Wireless Communication LSIz/Modules

C o n n e c t w i t h I o T

Ver.6.0

Wireless Communication LSIs/Modules

01

Devices and equipment all around us are connected in a variety of different ways, and going forward this number is

expected to only increase as the range of networked products continues to grow and a greater emphasis is placed on

convenience, energy savings, and cost effectiveness. Our wireless communication LSIs and modules support the

connected needs of customers in various markets by leveraging CMOS RF circuit, low power consumption, network, and

other proprietary technologies. From the Sub-GHz to the 2.4GHz band, a broad lineup is offered, including modules

optimized to meet application demands.

Ver.6.0

20 years of experience

MODEM

FILTERRF

CMOS RF

Technology

20 years of experience with CMOS RF technology

We have been working on CMOS

RF development since 1998,

releasing a number of products

ranging from RF LSIs to SoC. And

in addition to advancing RF circuit

technologies such as digital

control and correction technology,

we are making efforts to improve

performance and reduce current

consumption utilizing precision

CMOS processes.

01

Low current consumption

Wireless communication LSIs and modules

achieve lower current consumption by adopting

power shutdown cells, low voltage drive

regulators, and multi Vt low power consumption

processes, contributing to lower standby power

and longer battery life in portable wireless devices.

02Low power technologies

PowerCutoffCells

Multi VtLow PowerProcesses

Low VoltageRegulators

Feature Broad lineup in communication distances ranging from mm to km

ROHM offers a wide lineup

optimized for a variety of

applications requirements, from

communication distances of several

mm within close reach to longer

distances as much as a few

kilometers.

03Broad lineup

LPWAN(Low PowerWide Area)

Sub-GHz Bluetooth®

Wi-Fi

13.56MHzWirelessCharger

IEEE802.EIE15.415

Wireless Communication LSIs/Modules

EN300-220(Europe)

FCC(North America)

Q/GDW374.3(China)

02

Applicable LSI: ML7421GD

2 Diversity Applicable LSIs : ML7396xGD, ML7406xGD, ML7345xGD, ML7414GD,

ML7404GD, ML7416N, ML7421GD, ML7436N

Applicable LSIs : ML7396xGD, ML7404GD, ML7416N, ML7421GD, ML7436N

Bluetooth low energy Applicable Modules: MK71351-xxx, MK71251-xx

IEEE802.15.4 Compatible LSI : ML7404GD

Sigfox® Compatible LSIs : ML7414GD, ML7404GD

Applicable LSIs: ML7416N, ML7436N

Step-down DC/DC is built-in to

reduce current flow from the

battery in portable devices such

as wearables. This ensures high

efficiency power consumption,

even if the battery terminal

voltage fluctuates, contributing

to longer battery life.

Built-in buck DC/DC04

Radio Law certified modules enable immediate evaluation and implementation

All ROHM wireless communication LSIs have

already acquired certification under Japan's Radio

Law, making it possible to immediately begin

evaluation and development of wireless

communication. The Bluetooth® modules

MK71351-xx series are FCC, IC, and CE compliant.

09

Prolongs battery life

Po

we

r C

on

su

mp

tio

n (

V)

100 1Battery Level (%)

Constant power consumption - regardless of

battery level

MLxxxx

Conventional

Functions such as 2 diversity and FEC are built-in to

improve wireless communication quality. This contributes

to stabler communication in a variety of areas.

Robust communication05Stabler communication

Conventional

Product

Applicable

Models

Stable RFtransmission even

with obstacles

Supports the latest wireless communication standards

LPWAN wireless product lineup for ultra-long-distance

communication ideal for IoT. We offer models compatible

with IEEE802.15.4k and Sigfox®.

Products compatible with Bluetooth® Low Energy v4.1

optimized for IoT edge nodes are also available.

07The latest

wireless standards

Embedded MCU system

We supply system LSIs that incorporate LAPIS

Semiconductor's RF LSI and MCU in a single package.

Our market-proven RF LSIs feature greater ease-of-use.

08Monolithic

LSIMCU

Low power wireless

system LSI with

built-in MCU

Evaluation Kits

Complete DevelopmentEnvironment

We offer a variety of

evaluation kits, software,

documents, and other

materials that support

customer evaluation and

development of wireless

characteristics.

10

Applicable Modules:

MK71351-xxx, MK71251-xx, BP35A1, BP35C0, BP35C0-J11,

BP35C2, BP3580, BP3591, BP3595, BP3599, BP359B

Radio LawCertified Module

EN300-220 Applicable Models : ML7396DGD, ML7406yGD, ML7344JyGD, ML7345GD,

ML7345DGD, ML7414GD, ML7411GD

FCC Applicable Models : ML7396AGD, ML7411GD

Q/GDW374.3 Applicable Models : ML7344CyGD, ML7345CGD

Complies with wireless communication standards

Our short-range wireless communication LSIs and

modules, manufactured using thorough quality control,

are optimized solutions that satisfy both transmission

and reception characteristics specified by the

EN300-220, FCC and Q/GDW374.3 specifications.

06Broad range of wireless

communication standards

,

Broad range of wireless communication standards

EN300-220(Europe)

EN300-220(Europe)

FCC(North America)

FCC(North America)

Q/GDW374.3(China)

Q/GDW374.3(China)

03

Smart Agri

Anti-disaster

Infra Monitoring

Asset Tracking

CloudWireless communication technologies that support IoTIoT

We offer a broad lineup of low power short-and long-range wireless products

optimized for IoT. This allows users to select the ideal product based on

application needs, from specified low power wireless and Bluetooth® low energy

to LPWAN.

01

Bluetooth® low energy is a 2.4GHz wireless communication standard used all over

the world to communicate over a distance of several meters or less with very low

power consumption. Applications include fitness/medical devices and smart

watches driven by coin batteries, and are expanding to the IoT sector for data

transmission and position detection utilizing beacon technology.

03

LPWAN is a new wireless protocol that allows communication over longer distances

than existing short-range radio. As a result, long-distance communication up to 10km

is enabled with a single device, making it possible to configure wide range networks

using fewer components. Prospects include repeaters that until now were required for

short-range wireless, and adoption is expected for wirelessly collecting and

transmitting data over a wide area with IoT systems.

04

Specified low power radio is characterized by the ability to communicate over

distances of several hundred meters using very low power. Since the Sub-GHz band

being used differs from the 2.4GHz band widely used for wireless LAN, Bluetooth®,

and other protocols, it is less susceptible to interference, and the lower frequency

makes it easy to travel around objects, facilitating communication. However, because

the frequency used will vary by country, it will be necessary to adapt to the standards

at each region. Wi-SUN, which is an international standard utilizing the Sub-GHz band,

is expanding its applicable range to include both indoor and outdoor use.

02

A broad lineup of wireless communication LSIs and modules are offered that utilize a variety of technologies. This ensures compatibility

with a range of applications and markets, from IoT, industrial equipment, and automotive to electronic toys and consumer devices. ROHM

also support customer development through proposals and development tools based on decades of experience.

LineupWireless Communication LSIs/Modules

Wi-Fi

Modules

13.56MHz

Wireless

Charger LSI

Multiband

Wireless ICBluetooth®

LSI/Modules

Ultra-Low-PowerConsumption

High-SpeedCommunicationWireless Charging

Low-Power Consumption Large DiffractionBatteryless

Universal Frequency Bands Long-Distance CommunicationUltra-Long-Distance

Communication

Specified

Low Power

Wireless

LSIs/Modules

LPWAN

(Low Power

Wide Area

Network)

Wireless LSIs

Specified

Low Power

Wireless System

LSI with

Built-in MCU

EnOcean®

Communication

Module

Specified Low Power Wireless

Frequency Band

Communication Distance

Transmission Rate

Market

1.2kbps to300kbps

2.4GHz400 to 960MHz

1Mbps

Approx. 10m

2.4GHz

Bluetooth®

low energy Multiband Wireless IC

72Mbps

Tens of meters

2.4GHz

Wi-Fi(IEEE802.11b/g/n)

212kbps

Few mm

13.56MHz

13.56MHzWirelessCharger (Narrow Area)

more than9,600bps

Hundredsof meters

426/429MHz

LPWAN(Low PowerWide AreaNetwork)

100 to thousands

of bps

Tens of kilometers

900MHz

The frequency band will differ based on country

50kbpsor more

Hundredsof meters

Hundredsof meters

900MHz

(Wide Area)

125kbps

Approx. 100m

868.3/928.35MHz

EnOcean®

Worldwide

04

CloudCloudCloudWi-Fi

Modules13.56MHz Wireless

Charger LSIEnOcean®

CommunicationModule

Bluetooth® LSI/Modules

Specified Low PowerWireless System

LSI with Built-in MCU

Multiband Wireless IC

Specified Low PowerWireless

LSIs/Modules

LPWAN(Low Power Wide Area Network) Wireless LSIs

Lighting Control

Home Electronics ControlHome Gateway

Illumination Household Appliance

Smartphone Connection

Smartphone Connected

Smart Meters

Smart Meter

Position Detection/Monitoring

Position Sensing

Low power consumption products

that combine a variety of technologies

Advanced Technologies

· RF CMOS Technology

· IEEE802.15.4· IEEE802.15.4d· IEEE802.15.4g· Bluetooth®

ROHM group

WirelessCommunication

Technologiesimprove quality

and performanceTransmission Circuit· S-NWK· Sigfox®

· Orthogonal Modulation Technology· Direct Modulation Technology· High Efficiency Power Amplifier Technology· 13.56MHz Wireless Charger

Frequency Synthesizer Circuit Security Technologies· Fractional-N PLL Technology· Phase Noise Reduction Technology

· AES 32bit/64bit/128bit· CCM· SHA-1/SHA-224/SHA-256

PHY Processing· Coding/Decoding Technology· Frame Processing Technology· FEC Technology

Network Technology

Device Technologies

· OFDM· DSSS· QPSK/O-QPSK· BPSK· FSK/GFSK· MSK/GMSK· ASK

Modulation/Demodulation

· Low IF Technology· Zero IF Technology· Digital IF Technology· Double Super Heterodyne Technology· 13.56MHz Wireless Power Reception

