What’s New in EDWinXPs_new_in_EDWinXP1.50.pdf · "Switch to reroute" and "Rip up before reroute"...

What’s New in EDWinXP Visionics

1

© Norlinvest Ltd, BVI. Visionics is a trade name of Norlinvest Ltd. All Rights Reserved.

No part of the What’s New in EDWinXP 1.70 document can be reproduced in any form or by any

means without the prior written permission of Visionics. What’s New in EDWinXP 1.50 document

is subjected to change without notice. Visionics will make changes in a manner that will not affect

dependent systems.

Unauthorized duplication, in whole or part, of this document by any means, mechanical or

electronic, including translation into another language, except for brief excerpts in published

reviews, is prohibited without the express written permission of Visionics.

Visionics, EDWinXP, Docone, EDComX, SimWinXP and Mixed Mode Simulator and their

respective logos are trademarks or registered trademarks of Visionics. Unauthorized duplication

of this work may also be prohibited by local statute.

Disclaimer: Information in this publication is subject to change without notice and does not represent a commitment on the part of Visionics. The information contained herein is the

proprietary and confidential information of Visionics or its licensors, and is supplied subject to,

and may be used only by Visionics’s customer in accordance with, a written agreement between

Visionics and its customer. Except as may be explicitly set forth in such agreement, Visionics

does not make, and expressly disclaims, any representations or warranties as to the

completeness, accuracy or usefulness of the information contained in this document. Visionics

does not warrant that use of such information will not infringe any third party rights, nor does

Visionics assume any liability for damages or costs of any kind that may result from use of such

information.


2

Contents

CONTENTS..................................................................................................................................... 2

WHAT’S NEW IN EDWINXP1.70.................................................................................................... 3

GENERAL....................................................................................................................................... 3 Automatic detection of updates : .............................................................................................. 3 Storing/restoring settings:......................................................................................................... 3 Remembering latest file path:................................................................................................... 3 New text input dialog with preview : ......................................................................................... 3 New color scheme for Property dialogs: .................................................................................. 4 Magnifying glass:...................................................................................................................... 5 Coordinate Zoom :.................................................................................................................... 5 "Ruler" cursor : ......................................................................................................................... 6

SCHEMATIC EDITOR ....................................................................................................................... 6 Dual Copy and Paste function:................................................................................................. 6 "Switch to reroute" and "Rip up before reroute" options in Schematics Editor: ....................... 8

SIMULATION ................................................................................................................................... 8 Motorola Kit .............................................................................................................................. 8

LAYOUT EDITOR ............................................................................................................................. 9 Tapered trace segments .......................................................................................................... 9 Improved automatic renumbering function............................................................................. 10 Global check and test report .................................................................................................. 11 Characteristic Impedance Calculator : ................................................................................... 12

LIBRARY EDITOR .......................................................................................................................... 16 New dialog for pad stack design: ........................................................................................... 16 Polygons in packages, symbols and pad stacks:................................................................... 17 3D Elements Library:.............................................................................................................. 19 New package types in Package Wizard:................................................................................ 19

FABRICATION MANAGER ............................................................................................................... 22 Changes in G-code export : ................................................................................................... 22 Separate toolbar for Copper Relief editing :........................................................................... 23 Gerber viewer replaced .......................................................................................................... 23


3

What’s New in EDWinXP1.70 As in previous year, our efforts concentrated on implementing specific features that were

requested by our users. This is an ongoing process and the version 1.70 includes all those new

elements that we have done so far. If some of suggested improvements could not be found in the

list below, does not mean that the idea was discarded. Most of them are in the pipeline and will

be gradually added to the package.

General

Automatic detection of updates

EDWinXP has been equipped with a function that automatically detects that updates are available

and informs the user when program is invoked.

Storing/restoring settings

All current settings may be stored and then restored in case of reinstallation of EDWinXP.

Remembering latest file path

Whenever disk file is opened for output and input the file open dialog redirects to the folder

selected with previous opening of a file of the same type.

