UNCLASSIFIED A D ,410398 · 2018-11-08 · 2.1 Task A-20 Contact :1icroassembly Receptacle 2 2.2...

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UNCLASSIFIED ,410398 A D_ .. .. DEFENSE DOCUMENTATION CENTER FOR SCIENTIFIC AND TECHNICAL INFORMATION CAMERON STAIION, ALEXANDRIA, VIRGINIA UNCILASSIFIED

Transcript of UNCLASSIFIED A D ,410398 · 2018-11-08 · 2.1 Task A-20 Contact :1icroassembly Receptacle 2 2.2...

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UNCLASSIFIED

,410398A D_ .. ..

DEFENSE DOCUMENTATION CENTERFOR

SCIENTIFIC AND TECHNICAL INFORMATION

CAMERON STAIION, ALEXANDRIA, VIRGINIA

UNCILASSIFIED

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NOTICE: When government or other drawings, speci-fications or other data are used for any purposeother than in connection with a definitely relatedgovernment procurement operation, the U. S.Government thereby incurs no responsibility, nor anyobligation whatsoever; and the fact that the Govern-ment may have formlated, furnished, or in any waysupplied the said drawings, specifications, or otherdata is not to be regarded by implication or other-wise as in any manner licensing the holder or anyother person or corporation, or conveying any rightsor permission to manufacture, use or sell anypatented invention that may in any way be relatedthereto.

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Qualified requestorsTr..y obr c ..of this report from A -STIA. -lease to OTS not authorized.

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I

!I FIRST QUARTER PROGRESS REPORTON

j PRINTED CIRCUIT CONNECTORSFOR

1, NICROASSILIBLIES

REPORT NO. 1

Period Covered by Report: 1 February 1963 to 1 May 1963

USAELRDL Contract No.: DA-36-039-AMAC-00122 (E)

Signal Corps Technical Requirement: SCL-7673, 1 July 1962

Department of the Army Project No.: 3A99-15-005

Department of the Army Task No.: 3A99-15-005-03

SUBMITTED TOU.S. ARMY ELECTRONICS RESEARCH AND DEVELOPMENT LABORATORY

FORT MONMOUTH, NEW JERSEY

SUBMITTED BYCINCH MANUFACTURING COMPANY

DIVISION OF UNITED-CARR FASTENER CORPORATIONRESEARCH AND DEVELOPMENT DEPARTMENT

CHICAGO, ILLINOIS

Ii

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PRINTED CIRCUIT CONNECTORS

FOR

IMICROASSEIBLI;S

iF'irst Quarter Progress Report

Report Yo. 1

1 February 1963 to 1 May 1963

The Program covered by this contract entails the development ofmicroascso ibly connectors, specifically designated for use withhermetic and encapsulated nilcroasso ibli s developed under SignalCorps Contract No. DA-36-039-SC-89176.

This program is made up of two tasks: Task A is a DevelopmentProgram, to provide the design and development of a receptacleto mate with established hermetic .iicroasso ;bly pin terminations.Task B is a Feasibility Study of a printed circuit connector for

an encapsulated .1icroarso-.bly of special design.

USAELRDL Contract No..: DA-36-039-AMC-00122 (E)

Signal Corps Technical Requirement: SCL-7673., 1 July 1962

Department of the Army Project No.- 3A99-15-O05

Department of the Army Task No.: 3A99-15-005-03

Written By:

HOWARD E. DWANMechanical Engineer1Research and Development Department

Cinch Manufacturing CompanyChicago, Illinois

/

/

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TABLE OF CONTENTS

SECTION PAGE NO.

1.0 PURPOSE 11.1 Objective 11.2 Related Projects 1

2.0 ABSTRACT 22.1 Task A-20 Contact :1icroassembly Receptacle 22.2 Task B-Encapsulated Microassembly Connector 2

3.0 PUBLICA.IONS, LECTURES, REPORTS Ai'D CONFERENCES: 33.1 Reports 33.2 Conferences 3

4.0 FACTUAL DATA 54.1 Introduction 54.2 Task A - Development and Evaluation of Design Approaches

for a Female Contact to Mate with Established HermeticMicroassembly Pin Ternination 5

4.2.1 Equipment used 54.2.2 Results 54.3 Task B - A Feasibility Study Leading to the Design of

a Printed Circuit Connector for an EncapsulatedMicroasserebly 10

4.3.1 Design Approaches 10

5.0 CONCLUSIONS 12

6.0 PROGRAM FOR NEXV INTERVAL 13

7.0 INDENTIFICAtION OF K-Y PERSONNEL 14

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LIST OF ILLUSTRATIONS

TASK A PAGE NO.TABLE 1 TEST ON CONTACT APPROACH A-2 (PRELIIARY) 18TABLE 2 TEST ON CONTACT APPROACH A-2-1 (PRELI114INARY) 20TABLE 3 TEST ON CONTACT APPROACH A-2-2 (PRELIMINARY) 22TABLE 4 TEST ON CONTACT APPROACH A-3 (PRELIMINARY) 24TABLE 5 TEST ON CONTACT APPROACH A-5 (PRELIMINARY) 27TABLE 6 TEST ON CONTACT APPROACH A-5-1 (PRELIMINARY) 29TABLE 7 TEST ON CONTACT APPROACH A-5-2 (PRELIMINARY) 31TABLE 8 TEST ON CONTACT APPROACH A-5-3 (PRELIMINARY) 33TABLE 9 TEST ON CONTACT APPROACH A-7 (PRELIMINARY) 36TABLE 90 TEST ON CONTACT APPROACH A-9 (PRELIMINARY) 39TABIE 10 TEST ON CONTACT APPROACH A-9-1 (PRELIMINARY) 42

