Viewpoint€¦ · Fairchild Semiconductor announced that its Global Power Resource power design and...
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Transcript of Viewpoint€¦ · Fairchild Semiconductor announced that its Global Power Resource power design and...
CONTENTS
ViewpointPicking Strawberries in the Blue Ridge Mountains . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Industry NewsA Generation Change at PCIM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
NEC Extends Distributor Network . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
White LED Patent to Strategic Partners . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Fairchild Design Center to Include Motion Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Texas Instruments Celebrates 75th Anniversary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
EPE 2005 in Dresden 11-14 September . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
H2Expo 2005 in Hamburg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Industry-First G-Selectable Accelerometer Measures in Three Dimensions, Boasts Quick Power-Up and Cost-Saving
Component Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Safety First, Balu Balakrishnan, President and CEO, Power Integrations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
MarketwatchThe Market Drivers in Power Are Changing, Chris Ambarian, Senior Analyst, iSuppli Corporation . . . . . . . . . . . . . . . . . . . . . . . 12
Cover StoryEcolabels Drive Platform Approach to Appliance Motor Controls, Toshio Takahashi, International Rectifier . . . . . . . . . . . . . . . . 14
FeaturesThermal Management—Analysis and Optimization of the Thermal Path, Dipl.-Ing. Olaf Zschieschang, IXYS Semiconductor;
Dr. Wilhelm Pohl, Kunze Folien; Dipl.-Ing. Michael Probst and Dipl.-Ing. Thomas Vogel, ISKO engineers; Jürgen Schmidt,
ServiceForce; Erwin Nagy, Konstruktionsbüro . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Design & Simulation—Nonlinear Control in a Linear Framework, Dr. A. Forrai, Mitsubishi Electric Corp., Japan . . . . . . . . . . . . . . 32
Power Management—Single-Chip Programmable Power Manager, Shyam Chandra, Lattice . . . . . . . . . . . . . . . . . . . 35
Power Management—Integrated Power Supply Controller, Brendan Daly, Analog Devices . . . . . . . . . . . . . . . . . . . . 40
New Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46-48
Member Representing
Eric Carroll ABB SwitzerlandPaul Löser Analog DevicesArnold Alderman AnagenesisTodd Hendrix Artesyn TechnologiesHeinz Rüedi CT-Concept TechnologyDr. Reinhold Bayerer eupecChris Rexer Fairchild SemiconductorDr. Leo Lorenz Infineon TechnologiesEric Lidow International Rectifier
Member Representing
David Bell Linear TechnologyRüdiger Bürkel LEM ComponentsPaul Greenland National SemiconductorKirk Schwiebert OhmiteChristophe Basso On SemiconductorDr. Thomas Stockmeier SemikronDr. Martin Schlecht SynQorUwe Mengelkamp Texas InstrumentsPeter Sontheimer Tyco Electronics
Power Systems Design Europe Steering Committee Members
PowerSystems DesignE U R O P EPowerSystems DesignE U R O P E
2 Power Systems Design Europe June 2005
Dear Power Friends,
Summertime is almost here and everyonewill be taking a break in order to recharge theirbatteries. One of my favorite pastimes in earlysummer is strawberry picking. I spent many asummer day in Mountaintop Pennsylvaniaattempting to gather a bucket full of strawber-ries, unsuccessfully I might add ending up withone strawberry in the bucket and the next twoto be eaten. What ever your plans are for hol-iday we know where everyone will be in June,together at the annual PCIM Europe show inNuremberg, and we will look for you at ourbooth 12-239 located directly across from thepodium discussions.
Again, we bring you an interesting issuepacked full of the latest technical advances inthe field of power electronics. While the worldis taking a closer look at the effects of productson our environment so ecological performanceis becoming more important to consumers. Asthe cover story from IR demonstrates that motorcontrol differentiates appliance manufacturersproducts in the marketplace. Ecolabels suchas the EU flower symbol and national schemessuch as Blue Angel in Germany and NordicSwan in Scandinavia will force design for nextgeneration refrigerators, washing machines,dishwashers and other appliances.
This months Power Player column is writtenby By Balu Balakrishnan, President and CEOof Power Integration who provides insights intothe the effect of the recent California EnergyCommission ruling (effective July 1, 2006) mak-ing it illegal in California to sell external powersupplies that do not meet tough minimum effi-ciency standards. Energy Star, the EuropeanUnion, China and Australia have also adoptedstandards. As a result, a transition en masse
from linear transformers to energy-efficientswitched-mode adapters and chargers nowseems inevitable.
Our newest column introduction, PowerLine,is a special section devoted to an innovativenew product launch. This month we review aproduct developed by Freescale.
Together with experts in thermal manage-ment: IXYS looks into highly integrated semi-conductor modules that are increasingly usedin power electronics. For an optimum coolingsolution, this higher integration at higher currentdensities requires a holistic consideration ofthe thermal-mechanical behavior of powermodules, including their integration to adjoiningsub-systems. They explore the locally occurringhigh power loss densities result in thermallyinduced deformations of the components. Thishas a direct impact on the thermal contactaffecting the heat dissipation. Better thermalbehavior leads us to more economical prod-ucts for green power.
Market pressure as well as a more energyand environment conscious society sets high-er standards for power systems, which are hardto achieve without advanced control. Althoughpower systems are highly nonlinear and belongto fast systems, real-time digital control seemsto be a trend and at the same time a challengefor the power systems community.
See you at PCIM in Nuremberg. Stop byour booth 12-239.
Best regards,
Bodo ArltEditorial DirectorThe Power Systems Design Franchise
Picking Strawberries inthe Blue Ridge Mountains
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4 Power Systems Design Europe June 2005
INDUSTRY NEWS
NEC Electronics Europe announced thatEltech has joined its European distribution net-work. Eltech is an established distributorbased in St. Petersburg with specialist knowl-edge of the Russian market.
The new agreement extends NECElectronics’ coverage to all countries of theCommonwealth of Independent States (CIS).Eltech is fully franchised to offer the completerange of NEC Electronics products to itsRussian customers, including microcontrollers,ASICs, peripheral ICs, power MOSFETs, photocouplers, CMOS, RF and microwavedevices, and LCD/TFT displays.
"The combination of NEC Electronics’ sys-tem-based approach to applications in fieldssuch as motor control and building manage-ment, together with Eltech’s technical support,means that the needs of the emergingRussian market can now be satisfied,” saidRob Green, president, NEC ElectronicsEurope.
“As one of the fastest growing markets inthe world, the Russian electronics industry,with high levels of engineering and designresources, represents a beneficial platform forglobal component companies aiming toexpand their operations in Russia,” said
Katherina Kober, executive director, Eltech.“We are proud to become a member of thedistribution community of NEC Electronics – aworldwide leader in semiconductor manufac-turing. We believe NEC Electronics’ productportfolio and technology leadership combinedwith Eltech’s local market knowledge, engi-neering and distribution expertise is the perfectbase for our successful business partnership”.
NEC Extends Distributor Network
A Generation Change at PCIM
After the early years of moving around withthe PCIM at different locations Nurembergbecame the home of power engineers inEurope to meet up for the PCIM conference.
Originally started as a conference and
show in the US by Myron Miller. PCIM wastaken to Europe and organized by Gerd E.Zieroth. Not many events like this can have asummary of such good history. It was nice tosee Christine together with Gerd Zieroth at
the 25 anniversary fueling in the spirit of a bigfamily day.
PCIM Europe has become a stable centralpoint of interest for all the experts in powerelectronics. Not only the engineers and theirmanagers showed up. Highly motivated toplevel executives have been seen all over theplace in cross discussion. Three Key-NotePapers from worldwide recognized special-ists opens each day with a very inspiring viewof future improvements in power electronics.
The tradition to present new developmentsin power electronic, both active and passivedevices, in power electronic circuits andapplications, has continued with high levelpresenters from universities and industry. The conference includes control and systemaspects as a link between device developersand device users.
Gerd Zieroth after more than a quarter of a century is handing over responsibility toMesago to navigate the PCIM show for thefuture. We remember the good old days andlook forward to the young and innovative future.
www.eu.necel.com
www.pcim.de
Europe Sales Offices: France 33-1-41079555 Italy 39-02-38093656 Germany 49-89-9624550 Sweden 46-8-623-1600 UK 44-1628-477066 Finland 358-9-88733699 Distributors:Belgium ACAL 32-0-2-7205983 Finland Tech Data 358-9-88733382 France Arrow Electronique 33-1-49-784978, TekelecAirtronic 33-1-56302425 Germany Insight 49-89-611080,
Setron 49-531-80980 Ireland MEMEC 353-61-411842 Israel AvnetComponents 972-9-778-0351 Italy Silverstar 39-02-66125-1Netherlands ACAL 31-0-402502602 Spain Arrow 34-91-304-3040Turkey Arrow Elektronik 90-216-4645090 UK Arrow Electronics 44-1234-791719, Insight Memec 44-1296-330061
www.eltech.spb.ru
Cree announced that it has licensed its pio-neering white LED patent, U.S. Patent No.6,600,175, to several strategic chip customers,including Stanley Electric Co., Ltd., and RohmCo., Ltd., both of Japan, and Cotco Holdings,Ltd., a Hong Kong company. The licenses pro-
vide rights to manufacture and sell white LEDsthat incorporate Cree’s high performance LEDchips. The company is currently in discussionswith other potential partners to license thispatent with a goal of announcing further licens-ing arrangements over the next several quarters.
These licenses are a result of Crees ongoingIP awareness activities.
White LED Patent to Strategic Partners
www.cree.com
www.powersystemsdesign.com 7
Fairchild Semiconductor announced thatits Global Power Resource power design and
application lab in Europe is expanding to pro-vide complete system power solutions formotion and motor control. Fairchild will investin new equipment as well as motion andmotor control engineers at its Fuerstenfeldbruck,Germany site. The centre has already com-pleted more than 50 successful systempower designs in its first eighteen months,reducing part count requirements andincreasing efficiency in customer applications.
“Customers value the total power systemdesigns we are able to give them and areseeking the same level of solutions in otherareas such as two- and three-phase motorcontrol, and motion control,” said Ole-PetterBrusdal, Fairchild’s vice president of Salesand Marketing, Europe. “These addressindustrial and consumer white goods applica-tions – areas that are growing quickly inEurope. As The Power Franchise, our strate-
gy is to constantly upgrade and extend theGlobal Power Resource design and applica-tion labs to meet the needs of our customers”.
