UNIVERSITY OF CALIFORNIA Los Angeles Comparison of Digital...

102
UNIVERSITY OF CALIFORNIA Los Angeles Comparison of Digital Offset Compensation in Comparators A thesis submitted in partial satisfaction of the requirements for the degree Master of Science in Electrical Engineering by Koon Lun Jackie Wong 2002

Transcript of UNIVERSITY OF CALIFORNIA Los Angeles Comparison of Digital...

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UNIVERSITY OF CALIFORNIA

Los Angeles

Comparison of Digital Offset

Compensation in Comparators

A thesis submitted in partial satisfaction

of the requirements for the degree Master of Science

in Electrical Engineering

by

Koon Lun Jackie Wong

2002

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The thesis of Koon Lun Jackie Wong is approved.

________________________________ Behzad Razavi

________________________________ Ingrid Verbauwhede

________________________________ C.-K. Ken Yang, Committee Chair

University of California, Los Angeles

2002

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Table of Contents

COMPARISON OF DIGITAL OFFSET COMPENSATION IN COMPARATORS1

CHAPTER 1 INTRODUCTION ..................................................................................... 1 1.1 GENERAL PURPOSES OF COMPARATORS..................................................................... 1 1.2 REQUIREMENTS ON COMPARATORS............................................................................ 1 1.3 INTRODUCTION TO OFFSET COMPENSATION............................................................... 6

CHAPTER 2 CORE COMPARATOR DESIGN........................................................... 9 2.1 ACCURACY............................................................................................................... 10

2.1.1 Device Mismatch in Differential Pair .............................................................. 10 2.1.2 Total Input Referred Offset of Comparator...................................................... 12

2.2 SUPPLY SENSITIVITY ................................................................................................ 24 2.2.1 Supply Sensitivity due to each transistor.......................................................... 24 2.2.2 Overall Supply Sensitivity of Core Comparator .............................................. 26

2.3 SPEED....................................................................................................................... 27 2.3.1 Evaluation Phase.............................................................................................. 27 2.3.2 Reset Phase ...................................................................................................... 34

2.4 INPUT CAPACITANCE ................................................................................................ 40 2.5 POWER CONSUMPTION ............................................................................................. 41 2.6 DESIGN OF NEXT STAGE (SR LATCH)....................................................................... 41

CHAPTER 3 DIGITAL OFFSET COMPENSATION ............................................... 43 3.1 FOUR DIFFERENT ARCHITECTURES .......................................................................... 44

3.1.1 Architecture Comp1 ......................................................................................... 44 3.1.2 Architecture Comp2 ......................................................................................... 45 3.1.3 Architecture Comp3 ......................................................................................... 46 3.1.4 Architecture Comp4 ......................................................................................... 47

3.2 CHARACTERISTICS OF DIGITAL OFFSET COMPENSATION.......................................... 48 3.2.1 Offset Magnitude of Digital Compensation ..................................................... 48 3.2.2 Linearity of Digital Offset Compensation ........................................................ 52 3.2.3 Worst-Case Overall Offset after compensation ............................................... 55

3.3 SUPPLY SENSITIVITY ................................................................................................ 56 3.4 SPEED....................................................................................................................... 59

3.4.1 Comparison on Speed of Different Architectures ............................................ 60 3.4.2 Speed Penalty of Digital Offset Compensation ................................................ 63 3.4.3 Comparison on Linear and Non-linear scaling ............................................... 65

3.5 INPUT CAPACITANCE ................................................................................................ 67 3.6 POWER CONSUMPTION ............................................................................................. 67

3.6.1 Power of Comparators ..................................................................................... 67 3.6.2 Power of Clocking............................................................................................ 70

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3.6.3 Total Power ...................................................................................................... 71 3.7 QUICK SUMMARY OF COMPARISON.......................................................................... 73

CHAPTER 4 CIRCUIT PERFORMANCE ................................................................. 74 4.1 ACCURACY............................................................................................................... 74

4.1.1 Measured Internal Offset Due to Device Mismatches ..................................... 74 4.1.2 Measured Digital Offset Compensation........................................................... 77 4.1.3 Linearity ........................................................................................................... 82 4.1.4 Worst-case Overall Offset ................................................................................ 85

CHAPTER 5 APPLICATIONS OF COMPARATORS.............................................. 89 5.1 APPLICATION OF COMPARATORS ON MULTIPHASE FLASH ADC .............................. 89

CHAPTER 6 CONCLUSION ........................................................................................ 93

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List of Figures

Figure 1 Ideal input/output characteristic of a comparator ................................................. 2 Figure 2 Positive feedback realization ................................................................................ 2 Figure 3 Block diagram of flash ADC architecture ............................................................ 4 Figure 4 Schematic of (a) an amplifier (b) a comparator.................................................... 5 Figure 5 A comparator with analog offset compensation ................................................... 6 Figure 6 Timing Diagrams of φ1, φ2, φ3, VX, and VY............................................................ 7 Figure 7 Core Comparator................................................................................................. 10 Figure 8 Model of Device Mismatch in Differential Pair ................................................. 12 Figure 9 Core comparator model for offset calculations................................................... 12 Figure 10 Current factor mismatch of M1 ......................................................................... 14 Figure 11 common mode analyses of M1,2........................................................................ 15 Figure 12 Threshold mismatch of M3 ............................................................................... 17 Figure 13 common mode analyses for M3 ........................................................................ 18 Figure 14 Current factor mismatch of M3 ......................................................................... 20 Figure 15 Input referred offset voltage due to each transistor .......................................... 23 Figure 16 Supply Sensitivity on Offset due to ∆β1, ∆β2, and ∆Vth2 .................................. 25 Figure 17 Overall Supply Sensitivity on Offset ................................................................ 27 Figure 18 Reset Response of sim2, sim3, sim10, and sim11 ............................................ 38 Figure 19 Simplified SR Latch.......................................................................................... 42 Figure 20 Schematic of Comp1......................................................................................... 44 Figure 21 Schematic of Comp2......................................................................................... 45 Figure 22 Schematic of Comp3......................................................................................... 46 Figure 23 Schematic of Comp4......................................................................................... 47 Figure 24 Digital Offset of Comp1 ................................................................................... 50 Figure 25 Digital Offset of Comp2 ................................................................................... 50 Figure 26 Digital Offset of Comp3 ................................................................................... 51 Figure 27 Digital Offset of Comp4 ................................................................................... 51 Figure 28 Digital Offset DNL of Comp1 .......................................................................... 53 Figure 29 Digital Offset DNL of Comp2 .......................................................................... 53 Figure 30 Digital Offset DNL of Comp3 .......................................................................... 54 Figure 31 Digital Offset DNL of Comp4 .......................................................................... 54 Figure 32 Worst-case overall offset .................................................................................. 56 Figure 33 Supply Sensitivity on Offset of Comp1............................................................ 57 Figure 34 Supply Sensitivity on Offset of Comp2............................................................ 57 Figure 35 Supply Sensitivity on Offset of Comp3............................................................ 57 Figure 36 Supply Sensitivity on Offset of Comp4............................................................ 58 Figure 37 Illustration of input transconductance loss ....................................................... 63 Figure 38 Schematic of Comp1 with 3-bit linear scaling.................................................. 65 Figure 39 Power Consumptions with Digital Offset Compensation Off .......................... 69 Figure 40 Power Consumptions with Digital Offset Compensation On........................... 69

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Figure 41 Total Power Consumption with Digital Compensation Off ............................. 71 Figure 42 Total Power Consumption with Digital Compensation On.............................. 72 Figure 43 Measured Internal Offset of Comp1 ................................................................. 75 Figure 44 Measured Internal Offset of Comp2 ................................................................. 75 Figure 45 Measured Internal Offset of Comp3 ................................................................. 76 Figure 46 Measured Internal Offset of Comp4 ................................................................. 76 Figure 47 Measured Digital Offset of Comp1 .................................................................. 79 Figure 48 Measured Digital Offset of Comp2 .................................................................. 79 Figure 49 Measured Digital Offset of Comp3 .................................................................. 80 Figure 50 Measured Digital Offset of Comp4 .................................................................. 80 Figure 51 Measured DNL of Comp1 ................................................................................ 83 Figure 52 Measured DNL of Comp2 ................................................................................ 83 Figure 53 Measured DNL of Comp3 ................................................................................ 84 Figure 54 Measured DNL of Comp4 ................................................................................ 84 Figure 55 Measured Offset of Comp1 after Digital Compensation .................................. 86 Figure 56 Measured Offset of Comp2 after Digital Compensation .................................. 86 Figure 57 Measured Offset of Comp3 after Digital Compensation .................................. 87 Figure 58 Measured Offset of Comp4 after Digital Compensation .................................. 87 Figure 59 Comparison on worst-case offset...................................................................... 88 Figure 60 Block Diagram of Multiphase Flash ADC ....................................................... 89 Figure 61 Speed of 6-bit p-phase Flash ADC ................................................................... 92 List of Tables

Table 1 Simulation results on evaluation with varying comparator transistor size .......... 33 Table 2 Simulation results on reset device........................................................................ 37 Table 3 Evaluation and Reset with vary Vcm (see Table 1,Table 2 for term definition) . 39 Table 4 Power Consumption of Core Comparator............................................................ 41 Table 5 Worst-case Supply Sensitivity of Comp1 − Comp4 ............................................ 59 Table 6 Speed Comparisons with Digital Offset Compensation Off ................................ 60 Table 7 Speed Comparisons with Digital Offset Compensation On................................. 61 Table 8 Maximum Sampling rate of different architecture............................................... 62 Table 9 Speed Comparisons on linear and non-linear scaling of Comp1 ......................... 65 Table 10 Power of Clocking.............................................................................................. 70 Table 11 Performances Rating of Comparators ................................................................ 73

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ABSTRACT OF THE THESIS

Comparison of Digital Offset

Compensation in Comparators

by

Koon Lun Jackie Wong

Master of Science in Electrical Engineering

University of California, Los Angeles, 2002

Professor C.-K. Ken Yang, Chair

Digital offset compensation is an efficient technique for designing high speed, high

accuracy, low input capacitance, and low power comparators. Low input capacitance and

low power allow higher order of parallelism, while digital offset compensation allows

high accuracy. A 4-bit digital offset compensation can reduce 140mV input referred

offset due to device mismatches to 13mV. For comparison, four different architectures of

digital offset compensation are fabricated in 0.18µm 1.8V CMOS technology, and a set

of performance metrics for a comparator is developed to compare the tradeoffs between

these four architectures.

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Comparison of Digital Offset Compensation in Comparators

Chapter 1 Introduction

1.1 General Purposes of Comparators

Modern integrated circuits (IC) design almost always involves strong well defined

digital signals; however, incoming data is often analog signals or corrupted digital signals,

which are caused by limited bandwidth of transmission line, noise coupling, capacitive

and inductive effects from the printed circuit board (PCB), chip package, wire bond, etc.

In order to convert the weak corrupted signals to full swing digital signals, a comparison

with a fixed reference value is performed. A comparator outputs a digital 0 if the signal is

below the reference or a digital 1 if the signal is above the reference.

Comparators are commonly found in modern IC design. Since most IC designs

are synchronous system, comparators are usually triggered by clock. Clocked

comparators are commonly found in Analog-to-Digital Converter (ADC) and based band

receivers. Moreover, since comparators have large voltage gain, they are often used as

sense amplifiers in SRAM and DRAM. Sometimes, in high performance circuits,

comparators are used as a storage element, for instance a latch.

1.2 Requirements on Comparators

In applications like flash ADC and over-sampled receiver, a comparator requires

high gain, high sampling rate, high accuracy, low power consumption, and low input

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capacitance. In addition, comparators are required to be triggered by clock, if the systems

are synchronous. The requirements of comparators are discussed one by one below.

Figure 1 Ideal input/output characteristic of a comparator

The first requirement of a comparator is having high gain. An ideal comparator

has input/output characteristic as shown in Figure 1. In real implementation, high gain

amplifier is used to approximate this input/output characteristic. To achieve virtually

infinite gain, positive feedback is often employed in comparator design. A simple

realization of positive feedback system could be two back-to-back inverters, as shown in

Figure 2. The output (V1 – V2) of this circuit increases exponentially with time. This will

be discussed in detail in Chapter 2.

Figure 2 Positive feedback realization

The second requirement of a comparator is having high sampling rate. As

synchronous system is running faster and faster, we require clocked comparator to run at

a higher sampling rate as well. A common clocked architecture that can achieve high

sampling rate has two phases of operation: evaluation phase and reset phase. In

Vin1−Vin2

Vout

Vin1

Vin2

Vout

V1 V2

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evaluation phase, positive feedback is enabled to achieve high gain. In reset phase,

positive feedback is disabled and the comparator clears its previous sample. For fast

operation, reset must be completed quickly and the positive feedback should be enabled

quickly and have short regeneration time constant.

The third requirement of a comparator is having high accuracy, for example ½

LSB of an ADC or minimum signal magnitude of a receiver. Errors that cause inaccuracy

usually are offsets, noise, and residual value from prior comparison. Offsets are often the

largest errors in comparator design. Offsets can be classified into systematic and random

offsets. Systematic offsets can be minimized by symmetric design and careful layout.

Random offsets are caused by device mismatches in layout, and the variance of mismatch

is inversely proportional to the area of devices size (W×L) [1]. Thus, to reduce random

offsets, we should make devices bigger. However, as modern CMOS technology scales

down for higher switching speeds and higher transistor density, offset requirements

become more and more difficult to fulfill. The second error that causes inaccuracy is

noise. Noise includes thermal noise, flicker noise, supply noise, and sampling noise.

Thermal noise is white Gaussian noise from resistors and transistors. Flicker noise is

often referred to 1/f noise of a transistor. Supply noise does not affect the output directly,

because comparator is a fully differential circuit. However, due to large device

mismatches, supply noise may momentarily change the input referred offset, and thus

degrade the accuracy. Sampling noise is caused by the fast transition of clock from reset

phase to evaluation phase. Fortunately, sampling noise is often negligible even with

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sampling rates of several GSamples/s1. The third error that causes inaccuracy is the

residual value from prior comparison. During reset phase, the comparator clears the

previous data. However, if the reset is not completed before the next evaluation phase

comes, small residual charge on output will get amplified exponentially because of

positive feedback. The imbalanced output thus creates input referred offset, degrading the

comparator accuracy. Since the residual charge depends on the previous sample, this

error is sometimes called Inter-Symbol Interference (ISI).

Figure 3 Block diagram of flash ADC architecture

The forth requirement of a comparator is having low power consumption. The

power consumption of a comparator must be low because frequently a large number of

1 Analysis of sampling noise is not part of this research.

VFS

COMP

COMP

COMP

COMP

Vin

clk

2N

DEC

OD

ER

N Digital Output

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comparators operating in parallel are used in a flash ADC architecture or in an over-

sampled receiver. A block diagram of a simple flash ADC is shown in Figure 3. The

basic concept of a flash ADC is to use 2N comparators to compare the input signal with

reference voltages that are generated by dividing the full scale voltage VFS by 2N resistors.

Decoder then converts the comparators output to binary code. Hence a N-bit flash ADC

requires 2N comparators. As a result, the power consumption of a flash ADC doubles as

the number of bits of resolution increases by one.

