WGR7640 IC GNSS RF Receiver Design Guidelines · 1.3 WGR7640 within the APQ chipset ... 16 Figure...
Transcript of WGR7640 IC GNSS RF Receiver Design Guidelines · 1.3 WGR7640 within the APQ chipset ... 16 Figure...
Qualcomm Technologies, Inc.
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U.S.A.
LM80-P0436-29 Rev B
WGR7640 IC GNSS RF Receiver Design Guidelines
LM80-P0436-29 Rev B
September 2016
LM80-P0436-29 Rev B MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 2
Revision history
Revision Date Description
B September 2016 Update to ‘E’ part
A August 11, 2015 Initial release
LM80-P0436-29 Rev B MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 3
Contents
1 Overview ................................................................................................................................ 5
1.1 Purpose ..................................................................................................................................................... 5 1.2 Acronyms, abbreviations, and terms .......................................................................................................... 5 1.3 WGR7640 within the APQ chipset ............................................................................................................. 6 1.4 Overview of WGR7640 topics .................................................................................................................... 6 1.5 WGR7640 features .................................................................................................................................... 7
2 WGR7640 System.................................................................................................................. 8
2.1 GNSS receiver system block diagram ....................................................................................................... 8
3 WGR IC Details – RF ............................................................................................................. 9
3.1 WGR RF receivers high-level comments ................................................................................................... 9 3.2 WGR7640 RF receiver pin assignments .................................................................................................... 9
4 WGR IC Details – Baseband Interfaces ..............................................................................11
4.1 WGR Rx baseband interfaces with Application Processor Qualcomm (APQ) IC ..................................... 11 4.2 WGR RF GNSS input ports – schematic ................................................................................................. 11 4.3 WGR RF GNSS input ports – layout guidelines ....................................................................................... 12 4.4 GNSS receiver matching procedure ........................................................................................................ 13
5 WGR IC Details – Support Circuits .....................................................................................14
5.1 WGR support circuits high-level comments ............................................................................................. 14 5.2 GNSS LO synthesizer .............................................................................................................................. 14 5.3 WGR digital status and control ................................................................................................................ 15
6 Top-level Design Topics ......................................................................................................17
6.1 Top-level parts placement WGR .............................................................................................................. 17 6.2 Shielding recommendations ..................................................................................................................... 18 6.3 WGR DC power topology ......................................................................................................................... 18 6.4 WGR IC DC routing and bypassing – general ......................................................................................... 19 6.5 WGR ground connections ........................................................................................................................ 19
EXHIBIT 1 .................................................................................................................................21
Figures
Figure 1-1 WGR7640 within the APQ chipset ................................................................................................................ 6 Figure 1-2 WGR7640 top-level layout guidelines ........................................................................................................... 6 Figure 2-1 GNSS receiver system block diagram .......................................................................................................... 8 Figure 3-1 WGR RF receivers ........................................................................................................................................ 9 Figure 3-2 WGR7640 RF receiver pin assignments ..................................................................................................... 10 Figure 4-1 WGR Rx baseband interfaces with APQ IC ................................................................................................ 11
WGR7640 IC GNSS RF Receiver Design Guidelines Contents
LM80-P0436-29 Rev B MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 4
Figure 4-2 WGR RF GNSS input ports ........................................................................................................................ 12 Figure 4-3 WGR RF GNSS input ports ........................................................................................................................ 12 Figure 4-4 GNSS receiver matching ............................................................................................................................ 13 Figure 5-1 WGR support circuits .................................................................................................................................. 14 Figure 5-2 GNSS LO synthesizer ................................................................................................................................. 15 Figure 5-3 WGR digital status and control ................................................................................................................... 16 Figure 6-1 Top-level parts placement WGR ................................................................................................................. 17 Figure 6-2 WGR DC power topology ............................................................................................................................ 18 Figure 6-3 WGR ground connections ........................................................................................................................... 20
Tables
Table 1-1 Acronyms, abbreviations, and terms .............................................................................................................. 5 Table 3-1 Supported frequency bands ........................................................................................................................... 9
LM80-P0436-29 Rev B MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 5
1 Overview
1.1 Purpose
This document provides a description of the WGR7640 IC chipset capabilities. Not all features
are available, nor are all features supported in the software.