To support the additional applications,Fairchild will significantly invest to increasestaff levels by 15% and add new test instru-mentation like additional three phase pro-grammable power sources, power analyzerand electronic loads to support higher currentlevels and three-phase applications, includ-ing inverter drives. The expanded team willoffer customers specific design experience inthe motion and motor control domain.
Texas Instruments Celebrates 75th AnniversaryAmong many major milestones in the
history of Texas Instruments, the companypassed another one on May 16th by markingits 75th anniversary. Yet even as the compa-ny paused to commemorate its past, the people of TI continue to deliver technologyinnovations that have a profound and posi-tive effect on people around the world.
“A common characteristic among the people of Texas Instruments is an impatienteagerness to buck the odds and do some-thing different,” said TI chairman TomEngibous. “TIers just don’t seem to knowwhat cannot be done. So, this company has consistently achieved what othersthought was impossible.”
Revolutionary developments from TIinclude the use of a new technology toexplore for oil worldwide during the GreatDepression, the world’s first commercial sili-con transistors in 1952 and the invention ofthe integrated circuit in 1958. More recently,TI has become the acknowledged leader in
real-time signal processing, which is the pri-mary enabling technology behind communi-cations and electronics products such as cellphones, HDTVs, portable media players,high-speed networking, digital cameras and other advances in digital technology.
TI is the world’s leading supplier of bothDSP and analog semiconductors, the princi-pal technologies for real-time signal process-ing. More than half of all cell phones shippedworldwide rely on TI’s wireless solutions.The company is also the world’s top supplierfor DSL modems, Voice over InternetProtocol (VoIP) solutions and mobile wirelessLAN products.
6 Power Systems Design Europe June 2005
INDUSTRY NEWS
Power Events
• PCIM Europe 2005, June 7-9, Nuremberg,
www.pcim.de
• Automation Seminare, June, Germany,
www.mesago.de/automationseminare
• GEMV Energietechnisches Forum,
June 14-15, Kiel, www.gemv.de
• EPE 2005, September 11-14, Dresden,
www.epe2005.com
• H2Expo 2005, Aug. 31 - Sep. 1, Hamburg,
www.h2expo.de
• INTELEC2005, September 18-22, Berlin,
www.intelec.org
• SPS/IPC/DRIVES, 22-24 November,
Nuremberg, www.mesago.de/sps
H2 Expo is the leading showcasefor hydrogen and fuel cell technolo-gies in Europe. It is organized byGermany-based Freesen & PartnerGmbH, a consulting and event man-agement firm specialized in the ener-gy, environmental and waste recyclingmarkets. In 2001, the companylaunched H2Expo in Hamburg, thefirst stand-alone hydrogen and fuelcells exhibition and conference inEurope. In the United States, Freesen& Partner has teamed with theNational Hydrogen Association (NHA)and puts together the Hydrogen ExpoUSA alongside the prestigious NHAAnnual Conference.
www.epe2005.com
H2Expo 2005in Hamburg
EPE 2005 in Dresden 11-14 SeptemberDresden is the location of this years EPE,
the capital of the state of Saxony, is on the oneside, a very historical place mixed with hightech industry. The city itself is celebrating its800 years anniversary in 2006 – the universitywas founded in 1830 – and within the last 15years totally renovated keeping its originalface. The city as well as the surrounding offermany sight seeing highlights and the localindustries are producing high quality goods.
EPE 2005, Dresden offers compre-
hensive and promising technical programswhich complete with high level of social events.
The tutorial program has been set up by aspecial committee to offer a broad range ofhigh quality seminars. Tutorials will take placeon Sunday 11 September. The programincludes 9 tutorials.
The EPE conference provides excellentopportunity for companies to announce theirlatest research.
Along the years, there is an increasing trendof exhibition participants , proving that growingfocus for power electronic industry. Experts usethis platform for knowledge exchange and theyoung engineers get themselves update withthe technologies. The Exhibition is still open fornew industry partners.
www.ti.com
Fairchild Design Centre to Include Motion Control
INDUSTRY NEWS
www.fairchildsemi.com
www.hydrogenexpo.com
www.h2expo.de
www.powersystemsdesign.com 98 Power Systems Design Europe June 2005
As portable electronics increase infunctionality and fuel the demandfor data drive storage, designers
are seeking improved protection sys-tems that use less board space. TheMMA7260Q sensor now available fromFreescale Semiconductor helps meetthat need.
Freescale developed the three-axis,low-gravity (low-g), microelectro-mechanical systems (MEMS)-basedMMA7260Q specifically for portableconsumer electronics - a market that will require more than $48 billion ofsemiconductors in 2005, according toGartner Dataquest estimates. The sen-sor is small, competitively priced andideal for electronics that require lowpower consumption, high sensitivity and shock survivability.
An Industry FirstThe MMA7260Q includes a g-select
feature that ranges from 1.5 to 6g. Thisgives designers the flexibility to selectthe g-force detection level a specificapplication needs. The addition of the g-select feature reduces componentcount, which helps improve heat dissi-pation and overall production costs.
The MMA7260Q is a single-chipdevice that detects in three dimensions,allowing portable devices to intelligentlyrespond to changes in position, orienta-tion and movement. The small packagesize requires less board space, and thequick turn-on and sleep modes makethe MMA7260Q ideal for battery-pow-ered electronics such as PDAs, cellphones, 3D games and digital cameras.
The MMA7260Q measures smallforces resulting from fall, tilt,motion, positioning, shock orvibration to provide protection forshock-sensitive components. Itdetects acceleration or decelera-tion, such as when a device isdropped, helping prevent damageto the device and minimizing therisk of data loss.
The availability of low-cost,robust and highly functional three-axis accelerometers will contributeto an explosion of applicationopportunities in the price-sensitiveautomotive, industrial and con-sumer markets. They will enablenew products and improved func-tionality for existing products.Manufacturers are always seekingfeatures that will create a competi-tive advantage, and the adoptionof three-axis accelerometers cer-tainly will satisfy this need.
MMA7260Q features • XYZ: three axes of sensitivity in
one device• g-select: in a single device, the
sensitivity can be selected at any of these values - 1.5g, 2g,4g or 6g
• Low current consumption: 500 micro amps
• Sleep mode: three micro amps, ideal for handheld battery-pow-ered electronics
• Low voltage operation: 2.2V -3.6V
• Fast turn-on time: 1ms• Low noise: achieve higher reso-
lution, more accuracy • Package: 16-lead 6mm x 6mm x
1.45mm quad flat no-lead (QFN)
• Reference design (RD3112MMA7260Q)available now
• Evaluation board (KIT3109MMA7260Q)available now
Reference design enables multipledetection situations
To help demonstrate the many appli-cations possible with the innovativethree-axis sensor, Freescale offers theRD3112MMA7260Q sensing triple-axisreference design (STAR). The board
includes the three-axis MMA7260Qaccelerometer, the MC68HC908KX8microcontroller (MCU), a serial port con-nection, EEPROM and a piezohorn.Software is also included to show thesix sensing functions in various graphi-cal user interface (GUI) modules.
www.freescale.com
10 Power Systems Design Europe June 2005
We are all familiar with the old-fashioned AC adapters knownas linear transformers, and
sometimes by more disparaging nick-names (e.g., “bricks,” “wall warts” and“energy vampires”). Thanks to their simplicity, low cost and reliability, theseubiquitous devices have long been thepreferred power-supply technology forlow-power products such as cordlessphones, rechargeable tools, modems,toys, and many others. So entrenchedare linear adapters, in fact, that somemanufacturers continue to ship them evenwith portable products such as cell phonesand MP3 players, despite their consider-able size and weight disadvantages rel-ative to switched-mode power supplies.
However, linear transformers arenotorious wasters of electricity, and now,due to a recent spate of regulations,their days appear numbered. In December,the California Energy Commissionadopted rules (effective July 1, 2006)making it illegal in California to sellexternal power supplies that do not meettough minimum efficiency standards.Other U.S. states are now following suit,while Energy Star, the European Union,China and Australia have also adoptedstandards. As a result, a transition enmasse from linear transformers to ener-gy-efficient switched-mode adapters andchargers now seems inevitable.
Over the years, linear transformershave built a solid record of safety andreliability. Suppliers of switched-modepower supplies must now assure con-sumer-products manufacturers that thisrecord will not be compromised in thetransition. The most critical safety fea-ture provided by linear transformers andtherefore expected by consumer-prod-ucts manufacturers is thermal shutdown.Thermal shutdown is essential for pro-tection in overload conditions, or inabnormally high temperatures such as
when a power supply is covered by apiece of clothing or exposed to directsunlight. Under these conditions temper-atures can greatly exceed normal worst-case operating specifications. Thermalshutdown is therefore the only way formanufacturers to provide assurance thatindividual components are operatingwithin specified limits.
Fortunately, thermal shutdown caneasily be implemented in switchingadapters with the use of integrated circuits.In fact, integrated control circuitry canactually improve upon the mechanicalthermal fuses used in linear transformers.Mechanical thermal fuses cannot bereset; thus, once the fuse has done itsjob, the adapter must be replaced.Switchers, however, can feature hys-teretic thermal shutdown, which auto-matically restarts the power supplywhen the temperature returns to a safelevel. Hysteretic shutdown can thereforereduce consumer returns, an obviousbenefit to manufacturers.
Switching power supplies without inte-grated controllers (e.g., self-oscillatingswitchers) may feature latching thermalshutdown, which can be reset by
unplugging the adapter from the outlet.This approach presents problems formanufacturers since most consumersare unaware of this feature and simplyreturn the power supply for replacement.Furthermore, latching circuits tend to be susceptible to noise and accidentaltriggering, which was never a concernwith the mechanical fuses used in linear transformers.
Switching adapters provide otherenhanced features such as the ability tooperate across the global input voltagerange (typically 85-265 VAC), allowingthem to be used anywhere in the world.Many manufacturers are now demand-ing safe operation over an even widerrange to allow for abnormal input condi-tions (i.e., below 85 VAC and above 265VAC). The most robust switching powersupplies employ control chips that offerunder-voltage lockout, ensuring reliableoperation at abnormally low input volt-ages (as required by standards such as IEC61000-4-11 and EN61000-4-11).The use of 700 V MOSFET technologyprovides additional margin at high input voltages compared to traditional600 V switches.