TASK A

FIGURE. 1 DRAWIITG ON CONTACT APPROACH A-I (PRELIlIiARY) 17FIGURE 2 DRAWI!!G ON CONTACT APPROACH A-2 (PiELIVINARY) 19FIGURE 3 DRAWING ON CONTACT APPROACH A-2-1 (PRELIMINARY) 21FIGURE 4 DRAW.'ING ON CONTACT APPROACH A-2-2 (PRELIMINARY) 23FIGURE 5 DRAWING ON CONEACT APPROACH A-3 (PRELIMINARY) 25FIGURE 6 DRAWING ON CONTACT APPROACH A-4 (PRELIMINARY) 26FIGURE 7 DRAWING ON CONTACT APPROACH A-5 (PRELIMINARY) 28FIGURE 8 DRAWlING ON CONfACT APPROACH A-5-1 (PRELIMINARY) 30FIGURE 9 DRAWING ON CONTACT APPROACH A-5-2 (PRELIMIIARY) 32FIGURE 10 DRA:JING ON CONTACT APPROACH A-5-3 (PRELIMINARY) 34FIGURE 11 DRA !ING ON CONTACT APPROACH A-6 (PRELIM'INARY) 35FIGURE 12 DRAWING ON CONTACT APPROACH A-7 (PRLLININARY) 37FIGURE 13 DRAWING ON CONTACT APPROACH A-8 (PRELIMINARY) 38FIGURE 14 DRA!JING ON CONTACT APPROACH A-9 (PRELIMiINARY) 40FIGURE 15 DRA'!ING ON CONTACT IT, INSUL: TORA-9(PRELIiINARY 41FIGURE 16 DRAWING ON CONTACT APPROACH A-9-1 (PRELIMINARY) 43FIGURE 17 DRA'!INTG ON CONTACT IN INSULATOR A-9-1 (PRELIMINARY) 44FIGURE 18 DRA.'inG ON CONTACT APPROACH A-10 (PRELIMINARY) 45FIGURE 19 DRAU!ING ON CONTACT APPROACH A-II (PRLIMINARY) 46

TASK B

FIGURE 20 DRAWING ON DESIGN APPROACH B-i (PtiELIMINARY) 47FIGURE 21 DRAWING ON DESIGN APPROACH B-2 (PRi-LIMINARY) 48

IGURE 22 DRA. ING ON DESIGN AP-ROACH B-3 (P-iELIMINARY) 49

'1G R 2 DA*lT(*4

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1.0 PURPOSE

The purpose of this contract is the investigation, design anddevelopment of printed circuit connectors, to be used as ameans for connecting microassemblie into equipment of minimumpossible size. The program covered by this contract comprisestwo parts hereafter referred to as Task A and Task B.

1.1 Objective

Task A Design, fabricate and evaluate a 20 contact receptacle.whose female contacts are capable of mating with 0.016to 0.020 diameter microassembly pins.

The dimensions of the receptacle shall be such that the contactscan be mounted in an insulator body and onto a printed circuitboard on a 0.075 grid. The maximum height of the receptacleshall not exceed 0.100 inches, excluding the contact tabs.The dimensions of the receptacle shall not exceed 0.393 by0.393 inches.

Task B A Feasibility Study leading to the design of a printedcircuit connector for an encapsulated microassembly ofspecial design. Task B is divided into two phases,hereafter referred to as Phase 1 and Phase 2.

Phase 1 is concerned with the integration of a connector witha microassembly stack containing thirty-six (36) .010 X .002conductor ribbons extending on 0.025 centers from the peripheryof its base, The overall dimensions of the connector body arenot to exceed 0.350 by 0.350 inches.

Phase 2 is concerned with the integration of a connector with amicroassembly stack containing eighty (80) .010 X .002conductor ribbons extending on 0.025 centers from the peripheryof its base. The overall dimensions of the connector body arenot to exceed 0.700 by 0.700 inches.

The contact tab of the receptacle, shall be spaced on 0.050(enters and shall be contained within the area of the base.The maximum height of the mated halves in both Phases shallnot exceed '0o100 inches excluding the contact tabs of thereceptacle.

1.2 Related Projects

The following program is closely related to thils contract:

Carr Fastener Company, Cambridge; Massachusetts a Division ofUnited-Carr Fastener Corporation, is presently engaged inworking with Hamilton Standard, Division of United AircraftCorporation in the design and manufacture of a hermetic headerto be attached to a microassembly stack or module. The workboing perform6d by Hailton.Standard relates to the sameassembly for ihich this contract provides the connectors.

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2.0 ABSTRACT

2.1 Task A - 20 Contact Microassembly Receptacle

During this period design effort was concentrated on atotal of eleven (11) contact approaches to mate with0.016" to 0.020" diameter microassembly pins. The contactdesigns were studied analytically and hand-made contactsof the most promising designs were fabricated and testedwith regard to their retention characteristics. Six ofthe eleven contact designs were selected for furtheranalysis.

T2.2 Task B - Encapsulated Microassembly Connector

Analytical analyses of three connector design approachesfor the 36 and 80 conductor encapsulated microassemblieswere made during this period.

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3.0 PUBLICATIONS, LECTURES, REPORTS AND CONFERENCES

3.1 Reports

Technical Progress Chart - Technical effort on developmentprogram for Printed Circuit Connectors for Microassemblies,Dated, 28 February 1963.

Progress Chart - Monthly expenditures of funds on devel-opment program for Printed Circuit Connectors for Micro-assemblies, Dated 28 February 1963.

