X-Y IN CIRCUIT HiTESTER 1240 - 首页|HIOKI-日置(上海 ...HIOKI. Certifying reliability. 2...
Transcript of X-Y IN CIRCUIT HiTESTER 1240 - 首页|HIOKI-日置(上海 ...HIOKI. Certifying reliability. 2...
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1240 1 2 4 0 - 0 1 / 1 2 4 0 - 0 2 / 1 2 4 0 - 0 3
1 2 4 1 - 0 1 / 1 2 4 1 - 0 2 / 1 2 4 1 - 0 3
Reduced running costs (no test fi xture required)
Support for prototype boards (immediate support for design changes)
Improved reliability (reduced reliance on visual inspections)
Improved work effi ciency (standard support for automatic testing)
X-Y IN CIRCUIT HiTESTER
HIOKI. Certifying reliability.
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Increasing detection rates by combiningstatic and dynamic testing and adding an image test.
The 1240 takes high-precision measurements of the contact resistance between IC leads and the circuit pattern using the 4-terminal resistance measurement method and makes a judgment based on a comparison with known-good data. The use of an electrical detection method enables highly reliable detection.
Although the influence and characteristics of circuit networks make it impossible to test all pattern-mounted components with an in-circuit tester, the incorporation of simple function testing and image testing functionality into the in-circuit process can help increase overall detection rates.
Higher process detection rates
Detection of inadequate IC lead contact
Sense side
Precision probe for 4-terminal measurement
Support for 0.5 mm pitch and 0.3 mm line width Four-terminal probes that are not subject to the influence of contact resistance and wiring resistance are used to perform IC lead tests. These probes can also be used in component testing.
Good lead
The resistance value between these two points is measured.
The board alignment CCD camera, which is standard equipment on the 1240, can be used to test components that cannot be tested using electrical testing, dramatically reducing the need to rely on visual inspections. Visual mode supports chip component detection and polarity testing, while alignment mode augments component detection and polarity testing with misalignment testing. A component alignment camera (optional) can be added to enable testing of components other than chips such as ICs.
In addit ion to automatic alignment and visual testing, the 1240 offers other features that take advantage of the CCD camera.
Presence detection
Reduced reliance on visual inspections
Simple visual function
Source side
Insulating material
Lead float Inadequate contact
Polarity Misalignment
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Extensive selection of measurement modes
Active test (optional)
The active test option enables MOS-FET, J-FET, relay on resistance, 3-terminal basic function, as well as many other measurements.
FET operation test
Judge components based on their operational states. FET operation is judged by measuring the voltage and current between the drain and source while the on voltage and off voltage are applied to a MOS-FET or J-FET gate (both Nch and Pch are supported).
Relay operation test
Measure relay contact resistance. The secondary side’s resistance value is measured while applying a voltage to the relay’s primary side. This functionality allows checking of the resistance value when a user-specified voltage (5 V, 12 V, or 24 V) is applied as well as in an open state when 0 V is applied.
Three-terminal regulator voltage measurement
Measure generated voltage. The voltage generated on the output side of the circuit under test is measured while a user-specified voltage (max. 25 V/200 mA) is applied to the circuit’s input side. This functionality can also be used as a simple function test.
Simple, programming-free operation
Boundary scan test support
Boundary scan (“BS”) is a method for testing populated circuit boards based on the IEEE 1149.1 standard whereby switches inside the IC called boundary scan cells are used to check the mount status of individual components.Boundary scan testing makes use of boundary scan cells that are preinstalled in a digital IC’s I/O pins. These cells comprise a digital switch and function similarly to a conventional in-circuit test probe. Boundary scan test featuresAlmost all digital ICs on a populated circuit board can be tested using a small number of probes (minimum of about 8).
Operation is judged based on the off current and the on resistance value.
Operation is judged based on the off current and measured current (IDSS).
Detection rate
■ The 1240 provides a variety of test modes to help raise detection rates.
Use in combination with an external instrument.
Function feature voltage measurement (optional)
Testing is performed after connecting the HiTESTER to an external instrument with analog output. In CONV mode, the voltage between the H and L potentials is measured and converted using a conversion equation set with that voltage value (the user specifies a and b values for a linear function). A judgment is then made based on the converted value.
