User Manual ROM-DB7501€¦ · v ROM-DB7501 User Manual Safety Instructions 1. Read these safety...

User Manual

ROM-DB7501

Development Board for Qseven 2.0 Modules

CopyrightThe documentation and the software included with this product are copyrighted 2017by Advantech Co., Ltd. All rights are reserved. Advantech Co., Ltd. reserves the rightto improve the products described in this manual at any time without notice. No partof this manual may be reproduced, copied, translated, or transmitted in any form orby any means without the prior written permission of Advantech Co., Ltd. All informa-tion provided in this manual is intended to be accurate and reliable. However, Advan-tech Co., Ltd. assumes no responsibility for its use, nor for any infringements of therights of third parties that may result from its use.

AcknowledgementsARM is trademarks of ARM Corporation.

NXP is trademarks of Qualcomm Corporation.

Microsoft Windows are registered trademarks of Microsoft Corp.

All other product names or trademarks are properties of their respective owners.

Product Warranty (2 years)Advantech warrants the original purchaser that each of its products will be free fromdefects in materials and workmanship for two years from the date of purchase.

This warranty does not apply to any products that have been repaired or altered bypersons other than repair personnel authorized by Advantech, or products that havebeen subject to misuse, abuse, accident, or improper installation. Advantechassumes no liability under the terms of this warranty as a consequence of suchevents.

Because of Advantech’s high quality-control standards and rigorous testing, mostcustomers never need to use our repair service. If an Advantech product is defective,it will be repaired or replaced free of charge during the warranty period. For out-of-warranty repairs, customers are billed according to the cost of replacement materials,service time, and freight. Please consult your dealer for more details.

If you believe your product is defective, follow the steps below.

1. Collect all the information about the problem encountered. (For example, CPU speed, Advantech products used, other hardware and software used, etc.) Note anything abnormal and list any onscreen messages received when the problem occurs.

2. Call your dealer and describe the problem. Please have your manual, product, and any relevant information readily available.

3. If your product is diagnosed as defective, obtain an return merchandize authori-zation (RMA) number from your dealer. This allows us to process your return more quickly.

4. Carefully pack the defective product, a completed Repair and Replacement Order Card and a proof of purchase date (such as a photocopy of your sales receipt) into a shippable container. Products returned without a proof of pur-chase date are not eligible for warranty service.

5. Write the RMA number on the outside and ship the package prepaid to your dealer.

Part No. 2006750100 Edition 1

Printed in Taiwan May 2017

ROM-DB7501 User Manual ii

Declaration of Conformity

FCC Class B

Note: This equipment has been tested and found to comply with the limits for a ClassB digital device, pursuant to part 15 of the FCC Rules. These limits are designed toprovide reasonable protection against harmful interference in a residential installa-tion. This equipment generates, uses and can radiate radio frequency energy and, ifnot installed and used in accordance with the instructions, may cause harmful inter-ference to radio communications. However, there is no guarantee that interferencewill not occur in a particular installation. If this equipment does cause harmful interfer-ence to radio or television reception, which can be determined by turning the equip-ment off and on, the user is encouraged to try to correct the interference by one ormore of the following measures:

Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the

receiver is connected. Consult the dealer or an experienced radio/TV technician for help.

Warnings, Cautions, and Notes

Warning! Warnings indicate conditions that if not observed may cause personal injury.

Caution! Cautions are included to help prevent hardware damage and data loss.For example,“Batteries are at risk of exploding if incorrectly installed. Do not attempt to recharge, force open, or heat the battery. Replace the battery only with the same or equivalent type recommended by the manufacturer. Discard used batteries according to the manufacturer's instructions.”

Note! Notes provide additional optional information.

iii ROM-DB7501 User Manual

Packing ListBefore installation, please ensure that the items listed below have been shipped.

Optional Accessories

Qseven 2.0 CPU Boards

For more information please refer to the Advantech baseboard checklist and evalua-tion board reference schematic, both of which can be downloaded from http://com.advantech.com/

9696750100E Qseven 2.0 carrier board 1

9696ED2000E Debug adapter board 1

1700021882-01 LVDS backlight cable 1

1700021883-01 LVDS cable 1

1700021941-01 SATA power 1

1700004711 SATA signal 1

1700019076 USB OTG to Type A female 1

1700019077 USB OTG to Type A male 1

1701100300 F cable IDE#3 10P-2.54/D-SUB 9P(M) 30 cm for UART 1

1700022373-01 Debug port cable for ROM-7421 1

1700002204 USB pin header to USB Type A 1

Part Number Description

96PSA-A36W12R1 Adapter 100-240V 36W 12V 3A

170203183C Power cord 3P (EU), 183 cm

170203180A Power cord 3P (UK), 183 cm

1700008921 Power cord 3P (PSE), 183 cm

EWM-W142F01E 802.11 b/g/n, AR9287, 2T2R, full-size mini PCIe

968EMW0093 Telit HE910-D mini PCIE

1750007156-01 Cellular/GPS SMA short jack (9.5 mm) L = 100 mm (3G cable)

1750007050-01Wi-Fi RP-SMA short SMA jack (9.5 mm) to U.FL_100 mm (Wi-Fi cable)

1750000318 EMI antenna 2DBI 2.4GHz SMA (Wi-Fi antenna)

1750005865 Antenna L = 10.9 cm 500 hm AN8921F-5701SM (3G antenna)

9680015491 PCIe to mini PCIe adapter card

9696MEG510E ROM-EG51 audio codec board

Part Number Description

ROM-7421CE-MDA1E NXP i.MX6 dual plus Qseven 2.0 module (0 ~ 60 degree)

ROM-7421CU-MEA1E NXP i.MX6 quad plus Qseven 2.0 module (0 ~ 60 degree)

ROM-7421CE-MDA1E NXP i.MX6 dual plus Qseven 2.0 module (-40 ~ 85 degree)

ROM-7421CU-MEA1E NXP i.MX6 quad plus Qseven 2.0 module (-40 ~ 85 degree)