Consumer-products manufacturersbeing forced to transition from lineartransformers to switching power sup-plies can rest assured that today’s inte-grated circuits actually improve upon thesafety and reliability features providedby linear transformers for many years.The consumer, in turn, benefits from theenergy savings and enhanced portabilityenabled by the transition to switchingpower supplies.
www.powerint.com
By Balu Balakrishnan, President and CEO, Power Integrations
12 Power Systems Design Europe June 2005
By Chris Ambarian, Senior Analyst, iSuppli Corporation
Every component that is suppliedinto multiple industries or applica-tions has certain applications that
really drive the development of that com-ponent, both technically and commercially.
In power management, the two singlelargest categories of devices are voltageregulation and referencing, and powertransistors.
If we take a look at thetop 5 applications thatdrive demand for voltageregulation (mobile hand-sets, home audio, medicalelectronics, desktop PCs,and laptop PCs), we seethat from 2002 to 2009there are some slight shiftsup and down, but these 5remain the top 5 marketdrivers even while the mar-ket size more than triplesfrom $3.7Bn to $11.5Bn.
However, if we look at the power transistor mar-ket, we see some signifi-cant changes in the appli-cations that drive that portion of the market.
By 2009, the market driver categoriesfor power transistors become personalelectronics, consumer appliances, homeaudio, desktop PCs, and mobile handsets.
The big news here, of course, is theemergence of personal electronics andconsumer appliances as market drivers.During the period of 2002 to 2009, thesize of the “personal electronics” sector– which includes items such as MP3players, portable stereos, cameras,camcorders, and essentially anythingyou carry around easily that isn’t a cell
phone—quadruples, jumping from #3 to #1 in market impact. (See Figure 1.)This gain in market impact mirrors theincreasing impact of personal electron-ics in the semiconductor market in gen-eral during this period.
During the same time horizon, theconsumer appliances category jumpsfrom #7 to #2 market impact, as elec-tronic controls make greater inroads intotraditionally electromechanical applica-tions such as washing machines, airconditioners, refrigerators, and the like.
Unlike the personal electronics categorywhich impacts the entire semiconductorindustry in a more balanced way (includ-ing memory, logic, processors, analogand power), the consumer appliancescategory primarily impacts the powermanagement device category. Theseare predominantly offline applications,heavy in power conversion content.
Additionally, the end-equip-ment forecasts done byiSuppli to make the appli-ance power device projec-tions above also don’tcount upon any “disconti-nuity” market events, suchas legislation that suddenlyrequires PFC or certainefficiency performance.These would representeven greater upside poten-tial for the category.
Notably knocked out ofthe top-5 market drivers ismanufacturing automation– a very traditional driverfor the power transistor mar-ket. These projections areconsistent with the broad-ening awareness that con-sumer demand is surpass-ing that of industry. This
has large implications for suppliers;since industrial demand actually contin-ues to grow, that means that consumerdemand is growing even faster so theexcitement and growth opportunity forcompetitive advantage are in consumerapplications, so this is where the supplyfocuses the attention.competitive advan-tage are in consumer applications, sothis is where the supply base focusesthe bulk of its attention.
MARKETWATCH
www.iSuppli.com
Figure 1. Market-Driving Applications for Power Transistors in 2009
2009: US $12,081M
C t i d H i i th S l P t
14 Power Systems Design Europe June 2005
COVER STORY
Streamline development of home appliance applications
Achieving one, or more, of the new ecological labels (ecolabels) is becoming essential as ecological
performance is becoming more important to consumers, as well as being one of the few remaining
opportunities for appliance manufacturers to differentiate their products in the marketplace.
By Toshio Takahashi, International Rectifier,
Director of Engineering, System Architecture R & D group
Motor control strategies will bekey to creating next generationrefrigerators, washing machines,
dishwashers and other appliances thatqualify for ecolabels such as the EUflower symbol and national schemessuch as Blue Angel in Germany andNordic Swan in Scandinavia.
Motor Control is the KeyTraditional “on-off” motor controls
present a great barrier to meeting therequirements for most ecolabels. Forexample, a refrigerator motor capable of switching only between rest and maximum speed results in sub-optimalperformance in terms of the energy efficiency and operational effectivenessof the appliance.
This approach also demands a largercompressor than is really necessary,because it must repeatedly drive thetemperature below the desired set point.Reducing the temperature below thispoint also results in greater heat lossfrom the enclosure. Finally the timed de-frost cycle, which is typically designedfor worst-case conditions, causes higherthan necessary energy usage.
Tools and modules that will enablecost-effective and rapid design of vari-able speed motor systems for appli-ances will help designers reach thestandards set out by the various eco-labelling schemes. As well as lowerenergy consumption, electrical noise,acoustic noise and vibration will also bereduced. Variable speed motor technol-ogy will enable next generation refriger-ators to respond dynamically to temper-ature sensing data, and thereby opti-mise energy usage as well as sizing ofcomponents such as the compressor
Maintaining the enclosure tempera-ture within closer limits also reducesheat loss, enabling higher energy effi-ciency. De-frost energy is minimizedsince the de-frost cycle is only initiatedwhen needed.
Accelerating Variable Speed DesignFirst-generation variable speed motor
controls for appliances have made theseadvantages real for consumers butrequire design skills crossing many disciplines, as well as a great deal ofdesign effort, to perfect. In particular,developing the DSP algorithms to imple-ment Field Orientation Control (FOC),
which is essential for controlling three-phase AC motors is complex and usual-ly also requires special techniques toensure adequate performance. FOCestablishes linear control of torque bytransforming three-phase AC currentand voltage into two variables: torquecurrent and field current. As a result,closed loop current control actually contains separate current control loopsfor torque current and field current.
Each loop is identical and consists ofseveral control elements such as vectorrotator, Clark transformation, proportion-al plus integral, PWM, and current sens-ing. Extensive knowledge of real-timecontrol is a pre-requisite, since each ofthese high priority tasks must be execut-ed sequentially. These tasks, often driv-en by specific hardware events or inter-rupts, require precise control of execu-tion times. This demands sequencing ofinstruction coding to manipulate hard-ware at a specific time in order to control the motor.
The timing constraints usually dictatethe use of assembly language for theFOC for servo application and sensor-
16 Power Systems Design Europe June 2005
COVER STORY
less control, rather than a high level lan-guage, in order to maximise computa-tion and update rates. Even with thespeed-up thus achieved, special codingtechniques—for example to acceleratemultiply or divide functions—may still be necessary.
Regardless of the characteristics ofthe language or the chosen processorarchitecture, implementing FOC in soft-ware requires thousands of lines ofinstructions. This source code must thenbe compiled and linked together withany existing software modules that arebeing re-used to create the executableobject code containing closed loop con-trol, user interface sequencing, networkcommunication, and all other applicablefunctions. Any errors or mistakes mustbe discovered and fixed at source codelevel, and recompiled and linked againto produce the revised version of theexecutable object code. Several itera-tions are usually required to reach thefinal product.
Code maintenance cost is anotherfactor, the true extent of which is not typ-ically apparent until later in development.
Hardware Integration EffortSubsequent integration of the control
and power electronic components of the
drive is another challenge that requirespower electronic design and hardwareintegration skills, as well as advancedcontrol algorithm development, flexibleuser interface development, networkcommunications, and other disciplines.
Motion Control PlatformThere is now a new approach to
motor control design, which has alreadysuccessfully reduced implementationcosts and design time for complexindustrial motion control system.Register-configurable motion control ICsimplement an entire motion control algo-rithm in hardware, leaving the designerto complete the design by selecting opti-mal parameters via a configuration tool.Compatible power components or mod-ules for the power stage, plus analoguecomponents including current sensing,make up a chipset that delivers a com-plete, configurable motor control solu-tion in hardware.
International Rectifier (IR) has takenthis approach to create the MotionControl Engine (MCE), which imple-ments a complete FOC algorithm aswell as a speed control algorithm inhardware. The MCE concept eliminatesmost of the complexity—including codedevelopment and maintenance—fromdesigning variable speed motor drives.
The MCE (figure 1) includes all controlelements necessary to perform closedloop controls. Motion hardware peripher-als supporting space vector PWM,motor current feedback interface andencoder feedback are also implementedon-chip, as well as flow control logic forparallel multi-loop control. Hence, nomulti-tasking is required. Synchronousexecution mechanism of closed loopvelocity control and closed loop currentcontrol is included in the logic hardware.Using a dedicated PC-based configura-tion tool, the designer can quickly optimisethe IC to suit the parameters of selectedmotor and other system parameters,simply by configuring internal registers.
Hardware ChipsetAccompanying, compatible chips, also
shown in figure 1, address the additionalintegration challenges surrounding thecontrol and power electronic compo-nents. These include analogue gatedrivers and sensors, power silicon andpower modules developed together tocreate an integrated design platform,which eases design and integration andalso reduces the number of externalcomponents required.
The analogue chips include theIR2175 high voltage linear current-sens-ing IC, built using IR’s HVIC technology
Figure 1. The Motion Control Engine Implements Motor Control IP in Hardware, Including the FOC algorithm.
and the IR2136 is a three-phase invert-er-driver IC. These provide the essentiallink between the digital control IC andthe power stage, as part of the integrat-ed motion control platform.
The IR2175 senses the motor phasecurrent through an external shunt resis-tor, converts from an analogue to a digi-tal signal, and transfers the signal to thelow side drivers. HVIC technology is imple-mented to enable high bandwidth signalprocessing. The IR2136 is high voltage,high-speed power MOSFET and IGBTdriver with three independent high- andlow-side referenced output channels.Proprietary HVIC technology enablesruggedised monolithic construction.
There are several choices for thepower stage, including a family of 600Vnon-punch-through (NPT) IGBTs avail-able from 6A to 20A rating in either dis-crete or Co-Pack with ultra-fast, softrecovery diodes. Alternatively, integratedpower module (IPM) containing six NPTIGBT dice is available. The IPM alsocontains six commutation diode die, one three-phase monolithic IC, a gatedriver chip, three bootstrap diodes witha current limiting resistor and an NTCthermistor/resistor pair for over-tempera-ture protection.
To further streamline development of home appliance applications, IR’smotion control platform also integratesdedicated peripherals to facilitate inte-gration of variable speed motor drivesinto refrigerators, dishwashers, washingmachines, home air conditioners, fans,and similar appliances. A kit containingall necessary hardware includingheatsink, connectors and PCB—builtwith close reference to applicable indus-try standards —is also available.