Receiver Circuit

MAC Processing

05

P.09

ML7345xGD

ML7386xGD

ML7396xGD

ML7406yGD

ML7344xyGD

ML7414GD

L I N E U P

P.07

MK71511

MK71251-01

MK71251-02A

MK71521

MK71351-NNN

P.11

ML7421GD

2M

2M5.0

5.1

750~960

750~960

160~510

160~960

315~960

400~960

426

Communication Distance vs Data Transmission Speed

P.19 to 20

Ap

plic

atio

n D

ata

Tra

nsm

issio

n S

peed

Communication Distance

P.07 to 08

P.9 to 10

P.21 to 22

P.23 to 24

1Mbps

10Mbps

100kbps

100Mbps

10kbps

1kbps

100bps

Bluetooth®

low energyBluetooth®

low energyBluetooth®

low energy

13.56MHz Wireless ChargingNFC Type3 Tag



900MHz SpecifiedLow Power Wireless900MHz SpecifiedLow Power Wireless

Power MetersPower Meters HEMSHEMS

MK71351-NNNMK71251-01, MK71251-02A

BP3580, BP3591,BP3595, BP3599,

BP359B

400MHz SpecifiedLow Power Wireless400MHz SpecifiedLow Power Wireless

EnOcean®EnOcean®EnOcean®

0.01m 10m1m 100m 1km 10km

P.09 to 10P.15 to 16

P.11 to 12P.15 to 16

ML7421GD,ML7436N

Electrical Devices/Remote ControlElectrical Devices/Remote Control

AV Equipment/Remote ControlAV Equipment/Remote Control

EnOcean® WirelessCommunication

Modules

ML7630,ML7631

2.4GHzIEEE802.15.4

2.4GHzIEEE802.15.4

2.4GHzIEEE802.15.4

Gas AlarmsGas AlarmsP.13 to 14

2.4GHz Short-range Wi-Fi Modules



BridgesBridges

LPWANLow Power Wide

Area NetworkWireless

LSI

LPWANLow Power Wide


LSI

LPWANLow Power Wide


LSI

LPWANLow Power Wide


LSI

ACAC SecurityMonitorsSecurityMonitors

WirelessHeadphones

WirelessHeadphones

Bluetooth® Modules2.4GHz Short-range Wireless

Specified Low Power Wireless LSIsSub-GHz Short-range Wireless

Multiband Wireless LSISub-GHz & 2.4GHz Wireless

ML7416N, ML7396xGD,ML7406yGD,

ML7345xGD,BP35A1, BP35C0,BP35C0-J11,

BP35C2

ML7404GDML7386xGD,ML7344xyGD

PedometerPedometer

30 50 70 90 F

kcalTOTAL

0606

Icon Descriptions

TQFP

FEC

Connection

type

Bluetooth®

low energy

Transmission/

Reception

Product Form

Factor

Compatible

RCR Standard

Data Transmission

Rate cps

Data Transmission

Rate bps

Memory I/F

Encryption

Functions

Built-in Low-Power

General-purpose CPU

Compatible

EU Standards

Compatible

ARIB Standards

Compatible

IEEE Standards

Intermittent

Reception Operation

Integrated

Antenna type

Wi-SUN

Wi-Fi

Sigfox®

Compatible

US Standards

Built-in TCP/IP

Protocol Stack

Security

Compatible

User Application

Memory

Bluetooth® core

specification

Wireless

Frequency Bands

Host I/F

Compatible

Chinese Standards

Support for 2

Diversity Antenna

Operating

Temperature

Package type

Transmission

Output NFC I/F

Internal

Applications

Charging

Powe

P.23

BP35A1

BP35C0

P.17

BP35C2

ML7631

P.19

ML7630

P.13

ML7404GD

BP3580

BP3591

P.21

BP3599

BP359B

BP3595

ML7416N

P.15

ML7436N TQFP

1024KB

256KB

2M

5.0 5.1

M3

M3

315~960

400~960

750~960

750~960

160~510

160~960

315~960

400~960 426

920

920

BP35C0-J11920

920

13.56

13.56

13.56

Bluetooth®

low energy


Power Meters HEMS

EnOcean®

Electrical Devices/Remote Control

AV Equipment/Remote Control

2.4GHzIEEE802.15.4

Gas Alarms


LPWANLow Power Wide


LSI

AC SecurityMonitors

WirelessHeadphones

LPWAN (Low Power Wide Area Network) Wireless LSISub-GHz Long-range Wireless

Specified Low Power Wireless System LSI with Built-in MCUSub-GHz Short-range Wireless

Specified Low Power Wireless ModulesSub-GHz Short-range Wireless

Wi-Fi Modules2.4GHz Short-range Wireless

13.56MHz Wireless Charger Chipset13.56MHz Wireless Charger

EnOcean® Communication ModulesSub-GHz Batteryless Communication

Communication frequencies based on the radio laws of each country are being prepared. Please refer to page 23 for additional information.

Pedometer

LAPIS Semiconductor offers easier-to-use Bluetooth low energy modules (than LSIs).

The entire lineup is Bluetooth SIG End Product qualified, allowing users to easily develop Bluetooth compliant devices by simply

embedding the module without having to undergo the troublesome qualification process.

In addition, the antenna and all peripheral devices required for operation are built in, and radio certification has been acquired not only

in Japan, but in the US (FCC), Canada (SED), and EUY (CE) as well.

07

MK71521

Modules

MK71351-NNN

Bluetooth low energy Modules

MK71251-01MK71251-02A

Bluetooth low energy Modules

www.lapis-semi.com

MK71511

MK71251-01

MK71251-02A

MK71351-NNN

LINEUP

Built-in inductor for low-current operationEnables low current

operation without requiring

an external inductor for the

DC/DC converter.

Bluetooth SIG End Product QualifiedIntegrating the module eliminates

the need to obtain Bluetooth

qualification for user devices.

(Product declaration/registration

required)

Antenna

DC/DCLC Filter

X’tal26MHz

X’tal32.768kHz

GPIO

ADC

PWM

I2C

SPI

UART

Bluetoothlow energyController

Bluetoothlow energy

HOST Stack

2.4GHzRF Block

FlashROMRAM

07 www.la

MK71351

5.0

5.12M

2M

2.4GHz Short-range Wireless

Bluetooth® Modules

Ultra-Low-Power

Ultra-Low-Power

Ultra-Low-Power

Ultra-Low-Power

Serial Communication Applications

Please refer to page 6 for icon descriptions.

Part No.CommunicationFrequencyTransmission

SpeedHost I/F EncryptionAntennaCompliant and

Compatible StandardsOperating

Temp.Type RoleInternal

Applications

Radio certification enables immediate useCertified under radio laws in Japan,

the US, Canada, and the EU.

Bluetooth Modules Function/Block Diagram

End Product qualification facilitates commercialization/ radio law compliant

MK71351 Developer Kit (MK71351-DVK-01)

Radio certification allows for immediate evaluation and implementation

Significantly lower current consumption vs conventional productsPOINT 01

LAPIS Semiconductor’s Bluetooth low energy modules

provide low current consumption that extends battery life

while enabling the use of smaller batteries.

For example, the MK71351-NNN achieves low current

consumption (approx. 3mA) during sending/receiving

operation, making it ideal for smartphone peripheral and

beacon devices that operate on compact batteries (i.e. coin).

Ultra-low power consumption prolongs battery life

POINT 03

LAPIS Semiconductor’s Bluetooth low energy modules are

already Bluetooth SIG End Product qualified.

Embedding the module enables the development of

products without the need to undergo the Bluetooth

qualification process. (Registration required)

The modules also comply with radio laws in Japan, the US,

Canada, and the EU.

Bluetooth compliance

1.7 to 3.6MK71521 9.7×13.96×2.1

POINT 02

LAPIS Semiconductor’s Bluetooth low energy module for

serial communication applications supports proprietary

connectivity testing with commercially available

smartphones and tablets. This allows customers to verify

connectivity in advance to ensure worry-free use and

proceed with commercialization.

Conducting own connectivity tests

08

1.7 to 3.6MK71511 9.7×13.96×2.1

2.0 to 3.6MK71251-01 8.0×11.0×2.0

2.0 to 3.6

Ver.5.0

Ver.5.1

Ver.4.1

Ver.4.1

Pattern

Pattern

Pattern

Pattern

Master/Slave

Master/Slave

Master/Slave

Slave

Blank

Blank

—

Serialcommunication

MK71251-02A 8.0×11.0×2.0

–40 to +85

–40 to +85

–20 to +75

–20 to +75

Bluetooth low energyApplicable Models




www.lapis-semi.com

This is the development kit for the MK71351. An application

for serial communication is written into the module that makes

it possible to immediately carry out communication evaluation

by connecting to a PC. Communication evaluation of peer

devices can be performed with the smartphone app BLE

TOOL or utilizing two MK71351 development kits.

This kit is designed to evaluate the beacon sample software

for the MK71351. The sample software leverages low power

beacon operation utilizing sensors with the low power

characteristics of the MK71351 to enable location detection of

people and things* for up to 3 years on a single coin battery

(CR2032).

Applicable Models: MK71351-NNN

Applicable Models: MK71351-NNN, MK71251-02A

2.0 to 3.6 Ver.4.2 PatternMaster/Slave BlankMK71351-NNN 9.7×11.95×2.0–40 to +85


Applicable Models: MK71351-NNN

Applicable Models: All models

POINT 04

Various tools for evaluating and developing applications

using LAPIS Semiconductor’s Bluetooth low energy

modules are available.

Comprehensive user development support is also offered,

such as the “MK71351 Development Kit” that enable

immediate evaluation by connecting a PC, the “MK71351

Beacon Evaluation Kit” for evaluating the beacon software,

the “BLE Tool” smartphone application that makes it easy

to evaluate and develop communication device, the “BLE

Tool for BCS” application for carrying out updating and

reading of control parameters for the beacon evaluation kit

using a smartphone, and the SDK (Software Development

Kit) that includes sample software.

Supporting evaluation and development with a variety of tools

OK!

Android™

iOS

MK71251

8(mA)

7

6

5

4

3

2

1

0

MK71351

Transmission: 2.9mAReception: 3.0mA

Transmittion mode

Reception mode

*Transmits accelerator and voltage values at one-second intervals. Actual operating time: 6hrs/day.

MK71351 Beacon Evaluation Kit (MK71351-BCN-EVK-01)

Dimensions(mm)

Supply Voltage(V)

Part No.

Specifications

Bluetoothcore spec.