NOTE: Enabling some features may require additional licensing fees.
1.2 Acronyms, abbreviations, and terms
Table 1-1 provides definitions for the acronyms, abbreviations, and terms used in this document.
Table 1-1 Acronyms, abbreviations, and terms
Term Definition
APQ Application Processor Qualcomm
CSP Control Switching Point
GLONASS Global NAvigation Satellite System
GNSS Global Navigation Satellite System
GPS Globas Positioning System
LO Local Oscillator
PLL Phase-locked Loop
PMIC Power Management Integrated Circuit
RF Radio Frequency
SSBI Signal-Signal Beating Interference
WGR WLP GPS Receiver
WLP Wafer-level Package
WGR7640 IC GNSS RF Receiver Design Guidelines Overview
LM80-P0436-29 Rev B MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 6
1.3 WGR7640 within the APQ chipset
PMIC
SDRAM
Memory supportPower & Ground
Multimedia
APQ
Chipset I/Fs Internal functions
GPIOs
NFC
Peripherals
eMMC
debug
WLAN / BT
WL
AN
/ B
T
fro
nt-
en
d
GNSS Rx
LO circuits
Status & control
WGR7640
Sensors
GNSS
circuitsGNSS PRx
LCD/HDMI
I2C
I2C
I2C web
cam
PMIC
clocks
I2CI2C
SPI
WCN3620
Rx
Bluetooth
RF & BB
command
external
sources
battery
Vibration
motor
Backlights,
LEDs, etcUser
Interfaces
Input Power
Management
Output Power
Managementsupply
voltages
General
Housekeeping
IC Interfaces
supply
voltages
analog
sensorsclocks
others
power-on
WLAN RF
FM radio RF & BB Su
pp
ort
& I/O
s
SSBI
data & clk
SSBI
data
SSBI
S&C
SSBI
I2CSPI
WL
AN
BT
FM
S&C
SSBI
S&C
SSBI
SD/
MMC
GNSS RX0
WLAN T/R
Connectivity
USB
Ext
audio
D
A
D
A
Au
dio
tra
nsd
uce
rs Audio
codecADCs
DACs
DMICs
OTHC
mic bias
A A
Figure 1-1 WGR7640 within the APQ chipset
1.4 Overview of WGR7640 topics
This document provides an introduction to the WGR system, followed by three major sections:
RF receivers, baseband interface, and support circuits (as shown in Figure 1-2).
LNA LPF
LPF
Qu
ad
ratu
re
do
wn
co
nve
rte
r
LO generation
& distribution
GPSBPF
GPS
antenna
WGR7640
GNSS Rx
baseband
digital status
& controlstatus & controls
SSBI
GND
BB_IP
BB_IM
BB_QP
BB_QM
RF_P
RF_M
GND
VCO
XO
to other
circuits
PLL
circuits
FDBK
GNDs
VDD_RF_1P3
VDD_RF_1P3
VDD_DIG_1P8
VDD_RF_1P3
Po
we
r su
pp
ly/
bia
s c
ircu
its
Dig
ita
l I/O
s
& c
on
tro
ls
1) RF receivers
3) Support
circuits
to PM8916
2) Baseband interface
Figure 1-2 WGR7640 top-level layout guidelines
WGR7640 IC GNSS RF Receiver Design Guidelines Overview
LM80-P0436-29 Rev B MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 7
1.5 WGR7640 features
Salient features:
Small package: 2.07 mm × 1.51 mm × 0.63 mm
65 nm wafer-level package (WLP)
17-pin CSP
GNSS stand alone RF receiver
Compatible with Callisto (Gen8A) GPS digital baseband engine
Fully integrated synthesizer PLL, VCO, and loop filter components
Power reduction features for low-power consumption
Single-line serial bus interface (SSBI)
The chipset solution includes the APQ + WGR7640 ICs
LM80-P0436-29 Rev B MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 8
2 WGR7640 System
2.1 GNSS receiver system block diagram
LNA LPF
LPF
Qu
ad
ratu
re
do
wn
co
nve
rte
rLO generation
& distribution
GPSBPF
GPS
antenna
VREG_L18
VREG_S4
PMIC
19.2 MHz TCXO
XO output
WGR7640
GNSS Rx
baseband
AP
Q
digital
status &
control
status & controls
SSBI
GND
BB_IP
BB_IM
BB_QP
BB_QM
RF_P
RF_M
GND
VCO
XO
to other
circuits
PLL
circuits
FDBK
GNDs
VDD_RF_1P3
VDD_RF_1P3
VDD_DIG_1P8
VDD_RF_1P3
Po
we
r su
pp
ly/
bia
s c
ircu
its
Dig
ita
l I/O
s
& c
on
tro
ls
I and Q components from the WGR7640 IC are
routed to on-chip ADC circuits in the APQ IC,
that digitize the received signals and route the
serial data streams to the Gen8A Engine.
