X-ray Inspectipn of BTCs

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X-Ray Inspection of Bottom Terminated Components-QFNs, LGAs Bob Wettermann, MIT November 2017

Transcript of X-ray Inspectipn of BTCs

Page 1: X-ray Inspectipn of BTCs

X-Ray Inspection of Bottom Terminated

Components-QFNs, LGAs

Bob Wettermann, MITNovember 2017

Page 2: X-ray Inspectipn of BTCs

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X-Ray Inspection-BTCs 610 G Criteria

You DO NOT HAVE to x-ray inspect BTCs according to the IPC-A-610G

CHOICEA.Develop process. Validate process using x-ray. Sample plan inspection. Need to have objective

evidenceOR

B. Inspect via x-ray

Note: X-ray equipment not intended for electronic assemblies or not properly set up can damage sensitive assemblies

Page 3: X-ray Inspectipn of BTCs

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IPC-7093 Inspection Guidelines

x-ray should be used to establish process parameters

x-ray should be used when there is a high proportion of hidden solder joints like on BTCs

x-ray should be used when there are a significant number of untestable solder joints

x-ray should be used when there are numerous fanout vias which are inaccessible or there are mirror BTCs

THESE ARE GUIDELINES (SUGGESTIONS) AND NOT INSPECTION

CRITERIA

Page 4: X-ray Inspectipn of BTCs

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RECOMMEND – Discussing void criteria with customer else use BGA criteria of max 30% in inspection area

Page 5: X-ray Inspectipn of BTCs

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Shorts

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Show Integrity of Bond Wires

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Solder balls

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Insuff icient Solder

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More on Voiding

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More on Voiding

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X-Ray Inspection of Bottom Terminated

Components-QFNs, LGAs

Bob Wettermann, MITNovember 2017