Graphical Configuration ToolConfiguration of the control IC regis-
ters is achieved by writing specific val-ues into each register from a host PCusing Servodesigner, IR’s Windows-based dedicated configuration tool. Via the Servodesigner GUI (figure 2),the designer can define which registersto be accessed, change the registernames, customise reading and writingregisters, or group registers into sub-groups. Parameters can also be set dur-ing manufacture or at a customer site.
Servodesigner also allows the designerto create multiple start-and-stop speedprofiles and apply acceleration/decelera-tion characteristics, to quickly verify thatdesired performance targets will be met.This feature further streamlines applica-tion development by highlighting per-
Figure 2. Servodesigner GUI.
20 Power Systems Design Europe June 2005
formance deficiencies early. There arealso diagnostic features, with drive andstatus fault conditions permanently dis-played on-screen.
Configuring registers can be furthersimplified by using an Excel spread-sheet. Servodesigner provides a supple-mentary Excel spreadsheet as a templatefor adapting and configuring a newmotor. The designer can then simplywrite the motor nameplate data such asmotor amps, speed, encoder line countinto the spreadsheet, and then importthe calculated values back into theServodesigne registers.
The tool also contains an EEPROMread/write utility so that the user canstore tuned parameters and eliminaterepetitive configuration. Figure 2 showsa sample screenshot of the Servodesignergraphical user interface. After configura-tion is completed, Servodesigner canalso initiate operation of the resultingmotion control solution.
ConclusionEco-legislation has handed designers
of domestic appliances—very much a“commodity” market in modern, affluentsocieties—a golden opportunity to avoidprice competition and once more differ-entiate their products in terms of per-formance and features. A new, hard-ware-based approach now overcomesthe traditional barriers to designing variable speed motor controls into eco-friendly domestic appliances, bysubstantially reducing the design timeand effort involved. This should, ulti-mately, allow ecolabel-compliant appli-ances to deliver improved performanceat lower price points compared to first-generation models.
About International RectifierInternational Rectifier (NYSE:IRF) is
a world leader in power managementtechnology. IR’s analogue and mixedsignal ICs, advanced circuit devices,integrated power systems and compo-nents enable high performance comput-
ing and reduce energy waste frommotors, the world’s single largest con-sumer of electricity. Leading manufac-turers of computers, energy efficientappliances, lighting, automobiles, satel-lites, aircraft and defence systems relyon IR’s power management benchmarksto power their next generation products.
IR response management:Mike Wigg, International Rectifier Co Ltd,European Regional Centre439/445 Godstone RoadWhyteleafe, Surrey. CR3 0BLTel; +44 (0)20 8645 8003Fax; +44 (0)20 8645 8077e-mail: [email protected]
www.irf.com
COVER STORY
22 Power Systems Design Europe June 2005
Highly integrated semiconductor modules are increasingly used in power electronics.
For an optimum cooling solution, this higher integration at higher current densities
requires a holistic consideration of the thermal-mechanical behavior of power modules,
including their integration to adjoining sub-systems.
By Dipl.-Ing. Olaf Zschieschang, IXYS Semiconductor
By Dr. Wilhelm Pohl, Kunze Folien
By Dipl.-Ing. Michael Probst and Dipl.-Ing. Thomas Vogel, ISKO engineers
By Jürgen Schmidt, ServiceForce
By Erwin Nagy, Konstruktionsbüro
Using thermal-mechanical finite elementmethod and fluid mechanics CFD simulation
Locally occurring high power lossdensities result in thermallyinduced deformations of the com-
ponents. This has direct impact on thethermal contact affecting the heat dissi-pation. At contact-loss, the thermalresistance value increases markedly.The thermal contact strongly dependson the electric operating point, the mod-ule geometry and the module assemblyon the heat sink as well as the materialsused in the module. The power loss-induced heat flow is dissipated to theambience through the heat sink. Inorder to guarantee a reliable and long-term functioning of the module compo-nents it is necessary to minimize thetotal thermal resistance from the heatsource to the heat sink. In order toachieve this a joint project with IXYSSemiconductor GmbH, Kunze FolienGmbH, ISKO engineers AG,
ServiceForce GmbH, Design Office E.Nagy as project members has beenstarted for the IXYS Power ModuleGWM 120-0075P3. Below the way how this objective has been realizedis described.
Taking the IXYS Power ModuleGWM120-0075P3 (figure (1)) as an
example, the entire thermal path (figure(2)) from the power loss-induced heatsources within the module through theheat sink to the ambience as heat sinkwas analyzed by a consecutive finiteelement simulation (FE simulation)together with a fluid-mechanical simula-tion (CFD-simulation) and optimizedbased on thermal-mechanical consider-ations. The thermal analysis toolFlotherm 4.2 was used for CFD simula-tion. The thermal-mechanical FE simula-tion was performed using ABAQUSStandard V6.4. At the same time, a uni-versal clip fixing was developed for theexisting ISOPLUS DILTM Package withregard to the universal use, which tookinto consideration the simulation resultsand the demands on the design as wellas on the assembly. Eventually, theresults of the simulation were comparedto the laboratory measurements.
THERMAL MANAGEMENT
Figure1. GWM120-0075P3 in the ISOPLUS DIL Package.
24 Power Systems Design Europe June 2005
The analysis included the followingsteps:• Generation of an FE model for the
module• Analysis of the thermal-mechanical
behavior of the module together withthe clip by means of FE-simulation
• Design of the clip for adjusted pressureexertion on the module
• CFD simulation of the heat flow anddetermination of the Rth from modulebase plate to ambience, giving differentcooling concepts
• Comparison of results and laboratorymeasurements
Power Modules of the IXYS GWMseries in the ISOPLUS DIL Package
The concept and design of an electri-cally insulating package (ISOPLUS ver-sions) developed by IXYS for powersemiconductors in standardized hous-ings has been extended by the ISO-PLUS-DIL Package. The advantage ofthis design with DCB substrate andsemiconductors soldered to it is the flex-ibility to implement various circuit topolo-gies meeting the demands of the user.The DCB with its electrical insulationcapability coupled with very low thermalresistance Rth(junction-case) permitsthe use of advanced interface materialsbetween the module base plate and theheat sink for which no additional insula-tion pads are required. In comparisonwith insulating films, an advantage forthe thermal path can be achieved. Ahigh integration density characterizesthe component part concept. Thanks totheir performance and small dimensions,these GWM modules e.g. GWM220-004P3, GWM160-0055P3, GWM120-0075P3 with VDSS in a range of 40 to 75V; ID (TC = 90°C) of 145 to 95 A and withRDS(on) from 2,0 to 3,7 mΩ are best suit-ed for the use in automotive and indus-
trial electronics applications such aspower-assisted steering, traction drivesand pump drives subjected to harshenvironmental and temperature condi-tions. For simulation, the 3D CAD datawere processed and material data of theindividual components were determined.Based on the different coefficients ofthermal expansion of the module’s com-ponents, an optimization of the pre-cur-vature of the module base plate becamenecessary. This was based on theresults of the simulation also includingthe thermal resistance. Both have beenverified by experiment.
Process flow of the consecutivelycoupled simulation
The process flow chart shows the fol-lowing steps (organization responsiblefor a given activity is marked by a dis-tinct color) as depicted in figure (3),wherein data of fluid dynamics, thermaland mechanical simulation are exchanged.
Integrated FE simulation of the mod-ule and the clip
The production-related convex curva-ture of the module base plate amountsto approximately 40 µm. The thermal-mechanical behavior of the module wasthen simulated subject to heating up bypower dissipation. Based on this, a clipfor the module mounting of the ISO-PLUS DIL Package was designed takinginto consideration the thermal-mechani-cal behavior of the module. The contactpressure of the clip had to counteractthe module deformation to the extentthat no deformation-induced increase ofthe thermal resistance occurs betweenmodule and heat sink under load. In thisrespect, the mechanical stresses of theclip and the housing must be well belowthe relevant ultimate strength.
The following assumptions and restric-tions have been made:• Nominal power loss per trench MOS-
FET (steady state condition in nominaloperation)
• Homogeneous distribution across thetrench MOSFET surface
• Temperatures of the module ambience(at nominal power loss): in the area ofthe heat sink: 105 °C, in the remainingmodule housing area: 70 °C
For the sum of the thermal resistancesof the thermally conductive film and theheat sink with forced cooling, a totalthermal resistance of Rth = 0.13 K/Wwas determined to be necessary.
Thermal-mechanical behavior of the module
In a first step a thermal-mechanicalanalysis of the module was made. TheFE model consisted of the componentsmodule, heat sink and clip. The modulewas designed by volume elements. Initiallythe heat sink and the clip were replacedby ideally rigid plates to exclude anyinfluence of rigidities of the componentpart. To determine the clip force for theflatness of the module base plate, rigidityof the module is the only decisive factor.
The FE analysis included the following steps:1. Determination of the module pre-
deformation due to production by FEsimulation and adjustment with themeasured value for the curvature ofthe module base plate.
2. Exposing the module to a default thermal load in order to determine the temperature distribution and thethermally induced deformation.
3. Determination of the clip contact pressure for achieving flatness of the module during thermal load.
Figure 2. Total thermal path.
DRIVER ICTHERMAL MANAGEMENT
www.powersystemsdesign.com 27
Design of the clip in assembly withthe module through FE-simulation
The clip design was made by iterativesteps with FE analyses and a subse-quent FE-based form optimization. Theoptimized final form of the clip shows alargely homogeneous stress distribution
in the clip legs with stress peaks signifi-cantly below the ultimate strength.Based on the resulting final clip form,the flatness of the module base plateunder the thermally induced deforma-tions at nominal load is largely achieved(figure. 5a). The thermal interface mate-
rials compensate the remaining distancein the border area of the module baseplate. The maximum value of the con-tact pressure exerted on the modulehousing by the clip (figure. 5b) is signifi-cantly below the ultimate strength of the module housing.
26 Power Systems Design Europe June 2005
Figure 4a. Course of the clip force across the curvature of themodule base plate.
The simulation of the thermal coeffi-cient of expansion of the housing pottingshowed an excellent compliance (devia-tion < 2%) with the measured modulebase plate curvature after cooling off.