Simple image inspection
Circuit under test
Inadequate contact measurement
Active test
Boundary scan test
Component test
Application of constant voltage
OutputInput
Measured voltage
Circuit under test
Circuit under test
Circuit under test
Measurementtarget
Means of connectingtarget to probes
(1939 Measurement Switch Board, etc.)
H potential
L potential
Externalinstrument
Measurement pins Analog voltage output pins
Measured value conversion
and unit display.
y = ax + b
Measured voltage
BS cell A BS cell BLead A Lead B
Dig
ital I
/O
Dig
ital I
/O
Probe 1
:Boundary scan cell
Probe 3
Probe 2
Probe 4
Logiccore
TDI: BS data input
TMS: BS mode select
TDO: BS data outputTCK: BS clock
Logiccore
BS deviceregister
BS instructionregister
BS TAPcontroller
BS deviceregister
BS instructionregister
BS TAPcontroller
MultiplexerMultiplexerTDI: BS
data input
TDO: BS data output
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Easier. More effi cient.
Data creation and testing workfl ow
The 1240 provides a single workfl ow, from data creation to automatic testing.
Thanks to their ability to position probes and take measurements based solely on test data, X-Y in-circuit testers are capable of running tests from the initial lot stage and of accommodating design changes with remarkable fl exibility. Although the creation of test data requires the entry of component coordinates and a reasonable level of electrical knowledge, the process has been simplifi ed by powerful tools such as the ATG function.
In recent years, the ability to control and reduce running costs has come to be seen as an important component of tester performance. Along with the issues of fi xture costs and associated storage space, customers are demanding testing solutions that can immediately accommodate prototype boards. The 1240 X-Y IN-CIRCUIT HiTESTER meets these needs.
X-Y IN-CIRCUIT HiTESTERs are measuring instruments for testing the state of populated circuit boards.
■ Data creation workfl ow
Circuit diagrams, component charts, bare boards, populated boards (multiple samples are desirable), component layouts, net lists Documentation required for automatic data creation Mounter data and CAD data
Enter the necessary data.
Step
1
Step
2
Step
3
Step
4
Step
5
Step
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Register alignment marks.
Enter measurement coordinates.
Debug (adjust) the data.Adjust judgment criteria to allow the detection of problematic components.
Optimize the test order.Adjust the measurement order to achieve the shortest possible testing time.
Prepare documentation required for data creation.
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Software-assisted data creation method
Utilize CAD data.Basic data creation method
Utilize mount data.
● Conversion from mounter data (requires conversion software option)Data is created based on the component information, component coordinates, and component mount orientation stored in mounter data.
● Conversion from CAD data (requires HIOKI Expert)Data is created based on CAD data and component lists.
Automatically adjust measurement data.
ATG function
If the data includes information about connections between components (net information), the data can be used to automatically select test conditions, dramatically reducing the amount of time required for debugging in consultation with circuit diagrams.
● CAD data includes net information.This net information can be reflected in the created data, enabling use of the ATG function.
Component name Value
X coordinate
Y coordinate
Mount orientation
Mount method Chip code
Measurement conditions
MK1_1 ----- 500 500 0 F MARK MARK ↓MK1_2 ----- 17500 11300 0 F MARK MARK ↓IC101 ----- 4318 2667 90 FB SOP20 XC547 ↓R104 10K 3810 762 0 F CHIP2025 CN2A4T ↓VC101 2P 2921 3302 270 FB CHIP1608 CPTU ↓C101 47P 3429 3239 90 FB CHIP2025 HS15 ↓C102 680P 3175 2318 270 FB CHIP2025 D22CG ↓C104 0.1U 8255 3810 180 F CHIP3620 ECUV ↓D101 0.7 937 6350 90 FB D3PA 1S1588 ↓
Step
2Step
4Step
2Step
4Step
5Simplify steps 2 and 4.
Faster testing
Test order Z optimization function
The Z-axis height during X-Y probe movement can be specifi ed by area, allowing a margin of clearance for tall components to be incorporated when optimizing the test order.
Simplify steps 2, 4, and 5.
Step
6 Perform high-speed optimization for Step 6. Step
5 Automate Step 5.
Areas wi th ta l l components are specified, and the Z-axis height is increased for those areas during testing. This selective approach prevents decreases in the overall testing speed.