3.2 Conferences

The first meeting was held on February 26, 1963 in theoffices of the U.S. Signal Corps at Fort Monmouth, NewJersey.

Present

Mr. Roy Witte - Cinch Manufacturing CompanyMr. John Ralph - United Carr Fastener CorporationMr. Peter Byrne - Cinch Manufacturing CompanyMr. Sherman Bassler - U.S. Army Electronic R & D, LaboratoryMr. Weldon Lane - U. S. Army Electronic R & D,Laboratory

The purpose of this meeting was to discuss generally provisionsand requirements of the development contract covered by thisreport. The Signal Corps representative stated at thismeeting the possibility of changing the number of contactsrequired in both tasks A and B.A second meeting was held on April 10, 1963 at Fort Monmouth,

New Jersey to discuss progress to date.

Present

Mr. Roy Witte - Cinch Manufacturing CompanyMr. Ben Johanson - Cinch Manufacturing CompanyMr. Peter Byrne - Cinch Manufacturing CompanyMr. Sherman Bassler - U.S. Army Electronic R & D,LaboratoryMr. Weldon Lane - U.S. Army Electronic R & D,Laboratory

The proposed design approaches for Task A were examined anddiscussed and the following design decision arrived at:

The center of the module is to coincide with the center ofthe receptacle.

Every possible effort should be made to have the contacttabs in line with the header pins. Failing this, thecontact tabs shall be located on a 25-Mil. grid pattern.

Three of the contact designs considered worthwhile andworthy of further investigation are (a) Approach A-5 (b)Approach A-9 (c) Approach A-2. At the request of Mr. Lane

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sketches of these three contacts were sent to him.

The preliminary designs shall be further exploredbefore testing on a full scale.

Suggested changes to Technical Requirement SCL-7673covering Task A and Task B were advanced by the ArmySignal Corps. These changes were discussed and mutuallyagreed upon. These were:

Task A - The number of contacts to be reduced from forty(40) to twenty (20).

Task B - Phase 1 The number of contacts increased fromthirty-two (32) to thirty-six (36).

These changes were accomplished by an amendment toTechnical Requirement SCL-7673, dated 8 March 1963, andsent to us.

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4.0 FACTUAL DATA

4.1 Introduction

First Quarterly Report, covers the period February 1, 1963to May 1, 1963. During this quarter, sketches, drawings,calculations and hand made samples were made in an effortto define the technical approaches and designs mostapplicable to the accomplishment of technical requirementsfor Tasks A and B.

4.2 Task A - Development and Evaluation of Design Approachesfor a Femzale Contact to Ma~te with Established HermeticMicroasscmbly Pin Termin~.tions ,,

4.2.1 Equipment Used

1. Drop Weight - Graduated ounce weights(Graduated in ounces and gram increments)

2. Hunter ScaleManufacturer: Hunter Spring Company

Lansdale, Pa.Model No.: LO-2-M

4.2.2. Results

Contact Approach A-1

Explanation

This particular contact was a redesign of apopular similar contact of Cinch Manufacture,which had been well received by our customers.It was felt that if we could retain the specialfeatures of the contact (such as long operatingtines and therefore greater resiliency) and yetreduco the size to the Task A minimum requirement,it would wo:'k. However, upon redesign, it couldnot meet the minimum space requirement.

.esulti Discarded. (Ref.: FIG. 1 P.17)

Contact Anproach A-2

Fxplan t ion

A similar contact had previously been used in anexperimental proje-'ct calling for a micro-: iniatureconnector of comparable size. We felt that minor

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changes in its geometry would result in a contactusable in an insulator body of one piece construc-tion, thereby providing a desirable pin lead-infeature. This design was fabricated by threedifferent methods, two of aiich proved feasible.

Results (Ref. TABLE 1 P.18 - FIG.2 P.19)

Fabricated using phosphor bronze grade A hardtemper. Contact failed to hold minimum size pinafter tests. The tests further showed satisfactoryinsertion and retention forces with the minimum andnominal size pin. A permanent set resulted with theinsertion of the maximum size pin.

ApW oach A-2-1 (Modification of A-2)

Results (Ref. TABLE 2 P.20 - FIG.3 P.21)

This approach was fabricated with beryllium copperalloy 25, half-hard temper. The tests resulted infavorable insertion and retention forces as well asan ability to hold the minimum size pin.

Since the temper of the beryllium copper and that ofthe phosphor bronze material are similar, we cannotoverlook the possibility that the hand forming ofboth contacts could be a resulting factor in thecontact being able to hold the minimum sizo pin.

Approach A-2-2 (Modification oC A-2)

Results (Ref: TABLE 3 P.22 - FIG. 4 P.23)

Fabricated using beryllium copper alloy 25 half-hard temper heat-treated to 700F for 30 minutesshowed increasing ability thus greater reliabilityto hold the minimum size pin. Noticeable insertionforces greater than thoso of A-2-1 woro oborvod.

Contract Approach A-3

Explanation

It is a unique combination of desirable features ina sheet metal contact, such as a restricted openingin the top of the contact prevents over sized probesor pins from entering. Bifurcation of the contacttines permits three point contact on the pin, anon-restrictive arrangement for the pin length.

Results (Rof: TABLE 4 P.24 - FIG. 5 P.25)

Fabricated using phosphor bronze spring temper.Preliminary tests showed failure of contact to holdminimum size pin. Due to the exceptional features,we will fabricate using beryllium copper material

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and test the contact before making any decision.-

Contact Approach A-4

Explanation

This contact features long operating tines andtherefore greater resiliency, also bifurcation of

j the tines permitting a four point contact withthe pin. As of this writing it has not beenfabricated. Due to the small size, the majorproblem is that of cutting out the tail portionfrom the contact and forming such tail, withoutweakening the contact at its base.