Figure 4 Schematic of (a) an amplifier (b) a comparator

The last requirement of a comparator is having low input capacitance since low

input capacitance limits the input bandwidth. Similar to power consumption, total input

capacitance of a N-bit flash ADC is simply 2N × input capacitance of a comparator. For a

typical amplifier (Figure 4a) and a typical comparator (Figure 4b), input capacitance is

directly proportional to the size of input devices M1,2. In favor of input capacitance, we

should use small input devices M1,2. However, in favor of offset, we should use big input

M1

M2

M4

VDD

Vb

Vin1 Vin2

M3

Vout1 Vout2

M1

M2

M4

VDD

Vin1 Vin2

Vout1 Vout2

M3

Rst

M5

(a) (b)

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devices. This contradiction leads to direct tradeoffs between accuracy and input

bandwidth. Therefore, offset compensation is introduced to reduce input referred offset

while keeping input devices small.

1.3 Introduction to Offset Compensation

The ultimate goal of offset compensation in comparators is to reduce the input

referred offset. Offset compensation can be done in analog method or in digital method.

Figure 5 A comparator with analog offset compensation

Traditionally, analog offset compensation is used, and it utilizes capacitors to

store offsets. Figure 5 shows an example of comparator with analog offset compensation

[2]. The comparator has regenerative amplifier M1 – M4, reset S5 – S7, and sampling

network S1 – S4 and C1,C2. shows the timing diagram of φ1, φ2, φ3, and VX, VY.

M3

M1 M2

M4

S7 S6 S5

C2 C1

S2

S4

S1

S3

φ3

VDD

φ1 φ1 φ2 φ2

φ1 φ1

+Vout −Vout

+Vin

+Vref

−Vin

−Vref

Q P

X Y

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Figure 6 Timing Diagrams of φ1, φ2, φ3, VX, and VY

The operation of this comparator is the following: 1) The comparator is in reset phase, φ1

= H, φ2 = L, φ3 = H, S3 – S7 are on. Nodes P and Q are charged to +Vref and –Vref

respectively, and the offset of the comparator is stored in C1 and C2. 2) At t1, φ1 switches

to low, S3 – S6 turn off, so reset ends. 3) At t2, φ2 switches to high, S1 and S2 turn on to

track the inputs. 4) At t3, φ3 switches to low, S7 turns off, and regeneration starts. In this

example, we decouple the relationship between input capacitance and offsets. During

tracking mode in step 3, inputs see C1,2 in series with gates of M1,2, which results a

capacitance as small as gate capacitance of M1,2. Meanwhile, offset of the comparator is

given in [2]:

121

;7

71

−=∆+=

Rg

RgAV

AV

VmP

mNd

d

OSOS ,where VOS1 is the input-referred offset without

offset compensation, Ad is the differential voltage gain form the gates of M1 and M2 to

their drains, and ∆V is the offset due to charge injection mismatch between S5 and S6. gmN

and gmP are the NMOS and PMOS transconductance respectively, and R7 is the small-

signal on-resistance of S7. One potential problem for this architecture is that it may

t1 t2 t3 time

φ1

φ2

φ3

VX, VY

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require large C1,2 to reduce the charge injection mismatch between S5 and S6. Large C1

and C2 increase the settling time during reset and thus slow down the operating frequency.

Generally analog offset compensation requires a capacitor to store the offset in every

cycle, so the comparator is in closed loop in around half a cycle. The maximum speed of

a comparator is eventually limited by the closed loop response. This restriction is much

more relaxed in digital offset compensation.

In digital offset compensation, offsets of a comparator can be tuned by changing

the digital inputs. Offsets are then stored in static memory when the system is initialized.

Hence, the comparator can remain in open loop most of the time, and thus its inherent

maximum speed can possibly be achieved.

This project focuses on digital offset compensation techniques and how they

affect the other requirements of gain, sampling rate, etc. Four different digital offset

compensation architectures are compared. Chapter 2 begins by discussing the design

issues of a core comparator. This core comparator will also be the baseline to which each

of compensation technique is compared for the penalty of inserting digital compensation.

Comparisons on digital offset compensation in chapter 3 will be based on performance

parameters and terminology presented in chapter 2. A test chip is fabricated in 0.18um

CMOS technology, and measured results will be given in chapter 4. Applications of

comparators will be discussed in chapter 5.

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Chapter 2 Core Comparator Design

This project starts with a basic design of comparators. While there are many

architectures, we chose the comparator as shown in Figure 7 for its power efficiency [3].

This comparator has two operation modes, evaluation phase and reset phase. In

evaluation phase, clk is logical high. Current source Mclk turns on, and the input devices

M1,2 sense the differential input. The differential current of M1,2 imbalances the back-to-

back inverters, which form a positive feedback system. The imbalance charge on Vout1,

Vout2 is then regenerated to full swing. In reset phase, Mclk turns off and all RST1-6 turn on.

The reset devices RST1-6 eliminate all imbalance charge, so the previous data is cleared.

At this time, the comparator goes back to initial state and is ready to amplify the signal

when evaluation phase comes again.

Four digital offset compensation techniques are explored based on the same basic

comparator structure. Then we can examine not only tradeoffs among different

compensation architectures but also tradeoffs between with and without digital offset

compensation. For each compensation architecture, we base our comparison on the same

set of performance metric: accuracy, supply sensitivity, speed, input capacitance, and

power. This chapter looks at each of these metrics for the core comparator. A brief

discussion on SR latch, which receives the output of comparator and provides constant

logical output over one cycle, will be given at the end of this chapter.

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Figure 7 Core Comparator

2.1 Accuracy

A very important requirement of a comparator is small input referred offset

voltage. Any input offset voltage in comparator will directly add on the signal; as a result,

the accuracy of the comparator will be decreased. Offsets can be systematic or random.

Systematic offset can be minimized by differentially symmetric design and careful layout.

Random offset arises if there are device mismatches. In this section, we will describe the

model for device mismatch in differential pair and total input referred offset of the

comparator.

2.1.1 Device Mismatch in Differential Pair

Matching properties of CMOS transistor are categorized into threshold mismatch,

RST2 42

M5 42

VDD

RST142

RST5 42

RST6 42

M642

M3 42

M442

RST442

RST3 42

M1 82

M282

Mclk 162

Vout1 Vout2

Vin1 Vin2

clk

clk clk

clk

invbot1 invbot2

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∆Vth, and current factor mismatch, ∆β, according to [1]. The magnitude of these two

quantities can be approximated for a give gate oxide thickness and transistor size. For

instance, in 0.18µm technology, oxide thickness is around 4nm. In our comparator design,

drawn size of input transistor is W/L = 8λ/2λ = 0.96µm/0.24µm. Note that effective

channel length for the drawn length of 0.24µm is 0.18µm. The standard deviation of the

random mismatches can be approximated by [1],

eff

Vthth WL

AV

22 )( =σ

effWLA2

2

2 )( β

ββσ = ,

where σ(Vth) and σ(β) are standard deviation of ∆Vth and ∆β respectively, AVth2 and Aβ

2

are area proportionality constant which could be found from a lookup graph for a given

oxide thickness. It is found that AVth = 4mVµm, Aβ = 1%µm, σ(Vth) = 9.62mV and σ(β)

β

= 2.41%. Adapting to this methodology and assuming worst-case conditions, we will

model the threshold mismatch as an ideal voltage source on transistor gate with

magnitude ∆Vth = 6σ(Vth), and current factor mismatch as error in channel width, ∆W W =

6 σ(β)

β . This simple model is illustrated in Figure 8.

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Figure 8 Model of Device Mismatch in Differential Pair

2.1.2 Total Input Referred Offset of Comparator

With a mismatch model for a differential pair, we can replace all pairs in our core

comparator with this model to find the total input referred offset. In order to obtain the

worst-case offset, the placements of the voltage sources and scaled transistors are

specially chosen. As shown in Figure 8, transistors labeled with “OS” are replaced by the

mismatch model. For clarity, all reset devices RST1-6 are not shown.

Figure 9 Core comparator model for offset calculations

The mismatches of three differential pairs contribute offset of the comparator. In

this section, I will discuss the affects of each offset source carefully, and simulation

W−∆WL

WL

+ − ∆Vth

Vin1 Vin2

VDD

M1(OS) W12L

M2 W12L

Mclk Wclk

L

M3(OS) W36L

M4 W36L

invbot1 invbot2

M5 W36L

(OS)M6 W36L

Vout1 Vout2

Vin1 Vin2

clk

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results are presented at the end of this section to confirm the theoretical results.

Offset due to threshold mismatch of M1, ∆Vth1:

∆Vth1 is modeled as a voltage source on the gate of transistor M1. Since M1 is the

input device of the comparator, the input referred offset voltage due to threshold

mismatch of M1 is just ∆Vth1 itself. This magnitude is always constant under any bias

conditions.

Offset due to current factor mismatch of M1, ∆β1:

∆β1 is modeled as a channel width mismatch ∆W, i.e. ∆ββ =

∆WW To calculate the

input referred offset due to ∆W, I will calculate the differential current that ∆W generates,

as illustrated in Figure 10a, and then compare the current with that of generated by

equivalent ideal voltage source at the input, as shown in Figure 10b.

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Figure 10 Current factor mismatch of M1

Before analyzing two configurations, it is important to know that transistors M1,2 are in

saturation because in the beginning of evaluation mode node invbot1, invbot2 are

precharged to VDD. However, Mclk is in triode region because Vgs,Mclk = VDD, Vds,Mclk =

Vcm − Vgs1,2, which could be quite low. Analyzing Figure 10a, we could find:

211

211

212

211

211

)(21

)(21)(

21

)(121)(

21

thgsndiff

thgsnthgsoxn

thgsnthgsoxn

VVWWki

VVkVVL

WCI

VVWWkVV

LWWCI

∆=

−=−

=

∆+=−

∆−=

µ

µ

From Figure 10b, we have:

)(, 1111 thgsnmeqmdiff VVkgwhereVgi −=∆=

Equation 1 )(21

1, 1 thgstodueeq VVWWV −∆=∆⇒ ∆β

VDD

M1(OS)W−∆W

L

M2WL

Mclk Wclk

L

M3

M4

invbot1 invbot2

M5

M6

Vin1 Vin2

clk

VDD

M1 WL

M2 WL

Mclk Wclk

L

M3

M4

invbot1 invbot2

M5

M6

Vin1 Vin2

clk

+ −

I1 I2 I1 I2

∆Veq

(a) (b)

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15

Although this is a valid equation, this gives no insight on how it behaves for a given input

common mode voltage, which could be determined and controlled easily. Thus, it is

desirable to relate Vgs1 with input Vcm.

Figure 11 common mode analyses of M1,2

If we look at only common mode voltage, the input differential pair can be

combined into a single transistor twice as wide as original. Thus, circuit in Figure 11a can

be transformed to Figure 11b. Mclk is in triode region, so it is modeled as a resistor, and

M1,2 are in saturation because their drains are closed to VDD at the beginning of

evaluation mode. Hence we can write:

1

2112

1,

211

12

11

1,211

)()(

)()(

)(

)(212

gsthDDclk

thgsgs

thDDclkn

thgsngsthgsnclkcm

clk

gscm

clk

clkdsthgsn

VVVW

VVWV

VVkVVk

VVVkRV

RVV

RV

VVkI

+−

−=+

−−

=+−=

−==

−=

VDD

M1 W12L

M2 W12L

Mclk Wclk

L

M3

M4

invbot1 invbot2

M5

M6

Vcm Vcm

clk

VDD

M12 2W12

L

Rclk

M34

invbot12

M56

Vcm

+Vds,clk

_

(a) (b)

I

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16

This is a quadratic equation, so we can solve for (Vgs1 −Vth) after subtracting both sides by

Vth:

Equation 2

−−

+−

=− 1)()(4

12

)( 12

121

thDDclk

thcmthDDclkthgs VVW

VVWW

VVWVV

Therefore, we can substitute Equation 2 back to Equation 1 to get the input referred offset

due to current factor mismatch of M1 in terms of input Vcm. 1, β∆∆ todueeqV is, thus,

approximately square root of (Vcm − Vth) dependence.

Offset due to threshold mismatch of M3, ∆Vth2:

At the beginning of evaluation phase, invbot1,2 will drop from VDD. By the time

that invbot1,2 drops to VDD −Vthn, transistors M3,4 will turn on. However, M1-4 are still in

saturation. M3,4 act as cascode devices, and thus, ∆Vth2 does not create any offset at the

beginning of evaluation phase.

As invbot1,2 continue to drop and input devices M1,2 enter triode region, ∆Vth2

influences the differential current and thus creates offset. Let us analyze the differential

current as in the previous case. Here, I assume that out1, out2 are still closed to VDD, and

M5,6 are still off. This assumption is reasonable because by the time that M5,6 are on, the

signal is amplified, and hence the influence of ∆Vth2 becomes relatively small.

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17

Figure 12 Threshold mismatch of M3

In Figure 12a, since M1,2 enter triode region, they are modeled as resistors. As a

result, M3,4 is a degenerated differential pair. The differential current is:

)(1),(,

1,

111333

13

3,32,3

thgsnthgsnm

m

meffmtheffmdiff VVk

RandVVkgRg

ggwhereVgi

−=−=

+=∆=

In Figure 12b, differential current due to equivalent offset voltage is:

1111 , dsnmeqmdiff VkgwhereVgi =∆=

Using these two equations, we can find the input referred offset. However, the

mathematics becomes complicated very quickly. To simplify the calculation, we note that

313

3

1 11

mm

m gRg

gR

≤+

We can use this to calculate the upper and lower bounds of input referred offset. Since

upper bound gives the worst case offset, only upper bound calculation is shown here. As

a result, the upper bound of input referred offset due to ∆Vth2 is

VDD

M1 W12L

M2W12L

Mclk Wclk

L

M3(OS) W36L

M4W36L

invbot1 invbot2

M5

M6

Vout1 Vout2

Vin1 Vin2

clk

+ −

∆Vth2

VDD

M1 W12L

M2 W12L

Mclk Wclk

L

M3 W36L

M4 W36L

invbot1 invbot2

M5

M6

Vout1 Vout2

Vin1 Vin2

clk

+ −

∆Veq

(a) (b)

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18

Equation 3 2112

3362

1

3,

)(2 th

ds

thgsth

m

mVtodueeq V

VWVVW

Vgg

Vth

∆−

=∆≤∆ ∆

Again, we want to relate the above equation with input common mode voltage, so we do

a common mode analysis.

Figure 13 common mode analyses for M3

Assuming out1, out2 are closed to VDD, we can find Vds1:

Equation 4 )()( 131 gscmgsDDds VVVVV −−−=

From current equations, we have:

Equation 5 2331

233

1 )()( thgsnclkgscmthgsnclk

gscm VVkRVVVVkR

VVI −=−⇒−=

−=

Substituting the above back to Vds1, and substituting Vds1 into Equation 3, input referred

offset voltage becomes:

VDD

M1 W12L

M2W12L

Mclk Wclk

L

M3 W36L

M4W36L

invbot1 invbot2

M5

M6

Vout1 Vout2

Vcm Vcm

clk

VDD

M12 2W12

L

Rclk

invbot12

M56

Vout12

Vcm

+Vds,clk

_

(b)

M34 2W36

L

(a)

I

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19

Equation 6 212

362

333

3, )(2 th

ODnclkODthDD

ODVtodueeq V

WW

VkRVVVVV

th∆

−−−≤∆ ∆ , where

thgsOD VVV −= 33 is the overdrive voltage of M3.