Use a CAD input processor (support for more than 45 formats).
Two methods
Create custom conversion software for individual mounter data formats. Step
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Software Measurement System List of Options
•Active test support•Recovery CD•Line history management system support•Addition of software with support for QLAN and visual inspection link•Addition of software for simplifi ed compilation of measured value statistics for steps
•Addition of baffl e mechanism (Z-axis mechanism)•Four-terminal probes with support for 0.4 mm pitch•Addition of automatic arm offset verifi cation function•Installation of clamp jig for atypically shaped boards•Support for lower probe installation•Support for C reverse probe installation•Support for 4.0 mm board thickness•Frequency measurement of crystal oscillators
•Transport height modifi cation (900 mm or greater)•Addition of anti-vibration rubber (Dersbond)•Specifi cation of HiTESTER color•Rail side opening cover•Addition of dust collector (fi lter)•Installation of output relay for signal lamp use•Simultaneous transport specifi cations•Support for double-sided testing•Support for SMEMA standard•Special pre-/post-process interface support•Addition of LAN port•Addition of COM port•Barcode reader installation•QR reader installation•Addition of QR look-ahead function•QR code scanning with alignment cameras•Addition of ground terminal for connecting a wristband ground strap•Addition of control panel cover•Addition of operational preparation circuit•Large-format board support (560 × 500)
For 1240-01/02 For 1240-03
•Alignment camera, MR arm 1940-51 1940-52•Component alignment camera, MR arm 1940-61 1940-62•Stamp unit, R arm 1941-61 1941-63•Stamp unit, L arm 1941-62 1941-64•Feed rails 1942-01 1942-01•Automatic width adjustment function 1942-11 1942-12•Board warp correction unit 1943-11 1943-12•Measurement switching board 1939-01•Expansion I/O board 1944-01•DC measurement board unit (active test) 1935-24•Data creation software 1395-06•Measurement unit calibration unit 1330•Maintenance tool set 1356•Monitor camera 1946-08 1946-09•Recovery CD (1240-01, -03) 1139-06 1139-06•Recovery CD (1240-02) 1139-07
■Alignment cameras
An alignment camera can be mounted on each arm to provide high-precision probing. Component alignment corrects for misalignment of individual components after mounting and is used when making direct contact with component leads. (Options 1940-51 and 1940-61 cannot be installed at the same time.)
■Stamp units, R and L arms
Tested boards can be marked w i t h s t a m p s . M o d u l e -specific, group-specific, and overall test data stamp settings are supported and provide an effective means of preventing defective and untested boards from getting mixed in with PASS boards.
■Board warp correction unit
Reliable correction of board warp in the upward direction is provided by holding boards down at two points, one on each side.
■Feed rails
One untested board can be placed on the feed rails. The rails can be used to assist the operator during standalone 1240 automatic operation (no pre- or post-process device) when feeding or ejecting boards.
■Measurement switching board 1939
A n e x t e r n a l f r e q u e n c y counter or other instrument can be connected to enable measurement of frequency and other data. *The externally connected i n s t rumen t ( coun t e r ) i s operated using GP-IB control.
■Automatic width adjustment function
By including the board width in the test data, it is possible to automatically adjust the tester to the board width when reading the test data. This feature can be combined with board count setup editing, a standard feature, to allow automatic setup for different boards.
1240-01/02Support for large-format boards
1240-03Support for M rack boards
Options and Special-order Features
510 (W) × 460 (D) mm1240-01: Super-high-speed testing of up to 40 steps/second (200% faster than previous models)1240-02: Optimized for testing for inadequate IC contact; 150% faster than previous models
400 (W) × 330 (D) mmCompact, high-speed tester for use on production lines (super-high-speed testing of up to 40 steps/second)
For 1240-01/02 For 1240-03
Contact probe (for L, ML, MR arms) 1172-12 1172-18Contact probe (for R arm) 1172-17 Same as aboveFour-terminal probe (for L, ML, MR arms) 1172-43 1172-45Four-terminal probe (for R arm) 1172-44 Same as aboveCarbide contact probe
Probes
Additional Accessory OptionsFor 1240-01/02 For 1240-03
•One-way clutch 1164-02 Unnecessary•Support pins 1164-52•Printer paper 1196•Arm offset board 1350•Probe impact sheets (176 sheets) 1134-02
*Other special features are available on a special-order basis. Please contact a HIOKI sales offi ce near you for more information.
