Uncooled, high speed lasers for DATACOM and TELECOMleos.unipv.it/slides/lecture/Uncooled...

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Avago Technologies

Uncooled, high speed lasers for

DATACOM and TELECOMMay 27th, 2011Marina Meliga


Avago Technologies

0

1

2

3

4

5

6

2005 2006 2007 2008 2009 2010

Driving forces for increasing of bandwidth demand (1)

(*) International Telecommunication Union http://www.itu.int/ITU-D/ict/statistics/

BILLIONS of

mobile phones

2010: 5,3 BILLIONS of mobile phones, mobile network available for 85% of world population (but not everybody can buy one…)


Avago Technologies

0 100 200 300 400 500 600 700 800 900

Africa

Asia

Europe

Middle East

North America

Latin America/Caribbean

Oceania / Australia

Millions of users

2010 2010

11%

21%

58%

30%

77%

34%

61%

(*) http://www.internetworldstats.com2010: 2 BILLIONS OF PEOPLE in INTERNET

Driving forces for increasing of bandwidth

demand (2)


Avago Technologies

….and the social networks of course

30.000 servers

200 Terabit/day (> 1000 more than traditional mail)

500 millions of users

30.000 servers

200 Terabit/day (> 1000 more than traditional mail)

500 millions of users


Avago Technologies

Huge acceleration of bandwidth demand


Avago Technologies

A very “hot” topic

• 4% of energy in the world used for telecommunication (1 server=1 SUV) and it doubles in 18 months.

• In 10 years we will have x64 of increase

• New technology platform needed!!


Avago Technologies

Optical transceivers are now used in all network segments

Long Haul

City to City

Enterprise

Building to Building

Storage

Rack to Rack

Server

Board to Board

Chip interconnection

Chip to Chip

Today Next

Metro

City

TELECOM DATACOM

Market grow

EML

Cost ��

T Range ��

DFB

Cost ☺☺☺☺

T Range ☺☺☺☺

VCSEL

Cost ☺☺☺☺ ☺☺☺☺ ☺☺☺☺

T Range ☺☺☺☺ ☺☺☺☺

FP

Cost ☺☺☺☺ ☺☺☺☺

T Range ☺☺☺☺ ☺☺☺☺


Avago Technologies

~250 x 250 mm

LASER

XFP(78 x 18mm)

X2XENPAK(100 x 50mm)

Evolution (since 2000)

PLUGGABILITY: PAY AS YOU GOPLUGGABILITY: PAY AS YOU GO

Transceiver modules requirement:

• Strong limits in space available and power budget

• Wide temperature operation (0÷85oC)

⇒⇒⇒⇒ Requirement on lasers:

• High temperature operation (uncooled)

• Low cost, high manufacturing yield, high reliability

• no compromise on High performance

(high bit rate, high optical power, high spectral purity, …)

Pluggable transceiver: the enabling technology…


Avago Technologies

• InGaAlAs MQW

• Active material suitable for high speed and high temperature operating devices

• Ridge structure

• Best technique for reliable Al based lasers with high fabrication yield, oxidation risks and process steps are minimized

• λλλλ/4 shifted grating

• Typical problems related to grating phase at facets are negligible, ~100% single mode yield and no dynamic effects due to spatial hole burning

• Selective Area Growth

• One step EPI growth, no reliability issue related to Al oxidation in multisection/integrated devices

25Gb/s 1.3um DFB

4x10Gb/s DFB 1270-1330nm

Semi-cooled (40°C), 10Gb/s 1.5um EA-DFB

Dev

ices

Technology platform for uncooled DFB laser


Avago Technologies

OC48 (4CG4), 10GbE (4CG5), 10Gb Sonet (4CG3)Uncooled DFB Laser for XFP, SFP and SFP+ platform (2005 – 2006)

L

L/2 L/2

Phase shifted grating

70C-5C

10 G Sonet on XFP module


Avago Technologies

InGaAsP-based MQW

(Agilent, 2001)

0 10 20 30 40 50 60 70 80 90 1000

5

10

15

20

25

30

35

40

Current (mA)

Power (mW)

T0=48 K

T=20-100 ºC

Active material: our path of performance improvement10 years of active material engineering leads to massive improvement of temperature performance

InGaAsP Bulk material (50 mA Threshold at 80C, CSELT, 1995)

InGaAsAl-based MQW

(Avago, 2005)

0 10 20 30 40 50 60 70 80 90 100

0

5

10

15

20

25

30

35

40

0 10 20 30 40 50 60 70 80 90 1000

Current (mA)

5

10

15

20

25

30

35

40

Power (mW)

T=20-100 ºC

T0=95 K


Avago Technologies

Production started in Torino on November 2006.


Avago Technologies

Long Haul

Metro

StorageEnterprise

< 300 m

2-20 km 20-100 km

Equipment room

< 50m

Today’s Optical Networks

•Optical transceivers are now used in all network segments

•10 Gbps transceiver market is finally taking off

•Same trend will occur at 40 and then 100 Gbps


Avago Technologies

What’s next?