ROM-DB7501 User Manual iv

Safety Instructions1. Read these safety instructions carefully.2. Retain this user manual for future reference.3. Disconnect the equipment from all AC outlets before cleaning. Use a damp cloth

for cleaning. Do not use liquid or spray detergents.4. For pluggable equipment, the power outlet socket should be located near the

equipment and easily accessible.5. Protect this equipment from humidity.6. Place the equipment on a reliable surface during installation. Dropping or letting

the equipment fall may cause damage.7. The openings on the enclosure are for air convection. Protect the equipment

from overheating. Do not cover the openings.8. Ensure that the voltage of the power source is correct before connecting the

equipment to the power outlet.9. Position the power cord away from high-traffic areas. Do not place anything over

the power cord.10. All cautions and warnings on the equipment should be noted.11. If the equipment is not used for a long time, disconnect it from the power source

to avoid damage from transient overvoltage.12. Never pour liquid into an opening. This may cause fire or electrical shock.13. Never open the equipment. For safety reasons, the equipment should be

opened only by qualified service personnel.14. If one of the following occurs, have the equipment checked by service person-

nel:The power cord or plug is damaged.Liquid has penetrated into the equipment.The equipment has been exposed to moisture.The equipment is malfunctioning or does not work according to the user

manual.The equipment has been dropped and damaged.The equipment shows obvious signs of breakage.

15. Do not store this equipment in an environment where the temperature fluctuates below -20 °C (-4 °F) or above 60 °C (140 °F) as this may cause damage. The equipment should be stored in a controlled environment.

16. CAUTION: The battery is at risk of exploding if incorrectly installed. Replace only with the same or equivalent type as recommended by the manufacturer. Discard used batteries according to the manufacturer’s instructions.

17. The sound pressure level at the operator position does not exceed 70 dB (A) in accordance with the IEC 704-1:1982 specifications.

DISCLAIMER: These instructions are provided in accordance with the IEC 704-1.Advantech disclaims all responsibility for the accuracy of any statements containedherein.

v ROM-DB7501 User Manual

Safety Precautions - Static ElectricityFollow these simple precautions to protect yourself from harm and prevent damageto the equipment.

To avoid electrical shock, always disconnect the power from the PC chassis before manual handling. Do not touch any components on the CPU card or other cards when the device is powered on.

Disconnect the power before adjusting the configuration. The sudden rush of power as a jumper is connected or a card installed may damage sensitive elec-tronic components.

ROM-DB7501 User Manual vi

Contents

Chapter 1 General Introduction ...........................11.1 Introduction ............................................................................................... 21.2 Product Specifications............................................................................... 21.3 Block Diagram........................................................................................... 3

Chapter 2 H/W Installation....................................52.1 Module Form Factor.................................................................................. 62.2 Environmental Specifications .................................................................... 62.3 ROM-DB7501 Overview............................................................................ 62.4 Connectors, Jumpers, Switches, and LEDs.............................................. 7

2.4.1 Rear I/O Panel .............................................................................. 7Table 2.1: External I/O Connectors ............................................. 7Table 2.2: DC-In 1 (DC-Jack, +12V Power Input) ....................... 7Table 2.3: CN8A (CAN) ............................................................... 7Table 2.4: CN8B (UART0, 4 Wires)............................................. 8Table 2.5: CN1 (HDMI)................................................................ 8Table 2.6: CN2 (RJ-45 & USB 1/2).............................................. 9Table 2.7: Audio 1 (Audio Output) ............................................... 9Table 2.8: DIO1 (GPIO)............................................................. 10

2.4.2 Internal I/O .................................................................................. 10Table 2.9: Internal I/O Connector .............................................. 11

2.4.3 Connectors.................................................................................. 12Table 2.10:CN16 (PCIe x1 Connector 1).................................... 12Table 2.11:SATA1 (SATA Connector)........................................ 13Table 2.12:SATAPWR1 (SATA Power Connector) .................... 13Table 2.13:Module 1 (MXM Connector) ..................................... 14Table 2.14:LVDS 1 (24 bit) ......................................................... 16Table 2.15:LVDS 2 (24 bit) ......................................................... 17Table 2.16:LVDS_BK_PWR 1 (LVDS Backlight Power) ............ 17Table 2.17:LVDS_BK_PWR 2 (LVDS Backlight Power) ............ 18Table 2.18:USB_OTG 1 (USB OTG).......................................... 18Table 2.19:SD1 (SD Slot) ........................................................... 18Table 2.20:BAT1 (Lithium-Ion Battery Power Input)................... 19Table 2.21:BH1 (CR-2032)......................................................... 19

2.4.4 Jumpers ...................................................................................... 19Table 2.22:SATADOM_PWR (SATA-DOM Jumper, Default 2-3) ..

..................................................................................19Table 2.23:COM1 (UART1, 4 Wire)............................................ 20Table 2.24:CN28 (Reserved for GPIO3, Multi Pin)..................... 20Table 2.25:CN29 (Reserved for CAN, Multi Pin) ........................ 20Table 2.26:CN13 (Reserved for EC, Programming Pin)............. 20Table 2.27: I2S_CN1 (I2S0, Audio Codec).................................. 21Table 2.28:SPI1 (SPI1)............................................................... 21Table 2.29:LVDS_BL1 (LVDS Backlight Selection).................... 21Table 2.30:LVDS_BL2 (LVDS Backlight Selection).................... 22Table 2.31:LVDS_VDD1 (LVDS VDD Power Selection) ............ 22Table 2.32:LVDS_VDD3 (LVDS VDD Power Selection) ............ 22Table 2.33:LVDS_VDD2 (LVDS VDD Power Selection2) .......... 22Table 2.34:LVDS_VDD4 (LVDS VDD Power selection2)........... 22

2.4.5 Switches and Buttons ................................................................. 23Table 2.35:SW1 (Reset Button).................................................. 23Table 2.36:SW2 (Sleep Button).................................................. 23Table 2.37:SW3 (Power Button, CPU) ....................................... 23

vii ROM-DB7501 User Manual

2.4.6 Hardware Installation .................................................................. 23

Chapter 3 Advantech Services.......................... 253.1 RISC Design-in Services ........................................................................ 263.2 Contact Information................................................................................. 293.3 Technical Support and Assistance.......................................................... 303.4 Global Service Policy .............................................................................. 30

3.4.1 Warranty Policy........................................................................... 303.4.2 Warranty Period.......................................................................... 303.4.3 Repairs Under Warranty ............................................................. 303.4.4 Exclusions From Warranty.......................................................... 31

3.5 Repair Process ....................................................................................... 313.5.1 Obtaining an RMA Number......................................................... 313.5.2 Returning the Product for Repair ................................................ 313.5.3 Service Charges ......................................................................... 323.5.4 Repair Report ............................................................................. 333.5.5 Custody of Products Submitted for Repair ................................. 333.5.6 Shipping Back to the Customer .................................................. 33

ROM-DB7501 User Manual viii

Chapter 1
1 General IntroductionThis chapter gives background information for ROM-DB7501.
Introduction

Specifications

1.1 IntroductionROM-DB7501 is an evaluation carrier board designed for the Advantech Qsevenmodule. It is compatible with ROM-7421 and has rich I/O interface for evaluation anddevelopment. It supports wide range operating temperatures, 2 power input inter-faces (one of them is designed for lithium-ion battery). ROM-DB7501 is an idealdevelopment board for mobile applications, such as portable device, industrial tabletor HMI systems.

