World MEMS inertial sensor markets · MEMS industrial food chain Front-end Equipments Materials &...

© 2005

WISM May 2005 Copyrights © Yole Développement SARL. All rights reserved.

World MEMS inertial sensor markets

2004-2008 market analysis

© 2005• 2WISM May 2005 Copyrights © Yole Développement SARL. All rights reserved.

Content

• Methodology (4)

• Overview of the MEMS market and importance of inertial sensor business (8)

• Overview of Inertial Market (38)

• Accelerometer Market: Applications and Markets forecast (40)

– Automotive market• Airbag• Active Suspension• ESP• EPB• Safety Relating Testing

– Medical applications• Heart Pacemaker

– Seismic applications– Consumer Market

• HDD• Human Computer Interface• Mobile Phones• Projection systems• Toys and pedometer

• Gyroscope Market: Applications and Markets forecast (95)

– Automotive market

• Rollover

• Navigation

• ESP

– Consumer Market

• Camcorder stabilization

• Mobile Phone

– Defense Market• Overview

• Defense market for inertial MEMS (134)

• Synthesis and conclusion (144)

• Appendix (147)

– Complete profiles and analysis of the top 20 inertial sensor manufacturers.

– Presentation of different sensing principle for gyroscopes and acceleration sensors

– Presentation of manufacturing technologies


Foreword

• MEMS has different definitions and content in different countries worldwide:– Microtechnique in Switzerland, Microsystem technologies in Germany, Mems in USA, Micromachine in Japan, ink jet head business in HP …

– Is Mems an industry or a part of the semiconductor world or a part of the micromechanical world or a part of sensor world ?

• Our goal at YOLE is to make more visible the MEMS/MST …business and provide accurate data on MEMS markets, business and technology trends, industrial strategies …

• MEMS is an industry with its own rules, technologies, roadmaps, equipment and materials manufacturers …

• This second edition of the « World Inertial Sensors Market » will certainly help to clarify what inertial MEMS are and what are the future of this industry.


Definition, limitations & methodology

• MEMS (Micro ElectroMechanical Systems):– We consider as MEMS, devices including moving parts in µm to mm range and using photolithography process for manufacturing.

• Limitations– We consider only die-level components (first level packaging), not the full system including MEMS devices.

– Volumes and prices are for a packaged MEMS (including or not electronics according to the component technology)

• Methodology– The information has been gathered directly at :

• System manufacturer : car equipment manufacturers, IT equipment and medical devices manufacturers …

• Devices manufacturers : key Mems inertial sensor manufacturers worldwide

– Face to face meetings have been set-up with key persons in these companies in Europe, north America and Asia

– The gathering of information has been performed from second half of 2003 to Q1 2005.


Vocabulary: component, sensor, transducer

Silicon sensing elementAsic

(hybrid approach)

Packaging operations

Integration Wire bonding of the die to a metal can

First levelpackaged devices =Component

Chip+ASIC cointegrated(monolithic)

SMI (USA) pressure sensor

All our analysis are based on components (i.e. first level packaged device)


Vocabulary: component, sensor, transducer (2)

Second and third level packaging

with electronic without electronic

DIP

TO-8

Surface mount package

SIP

With special Housing

Or with long distance amplification = Transmitter

Transducers


World Mems markets

– Overview of MEMS markets

– Organization of the MEMS industry

– Analysis of the industrial food chain


MEMS industrial food chain

Front-end Equipments

Front-end Equipments

Materials & chemicals

Materials & chemicals

MEMS componentsMEMS components

MEMS systemsMEMS systems

1.03 B$ �� 1.5 B$

240 M$ �� 400 M$

3.35 B$ �� 5.36 B$

24 B$ �� 38.1 B$

2002 �� 2005

Mat & chem: 561 M$Wafers: 467 M$

Mat & chem: 819 M$Wafers: 682 M$


Si wafers consumption for components manufacturing

20042005

20062007

2008

8"

4"

6"0

1 000 000

2 000 000

3 000 000

4 000 000

5 000 000

6 000 000

7 000 000

8 000 000

Main MEMS applications Si wafers consumption for

components production in units

+33 %

-1 %

+33 %


MEMS Inertial Market Overview


World MEMS Inertial Market 2003-2007 (M$US - Yole Developpement est.)