The exact relationship between VOD3 and Vcm could be found by writing the drain current

of transistor M1 and substituting into Equation 5. Instead of the complete equations, to

understand how ∆Veq,due to ∆Vth2 and Vcm are related, we can pay attention on the

denominator of Equation 6. The denominator is simply a constant (VDD –Vth) subtract

(VOD3+Rclkkn3VOD32). We can expect that (VOD3+Rclkkn3VOD3

2) increase with Vcm by

inspecting Equation 5. The denominator will eventually reduce to zero if we allow Vcm to

increase beyond VDD. In other words, ∆Veq,due to ∆Vth2 will increase to infinity in the same

way as hyperbola. However, in the limited range of Vcm, we can only see a small portion

of hyperbolic curve as shown in simulation results in Figure 15.

Offset due to current factor mismatch of M3, ∆β2:

As in the previous case, we treat transistors M1,2 as resistors, and we can write the

differential current due to ∆β2 as:

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20

Figure 14 Current factor mismatch of M3

( ) ( )

( ) ( ) ( )

∆+∆+

∆+∆−−−∆=

−−−∆−

∆+=

36

23

3633

23

363

23

233

363

11221

121

WWV

WWVVVVV

WWk

VVVVVW

Wki

gsgsthgsthgsn

thgsthgsgsndiff

where ∆Vgs3 is the small change in Vgs3 due to introducing 36WW∆ in M3.

We can neglect the products of ∆ terms because they are relatively small, and the

differential current is equal to the difference of current through M1,2, which is modeled as

R1. Assuming the gate voltages of transistors M3,4 are the same, we can write:

( ) ( )1

333

23

363 2

21

RV

VVVVVW

Wki gsgsthgsthgsndiff

∆=

∆−−−∆≈

Equation 7

( )( )

( )31

23

363

331

23

363

121

121

m

thgsn

thgsn

thgsn

diff gR

VVW

Wk

VVkR

VVW

Wki

+

−∆

=−+

−∆

≈⇒

VDD

M1 W12L

M2 W12L

Mclk Wclk

L

M3(OS)W36−∆W

L

M4 W36L

invbot1 invbot2

M5

M6

Vout1 Vout2

Vin1 Vin2

clk

VDD

Mclk Wclk

L

M3(OS) W36−∆W

L

M4 W36L

invbot1 invbot2

M5

M6

Vout1 Vout2

clk

R1 R1

(a) (b)

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21

The expression in Equation 7 makes sense because it simply states that the small change

in drain current due to ∆β2 is the increase in current for a non-degenerated transistor

divided by (1+degeneration loop gain). Again to simplify the calculation, we calculate the

upper bound of input referred offset voltage.

( )23

3631 2

1thgsneqmdiff VV

WWkVgi −∆≤∆=

Equation 8

( )11

23

363

,21

2dsn

thgsn

todueeq Vk

VVW

WkV

−∆

≤∆ ∆β

Equivalently, we can express this in terms of VOD3 as in the previous case by using

Equation 4 & Equation 5.

Equation 9 ( ) 2333

23

3612

36, 2

12

ODnclkODthDD

ODtodueeq VkRVVV

VW

WWWV

−−−∆≤∆ ∆β ,where

thgsOD VVV −= 33

As you can see, the denominator is exactly the same as that of ∆Veq,due to ∆Vth2. Therefore,

∆Veq,due to ∆β2 has a hyperbolic increasing characteristic too. Although the numerator of

∆Veq,due to ∆β2 increases faster than that of ∆Veq,due to ∆Vth2, the overall rate of change is

dominated by the denominator. As a result, ∆Veq,due to ∆β2 is similar to ∆Veq,due to ∆Vth2 as

shown in simulation results in Figure 15.

Offset due to threshold mismatch of M5, ∆Vth3 and current factor mismatch of M5, ∆β3:

It can be seen that threshold mismatch and current factor mismatch of M5 have

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22

little influence on input referred offset voltage. It is true because by the time that M5,6

turn on, the differential signal is already amplified to a large amplitude compared to the

mismatches. In other words, the gain from input to output is large, offset due to M5,6 on

the output is divided by a large gain caused by positive feedback; as a result, the input

referred offset voltage due to M5,6 is very small. The simulations show consistent results

with the theory.

Total input referred offset voltage:

The device mismatches are statistical numbers, and they are modeled as Gaussian

distribution. As a result, the total input referred offset is found by summing the variance

of the 6 mismatches above. That is

Equation 10 23

23

22

22

21

21 βββ σσσσσσσ ∆∆∆∆∆∆ +++++= VthVthVthtotal

For convenience, the last two terms, σ∆Vth3 and σ∆β3, can usually be neglected because

they are relatively small.

Simulations on input referred offset voltages over different Vcm:

The simulation results on input referred offset voltage show that the equations

above can predict the offset. Also, the variations on offset with varying VCM are also

consistent with the theory. Figure 15 shows the 3σ offset due to each transistor.

Obviously, the dominant sources of input referred offsets are due to transistor M1-4, and

offsets due to M5,6 are negligible. The overall offset is again calculated by summing the

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23

variances as in Equation 10. For example, at Vcm = 1.4V, standard deviations of input

referred offset due to each differential pair are σ∆Vth1 = 10.1mV, σ∆β1 = 10.3mV, σ∆Vth2 =

9.5mV, σ∆β2 = 8.1mV, σ∆Vth3 = 1.9mV, σ∆β3 = 0.7mV. Using Equation 10, the standard

deviation of total input referred offset, σtotal = 19.2mV, and the worst case total input

referred offset is 6σtotal = 115mV.

0.8 1 1.2 1.4 1.6 1.80

10

20

30

40

50

60

Input Vcm

Inpu

t Ref

erre

d O

ffset

(mV

, diff

)

Offset due to Device Mismatch of Core Comparator

vt1 vt2 vt3 beta1beta2beta3

Figure 15 Input referred offset voltage due to each transistor

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24

2.2 Supply Sensitivity

In the previous section, we found that input referred offset changes with VCM. In

addition, we found that as supply voltage changes, the input referred offset changes as

well. In most digital system, supply voltage is noisy because of the digital switching

property. As a result, it is important to know the supply sensitivity on offset. In order to

find the supply sensitivity, we need to find the supply sensitivities due to each transistor

and then combine the results to obtain the overall supply sensitivity as in the case of input

referred offset. Thus, the first section will discuss the supply sensitivity on offset due to

each transistor. The second section will combine the results and obtain the overall supply

sensitivity on offset.

2.2.1 Supply Sensitivity due to each transistor

As in the offset calculations in 2.1.2, the comparator is broken into 3 differential pairs

and each pair has threshold mismatch, ∆Vth, and current factor mismatch, ∆β. Supply

Sensitivity on offset due to each differential pair has been found in simulations. Since

offset due to ∆Vth1, which is simply equal to input referred offset, does not change with

supply and offset due to ∆Vth3 and ∆β3 are much smaller than other offsets, supply

sensitivity due to ∆Vth1, ∆Vth3, and ∆β3 are not shown in Figure 16.

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25

0.8 1 1.2 1.4 1.6 1.810

15

20

25

30

35

40

45

Input Vcm (V)

Offs

et(m

V,d

iff)

Offset due to beta1 mismatch

Noraml 10% Sup −10% Sup

0.8 1 1.2 1.4 1.6 1.8−4

−3

−2

−1

0

1

2

3

4

Input Vcm (V)

Cha

nge

in O

ffset

(m

V, d

iff)

Offset due to beta1 mismatch

+10% Sup−10% Sup

(a) (b)

0.8 1 1.2 1.4 1.6 1.80

10

20

30

40

50

60

Input Vcm (V)

Offs

et(m

V,d

iff)

Offset due to beta2 mismatch

Noraml 10% Sup −10% Sup

0.8 1 1.2 1.4 1.6 1.8−4

−2

0

2

4

6

8

Input Vcm (V)

Cha

nge

in O

ffset

(m

V, d

iff)

Offset due to beta2 mismatch

+10% Sup−10% Sup

(c) (d)

0.8 1 1.2 1.4 1.6 1.80

20

40

60

80

100

Input Vcm (V)

Inpu

t Ref

erre

d O

ffset

(mV

, diff

)

Offset due to vt2 mismatch

Noraml 10% Sup −10% Sup

0.8 1 1.2 1.4 1.6 1.8−20

−10

0

10

20

30

Input Vcm (V)

Cha

nge

in O

ffset

, (m

V, d

iff)

Offset due to vt2 mismatch

+10% Sup−10% Sup

(e) (f)

Figure 16 Supply Sensitivity on Offset due to ∆β1, ∆β2, and ∆Vth2

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26

In Figure 16, all offset values are 3σ standard deviation. In the plots on the left i.e.

(a), (c), and (e), “Normal” represents the offsets at normal supply 1.8V, which is exact

equal to the data in Figure 15. “10% Sup” represents the offsets when supply is 10%

higher than normal, which is 1.98V. “–10% Sup” represents the offsets when supply is

10% lower than normal, which is 1.62V. The plots in the right column i.e. (b), (d), and (f),

show the change in offset, ∆σ, from normal operating supply. Note that offset due to ∆β1

has positive supply sensitivity, which means positive change of supply causes positive

change in offset, while offsets due to ∆β3 and ∆Vth2 have negative supply sensitivity.

2.2.2 Overall Supply Sensitivity of Core Comparator

We can use change in offset, ∆σ, in 2.2.1 to calculate the overall supply

sensitivity on input referred offset. Since all offsets are statistical values, the overall

change in offset, ∆σtotal, is calculated by using Equation 10. And the worst-case overall

supply sensitivity is 6∆σtotal as shown in Figure 17. Figure 17a shows 6∆σtotal in mV,

while Figure 17b shows 6∆σtotal

6σtotal in percentage. In moderate VCM (1.2V – 1.4V) the

worst-case change in offset due to 10% supply change is about 10% also.

Before we finish this section, please keep in mind that Figure 17 shows the worst-

case values. Offset of a comparator is a random variable, and so is supply sensitivity on

offset. In addition, notice that supply sensitivities on offset due to ∆β1 and due to ∆Vth2

oppose to each other. This means that it is possible to obtain a high input referred offset

while supply sensitivity on offset is small, because the two opposing sources cancel with

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27

each other.

0.8 1 1.2 1.4 1.6 1.80

10

20

30

40

50

60

Input Vcm (V)

Tot

al C

hang

e in

Offs

et (

mV

,diff

)

Supply Sensitivity on Offset

+10% Sup−10% Sup

0.8 1 1.2 1.4 1.6 1.80

5

10

15

20

25

30

35

Input Vcm (V)

Per

cent

age

Cha

nge

in O

ffset

(%

)

Supply Sensitivity on Offset in Percentage

+10% Sup−10% Sup

(a) (b)

Figure 17 Overall Supply Sensitivity on Offset

2.3 Speed

A second important requirement of a comparator is high sampling rate. Since the

comparator spends half of the cycle on evaluation and half of the cycle on reset, the

maximum sampling rate of a comparator depends on the speed of both evaluation and

reset. To do a complete analysis, the speed of evaluation and the speed of reset are

examined separately. First, analysis of evaluation phase will be performed and a set of

formula will be developed to represent how fast the evaluation is. Second, a criterion is

developed to assure proper reset. The effects on both evaluation and reset phase of

different input common mode bias, VCM, are discussed last.

2.3.1 Evaluation Phase

In evaluation phase, clock is logical high. All reset devices, RST1-6, are off, and

tail current Mclk is on. Input differential pair will steer the current according to the

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28

difference of inputs. In order to create a lot of gain within a short amount of time,

positive feedback is utilized. Unlike traditional operation amplifier, which has finite gain,

positive feedback system provides infinite gain. Positive feedback is realized by two

back-to-back inverters. Here, characterizations on evaluation phase will be given, and

then the choices of transistor sizes will be briefly discussed. For your convenience,

Figure 7 is shown again in this section.

Figure 7 Core Comparator

Characterizations on Evaluation phase:

The whole evaluation phase can basically divided into three time intervals. In the

first time interval, the comparator changes from reset phase to evaluation phase. The

second time interval begins when Vinvbot1,2 drop to VDD − Vthn, turning on M3,4. And the

RST2 42

M5 42

VDD

RST142

RST5 42

RST6 42

M642

M3 42

M442

RST442

RST3 42

M1 82

M282

Mclk 162

Vout1 Vout2

Vin1 Vin2

clk

clk clk

clk

invbot1 invbot2

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29

last time interval starts when Vout1,2 drop to VDD − |Vthp|, turning on M5,6. Let us look at the

behavior of the comparator starting from the first time interval.

During reset phase, nodes invbot1,2 are tied to VDD; thus, transistors M3-6 are all off.

As a result, when the comparator changes from reset phase to evaluation phase, M3-6 are

initially off. In this period, the only active devices are input differential pair M1,2 and

current source Mclk. Since M3-6 are off, transistors M1,2 see only capacitance on their drain,

Cinvbot1,2. The transfer function from input, in1,2, to invbot1,2, differential wise, can be

written as:

Equation 11 2,1

2,1

,

2,11 )(

invbot

m

diffin

invbot

sCg

VV

sH == , where gm1,2 is the transconductance of M1,2.

If we look at it more carefully, H1(s) is actually an integrator. This is desirable since it

gives infinite gain at DC while averaging or filtering out the high frequency noise

depending on viewing the problem in time domain or in frequency domain.

The second interval starts when M3,4 turn on, i.e. Vinvbot1,2 ≅ VDD − Vthn. Cross-

coupled transistors M3,4 provides positive feedback response. The response of positive

feedback is well known [4]. The differential output will be exponentially increasing with

time (often referred to as regeneration):

Equation 12 t

Cg

initialoutoutout

m

eVtV4,3

,)( = ,

where Cout/gm3,4 is regeneration time constant.

The third time interval is similar to the second time interval. As Vout1, Vout2 drop to

VDD − Vthp, M5,6 turn on. The positive feedback, as a result, becomes stronger and

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30

differential output becomes:

Equation 13 t

Cgg

initialoutoutout

mm

eVtV6,54,3

,)(+

=

Equation 13 is valid until M3-6 enter triode region. As M3-6 enter triode region,

gm3,4 + gm5,6 decreases. Regeneration will eventually stop and Vout saturates at VDD.

It is however not convenient to go through all three equations to calculate the

exact output. As a result, we developed a simplified equation to characterize the

evaluation phase.

Equation 14 τdelaytt

inout eVtV−

=)( ,

where out

mm

Cgg 6,54,3 +

=τ and tdelay captures the initial integrator response. The implicit

meaning of tdelay is that we treat initial integrator response, which is much slower than the

regeneration response, as a delay on start of regeneration. Equation 14 enables us to

compare the evaluation speed of different comparators.

