US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder1 US CMS Silicon...

US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder 1

US CMS Silicon Electronics TestingUS CMS Silicon Electronics Testing

US CMS Lehman Review

BNL5/21/03

A. Affolder

University of California

Santa Barbara

(on behalf of the US TOB testing group)


Electronics Testing GroupElectronics Testing Group– Fermilab (FNAL)

• S. Tkaczyk +2 technicians

– University of California, Riverside (UCR)• Gail Hanson, Patrick Gartung

– University of California, Santa Barbara (UCSB)• A. Affolder, S. Burke, C. Campagnari, D. Hale, J.Incandela, S. Levy,

S. Stromberg +2 Undergraduate Students

– University of Illinois, Chicago (UIC)• E. Chabalina, C. Gerber + 1 Graduate Student

– University of Kansas (KU)• A. Bean, L. Christofek, D. Coppage

– University of Rochester (UR)• R. Eusebi, A. Hocker, P. Tipton + 1 Graduate Student


OutlineOutline

• Introduction Clean rooms and infrastructure Test stands

• Testing model Plans for production First “300 modules”

• Status of each testing stage Hybrid testing Module testing Module burnin Rod assembly Rod burn-in with interlocks

• Summary


OverviewOverviewSS6 TOB5,6 1,800 6 122 - 4,147,200

SS4 TOB3,4 1,450 4 183 - 2,227,200

DS - rphi TOB1,2 1,150 4 183 - 1,766,400

DS - stereo TOB1,2 1,150 4 183 183 1,766,400

5,550 9,907,200

•FNAL and UCSB will have equal production capabilities and capacities

•UCSB will wire bond APV-pitch adaptors and thermal cycle hybrids for US sites FNAL test stands

– 2 of 4 DAQ and 2 of 4 ARCS UCSB test stands

– 1 of 3 DAQ and 3 of 5 ARCS UCR module diagnostics and repair

– 0 of 1 DAQ and 0 of 1 ARC

TOB Module Summary Table


FNAL Testing Clean Room FNAL Testing Clean Room

ARCS in place near gantry for quick testing

Space allocated for rods burn-in area, additional ARCS and DAQ (burn-in/repair) stands


UCSB Testing Clean RoomsUCSB Testing Clean Rooms•Clean room adjacent to production area 29 m2

Room layout finished Currently in high bay with intentionally

same layout– Missing only hybrid thermal cycling test

Beginning to move into completed area as we speak

•>100 m2 clean room dedicated solely to TOB rod assembly/testing

Currently removing gantry, wirebonder, OGP from space and into new clean room

– Simplifies transportation/storage of rods


Other Recent Infrastructure ProjectsOther Recent Infrastructure Projects

•Hybrid holding plates Matches hybrid thermal cycling

test stand Can bond and test with low

noise in same holder

•Hybrid thermal cycler Just beginning design

•Burn-in low voltage distribution crate

LED indicators and fuse protection

•Crowbar HV protection circuit

•Hybrid clamshell•Module clamshell


ARCS Based Test Stands ARCS Based Test Stands

•Hybrid testing Hybrid clamshells

•Hybrid thermal-cycler Under construction

•Module testing Module clamshell LED systems DEPP HV supply

Hybrid Clamshell

Module Clamshell

DEPP

LED Controller

ARC Controller

ARC crate

ARCS - APV Readout Controller Software

Purpose - Fast testing of hybrids and modules

Missing hybrid-to-utri adapters

to fully use capacity


DAQ Based Test StandsDAQ Based Test Stands

DAQ system – a prototype of the real CMS tracker readout chainPurpose – fast and burn-in testing of modules and rods (detail)

Single Module Test Stand

Module Burn-in

Rod Assembly And Burn-in

Missing necessary testing components for module burn-in and any rod testing


The TOB Testing CycleThe TOB Testing Cycle

Quick test hybrids on ARC Gantry constructs modules.

Modules test on ARC

Assemble rods from modules Rod burn-in Rods shipped to CERN

Thermal cycled module

Wir

e

bon

d

Final pinhole test on ARC

Wire bond

Thermal cycle hybrids


Production Ramp Production Ramp•Hybrids

Initially hybrids will have pitch adaptors bonded and will be thermally cycled and tested at CERN

Acceptance testing will occur at FNAL and later at UCSB

•Modules production will follow the flow presented earlier

All will be thermally cycled and run overnight with Vienna boxes to look for infant mortality and measure time constant for pinhole creation if applicable.