ROM-DB7501 released with RISC Qseven carrier board design documents: CarrierBoard Design Guide, Layout, Schematic checklist, and also the reference boardschematics ready for you to start your own carrier board design.

2 x power inputs (12V DC-in) and 1 x lithium battery 8 x GPIO 1 x 4-wire UART, 4 x USB, 1 x CAN bus

1.2 Product Specifications

Compatible Module

Advantech Qseven 2.0 CPU modules

GraphicsHDMI 1 HDMI Type A

LVDS 1 dual 24-bit LVDS

Ethernet 10/100/100 Mbps 1 RJ45

StorageSD 1 SD card slot

SATA 1 SATA II connector (with SATA-DOM support)

I/O

USB2 USB 2.0 Type A (host), 1 min USB Type AB (OTG), 2 USB 2.0 pin header

Serial 2 COM ports

Audio 1 1/8 audio jack (I2S HD audio), 1 SPDIF pin header

CAN 1 CAN 2.0 B ports, differential mode +5V

GPIO 8 GPIO ports

I2C 2 I2C pin header

SPI 1 SPI pin header

Expansion PCIe slot 1 PCIe x1

Input Power Power 2 power inputs (+12V DC-jack, lithium-ion battery)

Environment Operation 0 ~ 60 °C (32 ~ 140 °F)

Operating humidity 5 ~ 95% relative humidity, non-condensing

Physical Characteris-tics

Dimensions 170 x 170 mm (mini-ITX)

ROM-DB7501 User Manual 2

Chapter 1

GeneralIntroduction

1.3 Block Diagram

3 ROM-DB7501 User Manual

Chapter 2
2 H/W InstallationThis chapter provides mechanical information and describes the connectors on the ROM-DB7501 carrier board.
Connector Information

Mechanical Drawing

Hardware Installation

2.1 Module Form FactorQseven form factor size, 70 x 70 mm (W x D)

2.2 Environmental Specifications Operating temperature: 0 ~ 60 °C (32 ~ 140 °F) Operating humidity: 5 ~ 95% relative humidity, non-condensing Storage temperature: -40 ~ 85 °C Relative humidity: 95% @ 60 °C Total weight: 380 g

2.3 ROM-DB7501 Overview


Chapter 2

H/W

Installation

2.4 Connectors, Jumpers, Switches, and LEDs

2.4.1 Rear I/O Panel

Table 2.1: External I/O Connectors

Position Description

DCIN1 DC jack

CN8 RS-232 and CAN bus

DIO1 GPIO connector

CN1 HDMI port

CN2 Ethernet/ USB port 1/2

Audio1 Mic input/audio output

Table 2.2: DC-In 1 (DC-Jack, +12V Power Input)

Pin Signal Pin Signal

1 +12V Shield GND

Table 2.3: CN8A (CAN)


1 - 2 CAN0_D-

3 - 4 -

5 GND 6 -

7 CAN_D+ 8 -

9 +5V


Table 2.4: CN8B (UART0, 4 Wires)


1 - 2 Rx

3 Tx 4 -

5 GND 6 -

7 RTS 8 CTS

9 -

Table 2.5: CN1 (HDMI)


1 TMDS_D2+ 2 GND

3 TMDS_D2- 4 TMDS_D1+

5 GND 6 TMDS_D1-

7 TMDS_D0+ 8 GND

9 TMDS_D0- 10 TMDS_CLK+

11 GND 12 TMDS_CLK-

13 CEC 14 -

15 CTRL_CLK 16 CTRL_DAT

17 GND 18 +5V

19 HPD


Chapter 2

H/W

Installation

Table 2.6: CN2 (RJ-45 & USB 1/2)


1 CT 2 MDI0+

3 MDI0- 4 MDI1+

5 MDI1- 6 MDI2+

7 MDI2 8 MDI3+

9 MDI3- 10 GND

11 Active LED- 12 Active LED+

13 Link 1000- 14 Link 100-

15 +5V 16 USB port 2-

17 USB port 2+ 18 GND

19 +5V 20 USB port 1-

21 USB port 1+ 22 GND

1 TMDS_D2+ 2 GND

3 TMDS_D2- 4 TMDS_D1+

5 GND 6 TMDS_D1-

7 TMDS_D0+ 8 GND

9 TMDS_D0- 10 TMDS_CLK+

11 GND 12 TMDS_CLK-

13 CEC 14 -

15 CTRL_CLK 16 CTRL_DAT

17 GND 18 +5V

19 HPD

Table 2.7: Audio 1 (Audio Output)


1 GND 2 -

3 - 4 -

5 Mic-In 6 -

7 Audio_L 8 -

9 Audio_R


2.4.2 Internal I/O

Table 2.8: DIO1 (GPIO)


1 GPIO0 2 GPIO1

3 GPIO2 4 GPIO3

5 GPIO4 6 GPIO5

7 GPIO6 8 GPIO7

9 GND


Chapter 2

H/W

Installation

Table 2.9: Internal I/O Connector

Position Description Connector Type

USB0 USB port 0 Pin header 2 x 5, 2.54 mm 180D (M) yellow

CN16 PCIe x1 connector 1PCI Express 36P 180D (F) DIP 2EG01817-D2D-DF

SATADOM_PWR1

SATA-DOM jumper (power +5V pin 7)