Choice of transistor sizes

In order to choose the transistor sizes such that the comparator gives fastest

evaluation, we should maximize integrating factor and minimize regeneration time

constant. This section will discuss the tradeoffs of sizing the transistors.

First, it is desirable to minimize regeneration time constant, since smaller

regeneration time constant results in larger gain in fixed amount of time. Let us first

concentrate on the effects of M3-6. According to [5], having the width ratio of M3,4 and

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31

M5,6 equal to 1.0 gives the best regeneration. As you notice, the P:N ratio is smaller than

normal inverter P:N ratio, which is normally 2-3. In comparator both NMOS and PMOS

provide positive feedback, while PMOS has larger parasitic; thus, it is natural to size

down PMOS. If loading capacitance is large, increasing the width of M3-6 will increase

out

mm

Cgg 6,54,3 +

, so regeneration is faster. On the other hand, if loading capacitance is so

small that the gate capacitance of M3-6 dominates, increasing the width of M3-6 will not

change out

mm

Cgg 6,54,3 +

because both gm3,4 + gm5,6 and Cout increase at the same time. Under

small loading capacitance condition, although regeneration time constant does not depend

on the width of M3-6, it is not a good idea to choose arbitrarily large M3-6 because M3,4

add parasitic capacitance on node invbot1,2, which lowers down the integrating factor and

prevents the common mode of invbot1,2 from dropping down and thus delays the start of

regeneration. Another way to decrease the regeneration time constant is to increase the

current and thus increase the width of Mclk. As a result, there is tradeoff between power

and speed.

Secondly, we consider increasing the integrating factor 2,1

2,1

invbot

m

Cg

. It is obvious that

we should minimize Cinvbot1,2. However, when we employ digital offset compensation,

Cinvbot1,2 often increases. This will be discussed in more detail when we consider the

speed penalty of digital offset compensation in Chapter 3. Another way to increase the

integrating factor is to increase input gm. We can increase either the width of input

devices M1,2 or the width of current source Mclk. The former is a tradeoff with input

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32

capacitance, while the latter is a tradeoff with power. From equation,

Doxm IL

WCg 2,1

2,1 2µ= we find that the rates of increase in gm1,2 should be the same for

sizing M1,2 and for sizing Mclk. However, since Mclk is often in triode region, sizing M1,2

increases not only W1,2/L but also ID because smaller Vgs1,2 results in larger Vds,clk.

Therefore, sizing input devices M1,2 gives us more advantages. Note that sizing input

devices M1,2 also gives advantages in term of input offset voltage.

Simulation Results on Sizing Transistors

The evaluation speed has been simulated to confirm the intuitive understanding

explained above. [5] states that the comparator gives the best performance by having the

ratio between M3,4 and M5,6 equal to 1, so the width of M3-6 are always the same in all

simulations below. The three remaining parameters are width of transistors Mclk, M1,2,

and M3-6. To compare the speed, we calculate the regeneration time constant τ, and tdelay

(see Equation 14 for definition). To show the combined effect, we also calculate the time

from clock transition to the time that differential output reaches 1.2V, denoted as

t(@Vout=1.2V). An output of 1.2V is chosen because it is large enough to toggle the output

stage, for example inverter or SR latch. We rank the comparators using T(@Vout=1.2V). In

the table shown below, columns Mclk, M1,2, and M3-6 are the ratio of their width to the

minimum transistor width (Wmin/L) = 4λ/2λ = 0.48µm/0.24µm. For example, Mclk = 2×

means that size of Mclk = 2Wmin/L = 8λ/2λ = 0.96µm/0.24µm. Note that L=0.24µm has

effective length Leff = 0.18µm.

Sim Mclk M1,2 M3-6 τ(ps) tdelay(ps) T(@ Vout=1.2V)(ps) Ranks

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1 1× 1× 1× 40.4 74.0 263 8 2 2× 1× 1× 37.8 57.2 234 6 3 1× 2× 1× 37.2 55.6 227 5 4 1× 1× 2× 42.0 98.7 307 10 5 2× 2× 1× 34.3 38.3 196 1 6 1× 2× 2× 36.2 79.2 255 7 7 2× 1× 2× 38.9 75.6 265 9 8 2× 2× 2× 32.8 54.9 211 2 9 4× 1× 1× 37.2 45.3 219 4 10 1× 4× 1× 38.6 40.8 217 3 11 1× 1× 4× 52.5 130 425 11

Table 1 Simulation results on evaluation with varying comparator transistor size

As shown in the table, sim5, which doubles both Mclk and M1,2, gives the fastest

response. This makes sense because we simultaneously increase positive feedback

gm3,4+gm5,6 and input gm1,2, which is directly proportional to the integrating factor. One

would think that doubling all devices Mclk, M1,2, and M3-6 would be fastest. However,

sim8 is only second fastest. Although sim8 actually has a faster τ than sim5, sim8 has

more delay on tdelay, resulting in a slower overall response.

The next two fastest are sim10 and sim9. The larger M1,2 have a slight advantage

as discussed earlier. These two simulations are similar for the next two in the rank, sim3

and sim2.

The 7th in the rank is sim6. Again, increasing M3-6 gives better τ than rank #3-6 do,

but it adds too much capacitance on node invbot1,2, which slow down the integration. The

other interesting result is that sim1 is ranked 8th, which tells us using all minimum size

does not necessarily give the slowest response. Sim7, sim4, and sim11 are slowest. These

three simulations show that increasing size of M3-6 is not a good idea. Note that the

output loading effect is already taken into account in the simulations above. The details

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of output loading will be discussed in section 2.6.

Once the comparator is optimized for the evaluation phase, we should design an

appropriate reset so that it can work correctly and efficiently.

2.3.2 Reset Phase

Reset is as important as regeneration for accurate operation. In order to reset a

comparator that has positive feedback, we must break its positive feedback loop and reset

it as fast as its regeneration. However, if the reset is incomplete and there is any residual

charge on Vout1, Vout2, positive feedback will amplify the residual charge exponentially

when evaluation phase comes again. As a result, a small residual charge can create large

input referred offset. In this project, differential output needs to be less than 0.5mV at the

end of reset phase to achieve the required accuracy. In this section, the design of reset

transistors is presented; tradeoffs between reset and evaluation will also be discussed.

Design of Reset Transistors:

During clock is logical low, the tail current source Mclk is off. If no reset device is

added, the comparator will still stay in its state forever because of the positive feedback.

In order to break the positive feedback, we must place some transistors to break the back-

to-back inverter. All possible reset transistors RST1-6 are shown in Figure 7. For your

convenience, Figure 7 is shown here again.

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Figure 7 Core Comparator

The most important reset is RST5, which shorts the two outputs together. Without

RST5, the reset response is very poor. However, RST5 alone is not enough because as

long as all 4 feedback devices are on, there is fighting between reset and regeneration. In

order to break the positive feedback, RST1,2 and RST3,4 are utilized.

Both RST1,2 and RST3,4 have their tradeoffs. First, RST1,2 can only shut off

PMOS; as a result, there is still a slight fighting between reset and regeneration due to

NMOS M3,4. More importantly, since RST1,2 are connected to out1,out2, the parasitic of

RST1,2 will degrade the regeneration time constant. Second, RST3,4 are indirect resets,

because they serve as reversing the current of NMOS M3,4. Once current is reversed, M3,4

not only stop regenerating, but also help reset the comparator. In small signal analysis, a

cross-coupled NMOS pair under reversed current condition has effective resistance equal

RST2 42

M5 42

VDD

RST142

RST5 42

RST6 42

M6 42

M3 42

M4 42

RST442

RST3 42

M1 82

M2 82

Mclk 162

Vout1 Vout2

Vin1 Vin2

clk

clk clkclk

invbot1 invbot2

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to 1/gm. This 1/gm3,4 will help cancel the −2/gm5,6 from positive feedback PMOS M5,6,

leaving RST5 to eliminate the rest of the negative resistance. Since RST3,4 are indirect

resets, in the early part of the reset phase, it cannot reset the comparator as quickly as

RST1,2. On the other hand, RST3,4 completely break the positive feedback, so it can

remove small output residue more quickly and more accurately than RST1,2. This

behavior can be seen in simulations in the next section. RST3,4 do not degrade the

regeneration time constant, yet they degrade the integrating factor of a comparator.

The last reset is RST6. In digital offset compensated comparator, capacitance on

node invbot1,2 is usually large; as a result, RST6 is introduced to further reset the charge

on node invbot1,2.

Simulation Results on Reset Devices:

Simulations are performed with varying reset devices size to see the performance

change, including evaluation and reset. We simulate on different sizes of RST1,2, RST3,4,

RST5, and RST6. As in the evaluation section, one unit size is Wmin/L = 4λ/2λ =

0.48µm/0.24µm, and the device sizes are multiple of unit size. Simulation condition is

Vcm=1.2V, Mclk=4×, M1,2=2×, and M3,4=1×. This configuration is the same for all digital

offset compensated comparators so that we are able to perform a fair comparison later.

For comparison, we calculate all evaluation metrics, τ, tdelay, and T(@Vout=1.2V) (see

Table 1 for definition). Three new measurements are maximum frequency in evaluation

phase, fmax,eva = 1/(2 T(@Vout=1.2V)), reset time, treset, that is the time required to reset a

comparator whose differential output decreases from full VDD to 0.5mV, and maximum

frequency based on reset time, fmax,rst = 1/(2treset).

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Evaluation Phase Reset Phase Sim Rst5 Rst1,2 Rst3,4 Rst6 τ(ps) tdelay(ps) T(@Vout=1.2V)

(ps) fmax,eva (GHz)

Rank treset (ps)

fmax,rst (GHz)

Rank

1 1× 0× 0× 0× 30.5 15.7 157 3.19 1 836 0.60 11 2 1× 1× 0× 0× 33.0 19.3 171 2.92 5 332 1.51 9 3 1× 0× 1× 0× 30.6 21.2 162 3.08 2 305 1.64 8 4 1× 1× 1× 0× 32.9 24.6 176 2.84 7 174 2.88 2 5 1× 1× 1× 1× 32.9 29.0 181 2.77 8 175 2.85 3 6 2× 0× 0× 0× 32.3 20.7 170 2.95 4 650 0.77 10 7 2× 1× 0× 0× 34.7 24.3 184 2.72 9 269 1.86 6 8 2× 0× 1× 0× 32.3 26.5 176 2.85 6 234 2.14 4 9 2× 1× 1× 0× 34.7 27.9 187 2.67 11 149 3.36 1 10 1× 2× 0× 0× 35.3 24.0 186 2.68 10 266 1.88 5 11 1× 0× 2× 0× 30.6 26.0 167 2.99 3 281 1.78 7

Table 2 Simulation results on reset device

Let us analyze the results shown in Table 2 from top to bottom. Sim1 is a

comparator with only RST5, the middle reset that ties both outputs together. As expected,

it gives the fastest evaluation but the slowest reset. Next, adding RST1,2 in sim2 will

speed up the reset, almost 3 times as fast as original. Also as expected, adding RST1,2

slightly degrades the regeneration time constant because it adds capacitance on the output

nodes. Sim3 has a highly desirable result. By adding RST3,4, the comparator resets faster

than that in sim2 while degradation of evaluation is minimum, i.e. the 2nd fastest in

evaluation. Since RST3,4 do not add parasitic capacitance on out1,out2, the regeneration

time constant is almost the same as that in sim1. Although integrating factor is reduced,

which can be seen by comparing tdelay, the overall evaluation performance is not heavily

degraded because the comparator spends only a short time on integration.

Sim4 uses both RST1,2 and RST3,4; hence, reset response is much faster, the 2nd

fastest. Among all comparators shown in this table, sim4 is the best since both evaluation

and reset achieve 2.8Ghz. In next simulation, further adding reset RST6 seems to give

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adverse results, where both evaluation and reset is slower than those in sim4. However,

note that RST6 may become more useful when digital offset compensation is added to the

comparator. The effect of RST6 will be discussed more in Reset Penalty in Chapter 3.

Sim6-9 have similar behavior as sim1-4 do. Generally, sim6-9 have slower

evaluation but faster reset because of the doubled RST5. In sim10 and sim11, we see that

doubling RST1,2 or doubling RST3,4 alone can never be as efficient as having RST1,2 and

RST3,4 simultaneously (sim4).

0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6

−0.2

0

0.2

0.4

0.6

0.8

1

1.2

1.4

1.6

1.8

Time, ns

Diff

eren

tial O

utpu

t, m

V

Reset Response of a comparator

←sim2

←sim3

sim10→

sim11→

Figure 18 Reset Response of sim2, sim3, sim10, and sim11

Interestingly sim3 resets faster than sim2, but sim11 resets slower than sim10.

Figure 18 illustrates the reason. RST1,2 (sim2 & sim10) can reset the comparator quickly

at the beginning; however, the fighting between reset and regeneration exists, and thus it

takes a long time to eliminate small residue charge. On the other hand, RST3,4 (sim3 &

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sim11) mainly reverse the current of M3,4; hence, there is a delay before the positive

feedback is broken. After the feedback is broken, comparator is completely reset at a

rapid rate.

In conclusion, sim4, which has RST5, RST1,2, and RST3,4, gives the best tradeoff

between evaluation and reset. This configuration can break the positive feedback quickly

while it does not heavily degrade the evaluation.

Effects on evaluation and reset with varying Vcm:

The comparator shown in Figure 7 works only in a certain range of input common

mode voltage, Vcm. For the lower bound, the input common mode voltage must be high

enough to turn on both input devices M1,2 and current source Mclk. (Vcm > Vth1,2 = 0.4V)

For the upper bound, the input common mode voltage is limited by the power supply on

chip (Vcm < VDD = 1.8V). It is found that the comparator achieves the best performance in

intermediate Vcm. The simulation results are shown below.

Evaluation Phase Reset Phase Vcm (V) τ(ps) tdelay(ps) T(@Vout=1.2V)

(ps) fmax,reg (GHz)

treset (ps) fmax,rst (GHz)

0.8 39.5 33.9 216 2.31 168 2.97 1.0 34.5 24.8 184 2.72 171 2.92 1.2 32.9 24.6 176 2.84 174 2.88 1.4 32.2 29.7 178 2.81 176 2.84 1.6 31.7 35.6 182 2.75 178 2.82 1.8 31.4 45.4 190 2.63 179 2.80

Table 3 Evaluation and Reset with vary Vcm (see Table 1,Table 2 for term definition)

At low Vcm the regeneration is slow as expected because low Vcm results in low

Vds,Mclk thus low tail current. As Vcm increases, tail current increases, so regeneration time

constant decreases. However, at high Vcm, tdelay becomes worse since input devices M1,2

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enter triode region, which decreases input gm and thus the integrating factor. In short, τ

becomes worse in low Vcm, and tdelay becomes worse in high Vcm. Intermediate Vcm

therefore gives the fastest evaluation.

For reset phase, high Vcm leads to slightly slower reset. A high common mode

input tries to pull down invbot1,2 harder, which opposes the pull up of the reset devices.

Comparing the variation of fmax in evaluation phase and reset phase, we can see

that within the possible Vcm bounds (0.4V < Vcm < 1.8V), the comparator still provides a

good performance in the range of 1.0V ≤ Vcm ≤ 1.6V.