Dedicated synthesizer used for GNSS operation;
provides the LO for the GNSS receiver
grounded via a
0 Ω resistor 0 Ω
0 Ω
WGR7640 IC can be placed
close to the GNSS antenna and
does not need a GNSS ELNA
1
3
8
9
6
14
11
5
13
16
17
15
2
4
Figure 2-1 GNSS receiver system block diagram
LM80-P0436-29 Rev B MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 9
3 WGR IC Details – RF
3.1 WGR RF receivers high-level comments
GNSS quad
downconvert
RF_P
RF_M
LPF
LPF
BB_QM
BB_QP
BB_IM
BB_IPgnss_lo
GNSS
ELNA
BPFfilter
Placeholder components –
depends upon application
GN
SS
Rx
ba
se
ba
nd
WGR7640
RF receivers
BPF
Figure 3-1 WGR RF receivers
Receiver is implemented in 65 nm RFCMOS process which accommodates high-frequency,
high-precision analog circuits and low-power CMOS functions
Independent receive path from RF to baseband (I/Q)
Optimized for standalone operation
Consists of differential RF inputs supporting primary GPS, GLONASS, Compass, Galileo,
and QZSS navigation satellite systems. Supported frequency bands are shown in Table 3-1.
Table 3-1 Supported frequency bands
Satellite system Frequency (MHz)
GPS L1/QZSS 1575.42 ± 1 MHz
GPS L1C, Galileo E1, Compass B1-BOC 1575.42 ± 2 MHz
GPS L1 wide 1575.42 ± 10 MHz
GLONASS R1 1602 ± 4 MHz
Compass B1 1561 ± 2 MHz
3.2 WGR7640 RF receiver pin assignments
GNSS RF ports are grouped together (purple squares)
Sensitive RF signals
RF front-end (filters, etc.) located in this direction as seen in the top view
GNSS baseband (green squares)
Sensitive analog signals
Opposite side away from RF pins
WGR7640 IC GNSS RF Receiver Design Guidelines WGR IC Details – RF
LM80-P0436-29 Rev B MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 10
APQ source located in this direction as seen in the top view
15
XO
1
GND
6
BB_I_M
11
BB_Q_M
4
RF_M
16
VDD_
RF_1P3
2
RF_P
5
VDD_
RF_1P3
3
GND
9
BB_I_P
10
GND
14
BB_Q_P
13
VDD_
RF_1P3
8
SSBI
17
VDD_
DIG_1P8
7
GND
12
GND
Figure 3-2 WGR7640 RF receiver pin assignments
LM80-P0436-29 Rev B MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 11
4 WGR IC Details – Baseband Interfaces
4.1 WGR Rx baseband interfaces with Application Processor Qualcomm (APQ) IC
APQ deviceWGR7640 device
GNSS quad
downconvert
LPF
LPF
BB_QM
BB_QP
BB_IM
BB_IP
SSBI
GNSS_BB_QP
GNSS_BB_QM
GNSS_BB_IP
GNSS_BB_IM
gnss_lo
GPIO_81
SSBI_EXT_GPS
Figure 4-1 WGR Rx baseband interfaces with APQ IC
The baseband interface has two differential pairs: in-phase (I) and quadrature (Q):
The I and Q baseband outputs are sensitive analog signals.