The analysis of the module load witha nominal power loss confirmed theassumed maximum permissible value of0.13 K/W for the thermal resistance Rth
of the module base plate to the ambi-ence, observing the permissible maxi-mum temperature. The curvature of themodule base plate was significantlyreduced by the thermally induced defor-mation. For the required clip force arange between 100 N and 150 N wasdetermined (figure 4a). This resulted ina remaining curvature of the modulebase plate in the range of surface
roughness with mounted clip under load.Aberrations between the module andthe heat sink were compensated by theselected thermally conductive film with-out any problems. As shown by the sim-ulated contact pressure distribution onthe top of the module housing in figure4b, the relevant contact areas betweenclip and module housing are at theshorter edges of the housing.
Figure 3. Process flow of the consecutively coupled simulation.
Figure 4b. Simulated pressure distribution at the top ofthe module housing at the required clip force.
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28 Power Systems Design Europe June 2005
CFD simulation of the thermal resistance
The CAD data of the module and ablack anodized aluminum heat sinkwere imported into the simulation software via the CAD interface andprocessed for thermal analysis. Thethermal input of the MOSFETs at nomi-nal power loss at steady state wasdefined by IXYS. In the first heating con-cept, a black anodized finned coolerwith forced convection at different flowrate between 0 and 6 m/s was chosen.All simulations were performed at anambient temperature of TAmbient = 70°Ctaking into consideration the thermalradiation. For the thermal resistance ofthe interface material, a value wasassumed which occurs at nominal pres-sure of the clip of 110 N onto the modulepackage. The thermal analysis of the
ISOPLUS DIL™ Package showed thatthe thermal resistance of Rth = 0.13 K/Wfor the thermally conductive film togeth-er with the heat sink required for the FEsimulation can only be achieved byadditional heat dissipation measuressuch as forced convection cooling byfans or by fluid cooling (e.g. using water).
The actual heat dissipation of theGWM120-0075P3 was compared to thesimulation results. For this purpose, thepower module was operated at the teststand at room temperature of 22 °C. Thetemperature measurements were con-ducted with thermocouples installed inthe heat sink at the base plate “center”and base plate “edge” (fin-side). Theflow rate was measured by a thermo-couple anemometer and transferred tothe software. The temperature distribu-
tion was recorded with an infrared camera VARIOSCAN High Resolution3021-ST. The module was operated instationary operating points I = 50 (U =1.6 V) through I = 90 (U = 1.9 V).Theselected interface material was appliedto thermally link the module to the heatsink. Temperature rise at forced convec-tion at nominal power loss is shown infigure 8.
The CFD model was adapted to beable to compare the experimentalresults and the simulation results.TAmbient was changed from 70°C to 22°Cand the flow rate was adjusted to 3.4m/s. The comparison of the simulatedand measured values at I = 90 A und U= 1.9 V confirms the compliance of themathematical model and the reality (see table1):
Figure 5. Distance and contact pressure after temperature rise. The sum-tolerance of all system components is compensatedby the clip and its characteristic curve as a main requirement . As shown in figure (6), the peak values of the mechanicalstresses in both load situations are significantly below the ultimate strength of 1,300 MPa.
Figure 6. Main stress distributions a) after clip mounting and b) after heating up.
THERMAL MANAGEMENT
edge of the input parameters. Theresults can be used in practice andfacilitate the development of the idealthermal solution. The method shownwhich consists of first simulating themodule including mounting by FE simulation and optimizing in assemblyprovides a comprehensive solution,taking into consideration the thermal-mechanical interactions during opera-tion. With CFD thermal analysis, theoptimum heat dissipation concept forthe customer-specific application isdefined already before the prototypeproduction in order to prevent laterheat-induced failures. The employ-ment of this option provides for deci-sive technical and economical advan-tages working in a competitive world,where “Time to Market” is a key issue.The system is a closed loop, whichwill be described further in an analysisby examining step by step the effectsof the optimized cooling on the elec-tronic circuits and the temperature-dependent characteristics of thepower semiconductors.
www.powersystemsdesign.com30 Power Systems Design Europe June 2005
www.ixys.com
This result was confirmed by test at asecond operating point I = 50 A and U =1.6 V. The verification by experimentshows that the thermal resistance of Rth = 0.13 K/W at nominal power losswhich the thermal-mechanical simula-
tion was based on was accurate and isfeasible in practice by the shown heatdissipation concept. The heat dissipa-tion concept, however, largely dependson the installation and environment inthe customer-specific application.
Conclusion and outlookWithin the joint project it could be
proven that the results of finite elementsimulation and CFD simulation matchthe reality very well. The modeling ofpower modules requires exact knowl-
www.heatmanagement.com
Figure 7a. Thermal analysis with forced convection (6 m/s) at TAmbient = 70°C.
Figure 8.Temperature rise at forced convection (3.4m/s) at TAmbient = 22°C and at nominal power loss.
Table 1.
Figure 7b. Simulated temperature distribution at the heatsink (Dimensions: 128 mm x 100 mm x 30 mm, baseplate: 10 mm).
www.isko-engineers.de
THERMAL MANAGEMENT
www.powersystemsdesign.com 3332 Power Systems Design Europe June 2005
The next issue, which we are going todiscuss is, robust gain scheduling con-troller design and stability analysis. Gainscheduling consists in designing foreach operating point a LTI controller and a switching controller when theoperating conditions change.
It is known that when gain schedulingis used, the stability of the ‘frozen’ sys-tem ensures stability of the time-varyingsystem for slowly varying parameters. Inthe case of gain-scheduled controlsystems, stability analysis is per-formed considering the variationrange and variation rate of thetime-varying parameter, using lin-ear matrix inequalities (LMI) [5].
Quadratic stability means that,stability holds even when theparameters change arbitrarily fast,which can be quite conservative inmany applications. Biquadraticstability means that, stability holdsin a parameter box, defined byvariation range and variation rateof the parameter, which leads to aless conservative test and is usedin the case of slowly varyingparameter dependent systems.
Practical ExamplesAs example, let us consider a
coil on a magnetic core, which sat-urates as the current is increasing.The transfer function of the linearparameter dependent model isgiven by:
(1)
where i is the current, R = 6.8Ohm is the coil resistance andL=L(i) is the coil inductance, which is current dependent.Measurements showed that at i = 0.2A, L = 2H and at i = 2A, L = 0.5 H. Our main objective is tocontrol the current with high accu-racy between 0.2 A and 2A. Forsimplicity we assume that thepower converter is ideal and thereis no constraint on the control sig-nal (applied voltage). The designspecifications are: settling time
0.1 seconds and percent of overshootless than 1.5%.
System identification experiments,performed around different operatingpoints show that the system candescribed by P(s) = 1/(sL+R) LTI modelsas well as plant uncertainty.
(2)
The performance specifications givenin time-domain are translated into fre-quency-domain and leads to the per-formance weighting function [3]:
(3)
The next step is to design for eachoperating point a robust controller and aswitching controller, when the operatingconditions change. We consider two
DESIGN & SIMULATION
The techniques might be applied for power systems
If the operating point (scheduling parameter) is varying slowly, then biquadratic stability analysis of
the control system is performed. If we switch among different operating points – most likely in the
case of power converters – then quadratic stability analysis of the control system is required.
By Dr. A. Forrai, Mitsubishi Electric Corp., Japan
Day by day, market pressure aswell as a more energy and envi-ronment conscious society sets
higher standards for power systems,which are hard to achieve withoutadvanced control.
Although power systems are highlynonlinear and belong to fast systems,real-time digital control seems to be atrend and in a same time a challenge for the power systems community.
The article deals with robust gainscheduling control, which is a widelyused technique for controlling certainclasses of nonlinear or linear time-vary-ing systems.
To achieve high-performance over the entire operating range with a singlelinear time-invariant (LTI) controller it isoften impossible. Therefore, the param-eters values are measured or estimatedin real-time and the LTI controllers arescheduled by parameter measurements.
Robust Gain-Scheduled Control DesignIn the aim to treat the control design
in a unified framework we have toaddress three important issues:• linearization of nonlinear systems;• robust controller design for LTI systems;• robust gain-scheduled controller
design and stability analysis.
Linearization of nonlinear systems is awell-known procedure, for example: lin-earization around an operating pointand feedback linearization, are frequent-ly used in practice [1].
The first approach means that, sys-tem identification experiments are per-formed around different operatingpoints, where the system is consideredlinear, thus LTI models are derived,which can form a linear parameterdependent model.
Feedback linearization has the mainobjective to find out a feedback lawsuch that the nonlinear plant is trans-formed into a linear plant, which is validin the entire operating range. Sincefeedback linearization exactly cancelsthe nonlinear terms, it is not a robust
scheme. Furthermore, real-time imple-mentation of the feedback linearizationlaw is computationally expensive andmight be numerically fragile.
Let us assume that the system is lin-earized around operating points, thenconsidering a control-oriented systemidentification approach we can deriveLTI models and an upper uncertaintybound (due to parameter uncertaintyand unmodelled dynamics) as shown in Fig. 1.
A suitable model for control design isa proper balance between model fidelityand simplicity and requires not onlyadvanced system identification techniques,but also physical insight and significantdomain expertise [2].
The next step is to translate the per-formance specifications given in time-domain (in terms of settling time andpercent of overshoot) into frequency-domain. Then, a robust controller for theLTI plant can be designed, based onspecifications on the sensitivities usingsoftware tools [4]. The main differencebetween classical control and robustcontrol is that in the framework of robustcontrol plant uncertainty is taken intoaccount during controller design, whichis a more realistic approach [3].
Figure 1. Models for control systemdesign.
DESIGN & SIMULATION
www.powersystemsdesign.com 3534 Power Systems Design Europe June 2005
operating points around 0.2 A and 2A.Furthermore, let us note the designedrobust controllers for the operating pointsby K1(s) and K2(s), then the robustgain-scheduled controller is given by:
(4)
where
(5)
The previous equation can be writtenas:
(6)
Then biquadratic analysis is per-formed, when the current variesbetween 0.2A and 2A and the absolutevalue of the current rate is|di/dt|<18A/sec.
The block diagram of the control sys-tem is shown in Fig. 2.
Fig.3 shows the gain-scheduled sys-tem step response (green line) as wellas the system step response (blue line)when LTI controllers have been used,and tests have been performed not forthe designed operating point. It is obvi-ous that using a single LTI controller,performance and robustness cannot beassured in the entire operating range.
In the considered example, the physi-cal parameter (inductance) is dependenton the operating point (current), whichcan be easily measured. Therefore, highperformance and robustness can beachieved with minimal cost by increas-ing the complexity of the controller.