IntegratedAntenna type

RoleInternal

Applications

OperatingTemperature

(˚C)Functions

NorthAmerica

(FCC/IC)

Europe(CE)

Japan(TELEC)

Instantly begin broadcasting and

evaluation development

09

Specified Low Power Wireless LSIs Function/Block Diagram

LNA

PA

OscillationCircuit

Crystal Oscillatoror

TCXO

PARegulator

Fractional-NPLL

DemodulatorIFMixer

TIMER Data ComparatorAntenna

Reception Block

Transmission Block

Received Data

Transmission Data

Data Clock

Synchronous Serial I/F

SPI I/F

Logic

Register

Support for 2 diversity ensures stable receptionSwitching to the antenna with a stronger

signal ensures more stable reception.

Applicable Model: ML7396xGD, ML7406yGD,

ML7345GD, ML7345DGD,

ML7414GD

Direct modulation method reduces transmission currentAchieves a simple configuration for

2-value FSK (MSK) modulation (by direct

PLL modulation) to reduce current.

Regulator for PA ensures stable transmission powerThe built-in regulator for PA delivers

stable transmission power without

being affected by voltage fluctuations.

Built-in variable band filter achieves optimum reception sensitivityOptimum reception sensitivity can be achieved by

switching the IF frequency and reception filter band

based on the data rate.

Applicable Model: ML7396xGD, ML7406yGD, ML7345xGD

Low system power consumption functionAutonomous intermittent operation is performed,

allowing the MCU to sleep until data is received.

Applicable Model: ML7406yGD, ML7344xyGD,

ML7345xGD, ML7414GD

Register control allows for detailed settingsEnabling direct control of the registers

makes it possible to fine-tune settings

(i.e. frequency expansion) based on

system characteristics.

Applicable Model: ML7386xGD, ML7396xGD,

ML7406yGD, ML7344xyGD,

ML7345xGD

Supports direct TCXO inputLevel conversion circuitry is not required even when

TCXO (Temperature Compensated Oscillator) is used.

Applicable Model: ML7386xGD, ML7396xGD, ML7406TGD,

ML7344xTGD, ML7345xGD

Dedicated transmission LSIThe transmission block

was configured into an

LSI.

Applicable Model: ML7386xGD

RSSI DetectionBlock

HostMCU

426MHz Transmission type (10mW)

426MHz Transmission type (10mW/1mW)

868MHz Transceiver type for Europe

868/920MHz Transceiver type

470MHz Transceiver type for China

P-WQFN28-0404-0.40

426/429/433MHz Transceiver type

P-WQFN32-0505-0.50

P-WQFN40-0606-0.50

ML7344JyGD

ML7344CyGD

ML7406yGD

ML7396EGD

ML7386BGD

ML7386GD

Co. AWireless LSI

Co. BWireless LSI

Co. CWireless LSILAPIS

SemiconductorWireless LSI

920MHz Transceiver type for Japan

ML7396DGD

www.lapis-semi.com

470MHz Transceiver type for China

ML7345CGD

315 to 960MHz Transceiver type

ML7414GD

160 to 960MHz Transceiver type

ML7345GD315 to 960MHz Transceiver type

ML7345DGD

750~960

470~510

470~510

750~900

900~960

160~510

160~960

315~960

315~960

426

426

Top Bottom

Top Bottom

Top Bottom

Part No. OthersOperating

Temp.Package

type

MaxTransmission

Speed

MinTransmission

SpeedCommunication Host I/FFrequency

LINEUPCompliant and

Compatible StandardsType Package Code

70% of actual size shown.Please refer to page 6 for icon descriptions.* Optional

**

**

**

**

**

**

**

**


LAPIS Semiconductor Sub-GHz specified low power wireless LSIs have been adopted in a variety of applications, including

telemeters, fire alarms, home security, and industrial remote control. And the broad lineup supports adoption in smart meters which

have become increasingly popular in recent years. Each LSI undergoes thorough quality control and allow customers to develop

products that meet all laws and regulations for transmission and reception.

POINT 01

In addition to basic transmission/reception functions,

support for IEEE802.15.4d and IEEE802.15.4g packet

transmission/reception along with whitening and CRC

attachment functions are provided. Interconnectivity is

also enabled using standard protocols.

Standards compliance (IEEE)supports interconnectivity

Applicable Model: ML7396xGD, ML7406yGD, ML7345xGD

Configure systems using products from other companies

Co. A Meter

Co. B Meter

Co. C MeterPOS System

8

F1

.

F2

F3

Co. AWireless LSI

Co. AWireless LSI

Co. BWireless LSI

Co. BWireless LSI

Co. CWireless LSI

Co. CWireless LSILAPIS

SemiconductorWireless LSI

LAPISSemiconductor

Wireless LSI

POINT 02

When radio waves are transmitted, the frequency waves will

continue to spread.

However, due to reflection and other phenomena, areas with

predominately weaker signals may not be always be constant,

since in actual space both weak and strong signals exist.

2 diversity is a technology that utilizes 2 antennas to capture bit

synchronization signals at the beginning of the transmission frame,

then selects the antenna receiving the stronger signal to achieve

stable reception.

2 diversity compatibility ensures stable reception

Applicable Model: ML7396xGD, ML7406yGD, ML7345GD, ML7345DGD, ML7414GD

2 diversity operation captures stronger signals

Transmitter Weak Signal

Strong Signal

A

B

LSI

RSSIDetection

Block

Automatically selects Antenna B

receivingthe stronger signal

POINT 03

A variety of devices that utilize the same frequency as

specified low power systems exist. To distinguish between

data intended for the target device or other equipment,

a special system-level data string is placed at the beginning

of the data packet. Conventional specified low-power

products typically only include a wireless block and function

for outputting demodulated data, so an external MCU is

needed to perform data discrimination. Unfortunately, this

requires that the MCU continually operate when receiving

data. In contrast, with autonomous operation a built-in timer

enables intermittent receiving operation and a comparator is

utilized to detect special data patterns, allowing the MCU to

operate only when relevant data is received. This reduces

operating time vs conventional solutions, even with the same

system configuration.

Address filter reduces device power consumption

Applicable Model: ML7396xGD, ML7406yGD, ML7344xyGD, ML7345xGD, ML7414GD

Built-in address filter function minimizes MCU load, reducing power consumption

Conventional LAPIS Semiconductor

MCU

Cu

rren

t C

on

su

mp

tio

n

RF LSI

ReceptionData

MCU continuously operates while

wireless signals are received

The MCU operates only when

relevant data is received

Signal Discrimination

MCU

RF LSI

MCUData Comparator

RF LSI

Current

Host CPU

Current

Received data intended

for other devices


for this device

Sleep Current

Data Discrimination Period

Reduces total system current consumptionReceived data intended

for this deviceReceived data intended

for other devices

Unnecessary

No MCU LoadMCU Load

Interrupt Signal

ReceptionData

Is this data intendedfor this device?

Read datahas arrived

10www.lapis-semi.com

ML7396DGD —FCC part15, ARIB STD-T108,

IEEE802.15.4d/g, Wi-SUN–40 to +85 P-WQFN40-0606-0.501.8 to 3.6 915/920

ML7396EGD —ETSI EN300-220, IEEE802.15.4g –40 to +85 P-WQFN40-0606-0.501.8 to 3.6 868

ML7386BGD —ARIB STD-T67, RCR STD-30 –25 to +85 P-WQFN28-0404-0.401.8 to 3.6 426

ML7386GD —ARIB STD-T67, RCR STD-30 –25 to +85 P-WQFN28-0404-0.401.8 to 3.6 426

ML7406yGD ETSI EN300-220, EN13757-4:2011, IEEE802.15.4g, Wi-SUN

–40 to +85 P-WQFN32-0505-0.501.8 to 3.6 868

ML7344CyGD Q/GDW374.3 –40 to +85 P-WQFN32-0505-0.503.3 to 3.6(100mW)

470

ML7345GD —ARIB STD-T67, ARIB STD-T108, RCR STD-30

ETSI EN300-220, EN13757-4:2013, IEEE802.15.4d/g–40 to +85 P-WQFN32-0505-0.501.8 to 3.6

169/426/429/433/868/915/920

ML7344JyGD ARIB STD-T67, RCR STD-30 –40 to +85 P-WQFN32-0505-0.501.8 to 3.6 426/429/433

ML7345CGD —Q/GDW374.3 –40 to +85 P-WQFN32-0505-0.503.3 to 3.6(100mW)

470

ML7414GD —ARIB STD-T67, ARIB STD-T108, RCR STD-30

ETSI EN300-220, EN13757-4:2013, Sigfox® (Rev 2.E)IEEE802.15.4d/g

–40 to +85 P-WQFN32-0505-0.501.8 to 3.6 315 to 960

ML7345DGD ARIB STD-T67, ARIB STD-T108, RCR STD-30ETSI EN300-220, EN13757-4:2013, IEEE802.15.4d/g

–40 to +85 P-WQFN32-0505-0.501.8 to 3.6426/429/433/868/915/920

—

Specifications

Supported Standards Package CodePart No.Operating

Temperature(˚C)

Supply Voltage(V)

Supported Frequencies(MHz)

Clock Input

y=(C)rystal inputy=(S)PXO direct inputy=(T)CXO direct input



*

*

*

*

*

*

*

*

11 www.lapis-semi.com

LINEUP

400-960MHz/2.4GHz Transceiver type

ML7421GDP-WQFN36-

0606-0.50

POINT 01

Compatible with both the 315 to 960MHzsub-GHz and 2.4GHz ISM bands

915MHz

915MHz

868MHz

868MHz

868MHz

920MHz

920MHz

2.4GHz???


LAPIS Semiconductor’s multiband wireless LSI enables communication using the ISM band at 2.4GHz as well as the Sub-GHz band

within the range of 169MH to 920MHz, supporting product development in areas where the Sub-GHz band is unregulated. In addition to

the expansion of smart meters, smart cities, smart homes, and smart factories in Japan, EU, the US, and China, regional deployment

strategies are progressing in emerging areas such as Southeast Asia.

Multiband Wireless LSI Function/Block Diagram

PASub-GHz

DemodulatorIF

LNASub-GHz

Mixer

TIMERDC/DC Converter Data Comparator

Crystal Oscillator

or

TCXO

Antenna

Reception Block

Transmission Block

Received Data

Transmission Data

Data Clock


SPI I/F

Logic

Register



Regulator for PA ensures stable transmission powerThe built-in regulator for PA delivers stable transmission

power without being affected by voltage fluctuations.




system characteristics.

Supports direct TCXO inputLevel conversion circuitry is not required even when

TCXO (Temperature Compensated Oscillator) is used.

Built-in RF front end compatible with the 400 to

960MHz and 2.4GHz frequencies enables

support not only for the sub-GHz band, but the

mainstream 2.4GHz band as well.