Pin header 3 x 1P, 2.0 mm 180D (M) DIP 2000-13 WS

SATA1 SATA connectorSerial ATA 7P 1.27 mm 180D (M) DIP WATM-07DBN4A3B8

SATAPWR1 SATA power connectorWafer 4P 2.5 mm 180D (M) DIP 24W1161-04S10-01T

COM1 UART1 (RS232, 4 wires)Box header 5x2P 2.54 mm 180D (M) DIP 23N6960-10S10

CN13 Reserved for EC programming Box header 5x2P 2.54mm 180D (M) DIP 23N6960-10S10

MODULE1 MXM connector

I2C1 I2C pin headerWafer box 2.0 mm 4P 180D (M) with lock A2001WV2-4P

I2S_CN1 Audio codec connectorPin header 2 x 10P 2.54 mm 180D (M) DIP 21N22564

SPI1 SPI connector 1Pin header 2 x 4P 2.54 mm 180D (M) SMD 21N22564

SW1 Reset button TACT SW STS-091 SMD 4P H = 3.8 mm

SW2 Sleep button TACT SW STS-091 SMD 4P H = 3.8 mm

SW3 Power button TACT SW STS-091 SMD 4P H = 3.8 mm

LVDS1 LVDS (24 bit)B/B Conn. 40P 1.25 mm 90D SMD DF13-40DP-1.25V(91)

LVDS_BK_PWR1

LVDS backlight powerWafer box 2.0 mm 5P 180D (M) DIP WO/Pb JIH VEI

LVDS_BK_PWR2

LVDS backlight power Wafer box 2.0 mm 5P 180D (M) DIP WO/Pb JIH VEI

LVDS_BL2LVDS backlight selection (+12V/5V)

Pin header 3 x 1P 2.54 mm 180D (M) DIP 205-1x3GS

LVDS_BL1LVDS backlight selection (+12V/5V)

Pin header 3 x 1P 2.54 mm 180D (M) DIP 205-1x3GS

LVDS_VDD1LVDS VDD power selection (+3.3V/+5V)

Pin header 3 x 1P 2.0 mm 180D (M) DIP 2000-13 WS

LVDS_VDD2LVDS VDD power selection2 (+12V)

Pin header 2 x 1P 180D (M) square 2.0 mm DIP W/O Pb

LVDS_VDD3LVDS VDD power selection (+3.3V/+5V)

Pin header 3 x 1P 2.0 mm 180D (M) DIP 2000-13 WS

LVDS_VDD4LVDS VDD power selection 2 (+12V)

Pin header 2 x 1P 180D (M) square 2.0 mmDIP W/O Pb

USB_OTG1 USB OTG Mini USB 5P 180D (F) SMD UH51543-CS7-7F

BAT1 Lithium-ion battery power inputWafer 8P 2.54 mm 180D (M) DIP A2543WV2-8P (6 ~ 8.4 V recommended)

BH1 CR-2032 connectorBattery holder 24.9*23.4*8.9 CR2032 BH800.4GG

SD1 SD socketSD CONN 9P 90D(F) SMD DM1AA-SF-PEJ(82)

CN18 Power button connectorPin header 2 x 1P 180D (M) square 2.0 mm DIP


2.4.3 Connectors

CN19 Reset button connectorPin header 2 x 1P 180D (M) square 2.0 mm DIP

CN20 Sleep button connectorPin header 2 x 1P 180D (M) square 2.0 mmDIP

PWRLED 1 Power LED connector Pin header 2 x 1P 180D (M) 2.54 mm DIP

JP1 Terminal resistor for CAN busPin header 2 x 1P 180D (M) square 2.0 mm DIP

SATALED1 SATA LED connector Pin header 2 x 1P 180D (M) 2.54 mm DIP

Table 2.10: CN16 (PCIe x1 Connector 1)


B1 +12V A1 +12V

B2 +12V A2 +12V

B3 +12V A3 +12V

B4 GND A4 GND

B5 PCIE_A_CK A5 PCIEX_A_JTAG2

B6 PCIE_A_DAT A6 PCIEX_A_JTAG3

B7 GND A7 PCIEX_A_JTAG4

B8 +3V A8 PCIEX_A_JTAG5

B9 PCIEX_A_JTAG1 A9 +3V

B10 +3V A10 +3V

B11 +3V A11 PWRGD

Mechanical Key

B12 Reserved A12 GND

B13 GND A13 PCIE_A_REFCK+

B14 PCIE_A_X_TX+ A14 PCIE_A_REFCK-

B15 PCIE_A_X_TX- A15 GND

B16 GND A16 PCIE_A_X_RX+

B17 +3V A17 PCIE_A_X_RX-

B18 GND A18 GND


Chapter 2

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Installation

Table 2.11: SATA1 (SATA Connector)


1 GND 2 SATA_TX+

3 SATA_TX- 4 GND

5 SATA_RX- 6 SATA_RX+

7 SATA DOM PIN7

Table 2.12: SATAPWR1 (SATA Power Connector)1 +5V 2 GND

3 GND 4 GND

5 +12V - -


Table 2.13: Module 1 (MXM Connector)