2.4 Input Capacitance

In applications, like over-sampler and flash ADC, a bank of comparators is

typically placed in parallel. Total input capacitance, in these cases, may become

enormous because it is simply equal to the input capacitance of a single comparator

multiplied by number of comparators in parallel. Therefore, it is desirable to minimize

the input capacitance of a comparator. Unfortunately, the input capacitance of a simple

comparator, like Figure 7, is the gate capacitance of input devices M1,2, which must be

sized to fulfill the input referred offset requirement. As a result, there is a direct tradeoff

between input capacitance and offset. One of the methods to decouple the relationship

between input capacitance and offset is digital offset compensation. The input

capacitance requirement will be revisit in Chapter 3 where digital offset compensation is

introduced.

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2.5 Power Consumption

Power consumption is also a big issue when numerous comparators are used in

applications, like over-sampling receiver and flash ADC. Again, the total power

consumption simply gets multiplied by the number of comparators. To reduce the power

consumption, load capacitance and current must be minimized. Assuming that load

capacitance is already minimized by proper sizing and careful layout, we can only reduce

current by minimizing tail current transistor Mclk. As current has direct relationship with

speed, there is obviously tradeoff between power consumption and speed. Fortunately,

power consumption of a comparator is typically much less than normal operation

amplifier because positive feedback saturates the back-to-back inverters and shuts off the

current when evaluation is finished. Moreover, according to [3], comparator shown in

Figure 7 has a better power efficiency among other architecture. Simulation results on

power measurements are shown in Table 4. As you can see, power consumption increases

with input common mode voltage because Mclk is usually in triode region and Vds,clk varies

with Vcm.

VCM (V) 0.8 1.0 1.2 1.4 1.6 1.8 Power (µW) 79.41 87.76 94.25 100.4 106.0 112.2

Table 4 Power Consumption of Core Comparator

2.6 Design of Next Stage (SR Latch)

In order to provide a constant logical output over one period, we must place a SR

latch after the comparator. Since comparator outputs provide full swing signal in

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evaluation phase and are pull up to VDD in reset phase, a NAND based SR latch is well

suited. However, a NAND based SR latch may not give satisfying performance at high

speed. Hence, a simplified SR latch as shown in Figure 19 has been designed.

Figure 19 Simplified SR Latch

During evaluation phase, full swing differential signal from comparator is converted to

single ended digital signal at SRoutb. During reset phase, Vin1, Vin2 are pull up to VDD,

turning off MSR1,SR2. Thus, Node SRoutb stays constant until the next evaluation phase

comes again. This behavior is exactly same as a NAND based SR latch. The advantage of

this circuit is its high speed and low input capacitance, which directly affects comparator

regeneration time constant and power consumption. Although this SR latch has

systematic offset and large random offset due to small transistor size, fortunately

comparator has large gain, so input referred offset due to SR latch is well below 2mV

according to simulation. For fair comparison, all digital offset compensated comparators

in the next chapter are followed by this SR latch. Inverters are then used to buffer up to

drive the output.

MSR1 42

MSR2 42

VDD VDD

MSR3 42

MSR4 42

Vin1 Vin2

Output SRoutb

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Chapter 3 Digital Offset Compensation

The most important feature of digital offset compensation in comparator is that

offsets are measured digitally and are stored in static memory. Once offsets are stored,

the comparator can remain in open loop system, and thus, inherent speed of a comparator

can possibly be achieved.

In this project, four architectures on digital offset compensation are considered.

This project will compare the characteristics of these four architectures, and tradeoffs

between them. We compare all four architectures by measuring the performance metrics,

which were characterized for the core comparator in chapter 2. In this chapter, four

architectures are first presented, and their basic operating principles are explained.

Section 3.2 – 3.6 will compare performance metrics: input referred offset, supply

sensitivity, speed, input capacitance, and power consumption respectively. The last

section will give a summary of comparison of all four architecture.

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3.1 Four Different Architectures

3.1.1 Architecture Comp1

Figure 20 Schematic of Comp1

The first architecture, Comp1, is shown in Figure 20. Extra devices MCM1-6 and

MOS1-6 are placed in parallel with input devices to steer small amount of current. This

current will provide an offset to compensate for the internal offset due to device

mismatches. Node VCM is connected to the common mode voltage of inputs Vin1 and Vin2.

Since internal offset varies with common mode as you can see in Figure 15, an offset

compensation that varies with VCM can increase the correction precision. Nodes D1-4 are

controlled digitally. Turning on only D1 provides the least offset correction, so we call it

RST2 42

RST142

Mcm4 46

MCM3 46

M6 42

M1 82

M5 42

M2 82

Mclk 162

RST6 62

M3 42

M4 42

RST5 42

Vin1 Vin2

clk

RST4 62

RST3 62

clk

VDD

clk clk

Vout1 Vout2

Invbot2 Invbot1

MCM1 46

MOS1A 46

MOS1B 46

MCM2 46

MOS246

MOS3 46

D1 D2 D3

Mcm6 46

Mcm5 46

MOS4 46

MOS5 46

MOS6A 46

MOS6B 46

VCMVCM

D4

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Least Significant Bit (LSB) correction. Turning on subsequent bits (D2, D3) increases the

correction in a binary fashion. If negative offset compensation is needed, D4 will be

turned on and D1-3 will be turned on appropriately to control the magnitude of the

negative offset. The LSB control devices, D1, is not half the size of D2 device because it

is desirable to minimize the parasitic capacitance of MCM1-6 and MOS1-6 and not to slow

down the speed of the comparator. The performance and compensation non-linearity of

Comp1 will be discussed in the next section.

3.1.2 Architecture Comp2

Figure 21 Schematic of Comp2

The second architecture, Comp2, is similar to Comp1. Schematic of Comp2 is

shown in Figure 21 [6]. The problem of Comp1 is its large parasitic capacitance due to

digital offset compensation. Each branch consists of 2 NMOS and the capacitance

RST2 42

RST1 42

M6 42

M1 82

M5 42

M2 82

Mclk 162

RST6 62

M3 42

M4 42

RST5 42

Vin1 Vin2

clk

RST4 62

RST3 62

clk

VDD

clk clk

Vout1 Vout2

Invbot2 Invbot1MOS0 48

MOS1 48

MOS2 88

MOS3 168

MOS4 328

D1b

D2b

D3b

VCM VCM

D4b

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between the NMOS slows the comparison speed. In Comp2, one branch is a single

NMOS. Therefore, using linear scaling on MOS1-4 in Comp2 does not degrade the speed

as severely as Comp1 does. MOS1-4 are binary weighted, so additional coding on D1-4 is

not needed. The supply of inverters is VCM, so the compensation magnitude also varies

with input common mode. Dummy device MOS0 is added to balance the capacitance on

nodes invbot1,2, so no systematic offset is introduced when MOS1-6 are off.

3.1.3 Architecture Comp3

Figure 22 Schematic of Comp3

The third architecture, Comp3, produces digital offset by controlling tail current

[7]. In Figure 22, tail current is split to MclkL and MclkR. Additional currents sources Mclk0-

4 and MOS0-4 are digitally controlled by D1-4. Mclk1-4, and MOS1-4 is binary weighted.

Dummy current source Mclk0 and MOS0 is again for balancing the comparator. A small

RST2 42

RST142

M6 42

M1 82

M5 42

M282

MclkL 82

RST6 62

M3 42

M442

RST5 42

Vin1 Vin2

clk

RST4 62

RST3 62

clk

VDD

clk clk

Vout1 Vout2

Invbot2 Invbot1

M7 44

VDD

MclkR 82

MOS0 42

Mclk0 42

MOS1 42

Mclk1 42

MOS2 82

Mclk2 82

MOS3 162

Mclk3 162

Mclk4 322

MOS4 322

D1 D2 D3

D4

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NMOS M7 has three purposes. First, it reduces offset due to mismatch of MclkL and MclkR.

Second, the offsets created by digital compensation devices Mclk1-4 and MOS1-4 are

reduced, so minimum channel length can be used to create the appropriate range of offset,

unlike Comp1 and Comp2, whose digital compensation parts have longer channel length.

Third, M7 promotes current steering of differential pair M1,2. If M7 is not present, M1 sees

only MclkL, which is model as resistor because MclkL is in triode region. As a result, M1 is

degenerated by RMclkL. On the other hand, if M7 is present, M1 is degenerated by

RMclkL//(RM7/2) so input gm is larger.

3.1.4 Architecture Comp4

Figure 23 Schematic of Comp4

The last architecture, Comp4, is shown in Figure 23 used by [8]. Comp4 varies

capacitances of invbot1,2; an imbalance current flowing into PMOS capacitors MC0-4

produces offset. During digital signals D1B-4B are high, PMOS MC1-4 are off, so nodes

RST2 42

RST1 42

M6 42

M1 82

M5 42

M2 82

Mclk 162

RST6 62

M3 42

M4 42

RST5 42

Vin1 Vin2

clk

RST4 62

RST3 62

clk

VDD

clk clk

Vout1 Vout2

Invbot2 Invbot1

MC0 42

MR 162

VDDD1B D2B D3B

MC1 42

MC2 82

MC3 162

×1 ×2 ×4

D4B

MR 162

×8 ×1

MC4 322

RST7 46 VDD

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invbot1,2 see only source/drain overlap capacitances. If digital signal D1B, for example,

switches to low, PMOS MC1 turns on, so invbot2 sees source/drain overlap capacitance

plus channel capacitance due to MC1. A slight capacitance difference between invbot1 and

invbot2 results in a small current imbalance. As a result, by controlling the difference of

capacitance between invbot1 and invbot2, offset of the comparator can be controlled.

PMOS MR, acting as a resistor, is placed in series with PMOS capacitance MC0-4. The

series resistors reduce the effective capacitance, so the digital offset precision can be

adjusted. MR is carefully sized so that the correction range of the digital offset

compensation just covers the maximum offset due to internal device mismatches.

3.2 Characteristics of Digital Offset Compensation

The goal of digital offset compensation is to create an offset that cancels the

internal offset due to device mismatches, so the overall offset of the comparator reduces

to zero ideally. This section discusses the offset magnitude for each comparator. However,

if the digital offset steps are not uniform, the overall offset after compensation will be

degraded. In other words, linearity among offset magnitude directly affects the worst-

case overall offset. Linearity of offset compensation is secondly presented, and the worst-

case overall offset after compensation is shown last.

3.2.1 Offset Magnitude of Digital Compensation

All four comparator Comp1-4 have 4-bit (16-level) offset correction. Simulations

have been performed to examine the characteristics of offset correction of each

comparator. Simulation results are shown in Figure 24 – Figure 27. “Device Mismatch”

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49

represents 6σ of offset due to internal device mismatch of a core comparator. “Digital

OS” represents 16-level offset correction of the comparators.

Figure 24 shows the digital offset for Comp1. Comp1 loses one digital level on

D4D3D2D1 = 1111 because this digital value provides zero offset as shown in the

schematic in Figure 20. The variation of digital offset with VCM is similar to that of

internal device mismatch shown in dotted line in the figure. This property provides a

better correction over wide range of VCM.

Figure 25 shows the digital offset magnitude of Comp2. Comp2 provides 16-level

correction. Each level is close to a constant value over high VCM. As you can see from the

distribution, the 16 levels divides 6σ internal offset quite evenly. The linearity is

expected to be the best and will be discussed in the next section in detail.

Figure 26 shows the digital offset of Comp3. Comp3 splits the tail current, so

mismatch between two tail currents contributes offset of the comparator. As a result, the

internal device mismatch is larger than Comp1, Comp2, and Comp4. The digital offsets

created by Mclk1-4 in Figure 22 increase fairly quickly with VCM, making a wide spread in

high VCM. The worst-case overall offset after compensation is, thus, degraded. In addition,

compression of the offset step size at high digital offset settings can be easily observed in

Comp3. The first positive LSB creates the largest step. As the digital value increases, the

offset difference between two levels diminishes because Vds,clk decreases with more MOS1-

4 turned on. Since Vds,clk is reduced, the offsets created by digital controlled branches

reduces as well.

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50

0.8 1 1.2 1.4 1.6−150

−100

−50

0

50

100

150

Input Vcm

Inpu

t ref

erre

d of

fset

(mv,

diff

eren

tial) Comp1, Digital Controlled Offset

Device MismatchDigital OS

Figure 24 Digital Offset of Comp1

0.8 1 1.2 1.4 1.6−150

−100

−50

0

50

100

150

Input Vcm

Inpu

t ref

erre

d of

fset

(mv,

diff

eren

tial) Comp2, Digital Controlled Offset

Device MismatchDigital OS

Figure 25 Digital Offset of Comp2

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51

0.8 1 1.2 1.4 1.6

−400

−300

−200

−100

0

100

200

300

400

Input Vcm

Inpu

t ref

erre

d of

fset

(mv,

diff

eren

tial) Comp3, Digital Controlled Offset

Device MismatchDigital OS

Figure 26 Digital Offset of Comp3

0.8 1 1.2 1.4 1.6

−200

−150

−100

−50

0

50

100

150

200

Input Vcm

Inpu

t ref

erre

d of

fset

(mv,

diff

eren

tial) Comp4, Digital Controlled Offset

Device MismatchDigital OS

Figure 27 Digital Offset of Comp4

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52

As shown in Figure 27, the digital offsets of Comp4 increase gradually with VCM.

This characteristic is similar to that of Comp1. Some compression of the step size has

been observed.

3.2.2 Linearity of Digital Offset Compensation

All 4 architectures have equal number (4-bit) of digital offset correction. The

nonlinear offset compensation will degrade the effect number of bit correction; as a result,

the accuracy will be degraded. This section compares the differential non-linearity (DNL)

of each comparator.

Digital offset DNL of Comp1 is shown in Figure 28. The maximum DNL is

approximately 0.5 LSB. There is a clear “zig zag” pattern in the DNL profile. This

pattern is created by the non-linear scaling on the digital controlled branches. We

observed that the LSB creates a larger offset then it should; thus, a large positive DNL in

one digital setting is followed by an equal magnitude but negative DNL in the subsequent

digital setting. Fortunately, the “zig zag” pattern creates less than 0.5 LSB DNL.

Figure 29 shows digital offset DNL of Comp2. It can be observed that as more

switches are asserted, the step size slightly decreases. As a result, Comp2 also has minor

compression of the offset step size, and it causes about 0.5 LSB DNL.

Digital offset DNL of Comp3 is shown in Figure 30. The DNL of Comp3 is the

worst among 4 architectures. The maximum DNL is as high as 1 LSB, reducing the

effective number of bits to less than 3 bits of correction. The compression described

earlier is particularly noticeable. Digital Offset

DNL of Comp4 is shown in Figure 31. Comp4 loses about 0.8 LSB DNL.