New text input dialog with preview

Several users wished that dialog for text input should show also text preview in the same form

and size as on the graphic screen. The problem was in selecting proper text size in relation to the

size of objects displayed on the main screen. In the new dialog, the first character of entered text

is shown in preview screen in current scale of the main graphic screen. Text preview dialog has

been added to all applications where there is a need for entering text. Additionally, any required

text size may be also set directly in this dialog. Previously user could select only one of 15 preset

sizes. Possibility to preset text sizes for all editors has been though retained in order to facilitate

fast selection. It applies also to setting text sizes in all Property dialogs.


4

New color scheme for Property dialogs

Most used form of dialog in EDWinXP employs a double column grid, accompanied in many

instance by explorer type "tree view". Cells in left hand column are used to display names of

properties or parameters. Values are presented and entered into cells of right hand column. Not

all values are changeable in such dialogs - some are presented only as additional information.

User expressed difficulties in distinguishing which values are settable and which are purely

informative. This problem has been addressed in 1.70 by introducing uniform color scheme for all

such dialogs. Data may be entered only into cells with white background color. Those cells that

are displayed with grey background color contain property names or values unchangeable by the

user.


5

Magnifying glass:

All editors have been equipped with movable "magnifying glass". This feature allows viewing

portion of displayed image in 1, 2, 3 and 4 x magnifications.

Coordinate Zoom :

Possibility to focus display on entered X, Y-coordinates has been added to redraw modes in all

editors.


6

"Ruler" cursor :

Current cursor position is reciprocated in the ruler.

Schematic Editor

Dual Copy and Paste function:

Since long time back, we have been asked to upgrade block copy/paste feature to allow copying

parts of schematics with corresponding parts of PCB layout without losing topology of layout

components placement and routed connections. The same applied to copying parts of PCB

layout with maintained component positions and wiring on the schematic diagram. Previously, if

block of schematics was copied, the layout part was not affected since copied schematics

components were never packaged. Copying of buses was also not supported. Block copy of PCB

layout parts resulted in creating corresponding components on the diagram but they were stacked

on top of each other and required laborious relocation to desired position on the schematic page.

No wired connections were transferred. All above shortcomings have been fully solved in 1.70.

Whenever block of schematics is copied and pasted, the program subsequently switches to

Layout Editor allowing to relocate corresponding block of layout (if there was any already edited)


7

to its destination on the PCB. Block copy function gives this effect only under condition that

copied components were packaged and preference setting "Instant packaging" is ON.

Dual Copy and Paste works both ways. After copying part of PCB Layout program switches to

Schematics Editor where resulting block of component and wires may be placed on currently

active page. In cases when schematic component packaged in copied and pasted layout

components were placed on different pages, their copies and copied wiring will be located outside

of page outlines on respective pages. The interactive relocation of schematic part applies in any

case to these components and wires that were originally placed on the active page. Nevertheless,

placement topology of components and wires on hidden pages will be maintained.


8

In other words, it does not matter anymore whether Copy and Paste operation was initiated in

Schematics or PCB Editor - in both cases produced results will be practically identical .

"Switch to reroute" and "Rip up before reroute" options in Schematics Editor:

These two useful options for manual routing of wires (similar to those implemented previously in

PCB Layout Editor) have been now added to Schematics Editor.

Simulation

Motorola Kit

The EDWinXP Motorola MC68HC11A8 kit includes example project databases designed to illustrate functionality of the new simulation model for MC68HC11A8 microcontrollers. The new

MMI model allows coding programs in C or Assembler editors, and debugging them in real time

while functioning of the rest of circuitry is simulated.