Multimode-compatible RF front end

Low system power consumption functionAutonomous intermittent operation is

performed, allowing the MCU to sleep until

data is received.

RSSIDetection

Block

HostMCU

Built-in variable band filter achieves optimum reception sensitivityOptimum reception sensitivity can be achieved by

switching the IF frequency and reception filter band

based on the data rate.

Fractional-NPLL

OscillationCircuit

Antenna

LNA2.4GHz

PA2.4GHz

Mixer

Command instructions simplify controlA series of register setting are allocated for

command, facilitating control.

PARegulator

400~960

400~960

Part No.Communication OthersCompliant and

Compatible StandardsFrequencyType Host I/F

PackageCode

OperatingTemp.

Packagetype

MinTransmission

Speed

MaxTransmission

Speed

Multiband Wireless Provides Worldwide Compatibility

When expanding products worldwide, only the Sub-GHz

band from 400 to 960MHz cannot be marketed in

unregulated areas such as Southeast Asia.

Therefore, it is necessary to market 2.4GHz wireless, which

is one of the ISM bands, early on in Sub-GHz unregulated

regions. As a result, LAPIS Semiconductor’s multiband

wireless LSI compatible with both the Sub-GHz and 2.4GHz

bands supports product development worldwide.

Please refer to page 6 for icon descriptions. 60% of actual size shown.

Top Bottom


Specifications

Supported StandardsSupply Voltage

(V)Package CodePart No.


(˚C)


POINT 02

When radio waves are emitted, the frequency waves will

continue to spread. However, due to reflection and other

phenomena, areas with predominately weaker signals may

not be always be constant, since in actual space both

weak and strong signals exist. 2 diversity is a technology

that utilizes 2 antennas to capture bit synchronization

signals at the beginning of the transmission frame, then

selects the antenna receiving the stronger signal to

achieve stable reception.

2 diversity compatibility ensures stable reception 2 diversity operation captures stronger signals

Weak Signal

Strong Signal

A

B

LSITransmitter

RSSIDetection

Block

Automatically selects Antenna B

receivingthe stronger signal

POINT 03

A variety of devices that utilize the same frequency as

specified low power systems exist. To distinguish between

data intended for the target device or other equipment,

a special system-level data string is placed at the

beginning of the data packet. Conventional specified

low-power products typically only include a wireless block

and function for outputting demodulated data, so an

external MCU is needed to perform data discrimination.

Unfortunately, this requires that the MCU continually

operate when receiving data. In contrast, with autonomous

operation a built-in timer enables intermittent receiving

operation and a comparator is utilized to detect special

data patterns, allowing the MCU to operate only when

relevant data is received. This reduces operating time vs

conventional solutions, even with the same system

configuration.

Address filter reduces device power consumption Built-in address filter function minimizes MCU load, reducing power consumption

POINT 04Prolongs battery life

Integrating a buck DC/DC converter as a power supply

makes it possible to achieve lower operating current.

When the external supply voltage is higher than the

operating voltage due to energy conversion of the internal

DC/DC converter when driven by an external constant

voltage source, the current extracted from the external

supply can be significantly reduced. When the power

supply is a battery, current supplied from the battery can

be reduced when the battery voltage is high, prolonging

battery life.

Built-in buck DC/DC converter reduces current consumption

RF

RFLonger

battery life

Smaller current

Same current

Conventional LAPIS Semiconductor

MCU

Cu

rren

t C

on

su

mp

tio

n

RF LSI

ReceptionData

MCU continuously operates while

wireless signals are received

The MCU operates only when

relevant data is received

Signal Discrimination

MCU

RF LSI

MCUData Comparator

RF LSI

Current

Host CPU

Current


for other devices


for this device

Sleep Current

Data Discrimination Period

Reduces total system current consumptionReceived data intended

for this deviceReceived data intended

for other devices

Unnecessary

No MCU LoadMCU Load

Interrupt Signal

ReceptionData

Is this data intendedfor this device?

Read datahas arrived

ML7421GD P-WQFN36-0606-0.50ARIB STD-T66, ARIB STD-T67, ARIB STD-T108,

ETSI EN300-220, FCC part15, IEEE802.15.4d/g, Wireless M-BUS

–40 to +85400 to 960/

24001.8 to 3.6 (DC/DC Unused)

2.1 to 3.6


LAPIS Semiconductor's LPWAN (Low Power Wide Area Network) LSI is compatible with Sigfox's wireless protocol which is expected to see widespread

adoption for IoT wireless communication and has already been adopted in over 50*1 countries around the world, primarily in Europe. It is the first in the world*2 to support

the international IEE802.15.4K standard which is extremely robust against interference from the same system and can cover more terminals under one network, and the

first*2 2+1 mode wireless communication LSI compatible with IEEE802.15.4g, a near-field communication method used as the physical layer for Wi-SUN.*1 Announced by Sigfox® on July 10, 2018 *2 LAPIS Semiconductor October 2017 study

LPWAN (Low Power Wide Area Network) Wireless LSI Function/Block Diagram

LNA

PA

OscillationCircuit

Crystal Oscillator

or

TCXO

PARegulator

Fractional-NPLL

DemodulatorIFMixer

TIMER Data ComparatorAntenna

Reception Block

Transmission Block

Received Data

Transmission Data

Data Clock


SPI I/F

Logic

Register



Direct modulation method reduces transmission currentAchieves a simple configuration for

2-value FSK (MSK) modulation (by

direct PLL modulation) to reduce

current.

Regulator for PA ensures stable transmission powerThe built-in regulator for PA

delivers stable transmission

power without being affected by

voltage fluctuations.




system characteristics.Supports direct TCXO inputLevel conversion circuitry is not required

even when TCXO (Temperature

Compensated Oscillator) is used.

The industry’s first*2 Sub-GHZ BPSK modulator

compatible with Sigfox® and direct spread

modulation compliant with IEEE802.15.4k.

Multimode compatible modulator

Low system power consumption functionAutonomous intermittent operation is performed,

allowing the MCU to sleep until data is received.

RSSI DetectionBlock

HostMCU

Reverse diffusion circuit provides high sensitivityDirect sequence spread spectrum transmission is detected

via IEEE802.15.4k below the environmental noise level,

resulting in accurate demodulation and high sensitivity which

cannot be achieved with conventional FSK communication.

Modulator

No wireless method is perfect. Each one is suitable for different

purposes. Various LPWAN protocols have been proposed, but each

has its advantages and disadvantages, and even the suitability of

the LPWAN method itself may be called into question. In response,

we are offering a proposal.

Base installation is unnecessary, and terminals are cheap. Sigfox®

has been adopted in 50 countries around the world*1, primarily in

Europe. IEEE802.15.4k is strong against interference from the same

system, can accommodate a larger number of terminals in the

same network, and enables easy connection even in urban areas

with wireless congestion. In addition to these 2 LPWAN methods,

our 2+1 mode wireless LSI is the first*2 to support the IEEE802.15.4g

standard, a short-range communication protocol used as the

physical layer for Wi-SUN that provides faster speeds than LPWAN.

This LSI is the ML7404GD.

POINT 01

In addition to IEEE802.15.4k and Sigfox® for LPWAN, support is provided for the near-field IEEE802.15.4g standard

2+1 Mode Advantages

ADSL, etc.

ADSL, etc.

HTTP, etc.

Billing

WW Backbone

Cloud

Sigfox® radiowaves cannotreach

Enables interpolation of area coverage from

IEEE802.15.4x via Sigfox® bridge communication

Coverage for up to 85%*3 of the

population planned by March 2019

*3 Published by Kyocera Communication Systems Co., Ltd. in June 2018


LINEUP

ML7404GD P-WQFN32-

0505-0.50

Part No.Communication OthersCompliant and

Compatible StandardsFrequencyType Host I/F

PackageCode

OperatingTemp.

MaxTransmission Speed

Packagetype

MinTransmission Speed

315-960MHz Transceiver type

55% of actual size shown.Please refer to page 6 for icon descriptions.

Top Bottom

Diffusion

Propagation

Despreading

Interference


Specifications

ML7404GD P-WQFN32-0505-0.50

ARIB STD-T67, ARIB STD-T108, RCR STD-30,ETSI EN300-220, EN13757-4:2013,IEEE802.15.4d/g, IEEE802.15.4k,

Sigfox® Rev 2.E

Supported Standards

1.8 to 3.6

Supply Voltage(V)

Package CodePart No.

−40 to +85


(˚C)

315/426/429/433/470/868/915/920


POINT 04

A Sigfox® Verified reference design is available that

integrates the ML7416S protocol control MCU with the

ML7404GD wireless transceiver.

In addition to the BOM list and circuit/layout diagrams for

this design, various driver software is provided free of

charge.

Sigfox® Verified reference design offered MK74Q0410 Reference Design for Japanese Market

POINT 02

Sigfox® utilizes BPSK modulation, which is not used in

conventional Sub-GHz communication. However,

conventional Sigfox® compatible wireless communication

LSIs do not support BPSK modulation, making it necessary

to create BPSK symbol data using control MCU software.

But this requires that the control MCU be activated each

time wireless communication is performed, resulting in

unnecessary set power consumption. In contrast, the

ML7404GD integrates a hardware-based BPSK modulation

circuit that supports Sigfox®. This eliminates the need for

the control MCU to operate (in the physical layer) during

wireless communication, reducing system power

consumption.

The first*2 hardware-based BPSK modulator for Sigfox®.Contributes to lower set power consumption

Advantages of Hardware-based BPSK Modulation

Block Diagram

NWK

MAC

FSK → BPSK Conversion

Module

RF Transceiver

Control MCU

Required for

every transmission

Block Diagram

Current Consumption Profile Current Consumption Profile

<Competitor's Sigfox®> <LAPIS Semiconductor's Sigfox®>

NWK

MAC

Module

Modulator

RF Transceiver

Control MCU

Only operates

when necessary

POINT 03

The LPWAN is tasked with accommodating a number of

terminals within a cell that other wireless methods cannot

compete with. As a result, disturbance tolerance in the

same system is considered to be an extremely important

factor in LPWAN.

We offer the industry’s first*2 ASSP (Application Specific

Standard Product) -based wireless transceiver compliant

with IEEE802.15.4k, which utilizes the DSSS (Direct

Sequence Spread Spectrum) technique that provides

greater resistance to interference within the same system

and security against interception. As a result, it is strong in

urban areas, and can accommodate more terminals under

one network.