Results Discarded (11of: FIG. 6 P.26)

TContact Approach A-5

Explanation

This approach is a modification of a popularCinch Screw-rachine contact providing a meanswhere the contact tab lines up with the centerline of the contact.

Results (Ref. TABLE 5 P.27 - FIG. 7 P.28)

Fabricated using beryllium copper alloy 25 half-hard temper. The test resulted in the contacttaking a set thus preventing it from holding theminimum size pin.

Approach A-5-1 (Modification of A-5)

Results (Ref: TABLE 6 P.29 - FIG. 8 P.30)

Modification to this design was the increased depthof cut on barrel. Results were somewhat betterthan those of Approach A-5, although it stillwould not hold the minimum size pin.Note: (Sano material as A-5)

Approach A-5-2 (Modification of A-5)

Results (Ref: TABLE 7 P.31 - FIG. 9 P.32)

Contact was fabricated using beryllium copperalloy 25 half--hard heat-treated material. Twocuts were made in the barrel resulting in foursegments. A permanent set resulted in two of thefour cegments early in the test stage, thus

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destroying the effectiveness of the contact.Probable reason for failure, segments too smalland weak.

Approach A-5-3 (Modification of A-5)

Results (Ref: TABLE 8 P.33 - FIG. 10 P.34)

On this approach the barrel was lengthened andthe slot cut deeper. Material used:beryllium copper alloy 25 half-hard heat-treated.Preliminary test results indicate the contact willhold the minimum size pin after sizing.

Preliminary evaluation on contact approach A-5shows that barrel length and depth of cut, coupledwith the heat-trea';d material provided a workablecontact, Additional tests will be conducted tofurther evaluate the design.

Contact Approach A-6

Explanation

This approach is a modification of a Cinch fork-type contact. Miniaturized in past usage, it hasproved reliable in related similar applications.Since approach A-6 and A-7 are very similar, wedecided to proceed with Approach A-7.

Results Discarded (Ref: FIG. 11 P.35)

Contact Approach Ar7

Explanation

This approach offered a miniaturized sheet metalcontact with good contact bearing surface.

Result (Ref.: TABLE 9 P.36 - FIG. 12 P.37)

Fabricated using phosphor bronze grade A hardtemper. Preliminary tests indicated inability ofcontact to hold minimum size pin. This contact isnow being fabricated from beryllium copper material.

Contact Approach A-8

Explanation

The ability in drawing and forming from a piece oftubing was the reason for choosing this approach.After preliminary discussion on the design, itwas decided that many problems would result fromthis method due to its miniaturized size.

Results Discarded (Ref.: FIG.13 P.38)Page8

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Contact Approach A-9

Explanation

Of all the contact approaches considered thisappears thus far to be superior. The action ofthe contact in maintaining a suitable pressureagainst a mating pin, is of a cantilever type andcontrolled by the insulator cavity walls. Bydesign the contact tines can be spread to thewall of the cavity prior to the matorial reachingits elastic limit. This of course, enhances thereliability of the contact when considering itssusceptibility to damage due to mishandling. Thecontact is inserted into the cavity from thebottom. Two ears which are located on the topof the contact, spread out onto two shoulders of

'the insulator body, retaining the contact in thecavity. To minimize the effect of capillary actionduring the soldering process, the contact isindented across the folded tail to keep solderfrom flowing up into the pin area.

Another desirable feature is the restricted orclosed entry arrangement in the top surface of theinsulator body. This restriction prevents over-sized probes or pins from entering, therebyreducing the potential damage duo to mishandling.This restriction will also accurately control thepin alignment for engaging the contact.

Results Ref.: TABLE 10 P.39 - FIG.14 P.40 -

FIG. 15 P.41)

Fabricated from beryllium copper alloy 25 half-hard temper. Has proved itself very reliable inpreliminary tests.

Approach A-9-1 (Modification of A-9)

Results Rof: TABLE 11 P.42 7,FIG.16 P43.- P10.17 P44)

Very similar to A-9 with slight modifications asindicated by drawing. Has shown the same desirablequalities as that of A-9. Slight variation ininsertion and retention forces.

Contact Approach A-10

Explanation

The desirability of this approach relates to ourbelief that it will provide a contact with long

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operating tines and, therefore, the greatestresiliency. We plan to provide pre-tension in thecontact utilizing either restrictive tines in thecavity opening, or having the tines of the contactpre-loaded against each other in such a way as toprovide high pressure immediately upon entry of themale pin. It was hoped that we could design thiscontact for cro piece insulator body. Afterstudy and evaluation it appeared as though thiscould not be done. Since the technical requirementcalls for a one piece construction, the approachwas discarded.

Resulti Discarded (Ref.: FIG, 18 P.45)

Contact Approach A-!

Ex<-, :-.:or,

This approach is identical to Approach A-9 exceptmodified to have contact tab and header pin on thesame center line.

Resul"s (Ref: FIG. 19 P.46)

At tb i ,riting the contact is being fabricated. Theresults should prove to be as favorable as thoseof Approach A-9.

4-3 Task B- A feasibility Study Leading to the Design of aPrinted Circuit Connecto for an Encapsulated Microassembly

The basic design problem is (1) terminate the 0.002" X0.010" conductor ribbons extending from the encapsulatedmicroassembly into a male connector, and (2) design areceptacle which mates with the male connector and iscompatible with mou.::'ing on a printed wiring board. Thefollowing design approaches woro studied analytically thisperiod.

