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Dr. Andreas Schaller

ASC Andreas Schaller Technology Consulting

info@andreas-schaller.de

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Agenda

1. Introduction

- ASC / EU View on the Internet of Things

2. Future Internet / B2C Applications

- Use Case

3. Energy Efficient Buildings / Public Applications

- Use Case

4. Factories of the Future / B2B Applications

- Use Case

5. Technology Comparison

6. Summary

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ICT Drivers

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1990 1996 2002 2008 2014

Bill

ion

of P

ho

ne

s

Year

1

2

3

Voice

Data

Media

Sensors

4

Trends

5

6

IOT

Electronics Technology

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1985 1990 1995 2000 2005 2010 -> 2015 2020 2025 - 1980

Television

TV-Set

Computer

C64

Recorder

DVD

Digital

Sony Mavica

Portable

Nokia 5110

Mobile

Razr

Wearable

Ipod nano

Smart Objects

PriMeBits

Ambient Intelligence

3Plast

Smart Dust

“Vision” Embedded Silicon

Product Example 8088 386 486 Pentium Pentium 4 Core 2 Core 4

Transitor Volume 5000 275000 1600000 3100000 42000000 200000000 2000000000

Feature Size 2 µm 1.5 µm 0.8 µm 0.35 µm 0.13 µm 65 nm 45 nm

IC Packages

Package Example DIP PLCC QFP FQFP BGA CSP SiP/MCM

Package Type Pin Pin Lead Lead Ball Ball Ball

Pitch Size 2.5 mm 1.7 mm 1.0 mm 0.4 - 1.0 mm 0.7–1.5 mm 0.5 mm 0.25–0.4 mm

Small IC Packaging

Package Example SOT-23 SOIC SOP

Package Type Lead Lead Lead

Pitch Size 3mm 1.7 mm 0.65 mm

Passive Components

Package Example 1206 0603 0402 0201 01005

Pitch Size 2.5 mm 2.5 mm 3.2 mm × 1.6 mm 1.6 mm × 0.8 mm 1.0 mm × 0.5 mm 0.6 mm × 0.3 mm 0.4 mm × 0.2 mm

Package Technology THT THT SMT SMT SMT SMT SMT

Interconnect Technology

Component Placement THT THT/SMT SMT ( Descrete + IC ) SMT ( Descrete + IC ) SMT ( Descrete + IC ) SMT (Mix ) SMT (Mix )

Material Curing Wavesoldering Wave/Reflowsoldering Reflow ( 220° C ) Reflow ( 220° C ) Reflow ( 250° C ) Reflow ( 250° C ) Reflow ( 250° C )

Mfg-Concept Batch Processing Batch Processing in-line (1-Sided) in-line (2-Sided) in-line (2-Sided/dual line) in-line (2-Sided/dual line) in-line (2-Sided/dual line)

Printed Wiring Board

Process Subtractive Subtractive Subtractive Subtractive Subtractive Subtractive / Semi-additive

Layers Soldermask Multilayer/drilling Via /Laserdrilling Micro-Via / HDI

Line Space/Width 100/100 100/100 75/75 50/50 50/50 40/40 25/25

Product

Sample

Future ICT Driver and Markets ”Internet of Things”

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Green Cars

Factories

of the Future

Energy-efficient

Buildings

Future Internet

• Microelectronics

• Ubiquitous positioning

• Wirelessly communicating

smart systems

• Non-silicon based components

• Energy harvesting technologies

• Privacy- and security-by-design

Surface

Mount

Technology

Printed

Technology

Embedded

Intelligence

Integrated Smart Systems

Integrated Smart Systems Main devices and applications

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Future Internet

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GPS

Library

Social

Networks

Location

AR

Payment

Coupons

Loyalty

TV/Cinema

Flight

Ticketing

Product

Info

Wellness

Ticketing

Gaming

Sport

B2C

OLED

Smart Packaging

Diagnosis

Large Area Sensors

Future

Internet

Large Area Sensors Integrated Pyro/Piezoelectric Sensors

• Capacitive sensor part is based on ferroelectric polymer

• Sensor response to ΔT, Δp controls the transistor‘s gate

• Transistor transforms high-impedance sensor signal to low-impedance output

• Monolithically integrated on flexible substrate

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p ~ 40 µC/m2K

d33 = 24

pC /N

VG

VDS

VG

VDS

Sensor Transistors Integrated organic physical sensor

Human-Machine

Interface

All-printed sensor with ACREO display

• Control with/without touch

• Minimized number of materials

• Large Areas Electronics

• Very robust

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http://cid-2e87bf9055410c4c.photos.live.com/self.aspx/ASC-Andreas%20Schaller%20Technology%20Consulting/3Plast.wmv