1 GND 2 GND

3 GBE_MDI3- 4 GBE_MDI2-

5 GBE_MDI3+ 6 GBE_MDI2+

7 GBE_LINK100# 8 GBE_LINK1000#

9 GBE_MDI1- 10 GBE_MDI0-

11 GBE_MDI1+ 12 GBE_MDI0+

13 GBE_LINK# 14 GBE_ACT#

15 GBE_CTREF 16 SUS_S5#

17 WAKE# 18 SUS_S3#

19 SUS_STAT# 20 PWRBTN#

21 SLP_BTN# 22 LID_BTN#

23 GND 24 GND

KEY KEY

25 GND 26 PWGIN

27 BATLOW# 28 RSTBTN#

29 SATA0_TX+ 30 SATA1_TX+

31 SATA0_TX- 32 SATA1_TX-

33 SATA_ACT# 34 GND

35 SATA0_RX+ 36 SATA1_RX+

37 SATA0_RX- 38 SATA1_RX-

39 GND 40 GND

41 BOOT_ALT# 42 SDIO_CLK#

43 SDIO_CD# 44 SDIO_LED

45 SDIO_CMD 46 SDIO_WP

47 SDIO_PWR# 48 SDIO_DAT1

49 SDIO_DAT0 50 SDIO_DAT3



55 SDIO_DAT6 56 USB_DRIVE_VBUS

57 GND 58 GND

59 I2S_WS 60 GP1_I2C_CLK

61 I2S_RST# 62 GP1_I2C_DAT

63 I2S_CLK 64 SMB_ALERT#

65 I2S_SDI 66 GP0_I2C_CLK

67 I2S_SDO 68 GP0_I2C_DAT

69 THRM# 70 WDTTRIG#

71 THRMTRIP# 72 WDOUT

73 GND 74 GND

75 USB_P7-/ISB_SSTX0- 76 USB_P6-/ISB_SSRX0-

77 USB_P7-/ISB_SSTX0+ 78 USB_P6-/ISB_SSRX0+

79 USB_6_7_OC# 80 USB_4_5_OC#

81 USB_P5-/ISB_SSTX1- 82 USB_P4-/ISB_SSRX1-

83 USB_P5-/ISB_SSTX1+ 84 USB_P4-/ISB_SSRX1+

85 USB_2_3_OC# 86 USB_0_1_OC#

87 USB_P3- 88 USB_P2-


Chapter 2

H/W

Installation

89 USB_P3+ 90 USB_P2+

91 USB_VBUS 92 USB_ID

93 USB_P1- 94 USB_P0-

95 USB_P1+ 96 USB_P0+

97 GND 98 GND

99 LVDS_A0+ 100 LVDS_B0+

101 LVDS_A0- 102 LVDS_B0-





111 LVDS_PPEN 112 LVDS_BLEN



117 GND 118 GND

119 LVDS_A_CLK+ 120 LVDS_B_CLK+

121 LVDS_A_CLK- 122 LVDS_B_CLK-

123 GP_PWM_OUT0 124 GP_1-Wire_Bus

125 LVDS_DID_DAT 126 LVDS_BLC_DAT

127 LVDS_DID_CLK 128 LVDS_BLC_CLK

129 CAN0_TX 130 CAN0_RX

131 TMDS_CLK+ 132 RSVD

133 TMDS_CLK- 134 RSVD

135 GND 136 GND

137 TMDS_LANE1+ 138 DP_AUX+

139 TMDS_LANE1- 140 DP_AUX-

141 GND 142 GND

143 TMDS_LANE0+ 144 RSVD

145 TMDS_LANE0- 146 RSVD

147 GND 148 GND

149 TMDS_LANE2+ 150 HDMI_CTRL_DAT

151 TMDS_LANE2- 152 HDMI_CTRL_CLK

153 DP_HDMI_HPD# 154 DP_HPD#

155 PCIE_CLK_REF+ 156 PCIE_WAKE#

157 PCIE_CLK_REF- 158 PCIE_RST#

159 GND 160 GND

161 PCIE3_TX+ 162 PCIE3_RX+

163 PCIE3_TX- 164 PCIE3_RX-

165 GND 166 GND



171 UART0_TX 172 UART0_RTS#



177 UART0_RX 178 UART0_CTS#





183 GND 184 GND

185 GPIO0 186 GPIO1

187 GPIO2 188 GPIO3

189 GPIO4 190 GPIO5

191 GPIO6 192 GPIO7

193 VCC_RTC 194 GP_PWR_OUT2

195 GP_TIMER_IN 196 GP_PWR_OUT1

197 GND 198 GND

199 SPI_MOSI 200 SPI_CS0#

201 SPI_MISO 202 SPI_CS1#

203 SPI_SCK 204 MFG_NC4

205 VCC_5V_SB 206 VCC_5V_SB

207 MFG_NC0 208 MFG_NC2

209 MFG_NC1 210 MFG_NC3

211 VCC 212 VCC

213 VCC 214 VCC

215 VCC 216 VCC

217 VCC 218 VCC

219 VCC 220 VCC

221 VCC 222 VCC

223 VCC 224 VCC

225 VCC 226 VCC

227 VCC 228 VCC

229 VCC 230 VCC

Table 2.14: LVDS 1 (24 bit)


1 +VDD_LVDS 2 +VDD_LVDS

3 GND 4 GND


7 LVDS_D0- 8 -

9 LVDS_D0+ 10 -

11 GND 12 GND

13 LVDS_D1- 14 -

15 LVDS_D1+ 16 -

17 GND 18 GND

19 LVDS_D2- 20 -

21 LVDS_D2+ 22 -

23 GND 24 GND

25 VLDS_CK- 26 -

27 LVDS_CK+ 28 -

29 GND 30 GND

31 DID_CK 32 DID_DAT

33 GND 34 GND

35 LVDS D3- 36 -

37 LVDS D3+ 37 -



Chapter 2

H/W

Installation

39 GND 40 LVDS_CTRL




3 GND 4 GND


7 LVDS_D0- 8 -

9 LVDS_D0+ 10 -

11 GND 12 GND

13 LVDS_D1- 14 -

15 LVDS_D1+ 16 -

17 GND 18 GND

19 LVDS_D2- 20 -

21 LVDS_D2+ 22 -

23 GND 24 GND

25 VLDS_CK- 26 -

27 LVDS_CK+ 28 -

29 GND 30 GND

31 DID_CK 32 DID_DAT

33 GND 34 GND

35 LVDS D3- 36 -

37 LVDS D3+ 37 -

39 GND 40 LVDS_CTRL

Table 2.16: LVDS_BK_PWR 1 (LVDS Backlight Power)


1 +VDD_BKLT_LVDS 2 GND

3 BLK_EN 4 Brightness

5 +5V



Table 2.17: LVDS_BK_PWR 2 (LVDS Backlight Power)


1 +VDD_BKLT_LVDS 2 GND

3 BLK_EN 4 Brightness

5 +5V

Table 2.18: USB_OTG 1 (USB OTG)


1 +5V 2 USB_OTG D-

3 USB_OTG D+ 4 OTG ID

5 GND 6 GND

Table 2.19: SD1 (SD Slot)


1 SDIO_DATA3_X 2 SDIO_CMD

3 GND 4 +3V

5 SDIO_CK 6 GND

7 SDIO_DATA0 8 SDIO_DATA1

9 SDIO_DATA2 10 SDIO_CD#

11 GND 12 +3V_SDIO

H1 - H2 -

H3 - H4 GND

H5 GND H6 GND


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2.4.4 Jumpers

Table 2.20: BAT1 (Lithium-Ion Battery Power Input)


