WLP Probing Technology Opportunity and Challenge€¦ · WLP(Wafer Level Packages) Clark Liu 6...
Transcript of WLP Probing Technology Opportunity and Challenge€¦ · WLP(Wafer Level Packages) Clark Liu 6...
WLP Probing Technology Opportunity and Challenge
Clark Liu
PTI Group Overview Founded : May/15/97’
Capital : USD 246 Millions
Total Assets : USD 2.2B
Employees : 11,100 (Greatek included)
Major Services : Chip Probing, Bumping,
Packaging, Final Test & Module Assembly
IPO : 4/3/03’ in Taiwan
PTI HQ
Group Overview- Global Network
Payton in China
Suzhou Plant
15 min drive
BHuKou Industrial Park
Headquarter
Hsinpu Plant
4 hrs by air
ChinaHSIP Plant
Greatek Electronic
30 min
drive
Chung-Li Plant
Customer Success !!
Singapore Plant Southeast Asia
Xi’an Plant
Put more resource for next technology!
4Clark Liu
2012 SWTW ASE_SV 50um Pitch Array 2014 SWTW FFI 80um Pitch CPB
Probing at 2G Wide I/O Bump Pad
5Clark Liu
Source : 2011 IEEE _ Samsung
WLP(Wafer Level Packages)
6Clark Liu
Source : 2013 SEMI _ Yole
Wafer-level-packages have emerged in many different varieties that can be categorized into different advanced packaging technology platforms
Map of WLP manufacturing companies
7Clark Liu
Source : 2015 Yole
7 Companies
27 Companies
7 Companies
WLP Key Connection Technology
8Clark Liu
Wafer Level Package
Bump RDL TSV CPB
From Kid View!
9Clark Liu
Wafer Level Package
Bump like
RDLlike
TSV like
CPB like
Electrical Tests for WLP Connectivity Fault Model
10Clark Liu
Source : 2010 IEEE 3D IC Workshop _TSMC
Fault Model for different test items
11Clark LiuSource : 2010 IEEE 3D IC Workshop _TSMC
Supplier A or C
Supplier B or D
Supplier A
Supplier B
WLP Probing
WoW !
12Clark LiuSource : Taipei 101
13Clark Liu
Opportunity?Challenge?
Technology?
Cost? New Model?
Cooperation?
Source : NTHU
Case1: Tools Short Delivery Cycle Time?
14Clark Liu
DesignType Out Wafer Process Wafer Test
4~10 Weeks
DesignType Out
WLP Process WLP Test
2~3 Weeks
MP card
MP card??
Early Plan??
Eng Card??
Gap
[Ex] WLCSP 256DUT Probe card
15Clark Liu
• Bump Type: WLCSP – a. Diameter: 300um– b. Height: 170um ± 10%.– c. Pitch: 500um– d. TD : 10– f. Total Pin Count 2560 Pins
Delivery Time 8 Weeks
Case2: Process Change for more Chip Probing?
16Clark Liu
Exist Process
Wafer Process
Wafer Test Assembly Finial Test
Process X Wafer Process
Wafer Test(KGD) WLP WLP Test
Process Y Wafer Process WLP WLP Test
(KGD)
Assembly
Assembly
More WLP Test or More Finial Test?
• WLP Test • Finial Test
17Clark Liu
Pictures Source : Mitsubishi
Pitch Limit
Clean/10K Cleanness
Package Base
Fine Pitch
Contact Force
Silicon Baseum mm
Wafer Test or Finial Test Vender @ WLP Testing?
• Wafer Test Vender
• Cycle Time Challenge• Cost Challenge• New Process Challenge
• Finial Test Vender
• Cooperation Model Challenge• Wafer Level Requirement and
Quality
18Clark Liu
Gap
<500 Mhz
<3G Mhz
>3G Mhz
Speed
WLCSP / WLCPB Probe Card
Source : SWTW
Bump Process & WLP Probing Roadmap
20Clark Liu
400um 200um 100um 80um 60um 40um 20um
Mature Production
Production / Pilot Run
R&D
Bum
p Pr
oces
sW
LP
Te
st
Mature Production
Gap
Ideal Probe Force v.s Over Drive @ WLP Probing
21Clark Liu
Probe ForceDepend on
Material
Over Drive SlopeDepend on
Material
Electrical All Pass
Point
Low Force Keep No Damage
Case 3: Probe mark analysis Technology
22Clark Liu
AOI Probe Mark Analysis Challenge
Bump RDL CPBD
iffer
ent
Laye
r
What Expect data from those Probe mark?
23Clark Liu
AOI Probe mark Analysis
User ExpectData
Data Mining:
(1) ProberPerformance(2)Probe cardPerformance
[Keep Under Development]
Chip Design Wafer Process
Case 4: Business or Process Change?
24Clark Liu
Chip Design Wafer Process
WLP Design
WLP Process
WL Test A.P Finial Test
WLP Test
Customer Foundry OSAT
Cost
Tech
Yield
Probe card Vender B
Same Issue but different site?
25Clark Liu
ATE Vender
ProberVender A
Probe card Vender A
Customer
Foundry COSAT C
Recipe
Cont act
Alignment
Foundry B OSAT B
Foundry AOSAT A
CooperationProber
Vender B
Gap
AOI Vender
Clean Vender
Conclusion
26Clark Liu
• Cooperation from Customer to Supplier (Design House /Foundry/OSAT/Vender).
• New opportunity for Wafer/Finial Test I/F vender.
• The Evolution Business Model will start change something.