Compatible with the strongest IEEE802.15.4k standard against interfering waves

IEEE802.15.4k Advantages

DiffusionDiffusionDiffusion

PropagationPropagationPropagation

Desired Wave

DespreadingDespreadingDespreading

Disturbance

InterferenceInterferenceInterference

Original Signal

Spread Signal

Received Signal

Restoration Signal

Despreading :

Noise → Original signal

Signal → Noise

Same operation

as despreading

Same operation

as diffusion

Becomes noise

due to diffusion

Advantages of the Same System Disturbance Tolerance

Other Method

Terminal

Terminal

Terminal

Terminal

Terminal

Terminal

Terminal

TerminalTerminal

IEEE802.15.4k

Terminal

Terminal

Terminal

Terminal

Terminal

Terminal

Terminal

TerminalTerminal

Base StationBase Station

RF Operation (Communication)

MCU Operation (Code Conversion)

Communication startCurrent

Operating Time

RF Operation (Communication)

Communication startCurrent

Operating Time

Hardware-based

modulation

eliminates the need

for CPU operation

BottomTop

22.0mm

35.0

mm

CPU power used

for code conversion

www.lapis-semi.com15

920MHz Transceiver (Japan)

ML7416NP-LFBGA81-

1010-1.00

TQFP48-

0707-0.50

DAP

STD GPIO AHB/APBBridge

Cortex®-M3 or M0+CPUUp to

81MHz or 40MHz

MTB

FlashControl

AHBRAM

SWD

SysTick

NVIC

WIC

Single-cycle I/O AHB-lite

CRY PTO(AES, SHA) TRNG Flash

DMASystemControl

DMAC

UART

RAND

ADC TEMP. RC OSC (40MHz)

SPI

SSIS

I2C

WDT

VDET

Res

etC

ont

rol

Reset

Co

ntr

ol

GPIO

FTM

Timer

CLK Timer

RTC

RF-IF

FlashControl

AHBSRAM

Brg

Registers PLLPo

wer

Man

agem

ent

32.768kHz 48MHzor

36MHz

APB

ClockControl

Flash

FlashMemory

RC OSC (32kHz)

X'tal OSC(32.768kHz)

CPUCPUCPU

LINEUP

SubGitz

2.4GHz

(ML7436N)

ML7421or

ML7396D

RF

ML7436NTQFP

1024KB

1024KB

256KBM3

M3

or

or

400~960

750~960

Specified Low Power Wireless System LSI with Built-in MCU

Sub-GHz Short-range Wireless

LAPIS Semiconductor's market-proven Sub-GHz specified low power wireless system LSI integrates a high-performance MCU

optimized for implementing the protocol stack and is designed to meet the needs of the expanding IoT market, including

HEMS/BEMS.

55% of actual size shown.Please refer to page 6 for icon descriptions.

Type Part No.CommunicationOperating

Temp.

MaxTransmission

Speed

MinTransmission

SpeedFrequency

Packagetype

OthersMemoryCPUCore

Top Bottom

PackageCode

Compliant andCompatible Standards

400 to 960MHz&2.4Ghz Transceiver type

Antenna

Specified Low Power Wireless System LSI with Built-in MCU Function/Block Diagram

Built-in high performance low power MCUCortex®-M0+ decreases current by 30%

and improves processing power by 10%

Hardware-based encryption processing engineBuilt-in encryption processing engine and DMA

controller ensure that the main part of the

encryption processing engine is hardware-based,

significantly decreasing software load.

Store all layers up to the HEMS profile in the high capacity flash ROMAll layers up to Echonet Lite for HEMS devices

can be stored in the large capacity internal

1024KB (Max) memory.

Compatible with OTA (Over The Air) ISP2 flash controllers support 512KB × 2

(or 265KB × 2) memory for firmware

updates from external systems.

Support for 2 diversity ensures stable receptionSwitching to the antenna with a stronger signal

ensures more stable reception.

Supports data flashAllows for high reliability data

rewrites.

Multilayer pathEnables program rewriting

without placing a load on the

CPU.

Built-in low-speed oscillation circuit reduces the number of external partsThe integrated 32kHz RC circuit eliminates

the need for an external oscillator.


CPU

POINT 03

During standby when no data is being transmitted/received

ultra-low power consumption is achieved by only supplying

power to the blue areas at left in the Function/Block

Diagram that are necessary for time division. In addition,

it is possible to partially cut off power supply to memory

blocks with large working currents depending on usage.

Built-in power supply isolation functionreduces power consumption during standby

POINT 04

Enables program rewriting without impacting CPU load.

Multilayer Path Application

POINT 02

Security processing is reduced by over 2000×, improving

performance while reducing power consumption.Built-in Hardware

Encryption Engine

AES

DMAC

Integrated security hardware engine

RAM

SPI RF

Encryption Key Length: 128/192/256bit

Authentication/Encryption Modes: AES-CCM/GCM

Basic Encryption Modes: AES-ECD/CBC/CTR/OFB

Note: AES CCM processing for 1 block (16 Bytes)

ML7416Standard MCU(No encryption hardware)

24 cycles

Approx. 48,000 cycles

PowerConsumption

≈CPU Processing

Load

POINT 01

1024KB (512KB) flash ROM can be used as 512KB (256KB)

× 2 banks. This makes it possible to easily configure

systems capable of firmware updates to meet the needs of

the IoT market along with Wi-SUN updates, bug fixes, and

security enhancements.

2 flash ROM banks support OTA (Over The Air) ISP

OR

AC

ML7436N: 512KB x 2 configurable

(ML7416N: 256KB x 2 configurable)

ECONET Lite

TLS / PANA

(TCP/) UDP

iPv6 (/ RPL)

6LoWPAN

IEEE802.15.4/4a

IEEE802.15.4g

ECONET Lite

TLS / PANA

(TCP/) UDP

iPv6 (/ RPL)

6LoWPAN

IEEE802.15.4/4a

IEEE802.15.4g

HGW

Built-in Wi-SUN Stack

ECONET Lite

TLS / PANA

(TCP/) UDP

iPv6 (/ RPL)

6LoWPAN

IEEE802.15.4/4a

IEEE802.15.4g

SupportedFrequencies

(MHz)Supported Standards

SupplyVoltage

(V)Package CodePart No.


(˚C)

CPU CoreOperating Frequency

(MHz)

Specifications

RF(ML7421 or

ML7396D)

Cortex®-M3

or M0 +

RAM

FlashFlash

EncryptionProcessing

EngineAES128

CCM,GCM, etc

DMA

FlashDMA

ML7436N 2.6 to 3.6400 to 960

2400P-TQFP48-0707-0.50

ARIB STD-T108, T67, T66ETSI EN300-220, IEEE802.15.4d/g, Wi-SUN

Wireless M-bus, FCC, Port 15–40 to +85 up to 81

ML7416N 1.8 to 3.6 750 to 960 P-LFBGA81-1010-1.00ARIB STD-T108, IEEE802.15.4d/g, Wi-SUN –40 to +85up to 40


www.rohm.co.jp17

ModulesConnector type

BP35A1

Surface Mount type

BP35C0

BP35C0-J11

USB Dongle type

BP35C2

BP35C0/BP35C0−J11/BP35C2 Function/Block Diagram

ML7416N(RF+MCU)

TRX_SW

LCfilter

UART/USB

USB

LDO

filter

OSC36MHz

OSC32.768kHz

BP35C2

RFSW

HostMCU

Host I/F

BP35C0/BP35C0-J11

UART

UART

BP35A1920MHz Transceiver type for Japan

BP35C0920MHz Transceiver type for Japan

LINEUP

BP35C2920MHz Transceiver type for Japan

BP35C0-J11920MHz Transceiver type for Japan

10mW1mW920

920

920

920

ROHM Sub-GHz specified low power wireless communication modules are capable of transmitting and receiving over longer

distances with very low power, making them ideal for smart meters and smart communities along with the M2M and IoT markets.

Wi-SUN compatible modules that integrate a Wi-SUN communication protocol stack are also offered.

USB I/FBuilt-in USB interface.

Facilitates connection with

other systems.

Applicable Model: BP35C2

Antenna


Pre-adjusted transmission powerThe adjusted transmission power value and MAC

address are loaded before shipment.

ML7416N built-inLAPIS Semiconductor's RFIC is integrated.

Antenna-equipped moduleBuilt-in antenna and pre-adjusted

wireless characteristics facilitate

development.

IEEE802.15.4g compatibilityEnables development of an IEEE802.15.4g-compatible

communication system.

Usage NotesROHM specified low power wireless modules are wireless communication modules. When developing products using this module it is also necessary to develop application

software. Many applications are supported by third parties. Sample code for demonstrating and evaluating our modules can be downloaded from our website.

Also, please refer to our website for technical support.

Part No. AntennaType Frequency OutputTransmission

SpeedCommunication Host I/F

OperatingTemp.


www.rohm.co.jp 18

BP35A1

Applicable Model: BP35A1, BP35C0, BP35C0-J11, BP35C2

UART Wi-SUN/B Route −20 to +80 22.0×33.5×4.0BP35A1

UARTWi-SUN/B Route/

HAN −30 to +85 15.0×19.0×3.0BP35C0

UART Wi-SUN/B Route/ En hanced HAN −30 to +85 15.0×19.0×3.0BP35C0-J11

USBWi-SUN/B Route/

HAN −20 to +50 21.4×49.7×8.5BP35C2

Radio Law certification enables immediate evaluation and implementation

Construction DesignCertification Number

Worry-free Wi-SUN communication as a CTBU

Wi-SUN E-NET Profile Certified

2.7 to 3.6(Single power supply)




POINT 03

Evaluation boards enable immediate use

For Evaluating BP35C0/BP35C0-J11

• RS-232C I/O built-in

• USB-UART conversion

• Compatible with USB BUS power

Specified Low Power BP35C0-T01Module BP35C0-J11-T01

Motherboard BP359C

POINT 01

ROHM wireless communication modules have already

acquired certification under Japan's Radio Law. This,

combined with the built-in antenna and pre-tuned wireless

characteristics, make it possible to immediately begin

evaluation and development by broadcasting without the

need for characteristics adjustment by the customer. Of

course this makes it unnecessary for the customer to

obtain Radio Law certification.

Certification under Japan's RadioLaw enables immediate use

The BP35A1/BP35C0/BP35C0-J11 wireless

communication modules have already obtained Wi-SUN

certification, along with the BP35C2 USB dongle. The

modules are also registered as CTBUs (Certified Test Bed

Units) by the Wi-SUN Alliance, playing the role as reference

units for Wi-SUN communication (Wi-SUN for ECHONET

Lite Profile).