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53

Figure 28 Digital Offset DNL of Comp1

Figure 29 Digital Offset DNL of Comp2

−10 −5 0 5 10−0.8

−0.6

−0.4

−0.2

0

0.2

0.4

0.6Comp1, Digital Offset DNL

Offs

et D

NL

(LS

B)

Digital Level, W

vcm=0.8vcm=1.0vcm=1.2vcm=1.4vcm=1.6

−10 −5 0 5 10−0.4

−0.2

0

0.2

0.4

0.6Comp2, Digital Offset DNL

Offs

et D

NL

(LS

B)

Digital Level, W

vcm=0.8vcm=1.0vcm=1.2vcm=1.4vcm=1.6

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54

Figure 30 Digital Offset DNL of Comp3

Figure 31 Digital Offset DNL of Comp4

−10 −5 0 5 10−0.6

−0.4

−0.2

0

0.2

0.4

0.6

0.8

1

1.2Comp3, Digital Offset DNL

Offs

et D

NL

(LS

B)

Digital Level, W

vcm=0.8vcm=1.0vcm=1.2vcm=1.4vcm=1.6

−10 −5 0 5 10−0.8

−0.6

−0.4

−0.2

0

0.2

0.4

0.6

0.8Comp4, Digital Offset DNL

Offs

et D

NL

(LS

B)

Digital Level, W

vcm=0.8vcm=1.0vcm=1.2vcm=1.4vcm=1.6

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55

3.2.3 Worst-Case Overall Offset after compensation

Ideally, overall offset of a comparator after digital offset compensation is equal to

maximum offset of the core comparator divided by 2(Number of bits correction). In the previous

section, we know that effective number of bits should replace the actual number of bit to

capture the non-linearity. In addition to non-linearity, we found that the maximum offset

of the comparator should really be replaced by the offset correction range of the

particular architecture. In other words, the worst-case overall offset is approximated by

bitsofnumberEffective

RangeCorrectionOffset2

. In simulation, the worst-case overall offset is calculated by

dividing the biggest step between two digital levels in Figure 24 – Figure 27 by 2 because

the worst situation is when internal offset lies at the middle of two digital offset levels.

The simulated results are shown in Figure 32.

Comp4 has larger worst-case overall offset then Comp1 and Comp2 because

Comp4 has not only worse DNL profile but also larger correction range (±220mV), while

the correction range of Comp1 and Comp2 is only ±150mV. The large worst-case overall

offset of Comp3 clearly shows that knowing only DNL is not sufficient. Even though

DNL of Comp3 is only two times larger than that of Comp1 and Comp2, the actual

worst-case offset of Comp3 is four times larger, because Comp3 has worse internal offset

to start, and thus has larger offset correction range. From this comparison of the worst-

case overall offset, we conclude that Comp1 and Comp2 have the best compensation

offset and Comp3 is the worst.

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56

Figure 32 Worst-case overall offset

3.3 Supply Sensitivity

As discussed in section 2.2, the input referred offset due to device mismatches

changes with supply voltage. Similarly, the digital offset changes with supply as well.

The overall supply sensitivity of an architecture is thus calculated by combining the

supply sensitivity of internal offset in section 2.2 and the supply sensitivity on digital

offset. In this section, simulations are performed to find the supply sensitivity on digital

offset of each architecture. The worst-case supply sensitivity of each comparator will be

obtained in the end of this section.

0.8 1 1.2 1.4 1.60

10

20

30

40

50

60

70

Input Vcm

Wor

st−

case

offs

et(m

v, d

iffer

entia

l)

Worst−case overall offset

Comp1Comp2Comp3Comp4

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57

0.8 1 1.2 1.4 1.670

80

90

100

110

120

130

Input Vcm (V)

Offs

et (

mV

,diff

)

Digital Offset of Comp1

Noraml 10% Sup −10% Sup

0.8 1 1.2 1.4 1.6−10

−5

0

5

10

15

Input Vcm

Cha

nge

in O

ffset

(m

V, d

iff)

Digital Offset of Comp1

10% Sup −10% Sup

(a) (b)

Figure 33 Supply Sensitivity on Offset of Comp1

0.8 1 1.2 1.4 1.650

60

70

80

90

100

110

Input Vcm (V)

Offs

et (

mV

,diff

)

Digital Offset of Comp2

Noraml 10% Sup −10% Sup

0.8 1 1.2 1.4 1.6−20

−10

0

10

20

30

Input Vcm

Cha

nge

in O

ffset

(m

V, d

iff)

Digital Offset of Comp2

10% Sup −10% Sup

(a) (b)

Figure 34 Supply Sensitivity on Offset of Comp2

0.8 1 1.2 1.4 1.60

100

200

300

400

500

600

700

Input Vcm (V)

Offs

et (

mV

,diff

)

Digital Offset of Comp3

Noraml 10% Sup −10% Sup

0.8 1 1.2 1.4 1.6−100

−50

0

50

100

150

Input Vcm

Cha

nge

in O

ffset

(m

V, d

iff)

Digital Offset of Comp3

10% Sup −10% Sup

(a) (b)

Figure 35 Supply Sensitivity on Offset of Comp3

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58

0.8 1 1.2 1.4 1.640

60

80

100

120

140

160

Input Vcm (V)

Offs

et (

mV

,diff

)

Digital Offset of Comp4

Noraml 10% Sup −10% Sup

0.8 1 1.2 1.4 1.6−20

−15

−10

−5

0

5

10

15

Input Vcm

Cha

nge

in O

ffset

(m

V, d

iff)

Digital Offset of Comp4

10% Sup −10% Sup

(a) (b)

Figure 36 Supply Sensitivity on Offset of Comp4

In Figure 33 – Figure 36, the plots on the left (a) show maximum digital offsets of

Comp1 – Comp4 when supply is “Normal”(1.8V), 10% higher (1.98V) “10% Sup”, and

10% lower (1.62V) “–10% Sup”. The plots on the right (b) show the change in offset,

∆VDigiOS, from normal supply, which is the supply sensitivity on offset in mV.

Having both supply sensitivities on offset due to internal mismatch and due to

digital offset compensation, the overall supply sensitivity on offset can be found for each

comparator. However, the calculation on overall supply sensitivity is not straight forward,

because all sensitivities are not independent random variables. Supply sensitivity due to

digital offset compensation, ∆VDigiOS, depends on the total internal offset of the

comparator, because digital value is set to compensate the internal offset at the beginning.

Thus, it is reasonable to state that ∆VDigiOS is proportional to internal offset, 6σtotal. On the

other hand, the supply sensitivity on internal offset ∆σtotal must also depend on total

internal offset 6σtotal. Thus, supply sensitivity on digital offset ∆VDigiOS and supply

sensitivity on internal offset ∆σtotal are correlated. Furthermore, we know ∆σtotal is not

directly proportional to total input offset 6σtotal because some mismatches have positive

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59

supply sensitivity while the others have negative supply sensitivity. This causes a

possibility that high internal offsets, 6σtotal, may have low supply sensitivity, ∆σtotal. All

these situations complicate the calculation of overall supply sensitivity of Comp1 −

Comp4.

To develop special treatments on accounting the correlation between variables

seems to be out of scope of this project. A rough approximation on worst-case overall

supply sensitivity is thus given here. In this approximation, we pretend that ∆VDigiOS and

∆σtotal are independent. With this assumption, we can calculate worst-case supply

sensitivity, ∆VOS,SUP, by:

( ) ( )22, totalDigiOSSUPOS VV σ∆+∆=∆

Table 5 shows the results of ∆VOS,SUP at VCM=1.2V for all 4 comparators.

Comp1 Comp2 Comp3 Comp4 Supply Sensitivity, ∆VOS,SUP*

13mV 18mV 22mV 16mV

*Worst-case supply sensitivity (±10% Change in Supply) measured at VCM = 1.2V Table 5 Worst-case Supply Sensitivity of Comp1 − Comp4

3.4 Speed

As described in section 2.3, speed of the core comparator is determined by the

speed of two phases, evaluation phase and reset phase. In evaluation phase, regeneration

time constant τ, tdelay (Equation 14), and t(@Vout=1.2V) (Table 1) characterize the evaluation

speed. In reset phase, reset time, treset, that is time required to reset a comparator whose

differential output decreases from full VDD to 0.5mV determine the reset speed. In this

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60

section, the same measurements are repeated for each of the four comparators. The first

subsection compares the speed of different architectures. The second subsection discusses

the penalty on digital offset compensation. The last subsection compares the linear and

nonlinear scaling on digital compensation devices.

3.4.1 Comparison on Speed of Different Architectures

In each of the four architectures, the extra devices for compensation impact the

speed. Moreover, the comparator speed changes with the digital offset compensation

settings. Therefore, in this section, speed of 4 comparators with zero digital offset will be

first compared to the original speed of the core comparator. The effects of different

digital settings will be presented next.

Digital Offset Compensation Off

Evaluation Phase Reset Phase Architecture τ(ps) tdelay(ps) T(@Vout=1.2V) (ps) fmax,eva (GHz) treset (ps) fmax,rst (GHz)Core Comp 32.9 24.6 176 2.84 174 2.88 Comp1 36.8 38.6 211 2.37 201 2.49 Comp2 33.1 47.8 200 2.50 181 2.77 Comp3 33.9 53.2 210 2.38 173 2.89 Comp4 33.5 58.8 211 2.37 199 2.51

Table 6 Speed Comparisons with Digital Offset Compensation Off

Turning digital offset compensation off means setting digital offset be zero. In

order words, D4D3 D2D1=0000 or D4BD3B D2BD1B=1111 in the case of Comp4. In Table 6,

data for “Core Comp” is repeated from the speed of core comparator with the following

configuration: Vcm=1.2V, Mclk=4×, M1,2=2×, M3,4=1×, RST5=1×, RST1,2=1×, RST3,4=1×,

and RST6=0×. For evaluation phase, digital offset compensation architectures impact the

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61

speed of core comparator by 15%. This is expected because the digital compensation

devices contribute parasitic capacitance and slow down the comparison. Among four

architectures, Comp2 is fastest with digital offset compensation off. Reset devices are

intentionally made stronger, specifically, RST3,4=1.5×, RST6=1.5× and additional reset

like RST7 and M7 (see schematic of Comp1-4). The reset speed of Comp1 – Comp4 is

optimized under the condition when digital offset compensation is on. The reset devices

are carefully sized so that the reset speed and evaluation speed is similar, as shown in

Table 7 in the next subsection. Hence when digital offset compensation is off, the reset

speed is faster then the evaluation speed. Also, we know the reset speed with digital

offset compensation off is so fast that it will not be the limiting factor of the speed of the

comparator.

Digital Offset Compensation On

Evaluation Phase Reset Phase Architecture τ(ps) tdelay(ps) T(@Vout=1.2V) (ps) fmax,eva (GHz) treset (ps) fmax,rst (GHz)Core Comp 32.9 24.6 176 2.84 174 2.88Comp1 35.8 72.4 238 2.10 218 2.29Comp2 34.5 65.1 224 2.23 229 2.19Comp3 32.7 37.8 189 2.65 191 2.62Comp4 36.6 66.8 232 2.15 231 2.17

Table 7 Speed Comparisons with Digital Offset Compensation On

When digital offset compensation is turned on, all digital compensation devices

are on. Since the speed of a comparator depends on input magnitude, we must make sure

that the input magnitude in this section is the same as that of last section. To do so, we

must force the comparators to have zero input referred offsets. Therefore, while we turn

on digital compensation devices, dummy devices, which include MOS0 (Comp2 and

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62

Comp3) and MC0 (Comp4), are turned on at the same time to balance the comparator. In

short, digital settings will be D4D3 D2D1=1111 for Comp1, 2, and 3 or D4BD3B

D2BD1B=0000 for Comp4, and dummy devices are turned on as if they were connected to

D1 or D1B.

With digital offset compensation, more parasitic capacitance is added to the

comparator, so the evaluation speed of Comp1, Comp2, and Comp4 slow down by 24%

compared to the core comparator. However, Comp3 is only 6.7% slower than the core

comparator because Comp3 increases the total tail current. Reset speed is designed to be

closed to the evaluation speed for optimizing the sampling rate.

With the sampling rate under conditions of offset compensation on and off, we

found that the maximum overall sampling rate of Comp1, Comp2, and Comp4 is limited

by compensation on condition, whereas overall sampling rate of Comp3 is limited by

compensation off condition. The maximum overall sampling rates of all architectures are

listed in Table 8. The percentage reduction on sampling rate compared to CoreComp is

listed in the last column. Overall, digital offset compensation reduces the sampling rate of

a comparator by 15% – 25%.

Architecture Sampling Rate (GHz)

Sampling Rate Reduction (%)

Core Comp 2.84 0% Comp1 2.10 –26% Comp2 2.19 –23% Comp3 2.38 –16% Comp4 2.15 –24%

Table 8 Maximum Sampling rate of different architecture

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63

3.4.2 Speed Penalty of Digital Offset Compensation

This section only applies on Comp1, Comp2, and Comp4; Comp3 is actually

faster when digital offset compensation is on because of its split current architecture. The

speed penalty of Comp1, Comp2, and Comp4 is caused by several factors. The dominant

factor is the extra parasitic capacitances due to digital compensation devices, which have

been discussed in the last subsection. Another factor is the decrease in input

transconductance, gm,in, of Comp1,2,4 with increasing digital offset. The decreasing gm,in

degrades the integrating factor, and thus the evaluation response is degraded. We will

carefully examine why input transconductance reduces in this section.

Loss in Input Transconductance, gm,in

Figure 37 Illustration of input transconductance loss

In Comp1, Comp2, and Comp4, the common idea is to add some devices to

influence the current steering of input devices M1,2. Let us take a simple differential pair

and add an extra device to draw a constant current on one side, as shown in Figure 37.

Assume the current through the extra device is a fraction of ISS, say αISS, where α ≤ 12 .

For comparator, the only important operating point is where the differential output

current crosses zero, i.e. I1 = I2. In addition, total tail current is ISS. Hence, IM2 = 0.5ISS,

M1 WL

M2WL

VCM + ∆Vin2 VCM – ∆Vin

2 MOS

IM1 IM2 αISS

I1 I2

VCM

ISS

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64

and IM1 = (0.5 – α) ISS. Small differential voltage ∆Vin is applied to the inputs, creating

small differential current idiff.

∆−−

+=−=22 2121

inm

inmSSdiff

Vg

VgIiii α

( )221

inmmSSdiff

VggIi

∆++=α

We can then find gm1 and gm2 by substituting IM1 and IM2.

( ) ( )2

5.025.02 inSSOXnSSOXnSSdiff

VI

LWCI

LWCIi

+−+= µαµα

Equation 15 ( ) ( ) inSSOXnSSdiff VI

LWCIi ∆

+−+= 5.022

121 µαα

If α = 0, then inSSDmdiff VIIgi ∆== )5.0(2,1 , which is the case without digital offset

compensation. In Equation 15 the first term αISS is the offset created by MOS, and the

fraction ( )2

121 +− α is the factor of loss in input transconductance, gm,in. If α is small,

we can approximate the fraction ( )2

121 +− α with first order Taylor series, which gives

− α

211 . This means that if a fraction α of ISS is used in digital offset compensation, the

input transconductance is lost by 12 α. This also tells us that a comparator with larger

offset will have a slower speed, even though parasitic is not taken into account.

Furthermore, the input referred noise will increase as digital offset increases.