4.3.1 Design App-'onnhen

Dosign App2ro:. ,h B-'- (Ref: FIG. 20 Po47)

The attached drawing sh~us the basic layout of what theoverall connectco- Z:_sh, look like, the cross-sectionsrepresenting what will be fabricated on an experimentalbasis toward providing electrical contact. The intent hereis to provide from the rodule, a series of contact ribbons,which, in themselves, would be permanently attached to aninsulator base having an adequate lead-in so that entryto the connector receptacle would be easily permitted.

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The female contact would be secured to its insulator andformed in such a way as to be required to flex uponengagement with the contact which is part of the malemodule package. In spite of the fact that this wouldrepresent probably the most conventional approach towardthe solution of this problem, it is considered that thiswould be a very desirable starting point.

Design Approach B-2 (Ref: FIG. 21 P.48)

This approach, which is essentially very similar to B-1,has one basic difference in the fact that the receptaclecontact is not required in itself to have the strength andaccurate positioning required to make contact. To providethis feature, a suitable non-conductive external elasticmember will be properly pbsitioned in such a way as to causethe contact per so to be in an interference position withthe male contact, so that upon mating the elastic membercould be compressed and thereby be the vehicle for providingthe pressure for electrical contact between the male andfemale members.

Design Approach B-3 (Ref: FIG. 22 P.49)

Approach B-3 provides another geometric view of the util-ization of an independent external elastic contact pressuringmember having the ability for greater flexure and quitepossibly less contact insertion force than Approach B-2.

One additional feature of this approach is in the provisionfor greater engagement depth by the module into the recep-tacle and with it the inherent advantage of stability.

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5.0 -CONCLUSIONS

Task A

Tests have indicated that it is possible to provide acontact to accept a microassembly pin within the require-ments of SCL-7673. Six of the approaches considered appearto have the capabilities of performing within the require-ments and will be explored further. These are: A-2, A-3,A-5, A-7, A-9 and A-11.

Task B

The microassembly connector approaches B-i, B-2 and B-3appear feasible. However, it is concluded from thesestudies that an approach wherein the male connector

replaces the hermetic header in the microassembly stack isa more practical approach. Modification of the B-1, B-2and B-3 as woll as new design approaches will be pursuedbased on a header design compatible with electron beamwelding in the microassembly stack (Ref. Final ReportContract #DA-36-039-SC-89176).

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6.0 PROGRAM FOR NEXT INTERVAL:

Task A

Contact Approaches A-2, A-3, A-5, A-7, A-9 and A-11 willbe further tested and evaluated. By the end of June alltested and supporting data will be reviewed and at thistime we will finalize on three (3) contact approaches.During the month of July we will fabricate from temporarytooling, the three contact approaches selected. By theend of July all testing shall be completed on threeapproaches. From these tests one of the three shall beselected as the contact design, to fullfill the require-ments covered in this contract, under Task A.

In conjunction with selecting a final contact approach,we will have established the following:

1. Header pin length and end configuration.

2. Plating specification for contacts

By this time samples will be available for visualobservation.

Task B

The three approaches defined in section 4.3 as B-1, B-2, B-3and other approaches will be considered and evaluated.Preliminary fabrication and tests will be performed toevaluate the feasibility of approaches considerdd.

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7.0 IDENTIFICATION OF KEY PERSONNEL.,-

During this quarter the following personnel took part in the workcovered by this report.

NAME TITIIE MAN HOURS

R. Witte Project DirectorB. Johanson Technical AdministratorA. Van Keulen Services CoordinatorR. Scott Modjeska Physical Sciences Consultant *S,. Majewski Senior Engineer 176H. Dwan Mechanical Engineer 160Model Makers 166Laboratory Technicians 8

* R. Witte, Bo Johanson, A. Van Keulen, R. Scott Modjeskado not charge directly to this project.

Key Personnel - Brief Statcm nt of Technical Background.-

R. Witte - Project Director.-

Mr. Witte joined Cinch Manufacturing as Vice President ofResearch and Developrmnt in 1961. During his career he hasheld executive engineering positions in several companiessince joining Ditto, Inc. in 1940. Among his more recentaffiliations have been Link Belt Co., Motorola, Halicraftersand Magnecord. Before joining Cinch he served as Manager ofEngineering for the Heydon Division of General Time Corpor-ation. He holds a B.S.M.E. degree from Illinois Instituteof Technology and is a member of the Institute of RadioEngineers, American Management Association and the AmericanSociety of Military Engineers. He is a registered profess-ional engineer in the state of Illinois.

B. Johanson - Technical Administrator.-

Mr. Johanson joined Cinch Manufacturing Company in 1938. Inhis 2' years with Cinch he has worked directly as a designerof Electrical Sockets and Connectors and >.olds basic patentson many innovations on this type product. In the past tenyears he has functioned as Chief Design Engineer of theResearch and Development Department.

PAGE 14

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A. Van Keulen - Services Coordinator.-

Mr. Van Keulen received his B.S. degree from AmericanTelevision Institute of Technology in 1949.

He has had 14 years experience in the Electronics Industryhaving spent the past 11 years in the R & D Department ofCinch Manufacturing Company. During this time he hasserved as Laboratory Supervisor and in the early part of1961 was appointed Engineering Services Manager.

Mr. Van Keulen is active in EIA, having served as Secretaryof the 08C Committee for 10 years, and is a member of theP-5.1 and P-5.2 Working Groups on Connectors and Socketsrespectively.

He is a member of IRE and a United States Delegate in IEC.