There are other practical exampleswhere robust gain-scheduled control is
used such as: aircraft control (where thedynamics strongly depend on: angle ofattack, speed and altitude) or car steer-ing control, where the controller isdesired to work well inside the operatingdomain defined by car speed and roadconditions (friction coefficient), shown in Fig. 4.
ConclusionsThe article briefly reviewed powerful
linear control design techniques, whichare currently applied for nonlinear sys-tems in other industries, thus might beuseful for the power systems communi-ty, too.
The main features of gain schedulingcan be summarized as:
- gain scheduling employs powerfullinear design tools (well-understood)on difficult nonlinear problems;
- performance specifications are formulated in linear terms;
- gain scheduling enables the controller to respond rapidly tochanging operating conditions.
The described techniques might beapplied for power systems, too. If theoperating point (scheduling parameter)is varying slowly, then biquadratic
stability analysis of the control system isperformed. If we switch among differentoperating points – most likely in thecase of power converters – then quad-ratic stability analysis of the control sys-tem is required.
The main advantage – from thedesign engineer viewpoint – is: thedesign is performed in a well-under-stood linear framework with commercial-ly available software tools.
References:1. Khalil, H.K.: Nonlinear Systems. 3rd
edition, Prentice Hall 2002.2. Ljung, L.: System Identification -
Theory for the User. New York:Prentice-Hall 1987.
3. Doyle, J.C., Francis, B.A.,Tannenbaum, A.R.: FeedbackControl Theory. New York: Mcmillan1992.
4. Chiang, R.Y., Safonov, M.G.: RobustControl Toolbox, User's Guide. TheMathWorks, Inc. 1992.
5. Gahinet, P., Nemirovski, A., Laub,A.J., Chilali, M.: LMI Control Toolbox,User’s Guide. The MathWorks, Inc.1994.
Contact:ForraiMechatronics DepartmentAdvanced Technology R&D CenterMitsubishi Electric Corp., Japan
Tel: +81 6 6497 7759Fax: +81 6 6497 7725E-mail: [email protected]
POWER MANAGEMENT
Figure. 2 Gain-scheduled control system.
Figure. 3 Step responses – comparisons.
Figure. 4 The operating domain of thesteering controller.
www.mitsubishichips.com
Sequences, tracks and monitors suppliesin hot-swappable cPCI circuit board
Power supply management in modern day Compact PCI (cPCI) boards involves not only the
sequencing and monitoring of on-board supplies but must also provide hot-swap functionality.
The hot-swap functionality is determined by the Compact PCI specification while the
sequencing and monitoring of the supplies is determined by the circuit board functionality
and the devices used on that board. Hence, designers resort to using multiple ICs to
address the power management problem.
By Shyam Chandra, Lattice
Power Supply Challenges in aCompact PCI Circuit Board
Most off-the-shelf hot-swap ICs limitinrush current during card insertion, butthey do not respond to power supplyfaults local to the circuit board. In orderto prevent a power supply problem localto a circuit board affecting the entiresystem, it is desirable to isolate thefaulty card from the back plane supply.In addition, designers will be required toimplement multiple power supplybusses to meet the supply sequencingand tracking requirements of thedevices on the board such as FPGAs,CPUs and ASICs. Multiple reset genera-tors/ supervisory chips and various logicfunctions will be required, in addition, tomonitor all supplies. Hence, traditionallyit takes multiple devices to implementcomplete power management on aCompact PCI circuit board, and it maystill not address all the issues.
This article shows how LatticeSemiconductor’s ispPAC PowerManager device implements complete
power management of a cPCI cardincluding circuit board isolation duringpower supply faults eliminating the com-plexities previously encountered.
Application Example: Power SupplyChallenges in a typical cPCI Circuit board
Figure 1 shows the devices used on atypical cPCI Circuit Board along with itsbackplane interface and power supplies.There are 3 multi-voltage devices on
this card: A PowerQUICC CPU,ORT42G5 FPGA and the SwitchedBack Plane ASIC. The following table(Table 1) summarizes the power supplyrequirement for each multi-voltage device.
The power management circuit shouldnot only limit the inrush current on the5V, 3.3V, +12V & -12V backplane sup-plies, but also generate standard cPCIhandshake signals during the hot swap process.
Figure 1. cPCI Circuit Board with Multi Voltage devices.
DESIGN & SIMULATION
www.powersystemsdesign.com 3736 Power Systems Design Europe June 2005
Apart from the requirements of theindividual devices, the design also callsfor monitoring power supply voltagesduring normal operation. If any supplyvoltage falls below threshold, the CPUshould be reset and the power supply toall devices should be recycled.
Overall system power supply activitycan be subdivided into 5 phases. Figure
2 shows the five phases in the corre-sponding boxes. The actual power sup-ply functions during those phases areindicated below the appropriate box.>
Power Supply Management CircuitDiagram
The complete power supply manage-ment of this cPCI Circuit Board, imple-mented using the ispPAC-POWR1208
device, is shown in the circuit diagram(figure 3).
The ispPAC-POWR1208 (calledPower1208), integrates LatticeSemiconductor’s ispMACH CPLD andispPAC programmable analog technolo-gies, resulting in a single chip thatimplements a flexible, cost effective, and convenient solution for the power
Figure 2. Five Power Supply phases of the cPCI Circuit Board.
Table1. Individual device power supply requirement.
management problem. With a “supply-ruggedized” ispMACH PLD at its core,the Power1208 device features 12 precision analog threshold comparatorswith on-chip voltage references for sup-ply monitoring, 4 noise-immune digitalinputs and 4 open-drain digital outputsfor system control interfacing, 4 pro-grammable (both maximum voltage andramp rate) high voltage FET drivers forsupply control and 4 programmabletimers with an on-chip 250 kHz oscillatorfor delay control. The device has beenruggedized to operate in noisy powersupply environments from 2.25V to 5.5Vand is packaged in a 44-pin Thin QuadFlat Pack (TQFP) package.
In order to meet both cPCI hot-swapspecifications and power supplysequencing and tracking requirementsof individual multi-voltage devices, thepower supply is divided into 2 sections.
The first section, using independentMOSFETs (Q1, Q2), limits the inrushcurrent from the backplane. An interme-diate power bus called the “Soft StartedBus” is powered through these MOSFETs.
The second section, referred to as the “Device Power Bus”, is powered by individual power supply bricks andMOSFETs. The tracking requirement ofthe PowerQUICC processor can beimplemented using a bootstrapping
method. However, it results in a non-monotonic ramp of 3.3V at the CPU’sI/O pins. While that non-monotonic rampacceptable for the CPU, it does not con-form to the ORT42G5’s power supplyrequirement. Hence the 3.3V is routedthrough another power MOSFET. Thebackplane ASIC requires the 2.5V and3.3V to track. 4 power supply busses inthis card are required to address all therequirements simultaneously. The sup-ply busses are:• 1.5V supply, generated using 1.5V
brick for powering CPU’s core and theORT42G5.
• 3.3V for the CPU’s I/O is fed throughthe MOSFET Q5.
• 3.3V for the ORT42G5, Backplaneswitch ASIC and the remaining ICs onthe board is supplied through the #MOSFET Q3 to facilitate monotonicramp. This supply is enabled alongwith the 3.3V of the CPU.
• 2.5V brick powered by 5Volts, is for the Backplane switch ASIC core.Power supply tracking between 2.5Vand 3.3V supplies, as required by theASIC, is implemented by MOSFETsQ4 & Q3.
Power Management AlgorithmThe power management algorithm is
implemented on the embedded CPLD of the Power1208. As can be seen, theispPAC Power Manager device controlsthe soft-start, sequencing, tracking, and
monitoring of power supplies efficientlywhile generating supervisory signalsrequired both by the cPCI bus and on-board components.
Implementing Power SupplyManagement on the cPCI CircuitBoard Using the PAC-DesignerSoftware
Power supply sequencing and moni-toring designs can be implemented onPower1208 devices using Lattice’s pop-ular PAC-Designer version 2.1 software.The PAC-Designer software is an intu-itive PC-based schematic design entryand simulation tool. The user candesign complex sequencing and moni-toring functionality easily using PAC-Designer’s newest feature, LogiBuilder,which uses a series of easy-to-usepull-down menus to define sequencesand conditions to monitor.
To implement the design using thePAC-Designer software:1. Set the Monitoring threshold values
for each analog input by selecting theappropriate threshold value from apull down menu.
2. The Power Supply Ramp RateControl is implemented by setting theMOSFET gate drive characteristicsfor the HVOUT outputs. This is set bya pull down menu as well.
3. Power Supply Sequencing, Trackingand Supervisory Signal GenerationLogic can be defined easily using justfive point-and-click instructions in theLogiBuilder section.
4. Verification using PAC-Designer’swaveform simulator can verify thecompleted design.
5. ispDownload to Power1208 Device -The complete and verified design canbe downloaded to the Power1208device through the device’s JTAG port.
The complete power supply manage-ment program is implemented in 14steps as shown in the screen capture of Figure 4.
As can be seen, the LogiBuilder pro-gram steps that correspond with the 5power supply phases of power manage-ment are:• Phase 1 – Step 0 and Step 1 –
Figure 3. Power Management of the cPCI Circuit Board Using ispPAC-POWR1208.
POWER MANAGEMENT POWER MANAGEMENT
38 Power Systems Design Europe June 2005
POWER MANAGEMENT
www.latticesemi.com
Waiting for soft started power suppliesto stabilize Equation 0 in SupervisoryLogic Window enables Soft StartMOSFETs
• Phase 2 – Step 2 to Step 5 – Applyingthe correct power supply to eachdevice
• Phase 3 – Step 6 and Step 7 – Pulsestretching of CPU-Reset
• Phase 4 – Step 8 – Card normal oper-ation, Step 9 – Low-Voltage interrupt
• Phase 5 – Step 10 to Step 13 –Turning the power supply off
This LogiBuilder program is then com-piled and the resulting JEDEC file isthen downloaded into the ispPAC PowerManager device through its JTAG pins.
The design was implemented and thefollowing oscilloscope screen shots (fig-ure 5a & 5b), shows that the I/O voltagetracks the core voltage during powersupply ramp up.
The programmable mixed-signalispPAC-POWR1208 device manages
all power supplies on the cPCI circuitboard, effectively managing the cardunder power supply fault conditions andfinally isolating it.