2004 20052006

20072008

0

100

200

300

400

500

600

700

M$

World MEMS Inertial Market 2004-2008

(M$US, Yole Dev. Estimation)

Accelerometers

Gyroscopes


Accelerometers:Automotive market


Focus on automotive markets (4)

• Key issue: What will be the future of automotive sensors?

Application dedicated sensors vs. Networked sensors for safety applications

• Sensors dedicated to one application:– Today configuration, maximises volumes of components in a car

– This hypothesis was the basis of our component volume calculation

• Networked sensors:– All sensors of the vehicle are linked together and provide motion data to several safety systems

• Sensors can be distributed in a star system, in a ring system, or centralised in a IMU (Inertial Measurement Unit)

• Implemented in BMW ’s Series 7 model: 12 sensors networked using ByteFlightprotocol controls car’s airbag systems

• The new Opel Astra, a compact class car, networked all the safety electronics within a central electronic unit throuht CAN data bus (ZF Sachs OEM)

– Potential evolution which reduces number of sensors integrated per car:• use of roll over gyro data for active suspension systems for example.


Automotive Market:Airbag sensor overview

• Definition:– Safety device, consisting in impact sensors, computer, a detonation device and air bag, that protects the driver and the passenger in a crash by inflating a cushion hidden in the steering wheel and dashboard

• Application specifications :• +/- 50g, auto-calibration and self-test, integration of multi-axis sensing for front shock detection …

• Integration from 1 to 5 airbag sensors per car, for several axis of detection

• Price of 1 axis sensor : <2$

• Price of 3 axis sensor : 5 to 6 $

Airbag system simulation during crash tests

Air bag


Automotive Market:Airbag sensor overview

• Today pricing and trends :

• Market shares 2004:• Bosch : 35%, 37 Munits

• ADI : 27%, 26 Munits

• Freescale : 15%, 15 Munits

• Delphi : 9%, 10 Munits

• Denso : 8%, 9 Munits

• Melexis: ?% ?

• Business trends :• More sensors in order to have focused activation of airbags

• Integration of gyroscopes in the airbag unit of some high end cars

Million

unitsASP ($)

Marke

t

(M$)

Million

unitsASP ($)

Marke

t

(M$)

Million

unitsASP ($)

Marke

t

(M$)

Million

unitsASP ($)

Marke

t

(M$)

Million

unitsASP ($)

Marke

t

(M$)Airbag sensor (per axis) 112 $1,7 190,4 120 $1,6 192,0 126 $1,5 189,0 130 $1,4 182,0 132 $1,4 184,8

2007 20082004 2005 2006


Automotive Market:Airbag sensor food chain

Bosch

Denso

ADI

Freescale

Delphi

Melexis

Bosch

Denso

Delphi

Valeo

TRW

Autoliv

Key SafetySystems

Takata

SiememsVDO

…

MercedesBMWFord RenaultPSA…

Devicemanufacturer OEM End User


Automotive Market: AirbagWhat happened in 2004 ?

• Strong growth of Freescale with aggressive pricing

• Two major trends :• Integration of several axis of detection in one packaged sensor

• Strong push of the equipment manufacturers in order to have lesspoint of measure (ie more integrated sensor with multi-axis properties)


Accelerometers:Synthesis and Conclusion


Conclusion on acceleration sensor markets

• Each market is growing at a significant rate, due to several reasons:• Increase of each individual application due to the introduction of devices in new cars, toys, medical devices, consumer products, …

• Development of new applications with the availability of low cost devices (acceleration sensor for games) and reliable high end products

• The defense market is now growing, with the availability of the devices with good performance and adapted price (See defense chapter)$

• The competition between companies is increasing, especially in the automotive fields

• New entrants are possible, mainly coming from the semiconductor world (ie agreement between Memsic and TI to enter the automotive market)

• Each company is now looking for new growth areas, in order to absorb the ownership fab costs and become more profitable.


Analysis of major players strategies

• Different types of players are emerging :– The acceleration sensor manufacturers, with off the shelf products :

• Motorola, Analog Devices, Colibrys, VTI Technologies, Sensonor, Kionix, Memsic …

• It could be high end (Colibrys, Tronic’s,…) and low end products

• The acceleration sensor for automotive applications is becoming rapidly a commodity product (airbag sensor for example)

– The system manufacturers with internal capacity :• Bosch, Delphi, Denso …

• The added value and the margin are made on the sub-system

– The contract manufacturers :• Tronic’s Microsystems, Colibrys …

• The challenge is to break the Mems law.