Multifunction Model Interface (MMI) dialog for M68HC11 model supports following features:

• C Editor

• Assembly Editor

• Listing View


9

• Hex Editor

• Disassembler

• Output File

• Errors and Warnings

Layout Editor

Tapered trace segments

Any trace segment may be assigned different widths at the start and at the end. When property

"Tapered" is set at the beginning of a segment, it will produce following results:

If the width at the end of a segment is smaller then at the beginning, then the segment will taper

down gradually along its all length. In opposite case, such a segment will taper up from smaller to

bigger width. In version 1.70, this new feature has been used in several semi-automatic and

automatic tools. User may for example force selected or all segments in any trace to taper

whenever there is a change of width from segment to segment. This function creates smooth

change of width in cases when thicker trace must be routed between pads:


10

On request, all or selected trace segments may be automatically tapered to adjust to the size of

the pad to which they are connected:

As seen on the picture above, ordering the thin trace segment to taper to a pad with bigger

diameter produces similar results as creating "tear drop" pads by adding copper elements (a

method used in previous versions of EDWinXP). The advantage of tapering is that there is no

need to add any loose copper elements. The old method for creating "tear drop" pads has been

retained for compatibility reasons .

Improved automatic renumbering function

In older versions of EDWinXP, automatic renumbering of components had to be executed by

individually entering name prefixes. It could have been a very laborious process if there were

many component name prefixes. It was also not easy to remember all name prefixes used in the

project. In version 1.70, all prefixes are listed in the newly designed dialog allowing selection of all

those that should renumbered. All components with name prefixes that were selected (checked)

in the dialog are renumbered in one go


11

Global check and test report

Functionality of Layout Editor and Fabrication Manager incorporates all sorts of tests needed to

ensure that a PCB was laid out correctly. All these tests and checks are designed to be executed

individually. It may happen that running of some tests has been overlooked or the user missed

significance of some tests for ensuring that particular PCB design is correct. Solution to this,

introduced in 1.70 is global check that in one go executes all available tests in proper order and

produces test report containing details of all detected problems. Mouse click on some problem

listed the test report results in focusing image on the main screen on this problem and displaying

a marker that points to its exact location.


12

For the record, the contents of the test report may be output to a disk ASCII file. .

Characteristic Impedance Calculator :

This new tool allows designing layer stack (from available EDWinXP layers) and assigning layer

type property (PWR/GND, Signals or Mixed).


13

Other parameters are permittivity of dielectric material, thickness of dielectric material, Cu

thickness and planed trace width on signal layers. Program automatically applies suitable

characteristic impedance formula depending on layer configuration. (Microstrip, Embedded

Microstrip, Stripline and Dual Stripline). It is also possible to calculate required trace width for the

layer when value of characteristic impedance is specified as a design rule.


14


15

Library of common dielectric materials is integrated with calculator. Entries in this library may be

edited by the user and new materials added:


16

Library Editor

Various improvements have been added to this application. Few "Dead end" dialogs have been

replaced by dialogs pointing out to next possible operation, which in most cases is opening of

Library Explorer for picking up elements for editing. Functionality has also been enhanced by

adding several suggested features.

New dialog for pad stack design:

The dialog that open selections of pad stacks for editing (or inserting into packages) has been

completely redesigned in order to make the whole procedure more straightforward and at the

same time allow more flexibility. The user has now possibility to select and dimension one of

supported standard shapes (round, square, rectangular, oval or rounded rectangle) for layer

groups or individually for each layer. Pad stacks loaded from library may be modified using this

dialog, eliminating in many case necessity to edit elements of pad stack manually.


17

Polygons in packages, symbols and pad stacks:

Some users expressed need to create "free-hand" shapes, especially in pad stacks. Whereas it

was possible even before to create any copper/outline shape using basic graphic items like lines

or rectangles, it could be laborious for shapes that are more complex. This problem has been

addressed in 1.70 by introducing polygons as items in all graphical library elements. Polygons

may be filled or of open outline type with specified line width. In packages and pad stacks, they

represent copper (if not placed on top and bottom silkscreen layer). For these two kinds of library

elements, the polygons may be also assigned special properties. In packages, they may be used

to define boundaries of router keep-off zones, private for components using such package. Both

in packages and pad stacks, polygons may be assigned property "slot". This allows for creating

cutouts for each component on the board with reference to packages where slot were defined.