Route the I and Q signals as phase-critical differential pairs.
The resistance and capacitance on each pair should be equal.
Avoid crossing these traces; if necessary, cross them only near the APQ end points.
Isolate the device from digital logic and clock traces with ground all around; treat
similarly to controlled-impedance traces.
The length of the I/Q traces between the APQ and WGR should be equal and should not
exceed 8 inches.
4.2 WGR RF GNSS input ports – schematic
Optional:
An external LNA (not required)
Space and pads for an external LNA preceded by a second bandpass filter (to allow addition
of these components if necessary)
WGR7640 IC GNSS RF Receiver Design Guidelines WGR IC Details – Baseband Interfaces
LM80-P0436-29 Rev B MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 12
WGR7640
RF_P
RF_M
GNSS
BPF
from GNSS antenna –
may include more filtering
and/or external LNA
C15
1.2 pF
L3
10 nH
L4
10 nH
GNSS
100 W diff traces
Figure 4-2 WGR RF GNSS input ports
4.3 WGR RF GNSS input ports – layout guidelines
= stripline connection
17 13 8 3
10 5
16 12 7 2
15 11 6 1
9 414The GNSS input is extremely sensitive
and must be protected accordingly.L4
from GNSS
BPF100 W diff
L3C
15
Figure 4-3 WGR RF GNSS input ports
Traces from the filters (pink arrows) must use controlledimpedance techniques – microstrip
or stripline – designed to provide 100 Ω differential (nominal). Stripline provides higher
isolation since it is surrounded by ground planes.
The components are close to the WGR pins; routing is short and direct.
If needed, the areas directly below all component pads and signal traces are cleared of metal
on layer 2 to minimize parasitic capacitance (not shown).
Inductors should be placed in ways that limit mutual coupling.
The complementary paths within each differential pair should be as symmetrical as possible
to preserve their phase balance and maintain common-mode rejection.
Where possible, isolate matching components and traces from all other circuits and traces
using coplanar ground fill (not shown).
Trace capacitances between WGR input pins and matching components should be kept very
low.
Some extra components are included in initial layouts to increase matching flexibility but
might prove unnecessary after careful testing and evaluation.
Specific RF grounding guidelines should be followed:
The ground side of the RF components must connect as directly as possible to the nearest
ground reference and should connect to multiple ground fills on multiple layers to
provide the best grounding.
Do not allow long, thin traces to connect RF components to ground – the added trace
inductance could disrupt circuit performance.
Microvias from the ground pads directly to the PCB ground plane are recommended.
A total ground inductance of less than 100 pH is desired.
WGR7640 IC GNSS RF Receiver Design Guidelines WGR IC Details – Baseband Interfaces
LM80-P0436-29 Rev B MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 13
4.4 GNSS receiver matching procedure
Measure the differential 100 Ω input return loss (Sdd11) looking into the WGR device’s
matching network.
Iteratively adjust the matching network with minor component changes to achieve the desired
performance, making trade-offs between the following objectives as needed:
Center the passband and provide sufficient bandwidth.
Minimize the nominal noise figure using sensitivity measurements.
Standard values of inductors and capacitors can be selected.
The type and size of inductors can affect noise figure.
C3Measure Sdd11
L3
L1C1
C2
WGR7640
Figure 4-4 GNSS receiver matching
LM80-P0436-29 Rev B MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 14
5 WGR IC Details – Support Circuits
5.1 WGR support circuits high-level comments
WGR pins and circuits that provide secondary support functions to the RF transceiver
include:
GNSS LO synthesizer and related
19.2 MHz XO input
Digital status and control signals
Single-wire serial bus interface (SSBI)
Grounds
Pins 1 and 3 – grounded via a 0 Ω resistor
GNSS LO
circuits
WGR7640A
PQ
digital status
& control
status & controls
SSBI
GND
GND
XO
Dig
ita
l I/
Os
& c
on
tro
ls
0 Ω
0 Ω
19.2 MHz
TCXO ref clk
f_ref to other circuits
Support circuits
8
1
3
15
Figure 5-1 WGR support circuits
5.2 GNSS LO synthesizer
The integrated local oscillator (LO) generation and distribution circuits are driven by internal
VCOs to support various modes to yield highly flexible quadrature LO outputs to the GNSS
down converter.