• New entrants are on the way to be present, in order to take part to this growing business :

• Entry barriers are medium (technology well mastered by equipmentmanufacturers and partially available)

• Markets opportunities are real.


Profile of major inertial sensor manufacturers


Profile of major inertial sensor manufacturers

• Acceleration sensor manufacturer :• Analog Devices

• Austriamicrosystems AG

• BEI Technologies, Inc

• Colibrys SA

• DALSA Semiconductor

• Delphi Delco Electronics Systems

• Denso

• Freescale Semiconductor

• GE - Novasensor

• Hitachi Metals

• HL Planartechnik GmbH

• Honeywell

• Innovative Micro Technology (IMT)

• Kionix Inc.

• Melco (Mitsubishi Electric Corporation)

• Memsic, Inc.• Murata• NeoStones Micro Fabrication Corp.

• Oki Electric Industry Co., Ltd.• Omron Corporation• Robert Bosch GmbH• Samsung• SensoNor ASA• Silicon Sensing Systems Ltd• Silicon Microstructures Inc. (SMI)

• STMicroelectronics• TRONIC’S Microsystems SA• VTI Technologies Oy• Wacoh• X-FAB Semiconductor Foundries AG


Profile of major inertial sensor manufacturers (2)

• Gyroscope sensor manufacturer :• Analog Devices• BEI Technologies, Inc• DALSA Semiconductor• Denso• Honeywell• Innovative Micro Technology (IMT) • Kionix Inc.• Matsushita Electric Industrial Co. Ltd• Motorola Automotive• Murata• NeoStones Micro Fabrication Corp.• Robert Bosch GmbH• SensoNor ASA• Silicon Sensing Systems Ltd• STMicroelectronics• TRONIC’S Microsystems SA (gyrometers)• Walsin Lihwa Corporation


APPENDIX


Case study: cost breakdown of an accelerometer

Typical costs breakdown for airbag accelerometer manufacturing

Final Assembly

33%

Packaging

15%

Die Level

30%

Susbtrate/ASIC

Level

22%

Airbag accelerometer


Sensing principles of available devices

• Gyroscope

• Acceleration sensor

• Spherical 3 axis

• Squid supraconductors

• Electron beams

• Radiative pressure

• Hall effect

• SAW

� Pendular closed loop

� Vibrating

� Thermal

� Gradiometer

� Tunnel effect

� AOM

� Seismic mass

• Tunnel effect

• Eddy current

• Plasma

� Optical fiber gyro

� RLG

� Vibrating (star, Quapason, ring,)

�GSE

� GOM

� Super quantum fluid

� Coriolis strength measurement


Acceleration sensing principles

• Most of the Mems acceleration sensor are using following principles :

– Comb drive measurement (capacitive detection) :

• AD, STM, Delphi, Denso, Motorola, Tronic’s,Matsushita ….

– Detection of a cantilever movement (piezoelectric detection) :

• Sensonor

– Vibrating sensor (frequency detection):

• Sensonor, Allied Signal

– Thermal sensor (thermal detection):

• MemsicMemsic

Bosch


Accelerometers Companies processes (1/6)

Yes (20 to 60 µm)In dev. for MelexisIn introduction. Co-developed with LETI. Prod. may start end of

2005 on 6” SOIUse of SOI

Applications: Pacemaker & seismology2004 revenues ~ €4.5M

2004 revenues ~ €3M10 to 14 Steps

Yield~80%

Cost: Material & Process: 50%; Packaging: 15%; Test: 35%

Miscellaneous

Surface Deep RIE (Alcatel)

Surface MM

Deep RIE (2x STS)

Surface MMMicromachining technology

WLP Si

~70,000 / year

150 to 700 comp/W

4’’

Tronic’s

5 mm²Components/wafer

Glass (SensorPrep) but Si packaging offer has just started

Silicon using glass frit bondingPackaging material

3500 wafers Si for 2003

For P, accelero & gyro

18 millions in 2003 (50% for automotive)Estimated

production

6’’4” & 6’’Wafers type

X-Fab(Mainly for Temic or

Melexis)

Freescale(Tohoku Fab.)

World MEMS inertial sensor markets · MEMS industrial food chain Front-end Equipments Materials &...

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