He also presently serves as Chairman of EIA Task GroupHR-21097 which is engaged in the formulation of establishedreliability methods in Military Specifications in accordancewith the PSMR-1 recommendations to the Department of Defense.(Darnell Report).

R. Scott Modjeska - Physical Sciences Consultant.-

Prior to joining Cinch, Mr. Modjeska was Technical Directorof Scientific Control Laboratories. Ho is recognized as apioneer in the field of printed circuits. He consulted forboth General Electric Company and Motorola Inc. in theproduction of printed circuits. His resoarch activitieshave included vacuum metallurgy, electrodeposition, metal-lizing non conductors, extractive metallurgy, corrosiopi,physical metallurgy, studies of physical properties of thinmetallic film, semiconductor and rectifier materials.

His educational background is as follows:

Undergraduate: Chemical Engineering, Illinois Instituteof Toechnblogy,Graduate: Chemistry, DePaul University; Chemistry,University of Chicago. He has taught applied Electro-Chemistry at Illinois Institute of Technology and variouschemistry courses at DePaul University.

PAGE 15

Page 24: UNCLASSIFIED A D ,410398 · 2018-11-08 · 2.1 Task A-20 Contact :1icroassembly Receptacle 2 2.2 Task B-Encapsulated Microassembly Connector 2 3.0 PUBLICA.IONS, LECTURES, REPORTS

T S. Majewski - Senior Engineer.-

Mr. Majewski is a graduate of Illinois Institute ofTechnology.His previous experience is as follows:Mechanical Engineer - Belmont Radio Corporation

- 4 years.Assistant Chief Engineer - Daval Products Corporation

- 5 years.Plant Superintendent - Candace, Inc.

- 5 years.Design Engineer - American Phenolic Corporation

- 2 1/2 years.Mr. Majewski has been with Cinch Manufacturing Company as aDesign Engineer for a period of 5 years.Mr. Majewski's contributions while with Amphenol and Cinchhave been entirely in the field of electrical connectordesign.

H. Dwan - Mechanical Engineer.-

Mr. Dwan is a graduate of the Aeronautical University andholds a degree in Aeronautical Engineering.Previous to this he attended DePaul University for one year.His previous experience is as follows:Andrew Corporation - Junior Design Engineer - 2 years.While with Andrew Corporation, Mr. Dwan participated in thedesign of Parabolic Dishes, Cable Connectors and Commun-ications Antennas.

Mr. Dwan has been with Cinch Manufacturing Company 2 1/2years. His function at Cinch is Design Engineer ofElectrical Connectors.

PAGE 16

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II- i

w =d

00

0 0 Z

,S ., .

o) 0 tlK

1.1 ___I !©

x 0

i ooo z

x z:Z'' Iz'" 0 0 .K

------- -- -, 2 .+ :z U 0

SI ,, , o

u z2

r .,

i " wj j0 U - 0

O0I k. 2'

I,,'!" i.r , u,o r.

-- 10 -ax : I.

V U

|-u

Page 26: UNCLASSIFIED A D ,410398 · 2018-11-08 · 2.1 Task A-20 Contact :1icroassembly Receptacle 2 2.2 Task B-Encapsulated Microassembly Connector 2 3.0 PUBLICA.IONS, LECTURES, REPORTS

TASK A

TABLE 1

SUBJECT: TEST ON CONTACT APPROACH A-2 (PRELIMINARY)

TEST CONDUCTED BY: S. MAJETSKI

TEST SUBMITTED BY: S. MAJEWSKI

DATE OF TEST: APRIL 16, 1963

CONTACT MATERIAL: PHOSPHOR BRONZE GRADE A HARD

METHOD OF TEST: DROP WEIGHTS: GRADUATED OUNCE WEIGHTS.(GRADUATED IN HALF OUNCES)

NOTE: ALL FIGURES QUOTED ARE IN OUNCES.

RESULTS :

STEP 1 STEP 2

.016 DIA. PIN .018 DIA. PIN

INSERTION - RETENTION INSERTION - RETENTION

3.5 2.5 4.0 2.03.5 2.0 4.0 2.03.5 1.0 3.5 2.03.0 1.0 3.0 2.03.0 1.0 3.0 2.0

STEP 3 STEP 4

.020 DIA. PIN .016 DIA. PIN

INSERTION - RETENTION INSERTION - RETENTION

10.5 4.010.5 4.0 CONTACT FAILED7.0 3.07.0 2.75

PAGE 18

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z,1 i

w 0

N : 2

LL 0

0 I

o hi -J ! Z

o .1 )

z 8 000

0 0

Q90 4

I- Ii4* u -

Nr z

0 2 00.JZ0 L -7Eco o. 4b.I40

N~ N 5~

> ZZ

4' E

14

Page 28: UNCLASSIFIED A D ,410398 · 2018-11-08 · 2.1 Task A-20 Contact :1icroassembly Receptacle 2 2.2 Task B-Encapsulated Microassembly Connector 2 3.0 PUBLICA.IONS, LECTURES, REPORTS

TASK A

TABLE 2

SUBJECT: TEST ON CONTACT APPROACH A-2-1 (PRELfIINARY)

TEST CONDUCTED BY, CINCH TEST LABj

TEST SUBMITTED BY: S. MAJEWSKI

DATE OF TEST: APRIL 30, 1963

CONTACT i-ATERIAL: BERYLLIUM COPPER ALLOY 25 - HALF HARD

METHOD OF TEST: DROP WEIGHTS: GRADUATED OUNCE WEIGHTS.(GRADUATED IN HALF OUNCES)

NOTE: ALL FIGURES QUOTED ARE IN OUNCES

STEP 1

(AFTER FIVE SIZINGS WITH .016 DIA. PIN.)