The WGR7640 IC has a dedicated synthesizer used for GNSS operation. This synthesizer
provides the LO for the GNSS receiver.
WGR7640 IC GNSS RF Receiver Design Guidelines WGR IC Details – Support Circuits
LM80-P0436-29 Rev B MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 15
For the WGR7640 IC, an external 19.2 MHz input signal obtained from the PMIC device is
required to provide the synthesizer frequency reference to which the PLL is phase- and
frequency-locked.
The WGR7640 IC integrates all of the PLL loop filter components on-chip. With the
integrated PLL synthesizers, the WGR7640 IC has the advantage of more flexible loop
bandwidth control, fast lock time, and low integrated phase error.
WGR7640
0.8 to
2.0 Vpp
AC-coupling
capacitor required
XO
GNSS PLL
circuits
FDBK
GNSS
VCOgnss_lo to LO
distribution circuits
REF
GNSS
control
GNSS LO synthesizer
XO_OUT_A1
PMICto other
circuits1000 pF
Loop filter
Figure 5-2 GNSS LO synthesizer
5.3 WGR digital status and control
Power (VDD_DIG_1P3) – Use the same supply that is used for APQ digital I/Os to ensure
logic compatibility and prevent latchups.
SSBI allows efficient initialization, GNSS mode and parameter controls, and programming
verification:
The APQ device’s SSBI controller is the master while the WGR circuit is the slave.
SSBI is clocked at 19.2 MHz (reference clock frequency), so good layout techniques are
extremely important.
The SSBI signal is decoded and used to set on-chip control signals to the GNSS functional
blocks. GNSS status is also reported to the APQ device through these circuits and SSBI.
WGR7640 IC GNSS RF Receiver Design Guidelines WGR IC Details – Support Circuits
LM80-P0436-29 Rev B MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 16
Oth
er
I/O
s
Primary IC operating
modes, such as sleep,
warmup, air interface
technology, etc.
RF
tra
nsce
ive
r sta
tus &
co
ntr
ol
SS
BI
SSBI
GND
VDD_DIG_1P3 VREG_S4
(1.8 V)
Supports GNSS functions
Circuit parameters
such as gain, bias
conditions, on/off, clock
rates, LO frequencies,
etc.
Primary status &
control signaling
GND
APQ
GPIO_xx
SSBI_EXT_GPS
Figure 5-3 WGR digital status and control
LM80-P0436-29 Rev B MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 17
6 Top-level Design Topics
6.1 Top-level parts placement WGR
1. Place the WGR section as close as possible to the GNSS antenna.
2. Digital devices and traces must not be placed near the top edge because they generate noise
that could couple onto antennas, degrading performance (self-jamming/spurs).
3. Isolate the power management circuitry – especially SMPS circuits – from the WGR circuits.
4. The 19.2 MHz clock trace between the WGR7640 and PM8921 should be well isolated.
5. Allow space for shields. Specific shielding guidelines are given next.
PMIC
APQ
eMMC
USB
conn
DC
jack
SD
WCN
3620
LC
D
HD
MI
Codec
WGR7640camera H
PH
Wireless GPS
Receiver
AUDIO
POWERDISPLAY
DIGITAL
Wireless
Connectivity
Figure 6-1 Top-level parts placement WGR
WGR7640 IC GNSS RF Receiver Design Guidelines Top-level Design Topics
LM80-P0436-29 Rev B MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 18
6.2 Shielding recommendations
Shield the WGR7460 IC, its matching components, RF front end components, digital
(including the APQ device), and PMIC circuits.
Metal cans are better than metallized plastic.