1 GND 2 GND

3 BAT_THER 4 BAT_ID_CN

5 I2C_DAT_BAT 6 I2C_CK_BAT

7 +VBATT 8 +VBATT

Table 2.21: BH1 (CR-2032)


1 BAT_RTC 2 GND

Table 2.22: SATADOM_PWR (SATA-DOM Jumper, Default 2-3)


1 +5V 2 SATA-DOM Pin7

3 GND - -

Jumper Mode Jumper Mode

1-2 120 OM (default) - Without 120 OM


Table 2.23: COM1 (UART1, 4 Wire)


1 - 2 -

3 COM1_RX 4 RTS

5 COM1_TX 6 CTS

7 - 8 -

9 GND 10 -

Table 2.24: CN28 (Reserved for GPIO3, Multi Pin)


1-2 GPIO3 (Default) 2-3 CAM1_RST#

Table 2.25: CN29 (Reserved for CAN, Multi Pin)


1 +3V 2 CAN0_ERR#

3 CAN1_ERR# 4 -

5 GND

Table 2.26: CN13 (Reserved for EC, Programming Pin)

Pin Signal

1 EC_CLK

2 EC_DAT

3 GND


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* +VDD_BKLT_LVDS, pin1

Table 2.27: I2S_CN1 (I2S0, Audio Codec)


1 Audio_VDDA 2 GND

3 Audio_VDDA 4 I2S0_SDIN_C

5 I2S0_SDOUT_C 6 I2S0_LRCK_C

7 I2S0_CK_C 8 AUDIO_MCK_C

9 - 10 GND

11 Audio_I2C_CK 12 MIC_BIAS

13 Audio_I2C_DAT 14 GND

15 - 16 HP_R

17 MIC_IN 18 GND

19 GND 20 HP_L

Table 2.28: SPI1 (SPI1)


1 +3V 2 GND

3 SPI1_CS0# 3 SPI1_CK

5 SPI1_DO_C 6 SPI1_DIN_C

7 - 8 SPI1_CS1#_C

Table 2.29: LVDS_BL1 (LVDS Backlight Selection)


1-2 +5V (default) 2-3 +12V


* +VDD_BKLT_LVDS, pin1

**LVDS_VDD1 = LVDS_VDD3

LVDS_VDD2 = LVDS_VDD4**

Table 2.30: LVDS_BL2 (LVDS Backlight Selection)


1-2 +5V (default) 2-3 +12V

Table 2.31: LVDS_VDD1 (LVDS VDD Power Selection)


1-2 +12V (default) 2-3 +5V

Table 2.32: LVDS_VDD3 (LVDS VDD Power Selection)


1-2 +12V (default) 2-3 +5V

Table 2.33: LVDS_VDD2 (LVDS VDD Power Selection2)


1-2 +12V (default)

Table 2.34: LVDS_VDD4 (LVDS VDD Power selection2)


1-2 +12V (default)


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2.4.5 Switches and Buttons

2.4.6 Hardware Installation1. Slide the ROM-7421 module board into the carrier board socket at a 30 degree

angle.

Table 2.35: SW1 (Reset Button)


1 RESET_IN# 2 GND

Table 2.36: SW2 (Sleep Button)


1 SLEEP# 2 GND

Table 2.37: SW3 (Power Button, CPU)


1 POWER_BTN# 2 GND


2. Press the module board down, making sure that the 4 screw holes are aligned with those of the carrier board. Use 4 screws to affix the module board in place.


Chapter 3
3 Advantech ServicesThis chapter describes the design-in service, technical sup-port, and warranty policy for ROM-DB7501.

3.1 RISC Design-in Services

Advantech’s RISC design-in services help customers by reducing the time and effortof designing new carrier boards. Advantech handles the complexities of technicalresearch and greatly minimizes the development risk associated with carrier boards.

Easy Development

Advantech provides firmware, root file system, and BSP support, as well as otherdevelopment tools for customers, enabling them to easily develop carrier boards anddifferentiate their embedded products and applications.

Full range of RISC products Comprehensive document support

Design Assistance Service

Advantech provides a checklist for engineers to easily check schematics and alsooffers a review service for assessing customers’ carrier board schematics. The aim ofthe review service is to prevent and resolve design errors in order to reduce the timeand costs associated with carrier board development.

Schematic review Placement and layout review Debugging assistance services General/special reference design database.


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Thermal Solution Services

To provide quicker, more flexible solutions for customers’ thermal designs, Advantechoffers its thermal solution services, which cover both modular and customized ther-mal solutions.

Standard thermal solutions Customized thermal solutions

Embedded Software Services

Advantech offers driver, software integration, customized firmware, root file system,and Linux imaging support to save customers a substantial amount of time and allowthem to focus on core developments.

Embedded Linux/Android OS Advantech boot loader customization

With the increasing implementation of industrial computing, a wide range of newapplications have been developed, revolutionizing the IPC industry. In the past, sys-tem integrators were accustomed to completing projects without outside assistance.But nowadays, the working model has shifted. Because of diverse market demandsand intense competition, cooperation (both upstream and downstream) for verticalintegration has become a more effective way to create competitive advantages.ARM-based CPU modules were born out of this trend. Concentrating all necessarycomponents on the CPU module and placing other parts on the carrier board inresponse to market requirements for specialization, provides greater flexibility whilemaintaining low power consumption.

With many years of experience in the industrial computer industry, Advantech foundthat customers typically have a number of concerns (as listed below) regarding theimplementation of modular designs.

General I/O Design Capability

Although customers have vertical integration abilities and sufficient expertise andcore competitiveness in their professional application field, a lack of knowledge andexperience of general power and I/O design presents a potential barrier to integratingCPU modules into their carrier board.

Information Acquisition

Even sufficient information is acquired to make the right decision for specialized ver-tical applications, a number of customers struggle with general platform design andcommunicating with CPU or chipset manufacturers. This not only increases the risksand difficulties of carrier board design and extends the time-to-market, but alsoresults in lost market opportunities.

Software Development and Modification

Compared to x86 architectures, RISC architectures use simpler instruction sets.Therefore, the software support for x86 platforms cannot be applied to RISC plat-forms. System integrators must develop software for their system and integrate thehardware and software themselves. Unlike x86 platforms, RISC platforms have lesssupport for board support packages (BSPs) and drivers. Although driver support isprovided, system integrators still need to invest substantial effort into integrating thesystem core. Moreover, the BSPs provided by CPU manufacturers are usually forcarrier board design, making it difficult for system integrators to find an environmentfor software development.