INSERTION WITHDRAWAL RETENTION WITH .016 DIA. PIN

6.0 2.0 2.0

STEP 2

(AFTER FIVE SIZINGS ,1TH .018 DIA. PIN)

INSERTION WITHDRAWAL RETENTION WITH .016 DIA. PIN

9.0 3.0 1.25

STEP 3

(AFTER FIVE SIZINGS WITH .020 DIA. PIN)

INSERTION WITHDRAWAL RETENTION WITH .016 DIA. PIN

13.0 4.0 0.5

PAGE 20

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P11~

no ) L

0*M -

- w

L z

x U:

z0 z x=0 wZ

7 - Wu - z

re u1az z

z -- U' 0

0l o

L~ ID

ID II b

Le-

Page 30: UNCLASSIFIED A D ,410398 · 2018-11-08 · 2.1 Task A-20 Contact :1icroassembly Receptacle 2 2.2 Task B-Encapsulated Microassembly Connector 2 3.0 PUBLICA.IONS, LECTURES, REPORTS

TASK A

TABLE 3

SUBJECT: TEST ON CONTACT APPR OACH A-2-2 (PRELIMINARY)

TEST CONDUCTED BY: CINCH TEST LAB.

TEST SUBMITTED BY: S. MAJEwSKI

DATE OF TEST: APRIL 30, 1963

CONTACT MATERIAL: BERYLLIUM COPPER ALLOY 25 - HALF HARD - HEAT TREATED700OF for 30 min.

METhOD OF TEST: DROP WEIGHTS: GRADUATED OUNCES WEIGHTS(GRADUATED IN HALF OUNCES)

NOTE: ALL FIGURES QUOTED ARE IN OUNCES

STEP 1

(AFTER FIVE SIZINGS WITH .016 DIA. PIN)

INSERTION WITHDRAWAL RETENTION WITH .016 DIA. PIN

18.o 5.0 3.5

STEP 2

(AFTER FIVE SIZINGS WITH .018 DIA. PIN)

INSERTION WITHDRAWAL RETENTION WITH .016 DIA. PIN.

18.o 6.o 2.5

STEP 3

(AFTER FIVE SIZINGS UITH .020 DIA. PIN)

INSERTION WITHDRAWAL RETENTION WITH .016 DIA. PIN

20.0 6.0 1.75

PAGE 22

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C.K

ml '4 6

w-

k. o

*3

u z

in ~a L

a0 ~u

;L z

0~ z '

- 0 ~

0- z 4 ~ I

0.-A

% Id

Page 32: UNCLASSIFIED A D ,410398 · 2018-11-08 · 2.1 Task A-20 Contact :1icroassembly Receptacle 2 2.2 Task B-Encapsulated Microassembly Connector 2 3.0 PUBLICA.IONS, LECTURES, REPORTS

TASK A

j TABLE 4

SUBJECT: TEST ON CONTACT APPROACH A-3 (PRELIMINARY)

TEST CONDUCTED BY: S. H AJEWSKI

TEST SUPBMITTED BY: S. MAJE0SKI

DATE OF TEST: MARCH 1, 1963

CONTACT MATERIAL: PHOSPHOR BRONZE - SPRING TEMIPER

METHOD OF TEST: HUNTER SCALE

NOTE: ALL FIJURES (UOTED ARE IN OUNCES.RESULTS :

STEP 1 STEP 2

.020 DIA. PIN .016 DIA. PIN

INSERTION - RETENTION INSERTION - RETENTION

7.0 3.5 0 05.5 3.05.0 3.05.5 4.05.0 3.5

I

STEP 3 STEP 4j

,017 DIA. PIN .018 DIA. PIN

INSERTION - RETENTION INSERTION - RETENTION

0 0 1.5 1.01.0 1.01.0 0.751.5 1.01.5 1.25

PAGE 24

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z r

am.

o a(\.J U0~0

zJ 0)

0 U

u 0

~u - i

0

u z

o CcZ

'-+ 00

u U

O z ozI

.. 2a) ZLS" 0

0 ,6

u Uz*51oA uz 0

0 LM0

a- c 0 -0

.20 z

FIGURES FACaE e50 Ii-

Page 34: UNCLASSIFIED A D ,410398 · 2018-11-08 · 2.1 Task A-20 Contact :1icroassembly Receptacle 2 2.2 Task B-Encapsulated Microassembly Connector 2 3.0 PUBLICA.IONS, LECTURES, REPORTS

It I

IL-

0 j

_ _o o.

0u

0 M

.02 -J

i o 0 o Z0I j J4 0

0~0

UZO P Er

L_ 0

C

N _ _ _ _ _ _ _ _ _ _

31 0.

z ElL miFIGURE (a- PGE 2

Page 35: UNCLASSIFIED A D ,410398 · 2018-11-08 · 2.1 Task A-20 Contact :1icroassembly Receptacle 2 2.2 Task B-Encapsulated Microassembly Connector 2 3.0 PUBLICA.IONS, LECTURES, REPORTS

TASK A

TABLE 5

SUBJECT: TEST ON CONTACT APPROACH A-5 (PRET1iiNARY)

TEST CONDUCTED BY: H. DWAN

TEST SUBMITTED BY: H. DWAN

DATE OF TEST: APRIL 17, 1963

METHOD OF TEST: GRADUAT-D OUIJCR WEIGHTS. (GRADUATED IN HALF OUNCES)USED TO DETERMINE INSERTION AND WITHDRAWAL.

NOTE: ALL FIGURES QUOTED ARE IN OUNCES.

CONTACT MATEPIAL: BERYLLIUP! COPPER ALLOY 25 - HALF HARD.