*Probe pressure: 1.35 NContact probe (single needle) (when using 2 mm stroke)Four-terminal probe (when using 1.5 mm stroke)
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1266 1323
1787
1236
916
1133
No.of arms 4 (L, R, ML, MR)
No. of test steps 40,000 (max.)
Coordinate specification method Step XY / pattern XY
Measurement ranges
Resistor : 400 μΩ to 40 MΩCapacitor : 1 pF to 400 mFInductance : 1 μH to 100 HDiode VZ measurement : 0 to 25 VZener diode VZ measurement : 0 to 25 V / 25 to 80 V (optional)Digital transistor : 0 to 25 VPhotocoupler : 0 to 25 VShort : 0.4 Ω to 400 kΩOpen : 4 Ω to 40 MΩDC voltage measurement : 0 to 25 VFunction feature voltage measurement : 0 to 25 VRelay on resistance measurement : 40 m to 40ΩEFT on resistance measurement : 400 m to 400ΩSimple function measurement : 0 to 20 V
Test signalsDC constant voltage : 100 mV / 400 mV (2 ranges)DC constant current : 200 nA to 200 mA (13 ranges)AC constant voltage : 0.1 V rms (1 range)
Measurement unitDC voltmeter : 800 μV to 25 V f.s. (8 ranges)DC ammeter : 100 nA to 25 mA f.s. (7 ranges)AC ammeter : 10 μA to 10 mA rms (4 ranges)
Judgment range -99.9% to +999.9%, or absolute value
Guarding 2 points/step and lower probe channel guard specification
Probing precision Within ±100 μm per arm (X/Y direction)
Positioning repeatability Within ±50 μm (probing position)
Max. positioning resolution
X-Y: 1.00 μm/pulseZ: 6.00 μm/pulse
Probe work area 510 (W) × 460 (D) mm (1240-01/02)400 (W) × 330 (D) mm (1240-03)
Test board weight 2.0 kgf or less
Component mount range
Lower surface: Max. 100 mm (based on following conditions) 30.0 mm from reference rail: 90.0 mm 125.0 mm from movable rail: 85.0 mmNo components within 3 mm of both sides of board (transport margin)
Display 17” LCD display
Safety features
Emergency stop switch, safety covers (constructed of antistatic resin), arm and probe interference prevention software, moving part interference prevention limit switches, insulated transformer
Warning features Signal tower (3-light), buzzer
Power supplyAC 200 V ±10% (single-phase), 50/60 HzPower consumption: 3 kVA
Air supplyPressure (primary) : 0.5 to 0.99 MPa (dry air)Set pressure (secondary) : 0.5 ±0.1 MPa
Air consumption Max. 0.3 Nl/min
Environmental conditions
Temperature : 23°C ±10°CHumidity : 75% rh or lower (non-condensing)Air: Avoid use in the presence of excessive dust, vibration, or corrosive gases. Floor strength : At least 500 kg/m2
Standard accessories
1240-01/02
Contact probes: 1172-12 (for L and M arms) × 3, 1172-17 (for R arm) × 1; 4-terminal
probes: 1172-43 (for L and M arms) × 3, 1172-44 (for R arm) × 1; one-way clutch,
hexagonal wrench
1240-03
Contact probes: 1172-18 × 4; 4-terminal probes: 1172-45 (used for all arms) × 4; probe
relay board (for L and R arms) × 2; probe relay board (for ML and MR arms) × 2
1240-01/02 and 1240-03
Thermal miniprinter, printer cable, ball point screwdriver, grease, grease gun, keyboard,
mouse, computer accessories, setup disc, 4 leveling jacks, color display (17”), 1350 arm
offset board, UPS, 1134-02 probe impact sheets, power cable (terminating in bare wires),
spare fuse, probe impact sheets
Conveyor belts Double-sided flat belts (antistatic material)
Conveyor width reference side Front side
Transport height 900 ±15 mm
Conveyor speed Max. 40 m/min (no-load conditions)
Direction of transport Right to left or left to right (specify at time of order)
Specifications
External Dimensions
1410 1270
1760
Boa
rd c
lam
p he
ight
: 900
±15
1340