POINT 02

Wi-SUN certified, registered as a CTBU

Specified Low Power Module

BP35A1

Adapter Boards BP35A7A

Motherboard BP359C

For Evaluating BP35A1




ML7396B(LAPIS Semiconductor)

ML7416N(LAPIS Semiconductor)



Specifications

Supply Voltage(V)

Dimensions(mm)

Part No. Host CPU I/FSupportedStandard

Built-in System LSIOperating

Temperature(˚C)

LINEUP

ML7631

ML7630

P-WQFN32-0505-0.50-A63

S-UFLGA34-2.59x2.59-0.4-W


13.56

13.56


LAPIS Semiconductor’s wireless charger chipset combines power transmission and reception LSIs for wireless charging utilizing

the 13.56MHz band. This makes it possible to reduce antenna size, enabling greater miniaturization of the wireless charging block.

13.56MHz Wireless Power Transmission

13.56MHz Wireless Power Reception

Part No.CommunicationType Frequency Host I/FCharging

PowerNFC I/F

OperatingTemp.

Packagetype

Package Code

BottomTop

BottomTop

Please refer to page 6 for icon descriptions. 70% of actual size shown.

13.56MHz Wireless Charger LSI Function/Block Diagram

Built-in Wireless Charging Control ProtocolThe ML7631 can be used alone

without program development.

Set the power transmission output levelAllows users to optimize power

transmission based on the charging

side.

Reduces wasted power and heat

generation.

Integrated 10bit SA-ADCEnables 3ch AD conversion of external signals. In addition, monitoring the

transmission current makes it possible to change the impedance during

power transmission, enabling device desorption and abnormality detection.

ADC

Controller

ML7631(Power Transmission)

WirelessChargingControlBlock Transmission Circuit

Antenna

Receiver Circuit

MCU(Option)

I2C

5V

27.12MHz

USBBUS

Power

5V Power SupplyCan be driven using

standard 5V USB BUS

power.

Shared antenna for power reception and NFC TagSharing one antenna for makes it

possible to reduce mounting area.

Built-in data flashEquipped with 496B data Flash for

NFC Tag functionality. Allows any data

to be set.

Integrated NFC Forum Type 3 Tag functionNFC Tag functionality enables support for

smartphones

Provides support for Bluetooth® pairing

and application specific functions.

Integrated comparatorThe specified temperature range for charging can be set

using an ADC or comparator. The threshold value can be

set and charging control based on charge temperature

monitoring important when charging Li-ion batteries can

be duplexed, ensuring safe charging operation.

ML7630(Power Receiver)

Controller

Comparator Thermistor

Antenna

CommunicationControl Block

ChargingIC

Battery

Power Reception/LDO

(3.5V to 5.0V)

Rectifier(Diodes)

HostMCU

Built-in variable voltage LDOEquipped with a 200mW output LDO featuring

adjustable output voltage. Output setting for low

voltage applications is enable from 3.5V to 5V

optimized for standard Li-ion battery chargers.

Integrated 10bit SA-ADCEnables 3ch AD conversion of external

signals. Makes charging possible

within the specified temperature range

by connecting an external thermistor.

In addition, by measuring the charging

voltage/current and battery voltage,

the battery status can be confirmed.

Data Flash Built-in Wireless Charging Control ProtocolThe ML7630 can be used alone

without program development.

ADC

NFC ForumType3 Tag

NFC ForumType3 Tag v1.0


POINT 01

Performing wireless charging at 13.56MHz makes it possible

to use a smaller antenna on the order of 1μH.

For example, adopting an ultra-compact cube antenna

reduces board area by approx. 50% compared to the

charging area utilized by conventional Micro USB connectors.

Utilizing a smaller antenna contributesto greater space savings

Specifications

Part No.

ML7631

Features

Wireless PowerTransmission

Wireless PowerReception

Functions

Adjustabletransmission power

200mWMax output

I/F

I2C Slave×1ch

NFC Forum Type3 TagI2C Slave×1ch

ADC(Method)

10bit(SA type) ×3ch

10bit(SA type) ×3ch

DataFlash

496B

496B


(˚C)

−40 to +85

−40 to +85

Package Code

P-WQFN32-0505-0.50-A63(WQFN32)

S-UFLGA34-2.59x2.59-0.4-W(WCP34)ML7630

Saves valuable board space

Conventional

Mounting Board

80mm2

Mounting Board

New Wireless Charging Solution

40mm2

MicroUSBconnector 10×8mm

Cube Antenna for Power Reception 4×4mm

ML76302.6×2.6mm

Peripheral Components

50% smaller

Both the ML7630 and ML7631 integrate all functions

necessary for power reception/transmission in a single chip,

making it possible to achieve wireless charging control

without an MCU. This eliminates the need for software

development while contributing to set miniaturization by

reducing the space required for the MCU.

POINT 02

MCU-less design saves space and enables systemconfiguration without the need for software development

Standalone Design (No Control Software Needed)

USB Block

An

ten

na

ML7631(Transmission)

Charger Device

WQFN325V

TX1

RX0

RX1

An

ten

na

ML7630(Reception)

Charging IC

Battery

2.6mm×2.6mm WCSP

RX0

RX1

BAT

VDDIO

BAT2

Thermistor

The ML7630 integrates a 200mW output LDO capable of

charging Li-ion batteries by using a charging IC at the output.

In addition, the built-in 10bit AD converter and comparator

provide programmable temperature control (temperature

detection, threshold management) important for Li-ion

batteries, ensuring high reliability charging control.

POINT 03

200mW output LDO and temperaturemanagement support Li-ion battery charging

Receiver LSI (ML7630)

Charging IC

Battery

LDO(3.5V to 5.0V)

Rectifier(Diodes)

Antenna

ThermistorComparator

CommunicationControl Block

10bit ADC

ControllerFlash ROM

200mW Output LDO

Dualtemperature control

with ADC andcomparator

ML7630

TX0

Reference Kit

This kit allows users to verify antenna characteristics for

13.56MHz wireless charging and charge control in advance.

In addition, an NFC Forum Type3 Tag function is installed on

the power reception board that makes it possible to confirm

compatibility between NFC and charging operation. The kit

includes a power transmission board, power reception board,

and LCD board for displaying charging conditions, providing

a standalone 13.56MHz wireless charging solution.

POINT 05

Optional reference kit enables immediate evaluation

ML7630 EVA Board

(Power Reception)

ML7631 EVA Board

(Power Transmission)LCD Board

The ML7630 incorporates NFC Forum Type3 Tag

functionality that makes it possible to read Tag information

written in the internal ROM from NFC-equipped devices

such as smartphones, providing support for Bluetooth

pairing using NFC touch that eliminates the need for screen

or switch operation.

POINT 04

Integrated NFC Forum Type3 Tag function NFC Forum Type3 Tag

ML7630 Power Reception LSI

Thermistor

Charging IC

Battery

Rectifier LDO(3.5V to 5.0V)

CommunicationControl Block 10bit ADC

ControllerFlash ROM

Comparator

Antenna

r

Charging

ML7631-Equipped

Charger

ML7631 Power Transmission

edeed

Communication

Pairing between

ML7630-equipped

device and

smartphone, etc.

AntennaAntenna receives

magnetic field to generatepower and begin operation

Antenna



Anten

21 www.rohm.com

Modules

BP3591 BP3599 BP359BBP3595BP3580

Wi-Fi Modules Function/Block Diagram

ROHM Baseband LSICompatible with IEEE802.11b/g/n.

BP3580

3.3VRFSW

RFIC

Antenna

HostMCU

32bitMCU

BB/MAC

FLASH Memory

FLASH Memory

EEPROM

OSC

XTAL

LDO

LDO

Firmware must be

downloaded after every

startup and reset.

The appropriate firmware can

be selected from the lineup.

4Kbit flip-chip EEPROM for

storing personal information

such as MAC addresses and

RF adjustment parameters.

BP3599BP359B

BP3591 BP3595

Usage NotesROHM Wi-Fi modules are wireless communication modules. When developing products using this module it is also necessary to develop application and device drivers.

The device drivers are offered on our website as sample code (Linux). Other OS and applications are supported by third parties.

Also, please refer to our website for technical support.

2.4GHz Short-range Wireless

ROHM Wi-Fi modules are wireless communication modules. When developing products using these modules, it is also necessary to

develop application and device drivers. The device drivers are offered on our website as sample code (Linux). Other OS and applications

are supported by third parties. Also, please refer to our website for technical support.

Built-in Antenna type Built-in Antenna/Flash Memory type Internal Antenna/MCU typeCompact type with Built-in AntennaSurface Mount type

BP3591/BP3599 mounted

BP3580

BP3591

BP3595

BP359B

LINEUP

BP3599

Wi-Fi Modules

OperatingTemp.

Antenna Encryption OtherTransmission

SpeedCommunicationFrequencyType Part No.Host I/F


High-Speed Data Transmission






22www.rohm.com

POINT 01

LAPIS Semiconductor wireless communication modules

have acquired certification under Japan's Radio Law.

Built-in antenna and pre-adjusted wireless characteristics

allow for immediate broadcasting and application

evaluation/development. Of course this eliminates the need

to certify customer sets.


Specifications

Supported Standards/Module Specifications


(˚C)

Dimensions(mm)

Part No.

BP3580

BP3591

17.0×17.0×2.3

24.0×33.1×4.7

BP3599 24.0×33.1×4.7

15.3×27.6×2.6BP3595

HostCPU I/F

USB/SDIO/UART

USB/SDIO/UART

USB/SDIO/UART

USB/SDIO/UART

USB/SPI/UART

· IEEE802.11b/g/n

· IEEE802.11b/g/n· Module incorporating the BP3580 and chip antenna

· IEEE802.11b/g/n· BP3591 with built-in MCU and flash memory· Preloaded firmware

· IEEE802.11b/g/n· Compact version of the BP3591

· IEEE802.11b/g/n· BP3591 with built-in MCU and flash memory· Preloaded firmware

Built-inSystem LSI

BU1805GU

BU1805GU

BU1805GU

BU1805GU

BU1805GU

−40 to +85

−40 to +85

−40 to +85

−40 to +85

−40 to +70 24.0×33.1×4.7BP359B

POINT 02

Selectable software stack

Software configuration with standard firmware

User Applications

TCP/IP Protocol Stack

Wireless LAN Device Driver

USB2.0/SDIO Device Driver

HOST side Software

HOST Interface Device Driver (USB2.0/SDIO)

WPS Registrar/Enrollee

WPA/WPA2-PSK

BB/MAC Controller

Wireless LAN Firmware

*Wireless LAN compliant software

for performing authentication and

encryption processing

ROHM originaldevice driver

Supplicant*stored within

module

Radio Law certification enables immediate evaluation and implementation

BP3595BP3580 BP3591 BP3599 BP359B

Construction DesignCertification Number

Evaluation Boards

BP359C UART I/F board




UART

Note: BP359D can be used for both BP3591 and BP3599.