Recommended shield partitioning:
Preserve Tx-to-Rx isolation
WGR IC and its Rx matching components in one shield and RF front end components in
another shield
Do not locate WGR matching inductors too close to shield walls (this might cause EM
coupling and inductor de-Q)
6.3 WGR DC power topology
The number of bypass capacitors required in a final design depends upon the PCB layout:
Initial designs should begin with “extra” series components (such as resistors, inductors,
or beads) and bypass capacitors.
After extensive test and evaluation, their numbers might be reduced prior to production.
Ground bypass capacitors with vias that are connected directly to the internal PCB RF ground
plane.
Avoid thin, high-inductance traces.
PMIC
5
17
13
16
1.3
V
L181
.8 V
VREG_S4
C18
0.1 mF
C20
0.1 mF
C17
1.0 mF
DNI
R8
zero
R10
zero
C19
0.1 mF
R9
zero
C16
1.0 mF
DNI
WGR7460
VDD_DIG_1P8
VDD_RF_1P3
VDD_RF_1P3
VDD_RF_1P3
Place C18, C19, and C20
close to the WGR IC
Figure 6-2 WGR DC power topology
WGR7640 IC GNSS RF Receiver Design Guidelines Top-level Design Topics
LM80-P0436-29 Rev B MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 19
6.4 WGR IC DC routing and bypassing – general
WGR device VDD_RF pads
VDD_RF bypass capacitor
from VREG
branch at
capacitor onlyouter layer or inner layer
WGR device VDD_RF pads
VDD_RF bypass capacitor
from
VREG
WGR device VDD_RF pads
VDD_RF bypass capacitor
from VREG
C
WGR circuits
DC PWR
Ground
Inductance loop
VDD vias
Ground vias
C
WGR circuitsIf on same side, keep
this distance short
Star configuration with dedicated traces
from capacitor to each WGR IC pin
Daisy-chain configuration with shared traces
from capacitor to multiple WGR IC pins
WGR IC and bypass capacitor on the same side
GOOD do not branch at
other places away
from capacitor
BAD
WGR IC and bypass capacitor on opposite sides
Opposite side bypassing is better
due to lower loop inductance
DC PWR
17 13 8 3
10 5
16 12 7 2
15 11 6 1
9 414
RF power bus
GOOD
C
17 13 8 3
10 5
16 12 7 2
15 11 6 1
9 414
RF power bus
C
BAD
6.5 WGR ground connections
Proper grounding is crucial:
Dedicate at least one layer for ground – layer 5 is shown for example
Ground plane – common point referenced by all handset circuits
Fill unused space on all layers to provide robust layer-to-layer ground
Connect bypass caps directly to surface ground fill, with multiple vias to layer 5 ground
Keep WGR ground pins separate from all other circuit grounds until they converge on layer 5:
Via each set as directly as possible to the layer 5 ground plane.
Include as much ground fill as possible to each layer between 1 and 5 below the WGR
device, connecting each stack of vias to the WGR ground fill areas.
Use a large copper mass to provide the best possible electrical ground and thermal
conductivity – both needed for WGR performance.