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65

3.4.3 Comparison on Linear and Non-linear scaling

When Comp1 was being designed, we found that a linear 4-bit scaling on digital

offset compensation severely degraded the comparator performance. In this section, we

will compare Comp1 with 3-bit linear scaling as shown in Figure 38, with 4-bit linear

scaling (schematic is same as Figure 38 except that one more bit correction is needed),

and with 4-bit non-linear scaling as shown in Figure 20. Hence, we know how well the 4-

bit non-linear scaling improves the performance.

Figure 38 Schematic of Comp1 with 3-bit linear scaling

Evaluation Phase Reset Phase Architecture τ(ps) tdelay(ps) T(@Vout=1.2V) (ps) fmax,eva (GHz) treset (ps) fmax,rst (GHz) 3-bit Linear 34.7 73.0 233 2.15 216 2.32 4-bit Linear 42.8 106.9 310 1.62 383 1.31 4-bit Non-linear 35.8 72.4 238 2.10 218 2.29

Table 9 Speed Comparisons on linear and non-linear scaling of Comp1

RST2 42

RST1 42

M642

M1 82

M5 42

M282

Mclk 162

RST6 42

M3 42

M442

RST5 42

Vin1 Vin2

clk

RST4 42

RST3 42

clk

VDD

clk clk

Vout1 Vout2

Invbot2 Invbot1 ×2 ×1 ×1

×1 ×1 ×2

VCM

D1 D2

×4

×4

D3

VCM

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66

From Table 9, 4-bit linear scaling version performs poorly in both evaluation

phase and reset phase. Both speeds are almost half of the speeds that the 3-bit version has.

In the 4-bit non-linear version, the performance is very closed to that of the 3-bit linear

version. Moreover, we expect that the power consumption of the 4-bit non-linear version

is similar to that of the 3-bit linear version as well. With the speed and power benefit, we

decided to use the 4-bit non-linear version and sacrifice 0.5LSB nonlinearity as shown in

Figure 28.

After comparing the speeds for digital compensation both off and on and

understanding the origin of speed penalty of digital offset compensation, we know that

digital offset compensation could reduce the speed by 15% – 25%. We can improve the

speed by changing the digital coding scheme. In the current setting, we control the whole

(both left and right) digital compensation in a single binary array, and the worst case is

during compensating for −1LSB offset, which corresponds to turning on all compensation

devices. As a result, all parasitic capacitances due to digital compensation are added to

the comparator and large portion of total current is used for offset compensation. On the

other hand, if we choose to control the left and right digital compensation separately,

which means we need digital signal D3L D2L D1L for left and another D3R D2R D1R for right

hand side, the worst-case becomes turning on all devices on one side only. Since we

reduce the number of active devices by half, we halve not only parasitic capacitance but

also the current flowing through digital compensation devices. The loss in input

transconductance is also reduced, so the speed of the comparator can be improved.

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67

3.5 Input Capacitance

As shown in schematics Figure 20 − Figure 23, all four comparators do not

increase input capacitance. However, Comp1 and Comp2 need an extra terminal VCM.

Depending on applications, an extra driver may be needed to generate VCM. Fortunately,

VCM is a DC value or a low frequency signal. Hence, extra driver can be simple.

In applications of high order parallelism, the VCM driver is usually shared among all

comparators. The little extra hardware on VCM driver and the small input capacitance

make the digital offset compensation attractive in applications with high order parallelism.

3.6 Power Consumption

Similar to the speed issue, power consumption of each comparator is more than

that of core comparator, since digital offset compensation devices add parasitic

capacitance on the comparator. In the first subsection, power consumption of each

comparator is compared with that of core comparator. As in the speed section, we

separate our discussion into 2 cases. The first case is when digital offset compensation is

off, and the second case is when digital offset compensation is on. Clock loading and

power consumed on driving clock is discussed in the second subsection. The total power

of comparator and clocking will be discussed in the last subsection.

3.6.1 Power of Comparators

Digital Offset Compensation Off

When digital offset compensation is off, the comparator’s switched

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68

capacitance does not include the channel capacitance; only source/drain overlap

capacitances are added to the comparator. The power consumption is, thus, closed to the

power consumption of the core comparator. Figure 39 shows power consumption of all

comparators, under the condition of digital offset compensation off, operating at 1.5GHz,

1.8V supply. Comp2 and Comp3 have similar power consumptions, which are closed to

that of core comparator. However, Comp4 dissipates more power because both source

and drain overlap capacitances are added on node invbot1,2. Comp1 has the largest power

consumption because MCM1-6 are always on, and thus capacitances CgdMcm1-6, CgsMcm1-6,

and CgdMos1-6 are added to invbot1,2. As a result, power consumption of Comp1 is largest.

Digital Offset Compensation On

When digital offset compensation is on, more capacitances are added on the

comparator. The power consumption thus increases. Figure 40 shows the power

consumption of all comparators operating at 1.5GHz, 1.8V supply. Comp4 is

interestingly the lowest power consuming. The reason is that Comp4 uses the smallest

size devices for digital offset compensation, its overlap capacitance plus the gate

capacitance is thus the smallest. Comp3 is the second least power consuming, because

again the digital compensation devices are smaller than that of Comp1 and Comp2.

Comp1 and Comp2 have comparable power consumptions. Note that by adding digital

offset compensation, the power consumption is at least double to that of core comparator.

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69

0.8 1 1.2 1.4 1.6 1.850

100

150

200

250

300

Input Vcm (V)

Pow

er (

uW)

Power Consumption with Digital Compensation Off

CoreCompComp1 Comp2 Comp3 Comp4

Figure 39 Power Consumptions with Digital Offset Compensation Off

0.8 1 1.2 1.4 1.6 1.850

100

150

200

250

300

350

Vcm (V)

Pow

er (

uW)

Power Consumption with Digital Compensation On

CoreCompComp1 Comp2 Comp3 Comp4

Figure 40 Power Consumptions with Digital Offset Compensation On

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70

By noticing the increase in power consumption when digital compensation is on,

we again suggest to control the left part and right part of digital compensation separately.

As we explained at the end of speed section, by turning on only left or right devices, we

halved the extra parasitic capacitance, and thus the power consumption can be greatly

reduced.

3.6.2 Power of Clocking

Power of clocking is mainly due to charging and discharging the clock load

capacitance. Thus, to find the power consumed on driving the clock, we can simply find

the clock load capacitance. Table 10 shows the clock load capacitance of each

comparator, and the corresponding clocking power. Power calculation is based on 1.8V

supply operating at 1.5GHz. It is obvious that Comp1, Comp2, and Comp4 have the same

clock load capacitance. Comp3 has large clock load capacitance because of its digital

offset compensation structure.

Core Comp Comp1 Comp2 Comp3 Comp4 Clock Load Capacitance

10.9fF 12.5fF 12.5fF 37.6fF 12.5fF

Clocking Power

52.9µW 60.8µW 60.8µW 183µW 60.8µW

Table 10 Power of Clocking

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3.6.3 Total Power

The total power is calculated by summing the power of comparator itself and

power of clocking. Figure 41 shows the total power consumption when digital

compensation is off; Figure 42 shows the total power consumption when digital

compensation is on. Again, operating condition is 1.8V supply, 1.5GHz clock. Since

clocking power of Comp3 is much larger than others, Comp3 becomes the most power

consuming comparator among four architectures. Comp2 is the least power consuming

when digital compensation is off, and Comp4 is the least power consuming when digital

compensation is on. Overall, digital offset compensation increases the power

consumption by 60% to 160%, greatly depending on the choice of architecture.

0.8 1 1.2 1.4 1.6 1.8100

150

200

250

300

350

Input Vcm (V)

Tot

al p

ower

(uW

)

Total Power Consumption with Digital Compensation Off

CoreCompComp1 Comp2 Comp3 Comp4

Figure 41 Total Power Consumption with Digital Compensation Off

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72

0.8 1 1.2 1.4 1.6 1.8100

150

200

250

300

350

400

450

500

Vcm (V)

Tot

al P

ower

(uW

)

Total Power Consumption with Digital Compensation On

CoreCompComp1 Comp2 Comp3 Comp4

Figure 42 Total Power Consumption with Digital Compensation On

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73

3.7 Quick Summary of Comparison

In summary, we have compared the performances of 4 digital offset compensation

architectures. Offset compensation ability, supply sensitivity, speed, input capacitance,

and power have been compared in detail. Table 11 shows the summary of the

performances. Comp1 and Comp2 are suitable in high accuracy applications, while

Comp4 is suitable in low power system.

Performance Core Comp Comp1 Comp2 Comp3 Comp4 Worst-case Offset

60 – 140mV 8 – 14mV 8 – 13mV 7 – 65mV 9 – 21mV

Effective number of bit correction

N/A 3.5bit 3.5bit 3bit 3.2bit

Worst-case Supply Sensitivity on Offset*

10mV 13mV 18mV 22mV 16mV

Sampling Rate (%Reduction)

2.84GHz 2.10GHz (–26%)

2.19GHz (–23%)

2.38GHz (–16%)

2.15GHz (–24%)

Input Capacitance

1fF 1fF 1fF 1fF 1fF

Power** (% Increase)

142–175µW 213–390µW (50–120%)

238–400µW(67–129%)

328–460µW(130–160%)

168–280µW(18–60%)

*Worst-case supply sensitivity (±10% change in supply) measured at VCM = 1.2V ** Power consumption in VCM range 0.8V ≤ VCM ≤ 1.6V

Table 11 Performances Rating of Comparators

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74

Chapter 4 Circuit Performance All four architectures have been fabricated in 0.18µm 1.8V CMOS technology. In

the test chip, each architecture is duplicated 20 times. As a result, there are 20 Comp1, 20

Comp2, 20 Comp3, and 20 Comp4 in the same chip. Thus, we are able to collect

statistical data from the chip. Since this project emphasizes on offset compensation, only

offset of the comparators have been measured.

4.1 Accuracy

In each of the following subsections, we will present the measurements of internal

offset, digital offset, linearity of digital offset, and worst-case overall offset respectively.

4.1.1 Measured Internal Offset Due to Device Mismatches

As you can see from the schematics, Comp1, Comp2, and Comp4 share the same

core comparator, while Comp3 has split tail current architecture. Therefore, Comp1,

Comp2, and Comp4 have similar internal offset, while Comp3 has larger internal offset.

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0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6−200

−150

−100

−50

0

50

100

150

Vcm (V)

Mea

sure

d O

ffset

, (m

V, d

iff)

Comp1 Internal Offset measurements

Data Points Average +/− 3 sigma Theoretical bounds

Figure 43 Measured Internal Offset of Comp1

0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6−150

−100

−50

0

50

100

150

Vcm (V)

Mea

sure

d O

ffset

, (m

V, d

iff)

Comp2 Internal Offset measurements

Data Points Average +/− 3 sigma Theoretical bounds

Figure 44 Measured Internal Offset of Comp2

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76

0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6−400

−300

−200

−100

0

100

200

300

Vcm (V)

Mea

sure

d O

ffset

, (m

V, d

iff)

Comp3 Internal Offset measurements

Data Points Average +/− 3 sigma Theoretical bounds

Figure 45 Measured Internal Offset of Comp3

0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6−250

−200

−150

−100

−50

0

50

100

150

Vcm (V)

Mea

sure

d O

ffset

, (m

V, d

iff)

Comp4 Internal Offset measurements

Data Points Average +/− 3 sigma Theoretical bounds

Figure 46 Measured Internal Offset of Comp4

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77

In the figures above, “Data points” represent the offset of each duplicated

comparator. Thus, there should be 20 data points at the same VCM. “Average” represents

the average value of all data points at that VCM. “+/− 3sigma” is the ±3 × (standard

deviation σ) calculated statistically from data points. “Theoretical bounds” is ±3 ×

(standard deviation σ) obtained from simulations. In all four figures above, we can see

that the internal offset tends to negative. This negative trend is mainly due to layout

asymmetry of the comparator itself. If you neglect the offset due to layout asymmetry, the

range of “+/− 3sigma,” which is obtained from real circuits, is closed to the range of

“Theoretical bounds,” which are obtained from simulations. This verifies that the analysis

in chapter 2 accurately predicts the offset of the comparator.

4.1.2 Measured Digital Offset Compensation

Since there is inaccuracy in the simulation model, the performance of the real

circuit implementation deviates from the simulations presented in Chapter 3. The errors

on estimating parasitic capacitance in simulations are typically high. The incorrect

parasitic capacitance model will lead to large performance impact in digital offset

compensation. This will be discussed in detail for each comparator.

Figure 47 shows the measured digital offset of Comp1. It is obvious that the

correction range obtained in measurements is larger than that in simulations. We found

that the simulations over-estimated the parasitic capacitance. As a result, all transistors in

real implementation have more drive strength than those in simulations. Consequently,

the digital offset magnitude of Comp1 in real circuits, which is shown in Figure 47,

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78

covers a larger range than shown in the simulations of Figure 24. In addition to error in

correction range, simulated digital offsets increase fairly linearly with VCM, but measured

digital offsets are fairly constant over wide range of VCM. The intuitive understanding on

the structure of Comp1 actually predicts that the digital offset is quite insensitive to the

change in VCM. Comp1 stacks 2 transistors in series as if degenerating the top transistor

MCM1-6 by the bottom transistor MOS1-6 (see schematic Figure 20). As a result, the current

flowing through each branch is regulated by the small feedback mechanism. The created

offset is also regulated, and thus, the offset magnitude does not change rapidly over wide

range of VCM. This effect clearly shows up in Figure 47.

In addition, the drawback of Comp1 is its nonlinearly scaling devices on digital

offset compensation. It is expected that the LSB, D1 has different characteristic from

other bits do. Figure 47 shows that the offsets created by LSB, corresponding to all odd

digital levels, approach more to a constant than the offsets created by 2nd LSB,

corresponding to all even digital levels. It is because LSB is created by MCM1 and MOS1AB,

which form larger degeneration; thus the current flowing through the LSB branch is less

sensitive to VCM. The different behaviors between the 1st LSB and the 2nd LSB degrade

the linearity of the digital offset compensation. The linearity will be discussed in next

section.

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79

0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6−200

−150

−100

−50

0

50

100

150

200

Vcm (V)

Mea

sure

d O

ffset

, (m

V, d

iff)

Comp1 Measured Digital OS compensations

7 6 5 4 3 2 1 0 −1−2−3−4−5−6−7

Figure 47 Measured Digital Offset of Comp1

0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6−400

−300

−200

−100

0

100

200

300

400

Vcm (V)

Mea

sure

d O

ffset

, (m

V, d

iff)

Comp2 Measured Digital OS compensations

7 6 5 4 3 2 1 0 −1−2−3−4−5−6−7−8

Figure 48 Measured Digital Offset of Comp2

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80

0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6−600

−400

−200

0

200

400

600

Vcm (V)

Mea

sure

d O

ffset

, (m

V, d

iff)

Comp3 Measured Digital OS compensations

7 6 5 4 3 2 1 0 −1−2−3−4−5−6−7−8

Figure 49 Measured Digital Offset of Comp3

0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6−40

−30

−20

−10

0

10

20

30

40

Vcm (V)

Mea

sure

d O

ffset

, (m

V, d

iff)

Comp4 Measured Digital OS compensations

7 6 5 4 3 2 1 0 −1−2−3−4−5−6−7−8

Figure 50 Measured Digital Offset of Comp4

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81

Figure 48 shows the measured digital offset of Comp2. The difference between

Comp1 and Comp2 is especially clear with measurements. Comp2 creates offset similar

to a β mismatch of M1,2. Notice the similarity of “beta1” in Figure 15 with Figure 48.