Additionally, the ispPAC-POWR1208device has well thought-out resources tomeet the requirements of individual cir-cuit board designs through programma-bility. The discrete component basedsolution, on the other hand, while beinginflexible and occupying larger boardarea, fails to address all aspects ofpower management.
The PAC-Designer software supportsinterfacing the ispPAC Power Managerdevice to various power supply arrange-ments. Power supply management
algorithms can be specified quicklyusing the LogiBuilder’s 5 basic instructions.
The integration and programmabilityof the ispPAC-POWR1208 device cou-pled with the PAC-Designer softwaretool increases reliability of the circuitboard whilst reducing board space, cost and time to market.
Figure 4. LogiBuilder Program for cPCI Circuit Board Power Management.
Figure 5a. Oscilloscope waveform showing 1.5V and 3.3V Bootstrapping at PowerQUICC Processor
Figure 5b. Oscilloscope waveform showing 2.5V and 3.3V tracking at ASIC.
3.3V-I/O
2.5V Core
3.3V-I/O
2.5V Core
40 Power Systems Design Europe June 2005
The offer for more flexibility and intelligenceThe ADM1041 secondary side controller offers current sense, voltage sense, share bus and
OrFET control. An SMBus interface means that the part can be programmed over the SMBus.
By Brendan Daly, Analog Devices
The question of integration on thesecondary side of AC-DC redun-dant power supplies has been
largely neglected by semiconductormanufacturers. This has resulted in hun-dreds of discrete building block compo-nents such as opamps, transistors,resistors, capacitors and digital logic toperform the various secondary side con-
trol and monitoring. A recent addition tothis is the demand for more communica-tion between the power supply and therest of the system. This trend towardsintelligent power supplies with a digitalinterface is now becoming a standardrequirement for most new designs.There are parts available which offersome integration, such as current
sense, voltage sense or OrFET control,but all still require a lot of external cir-cuitry, and a microcontroller and EEP-ROM to provide the intelligence.However, none of these parts offer thelevel of integration or intelligence offeredby the ADM1041, from Analog Devices.It incorporates current sense, voltagesense, share bus and OrFET control.
Figure 1. Block diagram of the ADM1041.
POWER MANAGEMENT
Power Systems Design Europe June 2005
Figure 2. A typical application solution for the secondary side of a redundant power supply using an ADM1041.
This new part, which is also I2Ccompatible, can also communicateover the SMBus, and has built-inEEPROM. This allows huge flexi-bility in setting up a power supply,and can dramatically cut designand development time. This articledescribes the trade offs of existingdiscrete solutions against an inte-grated solution, like the ADM1041.Figure 1 shows a block diagram ofthe typical secondary side func-tions contained in a redundantpower supply.
Even though a power supplydesigner might not like it, cost isusually the primary concern whendesigning a power supply.Component cost, maintaininginventory, development, test andproduction all factor into the cost ofa design project. The flexibility thatthe ADM1041 offers the powersupply designer results in easierand quicker development of a newdesign. It is a lot quicker to repro-gram a register, than re-solder several componentswhen developing an AC Sense cir-cuit. Also, the level of integrationprovided by the ADM1041 resultsin a much lower BOM count andcost than an equivalent discretesolution. This also saves issueswith inventory and ordering. Figure2 shows a typical application solu-tion for the secondary side of aredundant power supply using anADM1041. Further examples ofcost saving advantages are alsodiscussed later.
The end users of AC-DC powersupplies are increasingly lookingfor the ability to interface to thepower supply from the rest of thesystem. A discrete solutionrequires microcontroller, EEP-ROM, and a host of digital logicblocks to perform the monitoringfunctions. The SMBus interface ofthe ADM1041 allows it to commu-nicate with a microprocessor orother systems on the bus. This
results in more flexibility to perform loadsharing, or more advanced sharing con-figurations, such as thermal balancing toimprove reliability. The ADM1041 incor-porates EEPROM on-chip, which storesthe setup contents for the registers. Theregister contents are lockable, meaningthe the power supply can be sent intothe field without the worry that the enduser will overwrite the register values,and hence cause a failure in the field.There is also spare EEPROM on board,which can be used to store the program-ming information of a microcontroller, orto store fault events, and when theyhappened. The on-board EEPROM alsoallows stand-alone operation. This canremove the need for a microcontroller.User friendly interface software is avail-able to allow the designer to very quicklyprogram the ADM1041, without havingto worry about register maps, consultingthe datasheet, or writing code. Figure 3shows the OCP programming window ofthe interface software.
Extra digital logic is required to pro-vide the capability of debugging a sys-tem that fails in the field, or during thedesign stage. During a fault event in apower supply, the internal status regis-ters of the ADM1041 allow the user tosee real-time flags to determine thesource of the fault. Latched status regis-ters are also available, which rememberif a fault has occurred at some time inthe past. This is useful for tracking downintermittent fault conditions, in benchtesting and in field testing. This addedintelligence means that much moresophisticated fault conditions can bemonitored and controlled. For example,the OCP time-out is programmable, asis the ADM1041’s reaction to an OCPevent. It can be set to constant currentoperation, or to shut down the powersupply in the presence of an OCP event.Figure 4 shows the various monitoringflags of the ADM1041.
Production cost is critical, but some-thing that is often an afterthought forpower supply designers. Using a dis-crete approach, trimming out errors dueto sense resistors and other compo- Vis i t us at
Hal l 12Booth 302
POWER MANAGEMENT
www.powersystemsdesign.com 4544
nents is often performed by an operatortweaking potentiometers. This can be arelatively expensive process, that canstill leave errors. The ADM1041 integratesthe ability to perform this trimming on-chip. A simple software algorithm isavailable for production test, where anADC or automated tester takes theplace of the operator, and the softwarecalibrates the ADM1041 trim registers.This means there is no more need foroperators at final test, thus saving pro-duction costs and time, as well asensuring consistent trimming in eachunit. It is possible to trim the load volt-age and the current sense circuit, to correct for common mode and differen-tial mode errors that are introduced byresistor tolerances and amplifier inaccu-racies. This is a particular advantage inhigh volume applications, as throughputis vastly improved over the traditionalmethod. Figure 5 shows a possible production trim setup.
A major design headache at present is the demand for ever increasing powerdensity. In server applications, figureslike 10W/in3 are now commonplace, asend users demand more power in smallerform factors. This is a Catch-22 situa-tion, as higher power outputs requirelarger power components to beemployed. So, PCB real estatebecomes even more valuable. By inte-grating all of the secondary side controlfunctions on a 24 pin QSSOP package,the ADM1041 saves valuable area forthis increase in power density. Multi-chipsolutions and discrete solutions alsolead to layout and routing headaches,and grounding issues. The ADM1041also can be used with a thermistor tocontrol a fan, as thermal managementbecomes more critical with increasedpower density.
Many power supply designs are cus-tom designs, whereby an existing prod-uct is tweaked slightly for different cus-tomer requirements. And in the vastmajority of projects, the designer tries tore-use previous designs, or sections ofdesigns, that have been thoroughlycharacterized, tested and proved in thefield. Even small changes to a discreteapproach can lead to several new com-
www.analog.com
Figure 5 shows a possible production trim setup.
Figure 3. The OCP programming window of the interface software.
Figure 4. Various monitoring flags of the ADM1041.
ponents being used, which will all needto be characterized thoroughly. TheADM1041 has internal registers whichcan be configured to suit a customapplication. This allows the designer tore-use the tried and tested circuit, andjust reprogram the registers of the
ADM1041 for eachnew project. Thissaves design,development andcharacterizationcost and time.Changing OCP(overcurrent protec-tion) limits or thepower supply start-up time is asstraight forward aschanging theappropriate regis-ter, and shipping tothe customer.Software is alsoavailable to designthe feedback loop,and incorporates
bode plots for optimizing the loopdesign. The designer inputs basicparameters and specifications, and thesoftware designs the filter. Figure 6shows the front panel of the VoltageLoop Design Software.
When a Power Supply designer getsthe specifications for a new project, thechallenge is obvious. Less expensive,higher power density, smaller form fac-tor, faster turn-around, higher integra-tion, more functionality and intelligence.A discrete approach to power supplydesign cannot achieve this. The require-ment for highly integrated and flexiblesingle chip solutions is clear.
Figure 6. Front panel of the Voltage Loop Design Software
Power Systems Design Europe June 2005
POWER MANAGEMENT POWER MANAGEMENT
www.powersystemsdesign.com 4746 Power Systems Design Europe June 2005
Powersem offers a new package line:ECO-TOPT 1. This power module willalready be presented at PCIM 2005 inNuremberg and will enlarge and accom-plish POWERSEM’s product range withrespect to higher performances.
ECO-TOP 1 was developed in order to provide the Power Electronics Marketwith a power module in which an IPM circuit containing Three Phase RectifierBridge, IGBT Brake Chopper and Three
Phase IGBT Inverter with current ratingsfrom 30 to 80 Amps (inverter IGBT) canbe realized. Besides, SIXPAC circuits withcurrent ratings from 30 to 90 Amps (IGBT)are also available. With outline dimen-sions of 109 mm to 63 mm this solderablepower module can also be used for highlyintegrated customized solutions or HighPower AC Controller Modules coveringcurrent ranges from 3 x 30 up to 3 x 200 Amps.
Using the ECO-PAC standard height of9 mm this new package ECO-TOP canbe combined and soldered together (i.e.on the same PCB) with all already exist-ing ECO-PAC 1 and 2 Power Modules.Featuring all the advantages of the ECO-PACs with reference to long term reliabili-ty and thermal/load cycling capability bythe usage of DCB Technology, glass pas-sivated chips and connection leads withexpansion bends for stress relief, ECO-
TOP 1 is especially suited to realize cus-tomized solutions within a short time.
Closing the gap between ECO-PAC 2and ECO-TOP 1 Powersem is going todevelop ECO-PAC 3 which will be avail-able in a few months.
Visit Powersem at PCIM, Nürnberg, 7 – 9th June 2005 – Stand 218
ECO-TOP 1 Package Line
www.powersem.com
NEW PRODUCTSNEW PRODUCTS
LEM hasintroducedthe first of anew rangeof high fre-quencyLEM~flexcurrentprobes. TheHFR3000provides a widedynamic
measuring range up to 3000A AC at frequencies from 1Hz to 1MHz. The newprobe is intended for use with oscillo-scopes and recorders providing accu-
rate, non-intrusive measurement of sinusoidal, pulsed and other complexwaveforms.