18


19

3D Elements Library:

Editing 3D views of packages is rather laborious process. We have followed suggestion of one of

the users and added a special purpose library consisting of more then 150 properly dimensioned

3D elements that may be used as building blocks for 3D editor. Elements include pins, bodies

and other details that we normally use while creating package 3D views. At any time, the library

may be opened and selected element inserted into currently edited package. Inserted elements

may be subsequently relocated to their desired location.

New package types in Package Wizard:

Package Creation Wizard has been enhanced with two new types - PLCC and SOIC


20


21


22

Fabrication Manager

Changes in G-code export :

Introducing slots in packages and pad stack, as well as tapered traces required several changes

in Fabrication Manager, Gerber output. The slots are represented on artwork images as board

outlines (exactly in the same way as cutouts). Since slots and cutouts are usually done using

milling machines, G-Code export has been enhanced to include also those. Cutting slots

(because of their small size) requires in most case usage of other tool that for cutting external

outline of the board. It is now possible to assign tool sizes individually for board outline, cutouts

and slots. This information is needed by the program to calculate trajectory of the tool paths


23

Separate toolbar for Copper Relief editing :

Possibility to focus display on entered X, Y-coordinates has been added to redraw modes in all

editors.

Gerber viewer replaced

Gerber viewer has been removed from Fabrication Manager and replaced by a new application

called Fabrication Graphics (Gerber/Excellon/DXF/HPGL) Viewer & Import). New viewer may be

invoked from Fabrication Manager menu or directly from Project Explorer. It is now more

convenient to examine GERBER artwork images in separate window when comparing with

artwork images displayed by Fabrication Manager. Repertoire of supported formats has been

completed by Excellon drill format and by HPGL. This last format together with AutoCAD's DXF is

intended for importing board outlines. It is no more needed to preprocess any files. If a file

selected for import is in any of supported formats, it will be automatically detected. Nevertheless,

it is necessary to enter formatting parameters for files in obsolete formats like Gerber files in RS-

274-D and Excellon One. Special function incorporated in the new viewer converts imported data

to import categories that may be edited in Fabrication Manager prior to reconstruction of projects


24

from graphics. The viewer has the capability for automatic distribution of imported data to most

suitable category.

Part library Symbol Package 70AAJ-4-M0 CON70AAJ4 DIP8/300/SM/B A-1JB CONA1JB CON/4/SMD ACS712ELCTR SNS712 SOIC8/150 ACS756SCA SNS756 PMD5 ADR130AUJZ VREF130 SOT23/6/A ADS1230IPWR ADC1230 SOP16/244 ADS21992 ADSP21992 QFP176 ASMT-QTB0 LEDTRICOLOR LCC4/A ASMT-QWBE LEDASMT LCC4 AT89S52-24PC MICR8952 DIP40/600 ATmega1281V-8AU MICR1281 QFP64/E BAS70-04W SCH_DIODE7004 SOT323/3/A BH906S BATTHOLD PMD2/A C707A CONN707A SOIC6/1011 CA3130AE OPAMP3130 DIP8/300 CMX7031L9 PRO7031 QFP64/B Colibri PXA270 FINGER SODIM200 CSM-7X-3L CRYSTAL XT/L354/SM DAC104S085CIMM DAC104 SOP10/189 DCP010512 CONV010512 SOIC14/300/P14 DIG-11-15-30-DD DRV111530 DIP8/300 DLW5BSN191SQ2 IND5 L/L264/SM EEVFK1C470UR CAPPO C/FK-C/L185/SM EI3032036 TRANSFORMER30320 DIP10/787 ET-318 GPS318 CON/GPS/ET318 FDS9435A FET9435 SOIC8/150 FT245RL USB245 SOP28/200 FTSH-110-01-L-DV CONN CON20/SMD G3VM-61H1 FETRLYG3VM SOP6/248 GT20D101 IGBT20 TO247/3 GT20D201 IGBT SOT199/3