Note that simulation shown in Figure 25 incorrectly predicts that digital offset stays

constant in high VCM. The stronger drive strength in actual devices shows up clearly in

measured digital offset of Comp2 in Figure 48. In high VCM, the real measured digital

offset is larger than the simulated digital offset by more than 100%.

Figure 49 shows the measured digital offset of Comp3. The measured circuit

performance of Comp3 deviates the least from simulation results. The digital offset in

real implementation is only slightly larger than that in simulation. The large non-linearity

also clearly shows up in real circuits.

Figure 50 shows the measured digital offset of Comp4. The inaccurate parasitic

capacitance model affects the performance of Comp4 the most. All capacitances due to

MC0-4 are smaller in the fabricated chip; thus, smaller offsets are resulted. In Figure 50,

the maximum digital offset created by Comp4 is only about 40mV, while simulation

expects the maximum digital offset of more than 200mV. Because of the small magnitude

of digital offset, the finite precision of the equipments leads to difficulties in offset

measurements. Figure 50 shows the measured digital offset of Comp4 with large

measurement uncertainty. By carefully inspecting all 16 digital offset levels, level 3 (3

LSB) and level 4 (4 LSB) cross over with each other. We suspect that the dummy

capacitor MC0 in Figure 23 does not match with other capacitors in layout. The same

problem occurs in –4 and –5, which is caused by the same transition from 3LSB to 4LSB.

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82

4.1.3 Linearity

Linearity will directly affect the effective number of bits correction. DNL of each

comparator is calculated from the digital offset measurements in the previous section, and

the DNL profiles are shown in Figure 51 − Figure 54.

The measured DNL of Comp1 increases to 1 LSB. However, if VCM is below 1.4V,

the DNL is less than 0.8 LSB. This suggests that it is better to operate Comp1 at low or

moderate VCM. Note that the “zig zag” pattern shows up in measurement as well.

Unlike digital offset measurements, measured DNL of Comp2 is much more

similar to the simulation results. From Figure 52, we confirm that Comp2 has DNL

approximately 0.5 LSB, and is the best among four comparators.

Comp3 has the worst DNL profile, as predicted in simulations. In real circuits, the

worst DNL is almost 1.5 LSB. Simulations can also predict the compression of the step

size of offset compensation. The measured DNL profile of Comp3 is also very similar to

the simulation results.

With a lot of difficulties in precise measurements, the measured DNL profile of

Comp4 is not very meaningful. Thus, we will not have further discussion on this.

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83

−8 −6 −4 −2 0 2 4 6 8−1

−0.8

−0.6

−0.4

−0.2

0

0.2

0.4

0.6

0.8

Digital Level, W

Offs

et D

NL

(LS

B)

Comp1 Measured Digital Offset DNL

vcm=0.8vcm=1.0vcm=1.2vcm=1.4vcm=1.6

Figure 51 Measured DNL of Comp1

−8 −6 −4 −2 0 2 4 6 8−0.8

−0.6

−0.4

−0.2

0

0.2

0.4

0.6

Digital Level, W

Offs

et D

NL

(LS

B)

Comp2 Measured Digital Offset DNL

vcm=0.8vcm=1.0vcm=1.2vcm=1.4vcm=1.6

Figure 52 Measured DNL of Comp2

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84

−8 −6 −4 −2 0 2 4 6 8−1

−0.5

0

0.5

1

1.5

Digital Level, W

Offs

et D

NL

(LS

B)

Comp3 Measured Digital Offset DNL

vcm=0.8vcm=1.0vcm=1.2vcm=1.4vcm=1.6

Figure 53 Measured DNL of Comp3

−8 −6 −4 −2 0 2 4 6 8−2

−1.5

−1

−0.5

0

0.5

1

1.5

Digital Level, W

Offs

et D

NL

(LS

B)

Comp4 Measured Digital Offset DNL

vcm=0.8vcm=1.0vcm=1.2vcm=1.4vcm=1.6

Figure 54 Measured DNL of Comp4

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85

4.1.4 Worst-case Overall Offset

When four comparators have similar range of digital offset compensation, DNL

and worst-case overall offset give the same results. However, since four comparators in

this test chip have different ranges of corrections, worst-case overall offset is eventually

the most important metric and it tells which comparator has higher accuracy.

In Figure 55 – Figure 58, “Worst-case offset” is the worst possible offset of a

comparator, and it is calculated by finding the biggest separation between two digital

levels in measured digital offset from Figure 47 – Figure 50. “Data Points” are the actual

offset of the duplicated comparators on chip after digital offset compensation. As a result,

all “Data Points” are bounded by the “Worst-case offset.”

In Figure 58, there are only 3 “Data Points” for offset of Comp4, because Comp4

has very limited correction range, and most duplicated comparators have offset larger

than its correction range. We can find only 3 comparators that have small enough offset

to compensate.

Finally, Figure 59 shows the worst-case offsets of all four comparators in one plot.

Since Comp4 has too narrow correction range, we will neglect Comp4. Comp1 provides

lowest offset in this test chip. Because of the inaccurate capacitance model in simulations,

Comp2 has larger worst-case offset than expected. Comp3 still performs the worst in

offset compensation.

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86

0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6−25

−20

−15

−10

−5

0

5

10

15

20

25

Vcm (V)

Mea

sure

d O

ffset

, (m

V, d

iff)

Comp1 Measured Offset after Digital compensation

Worst−case OffsetData Points

Figure 55 Measured Offset of Comp1 after Digital Compensation

0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6−40

−30

−20

−10

0

10

20

30

40

Vcm (V)

Mea

sure

d O

ffset

, (m

V, d

iff)

Comp2 Measured Offset after Digital compensation

Worst−case OffsetData Points

Figure 56 Measured Offset of Comp2 after Digital Compensation

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87

0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6−80

−60

−40

−20

0

20

40

60

80

Vcm (V)

Mea

sure

d O

ffset

, (m

V, d

iff)

Comp3 Measured Offset after Digital compensation

Worst−case OffsetData Points

Figure 57 Measured Offset of Comp3 after Digital Compensation

0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6−8

−6

−4

−2

0

2

4

6

Vcm (V)

Mea

sure

d O

ffset

, (m

V, d

iff)

Comp4 Measured Offset after Digital compensation

Worst−case OffsetData Points

Figure 58 Measured Offset of Comp4 after Digital Compensation

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88

0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 1.60

10

20

30

40

50

60

70

80

Vcm (V)

Mea

sure

d O

ffset

, (m

V, d

iff)

Measured Worst−case Overall offset

Comp1Comp2Comp3Comp4

Figure 59 Comparison on worst-case offset

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89

Chapter 5 Applications of Comparators

The comparators designed in this project are optimized for high order parallelism.

For example, flash ADC or over-sampler usually require a large number of comparators

in parallel in the first stage. Thus, the comparators should have small input capacitance,

low power consumption. For ADC design, comparator must fulfill the accuracy

requirement as well. In the coming section, a brief ADC design example is shown for

illustrating the application of comparators with digital offset compensation.

5.1 Application of Comparators on Multiphase Flash ADC

Figure 60 Block Diagram of Multiphase Flash ADC

To illustrate the application of comparators on Flash ADC architecture, we are

going to design a N bit multiphase flash ADC. In a single-phase flash ADC, we need to

φ1

N-bit

ADC

N

φ2

N-bit

ADC

N

φP

N-bit

ADC

N

Vin

VFS

COMP

COMP

COMP

COMP

Vin

clk

2N

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90

place 2N comparators in parallel in the first stage. To push the speed performance, we

place, for example, p single-phase flash ADC in parallel. Each flash ADC is triggered by

different phase, φ1, φ2,…φP. The block diagram is shown in Figure 60.

First of all, we need to design a comparator with required accuracy. Since we

know we are going to place a large number of comparators in parallel in the first stage,

we use small transistor size for input device M1,2. With a designed input device size, say

minimum size or 2× minimum size, we know the maximum offsets due to device

mismatch by using techniques developed in chapter 2. By applying digital offset

compensation, we can reduce the input referred offset to fulfill the required accuracy. In

short,

scorrectionbitsofnumberEffectiveV

V mismatchOSoverallOS

,, =

Effective number of bits corrections depends on DNL of offset compensation, which is

explained in chapter 3. After number of bits corrections on offset is designed, we can

design appropriate reset devices. The design of a comparator ends at this point. We can

then obtain the performance metrics of the comparator, especially speed of comparator

fcomp, by simulations.

After the design of the comparator is done, we can obtain the sampling frequency

by modeling the sampling action as a simple RinCin circuit, where Rin = 25Ω for end

termination configuration, and Cin is the sum of capacitances due to pads, channel, and

input capacitance of comparators. Since there are 2N comparators in a single-phase flash

ADC and there are p flash ADC in parallel, we have total (2N)p comparators connected to

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91

the input. Thus,

Equation 16 Cin,total = Cpad + (2N)(p)Cin,comp ,

where Cpad includes any fixed capacitances due to pads, channels, etc., and Cin,comp is the

input capacitance of the comparator. For proper operation, we need to let input voltage

settle within 0.5 LSB = VFS2N+1 , where VFS is full-scale voltage of ADC. The settling time,

which is equal to the sampling time TSAMP, can be calculated by

( ) ininSAMPNCR

T

CRNTe inin

SAMP

12ln2

11 +=⇒≤ +

As a result, sampling frequency is

Equation 17 ( ) ininSAMPSAMP CRNT

f12ln

11+

==

Meanwhile, comparators can only operate up to its maximum speed, fcomp. Thus the

maximum operating frequency of p-phase flash ADC, fADC, = p×fcomp. Both fADC and fSAMP

depend on p, and they set the speed bounds of the ADC, as shown in Figure 61.

When p < po, fADC limits the speed of the ADC; when p > po, fSAMP limits the

maximum speed. The optimum speed is where fADC = fSAMP. This sets a quadratic equation

for p.

( ) inincompSAMPADC CRN

pfff12ln

1+

=⇒=

Equation 18 ( ) ( ) ( ) 012ln12 2

, =+

−+compin

padcompinN

fRNpCpC

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92

Speed of 6-bit p-phase Flash ADC

po0

2

4

6

8

10

12

14

0 2 4 6

Number of parallel ADC, p

Spee

d (G

S/se

c)

fadcfsamp

Figure 61 Speed of 6-bit p-phase Flash ADC

Hence, we can always solve for Equation 18 to obtain the optimum speed of a p-phase

flash ADC. The optimum speed can tell us the fundamental speed limit of a p-phase flash

ADC architecture. This is just a simple example, as we can still increase the performance

by using a multistage ADC to decrease the total input capacitance, or by using distributed

capacitance technique to increase the input sampling bandwidth. More design issues on

those techniques seem out of scope of this paper.

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Chapter 6 Conclusion

This project can be mainly divided into 3 big sections. The 3 sections are

characterization of core comparator (Chapter 2), comparison of comparators with digital

offset compensation (Chapter 3), and chip performance (Chapter 4).

In the first section, (Chapter 2), core comparator is characterized. The

performance metrics of a comparator are input referred offset, supply sensitivity, speed,

input capacitance, and power. A set of formulas is developed to calculate input referred

offset, and we identify the 6 different sources that contribute to offsets, and we

understand how each source varies with VCM. We are able to roughly estimate the supply

sensitivity on offset, so we know the fundamental limit of the accuracy of a comparator.

We know how to size the transistors to achieve higher speed on both evaluation and reset.

In addition, this architecture has small input capacitance and power consumption [2].

With these metrics, we can compare comparators with different architectures,

comparators with different offset compensation, and the tradeoffs of using digital offset

compensation.

In the second section (Chapter 3), we compare four comparators with different

digital offset compensation. Based on the performance metrics developed in chapter 2,

we created Table 11 to summarize the comparison of digital offset compensation. Comp2

has the best offset compensation ability because of its linearity, while Comp4 is a good

alternative because of its low power consumption. In general, digital offset compensation

can reduce the input referred offset from 140mV to 13mV. Effective number of bits

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correction can be ranged from 3 – 3.5 bit from a 4-bit architecture. Input capacitance is

less than 1fF. By adding digital offset compensation, the sampling rate is only reduced by

15 – 25%, and power consumption increases by 60 – 160%.

In the third section (Chapter 4), all four comparators are implemented in 0.18µm,

1.8V CMOS technology. Since this project emphasizes on offset compensation, only

offset measurements are performed. We verified that the analysis for internal offset could

predict the offset of a comparator. We found that simulations over-estimated the parasitic

capacitance; thus, transistors have more drive strength. As a result, Comp1, Comp2, and

Comp3 have offset correction range larger than that obtained from simulations; however,

Comp4 has offset correction range less than expected. In addition, Comp2 gives the best

DNL (0.5LSB), and Comp3 gives the worst DNL (1.5LSB).

In the end of this project, we also give a simple example to illustrate how to apply

comparators with digital offset compensation in real implementation. We have developed

a method to design transistor size of comparators and number of bit corrections for

comparators. Moreover, we are able to find the optimum speed of a p-phase flash ADC.

With this example, we showed that comparators with digital offset compensation have

high potential on applications with high order parallelism.

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Reference

[1] Pelgrom, M.J.M., Duinmaijer, A.C.J. and Welbers, A.P.G. “Matching properties of MOS transistors,” IEEE Journal of Solid-State Circuits, vol. SC-24, pp.1433-1440, 1989.

[2] Razavi, B.; Wooley, B.A., "A 12-b 5-Msample/s two-step CMOS A/D converter," IEEE Journal of Solid-State Circuits, vol.27, (no.12), Dec. 1992. p.1667-78.

[3] Dobberpuhl, D.W., "Circuits and technology for Digital's StrongARM and ALPHA microprocessors [CMOS technology]," Seventeenth Conference on Advanced Research in VLSI, IEEE Comput. Soc, 1997. p.2-11. ix+322 pp.

[4] Razavi, B., “Principles of Data Conversion system Design,” IEEE Press, pp. 177-81, 1995.

[5] Sakurai, T., "Optimization of CMOS arbiter and synchronizer circuits with submicrometer MOSFETs," IEEE Journal of Solid-State Circuits, vol.23, (no.4), Aug. 1988. p.901-6.

[6] Ellersick, W.; Yang, C.-K. K.; Horowitz, M.; Dally, W., "GAD: A 12-GS/s CMOS 4-bit A/D converter for an equalized multi-level link," 1999 Symposium on VLSI Circuits Digest of Papers, June 1999, pp. 49-52.

[7] Weinlader, D.; Ho, R.; Yang, C.-K. K.; Horowitz, M., "An eight channel 36 GSample/s CMOS timing analyzer," 2000 ISSCC Digest of Technical Papers, Feb 2000, pp. 170-1.

[8] Lee, M.-J.E.; Dally, W.; Chiang, P., "A 90 mW 4 Gb/s equalized I/O circuit with input offset cancellation," 2000 ISSCC Digest of Technical Papers, Feb 2000, pp. 252-3.