The HFR3000 probes are availablewith three head lengths – 200, 500 and800 mm. The flexible measuring headhas a diameter of only 6mm, allowing itto be used in confined spaces. The unitis supplied with a 1.5 metre output cable,simplifying non-intrusive AC measure-ments in many different applicationssuch as power electronic converters,induction heating, welding systems,motor and generator control drives andcapacitor discharge systems. Typicalaccuracy is ±1% of nominal current.
The unit can be powered either via
an optional external power supply (pro-vided with adaptors for worldwide use)or by a 9V PP3 battery with low-batteryindicator. This offers a flexible, light-weight solution to AC measurementrequirements without the need to loadthe test circuit.
The HFR3000 current probes are fullycompliant with IEC 1010 safety require-ments and rated 600V CATIII. This pro-vides confidence when working in haz-ardous voltage areas. Conformance toEMC standards ensures high reliabilitythrough reduced susceptibility to electro-magnetic influences.
www.lem.com
High-current, wide-bandwidth current probes
International Rectifier has introducedthe iPOWIR iP1203, a fully-optimized,full-function 15A single output synchro-nous buck converter device thatachieves over 90% efficiency at fullload. The iP1203 is a flexible solutionthat addresses requirements from5.5Vin to 13.2Vin and 0.8Vout to 8Vout,maintaining a full load capability of 15A.
The power building block is designed
to simplify DC-DC point-of-load (POL)converters for network processor units(NPUs) and ASIC power rails within net-working and telecommunication systems.The iP1203 is ideal for use in two-stagedistributed power architectures beingfed from either a regulated isolated brickor an unregulated DC bus converter.
Offering superior power density, theiP1203 building block integrates a full-function PWM control IC, trench MOSFETsand passive components enablingexcellent thermal performance at raisedambient temperature without de-rating.
The iP1203 addresses important net-working and telecommunications powersystem requirements such as hiccupover-current, over-temperature andover-voltage protection, external syn-chronization, power good and soft start.
The building block is housed in a landgrid array (LGA) package measuring9mm x 9mm x 2.3mm. The iP1203 usesthermally-enhanced mold compound,enabling dual-sided cooling capabilityand very low junction-to-case and junc-tion-to-PCB thermal resistance for maxi-mum current handling.Visit IR at PCIM, Nürnberg, 7 – 9th June 2005 – Stand 201
Mike Wigg, International Rectifier Co Ltd, European Regional Centre439/445 Godstone RoadWhyteleafe, Surrey. CR3 0BLTel: +44 (0)20 8645 8003Fax: +44 (0)20 8645 8077e-mail: [email protected]
www.irf.com
Building Block Synchronous Buck Converters
Recomextendedthe UL-cer-tification for theirDC/DC-convertersnow fromthe POW-ERLINE tothe well
known ECONOLINE. 5 series withextraordinary high isolation of more than4kVDC which are ideally suitable for anyapplication with safety considerationsare available now not only fully compli-ant to ROHS, they are as well certifiedaccording to UL-60950-1/CSA C22.2.Details for this UL-certificate for all mod-els incl. All the available options for theseries RP-xxxx (1W, 5,2kV), RxxPxx(1W, 5,2kV), RV-xxxx (2W, 6kV), REC3-
xxxxSRW/DRW-H4 and -H6 (3W, 4kVbzw. 6kV), REC5-xxxxSRW/DRW-H4and -H6 (5W, 4kV bzw. 6kV) can befound at www.ul.com using the UL-filenumber E224736 or via search fürRECOM. All RECOM datasheets can bedownloaded as PDF-files.
www.recom-international.com
UL-60950-1Certification for DC/DC-Converters
Tests show exceptional results fornew MIPHY macro-cell, which will beintegrated in System-on-Chip designsfor SATA, SAS, Fiber Channel, and PCIExpress applications
STMicroelectronics revealed success-ful fabrication of the MIPHY (Multi-Interface PHY) Physical Layer interfaceIP (Intellectual Property) using 90nmtechnology. This macro-cell, the first tosupport Serial ATA (SATA) disk drives,as well as applications using the SerialAttached SCSI (SAS), Fiber Channel,and PCI Express serial interface stan-
dards has been designed by ST’s engi-neers to be integrated with other func-tions into a System-on-Chip (SoC) andallow drive manufacturers to reducecosts by building and stocking one IC tooperate in multiple drives.
By implementing and verifying the90nm interface design now, ST ispreparing for the migration of SoC prod-ucts to 90nm technology later this year,benefiting from the lower power require-ment and smaller physical size. ProvenIP will be ready ahead of time to mini-mize the time-to-market for new prod-
ucts and reduce the development costsof new ASICs. In addition, the multiple-standard capability of the new macro-cell will enable fast design validation for different markets and will eventuallyyield the benefit of larger scale volumeproduction while at the same timereduce costs for manufacturers by optimizing their engineering resources.Visit STMicroelectronics at PCIMEurope Booth 12- 106
48 Power Systems Design Europe June 2005
XP Power hasannounc-ed itsnext generation of configurablepower suppliesthat enables thecompany to offeran infinite choiceof customizedpower solutions
from 400 Watts to 2200 Watts, with sam-ples available in 24 hours.
The fleXPower family of AC/DC powersupplies has been designed to deliverclass-leading power density in packages
25% smaller by volume than other prod-ucts in the market. At the same time, ahost of innovative features has beenadded: flexible series and parallel con-nectivity between units of differentpower levels, full medical and industrialapprovals for safety and EMC, up to sixoutputs from 3.3VDC to 150VDC from a universal AC (85 to 264V) or DC (120to 370V) input, floating controls and signals, field replaceable fans, anadvanced logic interface, and anextended operating temperature rangefrom -20°C to +70°C.
This additional flexibility will widen the
appeal of configurable power suppliesfor electronic systems, particularly asthe extra functionality and improvedpower density are offered at a reducedcost over earlier models.
The ability to interconnect units of different power levels enables systemdesigners to closely specify the powerlevel they need for each applicationwithout paying for excess power capa-bilities. This cuts overall system costand improves efficiency. Greater systemreliability is thereby achieved.
Configurable 400W to 2200W Power Supplies
www.xppower.com
NEW PRODUCTS
Companies in this issue
Company Page Company Page Company Page
ABB LYON . . . . . . . . . . . . . . . . . . . . . .45ABB Switzerland . . . . . . . . . . . . . . . . . . .1Allegro MicroSystems . . . . . . . . . . . . . . .1Anagenesis . . . . . . . . . . . . . . . . . . . . . . .1Analog Devices . . . . . . . . . . . . . . . . . . . .1Ansoft . . . . . . . . . . . . . . . . . . . . . . . . . .11Ansoft . . . . . . . . . . . . . . . . . . . . . . . . . . .1APEC . . . . . . . . . . . . . . . . . . . . . . . . . . .39Artesyn Technologies . . . . . . . . . . . . . . .1Coilcraft . . . . . . . . . . . . . . . . . . . . . . . .C3CT-Concept Technology . . . . . . . . . . .17CT-Concept Technology . . . . . . . . . . . . .1Cree . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4Danfoss . . . . . . . . . . . . . . . . . . . . . . . .27Diotec . . . . . . . . . . . . . . . . . . . . . . . . . .47ecpe . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4Epcos . . . . . . . . . . . . . . . . . . . . . . . . . .31EPE . . . . . . . . . . . . . . . . . . . . . . . . . . . .41EPE . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7eupec . . . . . . . . . . . . . . . . . . . . . . . . . . . .1Fairchild Semiconductor . . . . . . . . . .C2
Fairchild Semiconductor . . . . . . . . . . . .1,6Ferraz Shawmut . . . . . . . . . . . . . . . . . .20Freescale . . . . . . . . . . . . . . . . . . . . . . . . .8Fuji . . . . . . . . . . . . . . . . . . . . . . . . . . . .28H2Expo . . . . . . . . . . . . . . . . . . . . . . . . . .7Hitachi . . . . . . . . . . . . . . . . . . . . . . . . . .33Infineon . . . . . . . . . . . . . . . . . . . . . . . . . .1International Rectifier . . . . . . . . . . . . .C4International Rectifier . . . . . . . . . . .1,14,46Isabellenhutte . . . . . . . . . . . . . . . . . . .42ISKO engineers . . . . . . . . . . . . . . . . . . .22iSuppli . . . . . . . . . . . . . . . . . . . . . . . . . .12IXYS . . . . . . . . . . . . . . . . . . . . . . . . . . .43Kunze Folien . . . . . . . . . . . . . . . . . . . . .22Lattice . . . . . . . . . . . . . . . . . . . . . . . . . .35LEM Components . . . . . . . . . . . . . . . . .3LEM Components . . . . . . . . . . . . . . . .1,46Linear Technology . . . . . . . . . . . . . . . . .5Linear Technology . . . . . . . . . . . . . . . . . .1Methode Electronics . . . . . . . . . . . . . .13Mitsubishi . . . . . . . . . . . . . . . . . . . . . . .23
Mitsubishi . . . . . . . . . . . . . . . . . . . . . . . .32National Semiconductor . . . . . . . .18,19National Semiconductor . . . . . . . . . . . . .1NEC . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4Ohmite . . . . . . . . . . . . . . . . . . . . . . . . .21Ohmite . . . . . . . . . . . . . . . . . . . . . . . . . . .1On Semiconductor . . . . . . . . . . . . . . . . . .1PCIM Europe 2005 . . . . . . . . . . . . . . . . .4Power Integration . . . . . . . . . . . . . . . .15Power Integration . . . . . . . . . . . . . . . . .10Protronic . . . . . . . . . . . . . . . . . . . . . . .7,9Recom International . . . . . . . . . . . . . . .46Sanrex . . . . . . . . . . . . . . . . . . . . . . . . . . .6Semikron . . . . . . . . . . . . . . . . . . . . . . . . .1ServiceForce . . . . . . . . . . . . . . . . . . . . .22STMicroelectronics . . . . . . . . . . . . . . . .48SynQor . . . . . . . . . . . . . . . . . . . . . . . . . .1Texas Instruments . . . . . . . . . . . . . . . .1,6Tyco Electronics . . . . . . . . . . . . . . . . . . .1Würth Electronic . . . . . . . . . . . . . . . . .47XP Power . . . . . . . . . . . . . . . . . . . . . . . .48
Please note: Bold—companies advertising in this issue
Multi-Standard Disk-Drive
www.st.com