WGR7640 IC GNSS RF Receiver Design Guidelines Top-level Design Topics
LM80-P0436-29 Rev B MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 20
Layer 1
Layer 2
Layer 3
Layer 4
Layer 5
Layer 6
Layer 7
Layer 8
WGR ground pins
Below the WGR device – isolate WGR
grounds from all others on all layers
except the PCB ground plane layer
The two grounds are tied together
ONLY on the PCB ground layer
Other (non-WGR)
ground connections
Conceptual
illustration
17 13 8 3
10 5
16 12 7 2
15 11 6 1
9 414
Figure 6-3 WGR ground connections
LM80-P0436-29 Rev B MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 21
EXHIBIT 1 PLEASE READ THIS LICENSE AGREEMENT (“AGREEMENT”) CAREFULLY. THIS AGREEMENT IS A BINDING LEGAL AGREEMENT ENTERED INTO BY AND BETWEEN YOU (OR IF YOU ARE ENTERING INTO THIS AGREEMENT ON BEHALF OF AN ENTITY, THEN THE ENTITY THAT YOU REPRESENT) AND QUALCOMM TECHNOLOGIES, INC. (“QTI” “WE” “OUR” OR “US”). THIS IS THE AGREEMENT THAT APPLIES TO YOUR USE OF THE DESIGNATED AND/OR ATTACHED DOCUMENTATION AND ANY UPDATES OR IMPROVEMENTS THEREOF (COLLECTIVELY, “MATERIALS”). BY USING OR COMPLETING THE INSTALLATION OF THE MATERIALS, YOU ARE ACCEPTING THIS AGREEMENT AND YOU AGREE TO BE BOUND BY ITS TERMS AND CONDITIONS. IF YOU DO NOT AGREE TO THESE TERMS, QTI IS UNWILLING TO AND DOES NOT LICENSE THE MATERIALS TO YOU. IF YOU DO NOT AGREE TO THESE TERMS YOU MUST DISCONTINUE AND YOU MAY NOT USE THE MATERIALS OR RETAIN ANY COPIES OF THE MATERIALS. ANY USE OR POSSESSION OF THE MATERIALS BY YOU IS SUBJECT TO THE TERMS AND CONDITIONS SET FORTH IN THIS AGREEMENT.
1.1 License. Subject to the terms and conditions of this Agreement, including, without limitation, the restrictions, conditions, limitations and exclusions set forth in this Agreement, Qualcomm Technologies, Inc. (“QTI”) hereby grants to you a nonexclusive, limited license under QTI’s copyrights to use the attached Materials; and to reproduce and redistribute a reasonable number of copies of the Materials. You may not use Qualcomm Technologies or its affiliates or subsidiaries name, logo or trademarks; and copyright, trademark, patent and any other notices that appear on the Materials may not be removed or obscured. QTI shall be free to use suggestions, feedback or other information received from You, without obligation of any kind to You. QTI may immediately terminate this Agreement upon your breach. Upon termination of this Agreement, Sections 1.2-4 shall survive.
1.2 Indemnification. You agree to indemnify and hold harmless QTI and its officers, directors, employees and successors and assigns against any and all third party claims, demands, causes of action, losses, liabilities, damages, costs and expenses, incurred by QTI (including but not limited to costs of defense, investigation and reasonable attorney’s fees) arising out of, resulting from or related to: (i) any breach of this Agreement by You; and (ii) your acts, omissions, products and services. If requested by QTI, You agree to defend QTI in connection with any third party claims, demands, or causes of action resulting from, arising out of or in connection with any of the foregoing.
1.3 Ownership. QTI (or its licensors) shall retain title and all ownership rights in and to the Materials and all copies thereof, and nothing herein shall be deemed to grant any right to You under any of QTI's or its affiliates’ patents. You shall not subject the Materials to any third party license terms (e.g., open source license terms). You shall not use the Materials for the purpose of identifying or providing evidence to support any potential patent infringement claim against QTI, its affiliates, or any of QTI’s or QTI’s affiliates’ suppliers and/or direct or indirect customers. QTI hereby reserves all rights not expressly granted herein.
1.4 WARRANTY DISCLAIMER. YOU EXPRESSLY ACKNOWLEDGE AND AGREE THAT THE USE OF THE MATERIALS IS AT YOUR SOLE RISK. THE MATERIALS AND TECHNICAL SUPPORT, IF ANY, ARE PROVIDED "AS IS" AND WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS OR IMPLIED. QTI ITS LICENSORS AND AFFILIATES MAKE NO WARRANTIES, EXPRESS OR IMPLIED, WITH RESPECT TO THE MATERIALS OR ANY OTHER INFORMATION OR DOCUMENTATION PROVIDED UNDER THIS AGREEMENT, INCLUDING BUT NOT LIMITED TO ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR AGAINST INFRINGEMENT, OR ANY EXPRESS OR IMPLIED WARRANTY ARISING OUT OF TRADE USAGE OR OUT OF A COURSE OF DEALING OR COURSE OF PERFORMANCE. NOTHING CONTAINED IN THIS AGREEMENT SHALL BE CONSTRUED AS (I) A WARRANTY OR REPRESENTATION BY QTI, ITS LICENSORS OR AFFILIATES AS TO THE VALIDITY OR SCOPE OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT OR (II) A WARRANTY OR REPRESENTATION BY QTI THAT ANY MANUFACTURE OR USE WILL BE FREE FROM INFRINGEMENT OF PATENTS, COPYRIGHTS OR OTHER INTELLECTUAL PROPERTY RIGHTS OF OTHERS, AND IT SHALL BE THE SOLE RESPONSIBILITY OF YOU TO MAKE SUCH DETERMINATION AS IS NECESSARY WITH RESPECT TO THE ACQUISITION OF LICENSES UNDER PATENTS AND OTHER INTELLECTUAL PROPERTY OF THIRD PARTIES.