Separately some will be run longer to try to determine if any failures have longer time constants

•Rod Production Initially we will use whatever

single-rod test software is available

We will likely build single rods and run long-term tests on single rods until adequate multi-rod test software is available

– Interlocking for safety can be done in parallel with a separate pc


ARC Hybrid Test Results ARC Hybrid Test Results

•4 (11) hybrids have had APV bonded to pitch adapters at UCSB (FNAL)

2 opens developed in 7680 channels

– Final pitch adaptors will be more uniform even better bonding performance

•Hybrid clamshells enable testing without large pickup effects at chip edges

Same requirements can be made for hybrids with or w/o PA bonded


Hybrid Thermal CyclerHybrid Thermal Cycler

•Hybrid pitch adaptor pulsing/thermal cycling test

Acts as short-term burn-in (20 minutes)

– Hybrids (and components) tested for several minutes prior to arrival

•Very custom set-up Sam Burke (UCSB) has begun design

work for electrical system– Baseline provided by CERN

Dave Hale (UCSB) has begun mechanical design

Software for data acquisition and interlocks provided by CERN

•System should be operational in time for need (late summer)

Test/bonding performed by CERN for M800 hybrids

CERN Thermal Cycler

If failure rate determined to be low after first 200-300 hybrids, will

only sample test hybrids


ARCS Module TestingARCS Module Testing

• Group’s experience in previous silicon experiments have been used extensively to modify testing procedure

More stableMore descriptive

• Suggestions have been adopted by CMS silicon testing groups


ARC Module Testing (2)ARC Module Testing (2)

• Chip “feature” makes low common mode noise extremely important UCSB clamshell decreases

common-mode noise to the point where location of opens become detectable by their noise levels

– PA-sensor– Sensor-sensor

Pinholes act as if saturated High current channels can

have higher noise (Bad IStrip Slight noise increase on chip

edges

Pinholes

PA-sensor opens

Sensor-sensor opens

Bad CAC Bad Istrip

Sensor flaw

PEAK ON

Noisy Strips



•Gain test (UCSB) Test added to determine

location of opens without optical inspection/LED test

– Necessary for finding opens created during rod assembly/burn-in

Opens clear by higher gain Pinhole clear by lack of gain

Pinholes

Sensor-sensor open

PA-sensor open

Short



•Analysis macro under development which correlates testing results to determine type of channel defects

Ultimately will output list of bad channels with suggested repairs/rework necessary for module

Additional generates all plots necessary for module QA

•Work will be used to define testing criteria for cross calibration of all CMS strip silicon detectors


Module Testing ResultsModule Testing Results

• 18 prototype modules constructed at FNAL Used in rod prototypes and beam tests All of extremely good quality

• 8 production modules have been constructed and tested at FNAL

All of extremely good quality– 0.4% bad channel creation during early production

• 8 production module have been constructed and tested at UCSB All of extremely good quality

– 0.5% bad channel creation during early production• Last 4 modules had no bad channels introduced

– 3 damaged due to wire bonding mistake in the HV bias return line which will not be repeated

• Leads to high bias current (50-800 A)

• Will be used in cross calibration of all test stands


Module Burn-in StatusModule Burn-in Status

• Both Vienna boxes used for module burn-in arrived at UCSB

LV distribution + HV controllers ready

Demonstrated basic functionalitySoftware currently does not have

capability for multi-module tests– Patrick Gartung (UCR) and UIC

grad student (as of June) are actively working to improve software

• Once failure rates (if any) established, may be able to sample test


Rod Assembly Testing Rod Assembly Testing

• Actively working to finalize rod assembly hardwareVersions of rod assembly rotation table, rod handling tool

and all other tools should be shipped to UCSB soon

• Assembling single rod testing hardwareCommitment from CERN delivery of LV PS and DAQ

componentsCAEN HV PC controllers ordered

• Arrival times of assembly hardware and single rod testing hardware (2-3 months) match production schedule


Rod Burn-in Test Facility (UR Group)Rod Burn-in Test Facility (UR Group)

• Peak production at FNAL/UCSB will be at most 10 rods per week per site.

Each site will have capacity to burn-in 8 rods at one time.– 50% contigency

Currently plan 72 hour burn-in cycle– Should be able to reduce to 48 hours, if necessary

Each system to include…– Cold box

– Chiller

– PC/DAQ system for chiller and flow control

– 2nd PC for CMS DAQ system

– LV Power supplies provided by CERN

– HV Power supplies loaned from ‘CERN Prep’


Rod Burn-in Stand Status Rod Burn-in Stand Status

• Purchased a chest freezer and low temp chiller

Time from 20C to –25C is ~1.5 hours.