(In the case of BP3591, startup is initiated using flash memory

on BP359D, while flash memory on the BP3599 is used for startup.)

USB/SDIO

USB SDIO

Top Bottom Top Bottom

BP3591/BP3599 mountedBP3591/BP3599 mountedBP3591/BP3599 mounted

Wireless LAN Modules

BP3591

Adapter Boards

BP359D(for BP3591)

Supports conversion to 2.54mm pitch

Top

Bottom

BP359F(for BP3595)

Top

Bottom

BP3595

BP359E(for BP3599)

Top

Bottom

BP3599 BP359B

Supply Voltage(V)






Software stack with HTTP/SSL firmware

User Applications

HOST side Software

For BP359B


SSL/TLS

HTTP

HOST Interface Device Driver (UART only)

WPS Enrollee

WPA/WPA2-PSK

BB/MAC Controller


Software stack withbuilt-in TCP/IP firmware

User Applications

HOST side Software


HOST Interface Device Driver (UART only)

WPS Registrar/Enrollee

WPA/WPA2-PSK

BB/MAC Controller


HTTP, SSL and TCP/IP

protocol stack provided

AP firmware supports DHCP

and WPS Registrar

STA firmware compatible with

DHCP Client WPS Enrollee

Enables simple control through WID commands

(ROHM original) and achieveswireless LAN even with a non-powered

Host without the need for a driver.

Built-in supplicantand TCP/IP

protocol stack

UART

Adapter Boards

Wireless LAN Modules

23 www.rohm.com


EnOcean® modules combine ultra-low power communication elements with power generating devices that utilize energy harvesting

technology (i.e. light, electromagnetic induction). Their wire-free, batteryless design enables installation virtually anywhere and

eliminates the need for periodic maintenance. In addition, interconnectivity makes it easy to add devices.

LINEUP

Switch Modules

Circuit Boards for Switch Modules

Humidity Sensor Modules



Wireless Energy Harvesting Modules

Programmable Wireless Modules for Transmission/Reception

USB Receiver Modules

Wireless switch modules for push mechanisms. Integrates a switch

power generation element and wireless communication module.

Wireless transmission board modules for switches. Used in combination

with electromagnetic induction generator elements for switches.

Used for open/close detection of doors and windows.

Power generated from weak indoor light using photovoltaic cells

is used to wirelessly transmit open/close status.

Can be used as temperature sensors. Power generated from weak

indoor light using photovoltaic cells is used to wirelessly transmit

temperature data.

An expansion board for temperature sensor modules that adds

a humidity sensor. Includes a connector for connecting to temperature

sensor modules.

Wireless modules optimized for energy harvesting.

Programmable transceiver modules that can be used

for receiving signals from switch modules.

Transceiver modules that support USB connection.

Power generating switch elements that generate electricity using

electromagnetic induction. Used in combination with

switch module circuit boards.

Part No.

HSM 100

PTM 210J

WirelessFrequency928.35MHz

(Japan)

PTM 430J

STM 429J

STM 431J

STM 400J

TCM 410J

USB 400J

PTM 210

WirelessFrequency868.3MHz(EU/China)

PTM 330

STM 329

STM 331

STM 300

TCM 310

USB 300

ECO 200Electromagnetic Induction Generator Element for Switch Modules

Product Name Overview ImageCompliant and

CompatibleStandards

OperatingTemp.


Usage NotesEnOcean® modules are wireless communication modules. When developing products using these modules, it is also necessary to develop application software.

Many applications are supported by third parties.

For technical information on these products, please refer to EnOcean® GmbH’s website.

EnOcean® Module EDK 400J Evaluation Kit

Kit Contents

· PTM 210J (Switch Modules)

· USB 400J (USB Receiver Module)

· PTM 430J (Circuit Boards for Switch Modules)

· ECO 200 (Electromagnetic Induction

Generator Element for Switch Modules)

· STM 431J (Temperature Sensor Modules)

· STM 400J

(Wireless Energy Harvesting Module) *1

· EOP 350 (Programming Board) *2

· USB Cable

(for connecting the EOP 350 to a PC)

*1 STM 400 in the EDK 400J is mounted on a dedicated board for connecting to EOP 350.

*2 Used when rewriting firmware for STM 400J and STM 431J.

Programming kit ideal for application/firmware development, prototyping, and training purposes.

Dolphin V4 API (S/W)Requires purchase of EDK 400J

· Library files

· Peripheral functions manual

· Sample source code

Dolphin V4 Suite (S/W)Software bundle that performs program writing,

product settings, and chip calibration

Keil Integrated Development Environment (μVision)In conjunction with Dolphin V4 API/Suite (S/W), makes it possible to carry out a series of firmware

(F/W) development tasks such as original firmware coding, compiling, and writing.

Dolphin ViewAn evaluation tool for evaluating and analyzing EnOcean® wireless signals

Note: Representative image

24www.rohm.com

POINT 01

Combining ultra-low-power wireless communication

devices with energy harvesting technology capable of

generating electricity from a push of a switch, temperature

differences, or even light makes batteryless, wireless

communication possible. The batteryless design

eliminates the need for maintenance, enabling easy

installation even in places conventionally difficult to install.

In addition, ultra-low power communication 10x lower than

the IEEE802.15.4 standard (i.e. ZigBee®) is achieved.

And application support is provided in the form of an

easy-to-use module, facilitating practical use.

Wireless communication without batteries PTM 210J Block Diagram and ECO 200 Operating Principle

ECO 200(Electromagnetic

induction)

Current/

Voltage

Converter

Contact/

Nipple

Microcontrollers

RF IC

Pattern

Antenna

ECO 200 utilizes

electromagnetic

induction to

generate electricity

POINT 03

EnOcean® products for Japan are certified under Japan’s

Radio Law, allowing for immediate use by incorporating in

existing sets.

Note: EnOcean® products are available in multiple frequency bands to support the radio laws in different countries. Therefore, it is necessary to select the EnOcean® product according to the frequency band of the country used (destination).


EnOcean® Product List

Part No.Region

Switch Modules

Circuit Boards for Switch Modules

Electromagnetic Induction Generator Element for Switch Modules ECO 200

Magnetic Contact Modules

Temperature Sensor Modules

Humidity Sensor Modules HSM 100

Wireless Energy Harvesting Modules

Programmable Wireless Modules for Transmission/Reception

USB Receiver Modules

868.30MHz

EU/China

PTM 210

PTM 330

STM 329

STM 331

STM 300

TCM 310

USB 300

928.35MHz

Japan

PTM 210J

PTM 430J

STM 429J

STM 431J

STM 400J

TCM 410J

USB 400J

Specifications

Part No.

Supply Voltage

Supply from internal ECO 200

Supply from external ECO 200

Electromagnetic induction power

generation: 120μJ Min at 2V

Solar power generation


Supply from STM 431J

2.1 to 5.0V

(2.5V startup voltage)

2.6 to 5.0V

(via USB)

Antenna

Pattern Antenna

Whip Antenna

Helical Antenna

Helical Antenna

Pattern Antenna


(˚C)

−25 to +65

−25 to +65

−25 to +65

−20 to +60

−20 to +60

−20 to +60

−25 to +85

−25 to +85

−20 to +50

Dimensions(mm)

40.0×40.0×11.2

26.2×21.15×3.5

29.3×19.5×7.0

64.8×16.0×5.4

64.8×16.0×8.4

18.0×13.0×3.5

22.0×19.0×3.1

22.0×19.0×3.1

70.0×23.0×9.0

PTM 210J

PTM 430J

STM 429J

STM 431J

STM 400J

TCM 410J

USB 400J

HSM 100

928.35MHz (Japan)

PTM 210

PTM 330

STM 329

STM 331

STM 300

TCM 310

USB 300

868.30MHz (EU/China)

ECO 200

POINT 02

EnOcean® modules require no wiring, making it possible to

reduce both labor and wiring costs.

Installation work is minimized. And no wiring allows for

easy removal and reinstallation virtually anywhere.

The wire-free design lends a clean aesthetic that makes it

an attractive option for buildings and hotels. It has also

been used to light up important cultural assets.

Wire-free design reduces installation time Example of reducing wiring with stairway lighting

PowerSupply

PowerSupply

Wiring for powersupply switchnot required

—

—

—

—

25

ML7404GD P-WQFN32-0505-0.50

315 to 960

Up to 100kbps(xFSK)80k to

200kcps(DSSS)

2-level(G)FSK(G)MSK4-level(G)FSK(G)MSKBPSKDSSS

IEEE802.15.4k

–119.5dBm[2.4kbps,

BER=1%]*1

(xFSK)–121dBm[200kcps,

SF=64, PER=1%]*2

(DSSS)

ARIB STD-T67,ARIB STD-T108,

RCR STD-30,ETSI EN300-220,EN13757-4: 2013,Sigfox® (Rev 2.E),

IEEE802.15.4k

MK71521

MK71511

MK71251-01

1.7to3.6

2.0to3.6

Bluetooth core spec. v5.0(Single mode)



Bluetooth certificationRadio certifications:

TELEC/FCC/ISED/CE(To be acquired)

Bluetooth certificationQDID: 77987 (End Product)