1240-031240-01,02
1240-01(g11241-01) 1240-02(g11241-02) 1240-03(g11241-03)Measurement speed Combination measurement: From 0.025 s/step Combination measurement: From 0.033 s/step Combination measurement: From 0.025 s/step
Probe installation angle (L, ML, MR, R) -11° /1.8°,0° / -6°,0° / 6°,+11° / -1.8° -10° / +5°,0° /0°,0° / 0°,+10° / -5° -11° /1.8°,0° / -6°,0° / 6°,+11° / -1.8°
Min. probing pitch0.2 mm (with 4-terminal probes: 0.5 mm) 0.2 mm (with 4-terminal probes: 0.5 mm)
(for both probe types, 7.5 mm between ML and MR arms)
0.2 mm (with 4-terminal probes: 0.5 mm)
Probe installation method One-way clutch & wire routing One-way clutch and wire routing One-way clutch and one-touch
Testable size Max. 510 (W) × 460 (D) mm Max. 510 (W) × 460 (D) mm Max. 400 (W) × 330 (D) mm
Max. component mounting range Upper: 38 mm (including board thickness) Upper: 38 mm (including board thickness) Upper: 25 mm (including board thickness)
External dimensions (W) × (D) × (H) 1,410 × 1,270 × 1,340 mm 1,410 × 1,270 × 1,340 mm 1,266 × 1,323 × 1,236 mmTester weight 1,300Kgs 1,300Kgs 1,050Kgs
1240-01, 1240-02, and 1240-03 Common Specifications 1240-01, 1240-02, and 1240-03 Common Specifications
1240-01, 1240-02, and 1240-03 Common Transport System Specifications
aø4ø2
ø1.06
14.1
59Model Tip shape "a" Length Tester Probe pressure
1172-12 1 needle 315mm 1240-01/02 (L and M arms) 1.35N (when using 2 mm stroke)1172-17 1 needle 195mm 1240-01/02 (R arm) 1.35N (when using 2 mm stroke)1172-18 1 needle 61mm 1240-03 (all arms) 1.35N (when using 2 mm stroke)1172-43 1 needle (4-terminal) 310mm 1240-01/02 (L and M arms) 1.35N (when using 1.5 mm stroke)1172-44 1 needle (4-terminal) 190mm 1240-01/02 (R arm) 1.35N (when using 1.5 mm stroke)1172-45 1 needle (4-terminal) 56mm 1240-03 (all arms) 1.35N (when using 1.5 mm stroke)
Note: g1) Model 1241 is the CE Marking compliant version of the model 1240 specifications.
Boa
rd c
lam
p he
ight
: 900
±15
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Inquiries
HIOKI ONLINEWebsite http://www.hioki.com
Email [email protected]
HIOKI is ISO 14001 certifi ed.All of HIOKI’s domestic and overseas facilities have been certifi ed compliant with ISO 14001, an international standard governing environmental management systems.
1240E6-84BCAUTION To ensure safe and proper operation, be sure to read this product’s Instruction Manual before attempting to use it.
All information correct as of Apr. 9, 2008. All specifications are subject to change without notice.
CYNCRONA
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Headquarters, Factory, and Nagano Sales Offi ce(Nagano, Niigata, Gumma, Yamanashi, Toyama, Ishikawa, Fukui)
Osaka Sales Offi ce(Osaka, Kyoto, Nara, Shiga, Wakayama,
Hyogo, Tottori)
Hiroshima Sales Offi ce(Chugoku region except Tottori, Shikoku)
Fukuoka Sales Offi ce(Kyushu, Okinawa)
Tohoku Sales Offi ce(Hokkaido and six Tohoku prefectures)
Northern Kanto Sales Offi ce(Saitama, Ibaraki, Tochigi)
Tokyo Sales Offi ce(Tokyo, Chiba)
Kanagawa Sales Offi ce(Kanagawa)
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WKK PHILIPPINESWKK China(Shenzhen)WKK ESWKK PCB
WKK (MALAYSIA
Kuala Lumpur)
SEIKA(LA)
HUSA
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HIOKI-trained distributors provide local technical support. HIOKI is proud to maintain a growing network of distributors and product support offi ces in four overseas regions (North America, China, Southeast Asia, and Europe).
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Le Champ