To address this issue, Advantech proposed its streamlined design-in support servicesfor RISC-based computer on modules (COMs). With a dedicated professionaldesign-in services team, Advantech actively participates in carrier board design andproblem solving. Advantech services not only ensure effective resource distributionbut also reduce R&D costs and hardware investment.

Leveraging its close relationships with leading CPU and chipset manufacturers, suchas ARM, TI, and Freescale, Advantech helps customers solve communication andtechnical support difficulties, reducing the uncertainties of product development.Additionally, Advantech’s professional software team provides complete BSPs andassists customers with establishing a software development environment for RISCplatforms. Advantech’s RISC design-in services help customers overcome chal-lenges to achieve a faster time to market.

Along with a multi-stage development process, which includes planning, design, inte-gration, and validation, Advantech's RISC design-in services provide comprehensivesupport for customers during the following stages:

Planning Stage

Before adopting Advantech RISC COMs, customers must complete a comprehen-sive assessment process that involves identifying the product features and specifica-tions and conducting compatibility testing with software. Accordingly, Advantechoffers a RISC customer solution board (CSB) as an evaluation tool for carrier boardsthat are designed when developing RISC COMs. In the planning stage, customerscan use this evaluation board to assess RISC modules and test peripheral hardware.Moreover, Advantech provides standard software BSPs for RISC COM to enablecustomers to define their product’s specifications and verify I/O and performance.Advantech not only offers hardware planning and technology consultations, but alsosoftware evaluations and peripheral module recommendations. Addressing customerconcerns is the primary goal for Advantech at this stage. Because product evalua-tion, especially regarding performance and specifications, is essential during theplanning period, Advantech offer customers assistance with RISC COM testing.

Design Stage

When a product moves into the design stage, Advantech provides a carrier boarddesign guide for reference. The carrier board design guide contains pin definitions fora COM connector along with recommendations for carrier board design to providecustomers with a clear guideline for carrier board development. Regarding differentform factors, Advantech offers a complete pin-out checklist for various form factors,such as Q7, SMARC, and RTX2.0, to allow customers to easily examine the carrierboard signals and layout design. In addition, Advantech assists customers withreviewing the placement/layout and schematics to ensure the carrier board designsatisfies their requirements. For software development, Advantech’s RISC softwareteam can assist customers with establishing an environment for software develop-ment and evaluating the time and resources needed. If customers outsource soft-ware development to a third party, Advantech can also cooperate with the third partyand provide proficient consultation services. With Advantech’s professional support,the design process becomes much easier and product quality is improved.


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Integration Stage

This stage involves hardware and software integration, application development, andperipheral module implementation. However, if customers lack knowledge and expe-rience with platforms, they are likely to spend considerable time analyzing integrationproblems. The implementation of peripheral modules is highly dependant on thedriver designs on carrier boards, with RISC platforms typically having less support forready-made drivers on the carrier board. Because of its years of experience andknowledge of hardware and software development, Advantech can support custom-ers by providing professional advice and information to shorten the development timeand enable more effective product integration.

Validation Stage

After a customer’s ES sample is completed, the next step is a series of verificationtests. In addition to verifying a product’s functionality, efficiency is another importantfactor, especially for RISC platforms. During this stage, Advantech adopts a support-ive role and assists customers with addressing the issues identified in verificationtesting by providing suggestions and tips. With Advantech’s efficient verification pro-cess supported by its technical support team, customers can easily and convenientlyoptimize their applications. Advantech’s team can also provide consultations regard-ing further testing and equipment usage to ensure that customers have the right toolsfor identifying and resolving problems efficiently to further enhance their productquality and performance.

3.2 Contact InformationThe contact information for Advantech customer service is provided below.

Alternatively, contact the Advantech service team via the company website (providedbelow). Once the form is completed, an Advantech technical support engineer willprovided a rapid response.

http://www.advantech.com.tw/contact/default.aspx?page=contact_form2&sub-ject=Technical+Support

Region/Country Contact Information

America 1-888-576-9688

Brazil 0800-770-5355

Mexico 01-800-467-2415

Europe (toll free) 00800-2426-8080

Singapore & SAP 65-64421000

Malaysia 1800-88-1809

Australia (toll free) 1300-308-531

China (toll free)[email protected]

India (toll free) 1-800-425-5071

Japan ((toll free) 0800-500-1055

Korea (toll free) 080-363-9494

Taiwan (toll free) 0800-777-111

Russia (toll free) 8-800-555-01-50


3.3 Technical Support and AssistanceFor more information about this or other Advantech products, visit the Advantechwebsite at

<http://www.advantech.com/>

<http://www.advantech.com/ePlatform/>

For technical support and service, visit the Advantech support website at

<http://support.advantech.com.tw/support/>

Alternatively, visit the Advantech website at www.advantech.com/support to obtainthe latest product information. However, if you still need additional assistance, con-tact your distributor, sales representative, or one of Advantech’s customer servicecenters for further technical support. Please have the following information readybefore calling:

- Product name and serial number

- A description of your peripheral attachments

- A description of your software (operating system, version, application soft-ware, etc.)

- A comprehensive description of the problem

- The exact wording of any error messages

3.4 Global Service Policy

3.4.1 Warranty PolicyAdvantech’s warranty policy is as follows:

3.4.2 Warranty PeriodAdvantech branded off-the-shelf products and third party off-the-shelf products usedto assemble Advantech configure to order products are entitled to a 2-year completeand prompt global warranty service. Any defects in product design, materials, andworkmanship are covered from the date of shipment.

All customized products will, by default, carry a 15-month regional warranty. Theactual product warranty terms and conditions may vary based on the sales contract.

All third party products purchased separately will be covered by the warranty of theoriginal manufacturer, and shall not exceed 1 year of coverage through Advantech.

3.4.3 Repairs Under WarrantyA replacement product (cross-shipment) can be obtained within 30 days of purchase.If the product was purchased directly from Advantech and was dead on arrival(DOA), contact your original Advantech supplier to arrange a DOA replacement. TheDOA cross-shipment excludes any shipping damage, customized, and/or build-to-order products.