Radio certifications: TELEC/FCC/IC/CEMK71251-02A

(BACI*1) SPI(HCI*2) UART

UART

Flash: 512KBRAM: 64KB



Flash: –RAM: 28KB

9.7×13.96×2.1

9.7×11.95×2.00

TBD

TBD9.7×13.96×2.1

8.0×11.0×2.00M-FLGA33-8.0X11.0-0.65-9Y

–20to

+75

MK71351-NNN

UART SPI

UART SPI

UART SPI

Role: Master/SlaveApplication

blank


blank


blank

–40to

+85

–40to

+85

ML7344CyGD

ML7344JyGD

ML7396DGD

ML7386BGD

ML7396EGD

ML7386GD

ML7345DGD

470 to510

Up to 50,100, 150,200, 400

Up to 15

Up to 100

10

–107dBm[100kbps,

BER=0.1%]*1

–123dBm[2.4kbps,

BER=1%]*1

–119.5dBm[2.4kbps,

BER=1%]*1

–123dBm[2.4kbps,

BER=1%]*1

–117dBm[4.8kbps,

BER=0.1%]*1

–40to

+85

–40to

+85

–40to

+85

1/10

1/10/20

1/10/20

1/10/20

1/10/20

20/100

20/100


RCR STD-30,EN300-220,

EN13757-4: 2013

Q/GDW374.3

1.8 to 3.6

900 to960

750 to900

470 to510

160 to510

Up to 100

Up to 100

ARIB STD-T108,FCC part15

EN300-220

ARIB STD-T67,RCR STD-30

Q/GDW374.3

ML7345GD 160 to960

315 to960


RCR STD-30,EN300-220,

EN13757-4: 2013

1.8 to 3.6

1.8 to 3.6

ML7345CGD

2-level (G)FSK(G)MSK


2-level (G)FSK(G)MSK4-level (G)FSK



3.3 to 3.6(100mW)

ML7414GD 315 to960

ARIB STD-T67,ARIB STD-T108,Sigfox® (Rev 2.E),

RCR STD-30,EN300-220,

EN13757-4: 2013

1.8 to 3.6

3.3 to 3.6(100mW)

P-WQFN40-0606-0.50

P-WQFN32-0505-0.50

P-WQFN32-0505-0.50

–40to

+85

P-WQFN32-0505-0.50

–40to

+85

P-WQFN32-0505-0.50

–106dBm[100kbps,BER=1%]*1

1/10/20

1/10/20

1/10/20

Up to 100–40to

+85

P-WQFN32-0505-0.50

Up to 500–106dBm[100kbps,

BER=0.1%]*1

–40to

+851/10/20ML7406yGD 750 to

960EN300-220,

EN1357-4: 2011


P-WQFN32-0505-0.50

ML7421GD–40to

+85

P-WQFN36-0606-0.50

400 to 9602400

1.2 to 300

2-level(G)FSK(G)MSK4-level(G)FSK


(860/920MHz)–95dBm

[100kbps,BER=1%]*1

(2.4GHz)


ARIB STD-T108,EN300-220,FCC part15

1.8 to 3.6

1.8 to 3.6

Role :Master/Slave

Role: Slave onlySerial communication

application

*1 BER refers to Bit Error Rate. *2 Halogen-free products are indicated by the mark. For details, please contact a sales representative.

PackageCode

Part No.Operating

Temp.(˚C)

FrequencyBands(MHz)

TransmissionRate

(kbps)

ModulationMethod

ControlI/F

FECMode

ReceptionSensitivity

SupportedStandards

SupplyVoltage

(V)

TransmissionOutput(mW)

HalogenFree*2



M-FLGA33-9.7×11.95-0.75-9Y

−40to

+85

2.0to 3.6

Specifications

*1:BACI (Bluetooth Application Controler Interface), LAPIS Semiconductor’s original host I/F *2 HCI (Host Control Interface), a Bluetooth compliant interface

Note 1: When purchasing MK71251 series Bluetooth modules, we ask that the user verify the application, operating environment, equipment used, and other factors.

Note 2: Please contact a distributor or ROHM sales representative in advance when considering the adoption of MK71351 series Bluetooth modules.

Bluetooth® Modules2.4GHz Short-range Wireless


−25to

+85

P-WQFN28-0404-0.40

1.8 to 3.6Sync serial(Control)DI (DATA)

2-level FSK2-level MSK

426ARIB STD-T67,RCR STD-30

2.4,4.8,7.2

IEEE802.

15.4g

IEEE802.

15.4g

IEEE802.

15.4g

2-level (G)FSK(G)MSK4-level

(G)FSK, BPSK(transmission only)

Sync serial(Control)

DIO (DATA)


DIO (DATA)


DIO (DATA)


DIO (DATA)


DIO (DATA)


DIO (DATA)


DIO (DATA)


DIO (DATA)

Sync serial(Control ·

DATA)DIO (DATA)

— —

—

—

—

—

—


1.8 to 3.6

1.8 to 3.6

*1 BER refers to Bit Error Rate. *2 PER refers to Packet Error Rate . *3 Halogen-free products are indicated by the mark. For details, please contact a sales representative.


–40to

+85

PackageCode

Part No.Operating

Temp.(˚C)

FrequencyBands(MHz)

CommunicationSpeed

ModulationMethod

ControlI/F

FECMode


SupportedStandards

SupplyVoltage

(V)


HalogenFree*3

Part No.SupplyVoltage

(V)

PackageCode

OperatingTemp.

(˚C)

ControlI/F

ModulationMethod

FrequencyBands(MHz)

SupportedStandards

HalogenFree*2



TransmissionRate

(kbps)

FECMode

Part No.SupportedStandard Certification

HostCPU I/F

Built-in Flash/RAM

Dimensions(mm)

PackageCode

ModuleSpecifications

OperatingTemp.

(˚C)

SupplyVoltage

(V)

Bluetooth certificationQDID: 127008 (End Product)Radio certifications: TELEC/FCC/IC/CE

26

BP35A1

BP35C0

2.6 to 3.6(Single Power Supply) UART Wi-SUN

ML7416N(LAPIS Semiconductor) 15.0×19.0×3.0BP35C0-J11

BP35C2

ML7631

ML7630

PTM 210J

PTM 430J

STM 429J

STM 431J

STM 400J

TCM 410J

USB 400J

HSM 100

40.0×40.0×11.2

26.2×21.15×3.5

64.8×16.0×5.4

64.8×16.0×8.4

22.0×19.0×3.1

22.0×19.0×3.1

70.0×23.0×9.0

18.0×13.0×3.5

29.3×19.5×7.0

Supply from internal ECO 200

Supply from external ECO 200



2.1 to 5.0V (2.5V startup voltage)

2.6 to 5.0V

(via USB)

Supply from STM 431J

Electromagnetic induction power generation: 120μJ Min at 2V

−25 to +65

−25 to +65

−20 to +60

−20 to +60

−25 to +85

−25 to +85

−20 to +50

−20 to +60

−25 to +65

Pattern Antenna

Whip Antenna

Helical Antenna

Helical Antenna

Pattern Antenna

ECO 200

ML7416N

ML7436N P-TQFP48- 0707-0.50

–40to

+85

400 to 9602400

2-level(G)FSK(G)MSK4-level(G)FSK

ARIB STD-T66ARIB STD-T67ARIB STD-T108

EN300-220FCC part115

Cortex®-M3

FLASH1024KB, RAM256KB

1.2 to 300 1/10/20


(860/920MHz) –95dBm

[100kbps,BER=1%]*1

(2.4GHz)

Specifications

Part No.

928.35MHz(Japan)


Wi-Fi Modules2.4GHz Short-range Wireless

Dimensions(mm)

Part No.

BP3580 17.0×17.0×2.3

24.0×33.1×4.7BP3591

24.0×33.1×4.7BP3599

15.3×27.6×2.6BP3595

Supply Voltage(V)

3.1 to 3.5(Single Power Supply)





HostCPU I/F

USB/SDIO/UART

USB/SDIO/UART

USB/SDIO/UART

USB/SDIO/UART

USB/SPI/

UART

· EEE802.11b/g/n

· IEEE802.11b/g/n· Module incorporating the BP3580 and chip antenna

· IEEE802.11b/g/n· BP3591 with built-in Flash memory· Preloaded firmware

· EEE802.11b/g/n· Compact version of the BP3591

· IEEE802.11b/g/n· BP3591 with built-in MCU and flash memory· Pre-installed firmware

Built-inSystem LSI

BU1805GU

BU1805GU

BU1805GU

BU1805GU

BU1805GU

Operating Temp.(˚C)

−40 to +85

−40 to +85

−40 to +85

−40 to +85

−40 to +70 24.0×33.1×4.7BP359B

Supported Standards/Module Specifications

Specified Low Power Wireless System LSI with Built-in MCUSub-GHz Short-range Wireless

P-LFBGA81-1010-1.00

750to

960

2-level(G)FSK(G)MSK

ARIB STD-T1081.8to3.6

2.6to3.6

Cortex®-M0+

FLASH 512KB,RAM 64KB

to 50,100, 150,200, 400

1/10/20−106dBm[100kbps,

BER=0.1%]*1

−40to

+85

Part No.Supported

Frequencies(MHz)

ModulationMethod

SupportedStandards

SupplyVoltage

(V)

CPUCore

MemoryResources

CommunicationSpeed (kbps)



PackageCode

OperatingTemp.

(˚C)

HalogenFree*2



UART

UART

Wi-SUN

Wi-SUN

ML7396B(LAPIS Semiconductor)


−20 to +80

−30 to +85

22.0×33.5×4.0

15.0×19.0×3.0

4.5 to 5.5(Single Power Supply) USB Wi-SUN


−20 to +50 21.4×49.7×8.5

−30 to +85

Part No.Supply Voltage

(V)Host

CPU I/FSupportedStandard Built-in System LSI

Operating Temp.(˚C)

Dimensions(mm)



−40 to +85Wireless PowerTransmission

Wireless PowerReception

Adjustabletransmission power

200mW Max outputOutput voltage setting

I2C Slave×1ch

NFC Forum Type3 TagI2C Slave×1ch

496B

496B

10bit(SA type)×3ch

10bit(SA type)×3ch

−40 to +85

P-WQFN32-0505-0.50-A63(WQFN32)

S-UFLGA34-2.59x2.59-0.4-W(WCP34)

PackageCode

Part No. Operating Temp.(˚C)Features Functions I/F Data Flash

ADC(Method)


Dimensions(mm)

Supply Voltage Operating Temp.(˚C)

Antenna

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• ARM® and Cortex® are registered trademarks of ARM Limited (or one of its subsidiaries) in the EU and other countries.

• The Bluetooth® word mark and logo are registered trademarks owned by Bluetooth SIG, Inc, and are used under license.All other trademarks and trade names are the property of their respective owners.

• Sigfox® is a registered trademark of SIGFOX S.A.

• EnOcean® is a registered trademark of EnOcean® GmbH.

Catalog No.62B7238E-B 03.2020 PDF © 2020 ROHM Co., Ltd.

March 1st, 2020.

Wireless Communication LSIz/Modules

Documents

Transcript of Wireless Communication LSIz/Modules