Ventec International Group
Transcript of Ventec International Group
Ventec International Group
03/07/2019
Option Technologies
03/07/2019
Manufacturing CapabilitiesItem Capability
1 layers 4, 6, 8,10,12, 14 (layers)
2 Cu 1/3 OZ 、 HOZ、1OZ、 2OZ 、3OZ
3 maximum panel (PNL) size 20” x 30”
4 minimum panel (PNL) size 10” x 12”
5 minimum core thickness 3 mil H/H
6 minimum L/S 3/ 3mil
7 minimum thickness of different layers 11 mil (4L) 、49mil (12L)、79mil (14L)
8 inter-layer alignment ± 3 mil
9 tolerance of forming size ± 1mm
10 warp <0.75%
11 minimum hole size 0.15mm / 6mil
12 maximum hole size Up to 10mm / 0.254”
Copper Plating (bonding panels only)
13 maximum panel (PNL) size 24” x 24”
14 minimum panel (PNL) size 14.6” x 13”
15 copper thickness as per request (typically 20μ)
16 Drill aspect ratio 6:1
• working to IPC Standards
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Quality and Approvals
• ISO-9001• ISO-14001• QA reports generated with all jobs• All inner-layers are 100% AOI• Individual processes demonstrate detailed QA procedures• A detailed “Skills Matrix” is displayed in all departments
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CAM Department
• Genesis software • 24/7 operation • average throughputs: 10 new parts
per day
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Photography
• Orbotech LP-7008 photoplotter • maximum size of photographic film: 26*32” • minimum line width and line spacing 2/2mil• cleanroom garments are worn in this
department
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Cutting
• diamond cutting saws• maximum cutting size: 1092*1245
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Chemical Clean
• sulfuric peroxide based cleaning process.
• four stage cascade rinsing, followed by drying
• etching rate is controlled to 0.6μm• Process control etch rate sampling is
carried out on a per shift basis.• Loading and unloading is fully
automated.
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Photomech - Dry Film Lamination
• automatic cut sheet laminator with thin core capability
• pre-heat & hold station• eternal dry film 20μm
thickness• class 10000 cleanroom
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Photomech - lmaging
• fully automated exposure units• throughput: 100 panels per hour• camera alignment accuracy: <15μm
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Develop Etch Strip
• Cupric based etch media• minimum line width: 3.0mil• minimum line spacing: 3.5mil • minimum panel thickness: 3.0mil
(excluding copper)• maximum size: 21.5” x 24.5”
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AOl Process
• two AOI machines• three offline verification stations• the inner layer is scanned, barcoded,
interleaved, and then sent to fault verification
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Alternative Oxide
• line speed: 3.5 meters/min• Etch rate: 1.5 +/- 0.3 μm• maximum size: 21.5” x 24.5”
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Build Up
• all inner-layers are visually inspected at build up
• layers are built up with small rivets and flattened
• all multilayers are then 100% inspected by X-Ray
• any panels showing mis-registration will be rejected
• all operators wear cleanroom garments
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Lay Up Stations
• all panels are built on large format stainless steel panels
• panels are built free with oversize foil -for example, a 24” x 21” panel would be built four panels per page
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Presses & Press Capacity
• large format presses with auto-load &unload facility
• four presses all with 10 - openings• capacity: 5000 panels per day based on
a 24*18” 1.6mm panel• 320 panels per press load
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Press Control
• all presses have chart recorders for each individual press and platen
• the data is available from each press cycle recording both platen & product temperature
• buffering is 160gsm Kraft Paper• kraft paper is not reused
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X-ray Drilling
• four ADT-900 X-ray drill machines• all four machines optimized in both X & Y• all panels are interleaved before and after
drilling
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Routing
• two route machines with four spindles each• programs all ensure radius corners • typical height is 5 high for a 1.6 mm panel
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Edge Milling
• all panels are edge milled• four individual “v” blades for cutting each
edge • maximum panel thickness for edge milling
is 3.2mm
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Bonding Inspection
• all panels are checked for 100% surface defects, including pits, dents, resin spots or creases
• a thickness check is also performed using deep throat micrometer
• tooling hole diameters are verified using a plug gauge
• outer copper is verified using a copper scope
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Drilling
• 240 drill spindles• capacity: 8000 panels per day• process runs 24/7 • mechanical drilling • minimum hole size 0.15 mm
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Drilling
• a first off x-ray inspection is carried out prior to batch processing
• for batch inspection the bottom panel of each stack is x-ray inspected
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Spindle Accuracy
• all spindles are checked for accuracy twice per week
• reports are available for drill accuracy• hole positional checks are verified by AOI
inspection
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Hole Checking
• after drilling all panels are processed through a high pressure rinse and then inspected through the automatic hole for missing/blocked holes
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Copper Plating
• bonded panels only • copper thickness typically 20μ• max panel size: 24” x 24”• min panel size: 14.6” x 13”• aspect Ratio: 6:1
Ventec International Group
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