HMI Applications

Se

ns

or

Fu

nc

tio

na

lity

Sort

Select

Point Array Point Array

Several

Suppliers

3Plast

Demonstrator Several

Suppliers

Source : GestIC

Source : gesture-cube

Laser

Source : Microsoft

Source : Apple

Sensor Type Do

not

touch

Source : Motorola

Can

not

touch

Se

ns

or F

un

ctio

na

lity

Sort

Select

Sensor Type

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Energy Efficient Buildings

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Public

Health Public

Safety

E-Government

Public

Transportation

Digital

Library Energy

Health

Care

Environment

Public

Places

Traffic

Control

Pu

blic

Energy-

efficient

Buildings

Smart

Packaging

Diagnosis

Clean Energy

Lighting

Use Case Mildew Watch Dog

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Write

Function : Sensing Energy Harvesting

Even

t D

ata

Function : Storing

Info

rmat

ion

Function : Computing

Function : Connecting Energy Harvesting

Kn

ow

led

ge

Rea

d / W

rite

• Type : RFID Label

• Size : 180 mm x 10 mm

• Standard : UHF (868 MHz) EPC

• Memory : 1-Bit WORM

• Sensor : Water Detection (Alarm)

• Function : Sensor based Antenna Activation

• Price : est. ~ 0,30 €

• NEXT STEP : Wireless Activation !

Manufacturing Concept

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EPC

GEN2

Chip

Printed

Antenna

Inkjet

Printed

PriMeBits

Solution

RFID Tag

Sensing

Sensitivity

driven by

paper

selection !

Low Cost Approach

Pore radius (µm)

d(V

/A)d

r

((cm

3/m

2)/

I)

The five-lines WORM resistance changing with water drops

1

10

100

1000

10000

100000

1000000

10000000

0 1 2 3 4 5 6

The number of the water drops

Th

e W

OR

M r

esis

tan

ce (

oh

m )

pre-sintered

no pre-sintered

The five-lines WORM resistance changing in 80% humidity

1

10

100

1000

10000

100000

1000000

10000000

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

Time ( h )

Th

e W

OR

M r

esis

tan

ce (

oh

m )

pre-sintered

no pre-sintered

Resis

tivity (

Oh

m)

Resis

tivity (

Oh

m)

Time (h)

# waterdrops

80%

13

Triple Tag and Reader

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Power

Difference

Measurement

Future Alternative :

RSSI (Receive Signal Strength Indicator)

Tag#

∆dBm

Prototype Package

Reference

Actual

Historical

14

Factories of the Future

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M2M Mobile

Office

CRM

Email

Business

Processes

Cold Chain

B2

B

Apparel

Transportation

Authen-

tication

Logistics

Compliance

Shop

Floor

Factory

Floor

Factories

of the Future

Smart

Packaging

OLED

Large Area Sensors

Smart Packaging drives Pharmacy Services

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© Stora Enso © Stora Enso © Stora Enso

Pharmacy Logistics Personal Care Medical Compliance

http://www.rfidjournal.com/article/view/7848 http://81.209.16.38/Link.aspx?id=1034686 http://www.rfidjournal.com/article/view/7785

- Digital content driven services in pharmacy needs new smart packaging solutions

- Smoother integration of electronics in packaging is required

Data Logging Event Detection Human Machine Interface

Low Cost Printed Memory

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Demonstration roll-to-roll run

• direct gravure

• produced length > 150m

• roll-to-roll die-cut

• encapsulation: manual hot lamination

ROKO pilot line

© VTT

© VTT

© EPFL

©Nicanti

•resistive memory:

electrically induced sintering

(high-resistance->low-resistance)

•key point :

electrically post-fabrication programmable

Uwrite= 10 V and Rs= 330 Ω.

Questionnaire Card

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Technology Comparison

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Level 5 Connections between systems Ambient Intelligence Level 4 Subassembly System Integration Level 3 Connections between PWBs Smart System Level 2 Printed Wiring Board (PWB) System-in-Foil Level 1 Integrated Circuits Functional Layers Level 0 Monolithic Silicon Chip Printable Ink

Silver Ink

Printed

Antenna

RFID Label

Battery Assisted

Label

Smart Package

RFID System

Surface Mount Technology Printed Electronic Technology

Technology Comparison

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$$$ CO2

Assumptions :

- Production environment not included

- Battery MFG not included, only BOM

- Recycling not included

New Content=New Service=New Device

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- Digital Content drives Services and new Devices

- New digitalized content needs a new device to create a commercially

successful Service

Source : Stora Enso Source : Sensible Solutions

Construction Pharmacy Human Machine Interface

Source : 3Plast

Questions ?

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Andreas Schaller Technology Consulting Unternehmergesellschaft (haftungsbeschränkt)

Dr. Andreas Schaller

Email : andreas@andreas-schaller.de

Andreas Schaller Technology Consulting Unternehmergesellschaft (haftungsbeschränkt)

Office : Schulstr. 11, 95676 Wiesau

Management : Dr. Andreas Schaller

District Court : AG Weiden, HRB 3499