16Gb/s FC, 40 and 100 Gb/s Ethernet standard

• (IEEE P802.3ba)

• for 40Gb/s (40GBASE – SR4, 850nm, 4 x 10GbE; 40GBASE – LR4, 1300nm, 4 x 10GbE CWDM)

• for 100 Gb/s (100GBASE – SR10, 850 nm, 10 x 10GbE; 100GBASE – LR4, 1300 nm, 4 x 25GbE, DWDM)

• 16G FC standard for Fiber channel

• Standard and MSA have focused the technology development:

• 16G FC transceiver SFP+ (Avago 980nm, Opnext 1300nm)

• First 40Gb/s and 100Gb/s CFP MSA (Multi-Source Agreement) Opnext, Finisar

• Pushing the DFB technology up to 25Gb/s uncooled !


Avago Technologies

17G/25G 1300 nm DFB laser: eye diagram Key results

20Gb/s 20Gb/s 25Gb/s 25Gb/s 17Gb/s 17Gb/s

70C

20C

50C

70C

20C

50C

70C

20C

50C

• 17, 20 and 25Gb/s

• 4.5 – 5 dB e.r., 20 – 70 °C, positive mask margin


Avago Technologies

What next: 100G SMF Optical Module Roadmap

Source


Avago Technologies

Area and Power Dissipation of Optical

Modules


Avago Technologies

Sources for 100Gb: monolithic approach 4×25-Gbit/s, 1.3-um, Monolithically Integrated Light source

Takeshi Fujisawa (NTT Corporation, Japan); ECOC 2010, invited

• Application: 100GbaseLR4 and ER4 (10 and 40 km) 1300nm

• Now CFP with 4 TOSAs, WDM filter

• To move from CFP to smaller size (CFP2/?):

• integration

• Low power consumption

• Standard specifications

• dynamic extinction ratio (DER) larger than 4 dB for LR4 and 8 dB for ER4 system

• EADFB good for both LR4 and ER4

• Then NTT approach

• Monolithic integration of EADFB and MUX (MMI)

• 2×2.6 mm2

• Quarter wavelength shift DFB

• Ridge, buried in BCB

• Shallow ridge EADFB, deep ridge MUX

• InGaAlAs

• Double “ butt join” (one also fro the low doping cladding in the MMI…)


Avago Technologies

Photonic integration trends Single InP Chip for DQPSK

⇒⇒⇒⇒ Photonics on InP

Infinera, (OFC2009, OThN2) Transmitter PIC for 10-Channel x 40Gb/s per Channel Polarization-Multiplexed RZ-DQPSK Modulation

High complexity; system on a chip….


Avago Technologies

… Or will be Silicon Photonics?

ECOC 2010, John Bowers, Dept of Electrical and Computer EngineerECOC 2010, John Bowers, Dept of Electrical and Computer Engineering, UCSBing, UCSB


Avago Technologies

Silicon Photonics; Hybrid approach: die level

• Another material for gain (hybrid approach)

• Bonding: Die level

• Flip-chip (Luxtera)

ECOC 2010ECOC 2010


Avago Technologies

Silicon Photonics; Hybrid approach: wafer level

• Another material for gain (hybrid approach)

• Bonding: wafer level

ECOC 2010, J. Bowers, Dept of Electrical and Computer EngineerinECOC 2010, J. Bowers, Dept of Electrical and Computer Engineering, UCSBg, UCSB


Avago Technologies

Avago Technologies San Jose

� Product R&D

� III-V Device R&D

� Marketing

� Application Engineering

Fiber Optics WW OperationsAvago Technologies Italy

Turin Technology Center (TTC)

� III-V Devices R&D

� Product R&D

� Advanced Technology

Avago Technologies Singapore

� III-V Device Manufacturing

� Transceiver Manufacturing

� Product Development

� Marketing


Avago Technologies

Epi layer

How we do it……Technology: 1) MOCVD Epitaxial growth

MOCVD reactor

Epi growth

substrate

MULTI QUANTUM WELL

substrate: InP:n

InP:p

<10 nm


Avago Technologies

How we do it……(2) Processing, from EPI layers to chip on wafer

photoresist

SiN

1) photolithography1) photolithography2) Chemical etch2) Chemical etch

UV

mask

Photolithography

� 70 nm line in 75 nm thick resist

� 200 nm pitch lines

Electron Beam Lithography


Avago Technologies

Wafer bars Coating /cleave

How we do it……(3) Scribing: from wafer to single chip

Chips

Scribing Dicing


Avago Technologies

How we do it……(4) Automatic testing

What are What are LDIsLDIs??

Laser Device Inspectors are automatic systems for 100% device testing and screenings System capabilities and scope:

•Test: pulsed measurements on chip @ R.T.:

•F/B LIV, spectrum, rev. leakage, chip size and tilt

•10G FP, 10G DFB, EML

•Purpose: characterisation (chip level) for 10G FP, 10G DFB, EML (Wafer validation/qualification and 100% Pass/Fail production screening)


Avago Technologies

• Reliability has always been the key strength in a III-V world

• Customer reliability expectation is almost compared to the ‘telecom” field, but for low cost – consumer products

Long endurance test (45000 h; 10 years at worst case

operating conditions)

How we do it……(5) Reliability

Uncooled, high speed lasers for DATACOM and TELECOMleos.unipv.it/slides/lecture/Uncooled...

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