1.5 LIMITATION OF LIABILITY. IN NO EVENT SHALL QTI, QTI’S AFFILIATES OR ITS LICENSORS BE LIABLE TO YOU FOR ANY INCIDENTAL, CONSEQUENTIAL OR SPECIAL DAMAGES, INCLUDING BUT NOT LIMITED TO ANY LOST PROFITS, LOST SAVINGS, OR OTHER INCIDENTAL DAMAGES, ARISING OUT OF THE USE OR INABILITY TO USE, OR THE DELIVERY OR FAILURE TO DELIVER, ANY OF THE MATERIALS, OR ANY BREACH OF ANY OBLIGATION UNDER THIS AGREEMENT, EVEN IF QTI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. THE FOREGOING LIMITATION OF LIABILITY SHALL REMAIN IN FULL FORCE AND EFFECT REGARDLESS OF WHETHER YOUR REMEDIES HEREUNDER ARE DETERMINED TO HAVE FAILED OF THEIR ESSENTIAL PURPOSE. THE ENTIRE LIABILITY OF QTI, QTI’s AFFILIATES AND ITS LICENSORS, AND THE SOLE AND EXCLUSIVE REMEDY OF YOU, FOR ANY CLAIM OR CAUSE OF ACTION ARISING HEREUNDER (WHETHER IN CONTRACT, TORT, OR OTHERWISE) SHALL NOT EXCEED US$10.
2. COMPLIANCE WITH LAWS; APPLICABLE LAW. You agree to comply with all applicable local, international and national laws and regulations and with U.S. Export Administration Regulations, as they apply to the subject matter of this Agreement. This Agreement is governed by the laws of the State of California, excluding California’s choice of law rules.
3. CONTRACTING PARTIES. If the Materials are downloaded on any computer owned by a corporation or other legal entity, then this Agreement is formed by and between QTI and such entity. The individual accepting the terms of this Agreement represents and warrants to QTI that they have the authority to bind such entity to the terms and conditions of this Agreement.
4. MISCELLANEOUS PROVISIONS. This Agreement, together with all exhibits attached hereto, which are incorporated herein by this reference, constitutes the entire agreement between QTI and You and supersedes all prior negotiations, representations and agreements between the parties with respect to the subject matter hereof. No addition or modification of this Agreement shall be effective unless made in writing and signed by the respective representatives of QTI and You. The restrictions, limitations, exclusions and conditions set forth in this Agreement shall apply even if QTI or any of its affiliates becomes aware of or fails to act in a manner to address any violation or failure to comply therewith. You hereby acknowledge and agree that the restrictions, limitations, conditions and exclusions imposed in this Agreement on the rights granted in this Agreement are not a derogation of the benefits of such rights. You further acknowledges that, in the absence of such restrictions, limitations, conditions and exclusions, QTI would not have entered into this Agreement with You. Each party shall be responsible for and shall bear its own expenses in connection with this Agreement. If any of the provisions of this Agreement are determined to be invalid, illegal, or otherwise unenforceable, the remaining provisions shall remain in full force and effect. This Agreement is entered into solely in the English language, and if for any reason any other language version is prepared by any party, it shall be solely for convenience and the English version shall govern and control all aspects. If You are located in the province of Quebec, Canada, the following applies: The Parties hereby confirm they have requested this Agreement and all related documents be prepared in English.