400GB 2.5-inch SATA Solid State Disks (SSDs) with Marlin bracket

HDD Filler should be used in case when HDD is not installed


Internal Drives Mixing Rules

Mixing of hard disk technologies (e.g., SAS HDD and SATA SSD) is allowed within the 4 internal drive slots as long as they are in separate RAID volumes, or if treated as JBOD.

Within the RAID volume, the drives must be identical (capacity and type)

For example, a RAID volume with two 300GB/10K SAS HDDs is supported, but a RAID volume with a 300GB/10K SAS HDD and a 600 GB/10K SAS HDDs is not supported.


Cabling (Not support)


USB

2 Front USB2 slots

2 Internal USB2 slots

Supplied USB Drive USB Thumbdrive (USB 2.0

compliant) 4GB, MLC, USB-2, SBC, RoHS-6 Compliant


UCP Dongle

1 Video cable

2 Serial console

3 USB (x2)


Mensa Front Panel LEDs & BUTTONS

N Name Color

1 Locate LED/button White

2 Ready to Remove LED Blue

3 Service Action Required LED Amber

4 Power/OK LED Green

5 Power button None

6 NMI button None


Fault Tracing

Fault Remind button helps identify or locate a faulty component even after the blade has been removed from chassis

Amber fault LED of these components will be lit by Fault Remind button

Processors

DIMMs


Blade cooling

No fans are used on the Mensa blade, cooling is provided by the C10 chassis.

Airflow is front to back, in at the front panel, through the DIMM memory arrays and CPUs, and out the back

The following blade components have heatsinks:

Processors

Patsburg

Powerville


Mensa Remote Management


Service Processor

Based upon the Aspeed AST-2300 integrated processor

BMC provides industry standard IPMI feature set

Remote KVMS over IP

Serial port

Ethernet access to SP through a dedicated C10 10/100BaseT management port,

and optionally through one of the host GbE ports through NCSI interface

Front side KVM with Dongle

Support for in-system upgrade (BIOS, CPLD, HPC, etc.)

256MB DDR3 Memory

32MB Flash


Oracle ILOM Key Functions

Management Interfaces CLI, IPMI

Firmware Updates

Remote Host Management

Inventory and Component Management

System Monitoring and Alert/Fault Management

Thermal and Fan Control

User Account Management

Power Consumption Management


Appendix


Mensa SMBUS BLOCK


Memory Population Rules

Rule1: Always populate the channels as follows

* Fill up all Blue Sockets

* Next, fill up all White sockets

* Finally, fill up the Black sockets

This is known as the "fill farthest" approach to DIMM install. Always populate the DIMMs furthest from the processor (blue sockets) first.

Example: A processor with 4 DIMMs. Install 4 DIMMs in Blue sockets D0, D3, D6 and D9.

Example: A processor with 8 DIMMs. Install 4 DIMMs in Blue sockets D0, D3, D6 and D9, and 4 more DIMMs in the WHITE sockets D1, D4, D7 and D10.

Example: A processor with 12 DIMMs. Install DIMMs in all the sockets


Memory Population Rules, 2

Rule 2: Memory symmetry across processors is required. Processor #1 memory must match processor #0 memory, in placement, type, size, capacity, frequency and voltage.

Rule 3: Each processor can support single DIMM, two DIMMs, three DIMMs or four DIMMs per color socket set

Rule 4: Within every set of 4 DIMMs (e.g., blue socket set, white socket set, black socket set), mixing/matching of different size, memory speed and voltage is NOT ALLOWED Memories in D0, D3, D6 and D9 must be all the same.

Next, memories in D1, D4, D7 and D10 must be all the same, etc. While doing this, Rule 2 must be maintained.



Rule 5: Mixing and matching of different size, voltage and speed across different 4 DIMM sets is allowed. For example, memories in D0, D3, D6, D9 (blue sockets) must have the same size. But, they do not have to match memory size/voltage/speed in D1, D4, D7, D10 (white sockets). Note: When mixing speed across different 4 DIMM sets, all memory will be tuned to the slower speed.

Rule 6: Mixing of different DIMM technology is not supported. The blade must be all RDIMMs.

Rule 7: Each processor can support a maximum of: * 12 single-rank (SR) or dual-rank (DR) DIMMs; or * 12 Load Reduced (LR) DIMMs;



Rule 8: For maximum performance, apply the following rules:

* DIMMs can run in one of the 2 speeds: 1600 and 1067MHz.

DIMM speed rules are: (SR=single rank; DR=dual rank; LR=Loading reduced)

* Memory bus speed also depends on processor SKU.

1. 1DPC or 2DPC (SR/DR/LR) = 1600 MHz

2. 3DPC (SR/DR/LR) = 1067 MHz

Rule 9: Mixing different size DIMMs:

Farthest socket on a channel gets highest density DIMM,

second socket gets the next highest density, etc

Sun Confidential: Need to Know

X4-2B_HW_TOI_AUG_2013_Rev_02

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