• Chiller DAQ system Flow, temperature control and dew point

interlocks have been specified and quoted.– Low noise equipment similar to CDF

• Rod DAQ systemCommitments for DAQ components made

– Scheduled to be delivered in time for use

Multi-rod software under-development – Group’s involvement in multi-module software should

speed finalization of software


Current Estimated Testing Through-putCurrent Estimated Testing Through-put

•Hybrid Arrival Testing 24 hybrids per day at UCSB Matches peak production

(+ contingency) Requires dedicated tech

•Hybrid Thermal Cycling Most components missing Construction should finish in-time

for need (late summer) Test stand will be able to match

production rate

•Module Basic Test 2 ARC LED stands at both sites 12 modules per day Matches peak production

(+ contingency) Requires dedicated tech

•Module Burn-in (Vienna Box) Lack of hybrid-to-utri adapters

limits testing through-put to 1– Should receive more in next few

weeks Current software can only test 1

module at a time

•Rod Assembly Testing Most hardware not delivered yet

– Currently cannot test any rods– Will be able to match production

rate with full compliment of equipment

•Rod Burn-in will start in fall


SummarySummary• Production ramp up at FNAL/UCSB has begun

Current hardware/software meet hybrid/module testing needs – Multi-module burn-in software needed in near future

• Group actively working on software We have developed testing protocols to decisively find/diagnose all problem

channels Extremely high quality modules have been made so far

– <0.5% bad channels introduced per module

• We will need more test equipment to achieve peak rate Commitments made to deliver equipment in time

• Rod assembly and test stands under development Equipment specified and ordered

• Rod burn-in infrastructure to be ready in early summer Rod DAQ electronics and software will be ready

• Group’s work on multi-module burn-in software will speed up software development


Back-up Slides


Tracker/DAQ Readout SystemTracker/DAQ Readout System

PLL Delay

MUX 2:1

PLL

APVamplifierspipelines128:1 MUX

Detector Hybrid A-Opto Hybridprocessingbuffering

TTCRx

ADC

Rx Module

FED

DCU

TTC

DAQ

TTCRx

FEC

CCUCCU

CCU CCU

Control

processingbuffering

D-Opto Hybrid

Front End Drivers (FED) digitize the data

Front End Controller (FEC) distributes clock and trigger signals to the front end and sets and monitors all APV parameters

TSCTrigger Sequencer Controller (TSC) generates trigger signals corresponding to a L1 Trigger

Communications and Control Unit (CCU) provides slow control

Return


Testing Model (1) (03/01/29)Testing Model (1) (03/01/29)

• Hybrids Shipped to UCSB

– Visual Inspection

– Simple functionality test

– Wire bond pitch adaptors

– Thermal cycle with continuous ARC test and pitch adaptor pulsing

Distributed among FNAL and UCSB for production

– FNAL to repeat simple functionality test for finding transport damage

•Modules Fast test with ARC/LED

– Simple repairs (e.g. pull wirebonds on any newly developed pinholes)

Overnight “burn-in” of modules with Vienna box (sample unless necessary to do all)

Final pinhole check with ARC/LED

Modules stored for later rod installation


Testing Model (2) (03/01/29)Testing Model (2) (03/01/29)

• Rods at US SitesReceived and visually inspectedModules mounted on rod

– According to flavor (1 of 24)

– All modules mounted (e.g. 6 at a time for SS rod) and tested

Capacity: 2 SS rods/day per siteLT Test

– Up to 8 rods per site for up to 72 hours with 3 thermal cycles per day sampled data taking

– Recalibrate optohybrid vs temp

Final test at US site



•Chip “feature” results in loss of entire chip due to saturation effects if few pinholes bonded•LED pinhole test

Bonded multiple inherent pinholes on purpose

LED test always detects pinholes seen in sensor probing

PinholeSensor flaws

Pinholes are clearly identified


Rod Assembly Testing (2) Rod Assembly Testing (2)

• PC boardsNow need 5 PCI slot + 1 ISA slot +ethernet + COM port +

LV DI/O card (if necessary)– Neither site has such a computer

1 TSC2 FED2 OEC

– Allows for SS4 rods only

2 DI/O cards


Rod Assembly Testing (3) Rod Assembly Testing (3)

• To get first site read-out rods need the following hardware

1 LV PS1 A1303 CAEN controller1 PC (5 PCI + 1 ISA + ethernet + 1 com + LV DI/O

(maybe))2 Electrometers1 DI/O card1 OEC

• LV PS, A1303, and electrometers all may be long lead time items (2-3 months)

US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder1 US CMS Silicon...

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