VIA Mobile360 Surround View

March 2016

Established 1987, Fremont, California

Business Fabless semiconductor design;

embedded board & system design for

M2M, IoT, and Smart City applications

Headquarters Taipei, Taiwan, since 1992

CEO Wenchi Chen

Employees 2,000 (70% engineers)

Publicly Listed March, 1999 (TSE 2388)

VIA at a Glance

VIA Group

Beijing, China

Fremont, CA, USA

Tokyo, Japan

Shenzhen, China

Shanghai, China

Austin, TX, USA

Taipei, Taiwan

Worldwide Operations

VIA Transition

Silicon

Platforms

Systems

Software

Solutions

High-Tech Industry Transition

PC

Internet

Smart Phone

IoT

Smart Vehicle

Vehicle Industry Transition

Vehicle Smart Vehicle Autonomous

Vehicle

Vehicle Industry Technology Transition

Hardware Software &

Services

Deep Learning

Visual Computing

On-Demand

Mobility

Smart Vehicle

Disruptive Technologies

Computer

Vision

Deep

Learning

Computing &

Connectivity

Battery

Power

Smart Vehicle

Industry Value Chain Disruption

Vehicle

Manufacturers

Mobility

Service

Providers

Transportation

Service

Providers

Smart Vehicle

New Consumption Models

Personal &

Commercial

Mobility

Services

Personal

Ownership

Public

Transportation

Smart Vehicle

Exploding Complexity!

Technology

Development

& Integration

Smart

Service

Innovation

Business

Model

Re-alignment

VIA Smart Vehicle

Development Framework

Technology

Customization

Systems

Solutions

VIA Smart Vehicle

Core Technology Expertise

Graphics &

Video

Software ARM SoC

Platforms

Linux

Kernel

ARM SoC

& Driver

Optimization

VIA Smart Vehicle

Software Expertise

Linux & Android

BSPs & Solution

Packs

VIA Smart ETK

for Android I/O

Access and

Manageability

System

Level

Optimization

VIA Smart Vehicle

System Development Expertise

System-Level

Design Thinking

Quality &

Reliability

Functionality &

Performance

VIA Smart Vehicle

System Hardware Solutions

• Performance

• Power

• Fanless

• Connectivity

• Expandability

• Reliability

• Longevity

VIA Smart Vehicle

Customization Expertise

Software Connectivity Hardware

• Form Factor

• Power & Thermal Optimization

• Extended Temperature Range

• Graphics & Video Acceleration

• Wireless Connectivity

• I/O Integration

• Ruggedization

VIA Smart Vehicle

Hardware Customization

• Kernel & Framework

• System Management

• Applications

• Legacy I/O

• Security

• DMS

• OTA

VIA Smart Vehicle

Software Customization

In-Seat

Entertainment

Systems

In-Seat

Entertainment

System

Commercial-Grade

In-Vehicle Navigation

and Tracking

Systems

In-Flight

Entertainment In-Bus

Entertainment

Fleet

Management

VIA Smart Vehicle

Transportation Solutions

• Low power fanless designs

• Small form factor innovation

• Hardware and software building blocks

VIA Smart Vehicle

Forging a New Path

Silicon

Valley

Automotive

Industry

New Electric

Vehicle

Entrants

Future Perspectives

The Smart Car Race Heats Up!

It’s Not So Difficult to Show a

Prototype…..

….. But Achieving Global Scale

is Not Quite So Easy!

Software is Eating the

World…..

….. But it will Require Increasingly

Sophisticated Hardware!

Holistic Vision

Seamless System Integration

Hardware

Software Sensors

Cloud Physical

Environment

Craftsmanship

Optimization for Every Application

New Co-Creation Model

Market Needs

System

Development

VIA Japan

Taxi Domain

Knowledge

VIA Mobile360 Surround View

System Overview

• 360° real-time display and recording

• Up to 8 PoE or CSI (Real-Time) camera options

• VIA 360° Multi-Stitch technology

• VIA hardware encoding engine for local/cloud storage

• Remote viewing

• Customizable API’s

Q & A

Building/Tackling the IoT One

Solution/Application at a Time

Smart World

Smart Everything