LR8N3-G VOLTREGA TO92/3/B LR8N8-G VOLTREGA SOT-89/3/B LTS6-NP CSNS6 DIP6/500/P9 LV25-P VTSDR25 DIP5/A LXK2 LED SOJ4/410 M3561 SGEN3561 DIP8/300 MAX16820ATT DRV16820 TDFN6 MAX1758EAI CHGR1758 SOP28/200 MAX5035AUSA CONV5035 SOIC8/150 MC908JL16CFJE MCNTLR908 QFP32/B MCP2551-I/P CNTRLR2551 DIP8/300 MCV15-2 CONN CON/HEADER2/C MCV15-3 CONN CON/HEADER3/C MCV15-4 CONN CON/HEADER4/C MCV15-5 CONN CON/HEADER5/C MCV15-6 CONN CON/HEADER6/C MCV15-7 CONN CON/HEADER7/C MCV15-8 CONN CON/HEADER8/C MJ-4435 CON4435 CON/6/SMD MMA7361LT MMA7361 LGA14 N3055 NPN TO3/2 NFM18CC220U1C3 FLTR18 C/L33/SM NFM21CC220U1H3 FLTR21 C/L43/SM PD55008-E NMOS55008 SO10-RF PIC12F509 MCNTLR12509 DIP8/300 PIC16F877A CNTRL16F877A DIP40/600 PIC16LF818-I/P MICR16F818 DIP18/300 PIC18F2420- I/SO MICR18F242 SOIC28/300 PIC18F2520- I/SO MICR18F242 SOIC28/300 PIC18F2580ISP MICR18F2580 DIP28/300 PIC18F4420-I/P MCNTLR18F442 DIP40/600 PIC18F4420-I/PT MCNTLR18F442 QFP44/C

SN75240PWR USB75240 SOP8/170/A SPT30L INDUCTOR L/L360/SM SS-075-03-01-F020-V1-A SASSPDT CASE470/3/R SS-075-03-01-F020-V2-A SASSPDT CASE470/3/L ST7FLITE29F2B6 MCNTLR729 DIP20/300 STM32F103ZET6 MICR32F103 QFP144/C SUD45P03-15 PMOS_D TO252/2 TMC428-I/A CNTRLR428 SOP16/130 TME2415S CONV2415 SIP4 TMPA910CRAXBG MPRO910 BGA361/M16x16 TNY274GN SWT274 SOIC7/340 TPS2041BD PDSWT2041 SOIC8/150 TS2937CP FDVREG2937 TO252/3/E TSM0512D CONV0512 SOIC10/425 TUSB2046B USB2046 QFP32/B TUSB2077A USB2077 QFP48/D UM3561 SGEN3561 DIP8/300 VNC1L MCNTLR1 QFP48/B WE-CMB FLT744821201 L/L393 WE-PD INDUCTOR L/L390/SM WE-SL3 HV IND3 L/285/SM X9C102P DPOT9102 DIP8/300 XC3S50 FPGAXC3S400 QFP100/H XP1001000-03R CONN100 CON/RJ45-8/A

Contents What’s New in EDWinXP1.70 General Automatic detection of updates Storing/restoring settings Remembering latest file path New text input dialog with preview New color scheme for Property dialogs Magnifying glass: Coordinate Zoom : "Ruler" cursor :

Schematic Editor Dual Copy and Paste function: "Switch to reroute" and "Rip up before reroute" options in Schematics Editor:

Simulation Motorola Kit

Layout Editor Tapered trace segments Improved automatic renumbering function Global check and test report Characteristic Impedance Calculator :

Library Editor New dialog for pad stack design: Polygons in packages, symbols and pad stacks: 3D Elements Library: New package types in Package Wizard:

Fabrication Manager Changes in G-code export : Separate toolbar for Copper Relief editing : Gerber viewer replaced

What’s New in EDWinXPs_new_in_EDWinXP1.50.pdf · "Switch to reroute" and "Rip up before reroute"...

Documents

Transcript of What’s New in EDWinXPs_new_in_EDWinXP1.50.pdf · "Switch to reroute" and "Rip up before reroute"...