For products that are not DOA, the return shipping fee to an authorized Advantechrepair facility will the responsibility of the customer. The fee for shipping fee repairedor replacement products from Advantech back to the customer will be the responsibil-ity of Advantech.


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3.4.4 Exclusions From WarrantyThe product is excluded from warranty if

The warranty period has expired. Warranty has been voided by removal or alteration of the product or part identifi-

cation labels. The product has been misused, abused, or subjected to unauthorized disas-

sembly/modification; placed in an unsuitable operating environment; improperly maintained by the customer; or has failed due to an accident or other cause for which Advantech is not responsible. Such conditions will be determined by Advantech at its sole unfettered discretion.

The product is damaged beyond repair due to a natural disaster such as a light-ing strike, flood, earthquake, etc.

The product has been updated/upgraded as requested by customers who are without warranty.

3.5 Repair Process

3.5.1 Obtaining an RMA NumberAll returns from customers must be authorized with an Advantech RMA (return mer-chandise authorization) number. Any returns of defective units or parts without validRMA numbers will not be accepted; the items will be returned to the customer at thecustomer’s cost without prior notice.

An RMA number is only an authorization for returning a product, it is not approval forrepair or replacement. To request an RMA number, visit Advantech’s RMA portal athttp://erma.Advantech.com.tw using an authorized user ID and password.

Customers must provide basic product and customer information and describe theproblems encountered in detail in the section labelled “Problem Description”. Vagueentries such as “does not work” and “failure” are not acceptable.

If you are uncertain about the cause of the problem, please contact Advantech’sapplication engineers (AE). They may be able to find a solution that does not requiresending the product for repair.

The serial number of the entire product is required if only one part is returned forrepair. Otherwise, the product will be regarded as out of warranty.

3.5.2 Returning the Product for RepairCustomers can return defective products to an authorized Advantech repair facilitywithout an extra cross-region charge by contact their local repair center beforerequesting the global repair service.

Advantech recommends that cards are sent without the accessories (manuals,cables, etc.). Remove any unnecessary components from the card, such as a CPU,DRAM, and CF card. If you send all these parts back (because you believe they maybe part of the problem), please clearly note that they are included in your shipment.Otherwise, Advantech is not responsible for any items not listed. Ensure that adescription of the problem is enclosed.

European customers located outside the European community are requested to useUPS as the forwarding company. Advantech strongly recommends adding a packinglist to all shipments. Additionally, please prepare a shipment invoice according to thefollowing guidelines to reduce goods clearance time:


1. Give a low value to the product on the invoice, or customs will levy additional charges that will be borne by the sender.

2. Include the information “Invoice for customs purposes only with no commercial value” on the shipment invoice.

3. Show RMA numbers, product serial numbers, and warranty status on the ship-ment invoice.

4. Provide information identifying the country of origin.In addition, please attach an invoice with an RMA number to the shipping carton,then write the RMA number on the outside of the carton and attach the packing slip tosave handling time. Please also address the shipment to Advantech’s ServiceDepartment and mark the package “Attn. RMA Service Department”.

All products must be returned in properly packed ESD material or anti-static bags.Advantech reserves the right to return un-repaired items at the customer’s cost ifinappropriately packed.

Additionally, “door-to-door” transportation such as speed post is recommended fordelivery. Otherwise, the sender will bear any additional charges, such as clearancefees, if sent by air.

Should DOA cases fail, Advantech will take full responsibility for the product transpor-tation charges. If the items are not DOA, but fail within the warranty period, thesender will bear the freight charges. For out-of-warranty cases, customers mustcover the cost and be responsible for organizing both outward and inward transporta-tion.

3.5.3 Service ChargesThe product is excluded from warranty if

The product is repaired after expiry of the warranty period. The product is tested or calibrated after expiry of the warranty period, and a “no

problem found (NPF)” result is obtained. The product, although repaired within the warranty period, has been misused,

abused, or subjected to unauthorized disassembly/modification; placed in an unsuitable operating environment; improperly maintained by the customer; or has failed due to an accident or other cause for which Advantech is not respon-sible. Such conditions will be determined by Advantech at its sole unfettered dis-cretion.

The product is damaged beyond repair due to a natural disaster such as a light-ing strike, flood, earthquake, etc.

The product has been updated/upgraded as requested by customers who are without warranty.

If a product has been repaired by Advantech and within three months the same prob-lem occurs, Advantech will repair the product free of charge. However, such freerepairs do not apply to products that have been misused, abused, or subjected tounauthorized disassembly/modification; placed in an unsuitable operating environ-ment; improperly maintained by the customer; or has failed due to an accident orother cause for which Advantech is not responsible.

Please contact your nearest regional service center for a detailed service quotation.

Before beginning out-of-warranty repairs, Advantech will send customers a pro formainvoice (P/I) with the repair charges. When remitting the funds, please reference theP/I number listed under “Our Ref”. Advantech reserves the right to deny repair ser-vices to customers who do not return the DOA unit or sign the P/I. Furthermore,Advantech will scrap defective products without prior notice if customers do notreturn the signed P/I within 3 months.


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3.5.4 Repair ReportAdvantech returns every product with an accompanying repair report that details theresult of the repair. A repair analysis report can also be provided upon request. If thedefect was not caused by Advantech’s design or manufacturing, customers will becharged US$60/US$120 for in-warranty/out-of-warranty repair analysis reports,respectively.

3.5.5 Custody of Products Submitted for RepairAdvantech will retain custody of a product submitted for repair for 1 month if waitingfor a signed P/I or payment (A/R). If the customer fails to respond within this period,Advantech will automatically close the case. Advantech will take reasonable mea-sures to maintain contact with the customer during this 1-month period.

3.5.6 Shipping Back to the CustomerThe forwarding company for RMA returns from Advantech to customers is selectedby Advantech. Delivery can be arranged with other companies, such as UPS orFedEx, upon request. However, the customer must bear the extra costs of alternativeshipment. If customers require any special arrangements, they are asked to indicatethis when shipping the product to Advantech.


www.advantech.comPlease verify specifications before quoting. This guide is intended for referencepurposes only.All product specifications are subject to change without notice.No part of this publication may be reproduced in any form or by any means,such as electronically, by photocopying, recording, or otherwise, without priorwritten permission from the publisher.All brand and product names are trademarks or registered trademarks of theirrespective companies.© Advantech Co., Ltd. 2017

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