RESULTS:

STEP 1 STEP 2

•o16 DIA. P;N .o18 DIA. PIN

INSERTION - RETENTION iNSE±TIOi -R1'TIOi

il. 4.5 18.5 5.510.5 3.5 16.5 6.o.5 4.0 1.4.5 610.5 4.5 1, 6

9.5 4.0 14.5 5.5

STEP 3 STEP ,

.020 DIA. PIN .016 DIAS PIN

INSERTION - RETENTION INSERTION - RET2E'TION

24 1222.5 1018.5 11.5 (CONTACT FAILED)12.5 7.512.5 7.5

PAGE 27

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*z n-- 7r L

00t44

00

z

'S i o x

~~.'::ryz x 0

-~~ w

-u

I u z

I 0X, 91 I b U

0.

< zz 0 0

4cI"

Page 37: UNCLASSIFIED A D ,410398 · 2018-11-08 · 2.1 Task A-20 Contact :1icroassembly Receptacle 2 2.2 Task B-Encapsulated Microassembly Connector 2 3.0 PUBLICA.IONS, LECTURES, REPORTS

TASK A

TABLE 6

SUBJECT: T-.T 0. CO1T C2 APPR0.Cfi A-5-1 (PRELIiINARY)

TEST COLDUCTLD BY: H. DWAN

TEST SUBMITTED BY: H. DWAN

DATE OF TEST: APRIL 24 , 1963

METHOD OF TEST: GRADUATED OUNCE WEIGHTS. (GRADUATED IN HALF OUNCES)USED TO DETE': E 72 ITSERTION .: D ITHDIRAXT L.

NOTE: ALL FIGURES QUOTED ARE IN OUNCES.

CONTACT MATERIAL: BERYLLIUM COPPER ALLOY 25 - HALF HARD.

RESULTS:

STEP 1 STEP 2

.016 DIA. PIN .018 IA. PIN

INSERTION - RETENTION INSERTION - RETENTION

14 6 20 612.5 6.5 16 712.5 6.5 16 712.5 6 16 712.5 6 16 7

STEP3 STEPt

.020 DIA. PIN .016 DIA, PIN

INSERTION - RETEFTION INSERTION - RETENTION

22 1020 1322 12 (CONTACT FAILED)22 1221 12

PAGE 29

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/~~a I ~

ZI w

8l -8

~o1 2

-Z

F I G.B 4L-A E3

Page 39: UNCLASSIFIED A D ,410398 · 2018-11-08 · 2.1 Task A-20 Contact :1icroassembly Receptacle 2 2.2 Task B-Encapsulated Microassembly Connector 2 3.0 PUBLICA.IONS, LECTURES, REPORTS

TASK A

TABLE 7

SUBJECT: TEST ON CO}TACT APPROACH A-5-2 (PRELIINARY)

TE T CONDUCTED BY: H. DUAN

TEST SU13 ITTED BY: H. DWAN

DATE OF TEST: APRIL 24, 1963

METHOD O TEST: GRADUATED OUNCE 11EIGHTS. (GRADUATED IN HALFOUNCES). USED TO DETERMINE IISERTION ANDWITHDRAWAL.

NOTE: ALL FIGUOIES QUOTED ARE IN OUNCES.

CONTACT EATERIAL: BERYLLIUM COPPER ALLOY 25 - HALF HARD - HEATTREATED 700OF FOR 30 MINUTES.

RESULTS:

STEP 1 STEP 2

.016 DIA. PIN .018 DIA. PIN

INSERTION - RETENTION INSERTION - RETENTION

3 1 5 42.5 1 5 42.5 1 4 43 1.52.5 1

STEP 3 STEP 4

.020 DIA. PIN .016 DIA. PIN

INSERTION - RETNTION INSERTION - RETENTION

6 45 2 (CONTACT FAILED)5 2

NOTE: As noted above in Step Two (2) only three (3) insertion andwithdrawal attempts were made. As the third (3rd) insertionand a close examination of the contact was made, it was notedthat the contact was starting to take a set. With this condi-tion eminent Step Three (3) was started. As evidenced in theabovo figuros ana by examination of the contact after three (3)insertion and withdrawals with the .020 Dia. Pin, a permanentset resulted.

PAGE 31

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ANN

is

-Ihl,

I .d

Page 41: UNCLASSIFIED A D ,410398 · 2018-11-08 · 2.1 Task A-20 Contact :1icroassembly Receptacle 2 2.2 Task B-Encapsulated Microassembly Connector 2 3.0 PUBLICA.IONS, LECTURES, REPORTS

TASK A

TABLE 8

SUBJECT: TEST ON CONTACT APPROACH A-5-3 (PRELIMINARY)

TEST CONDUCTED BY: CINCH TEST LAB.

TEST SUBMITTED BY: H. DWAN

DATE OF TEST: MAY 5, 1963

CONTACT MATERIAL: BERYLLIUM CO PER ALLOY 25 - HALF HARD - HEATTREATED 700°F FOR 30 iiINUTES.

METHOD OF TEST: HUNTER oCALE & STANDARD OUNCE W EIGHTS.

NOTE: ALL FIGURES QUOTED ARE IN OUNCE6.

STEP 1

(AFTER FIVE SIZINGS WITH .016 DIA. PIN)(BY WEIGHTS)

INSERTION WITHDRAWAL RETENTION WITH .016 DIA. PIN

5.0 2.0 1.5

STEP 2

(AFTER FIVE SIZINGS 1, TH .018 DIA. PIN)(BY WEIGHTS)

INSERTION WITHDRAWAL RETENTION WITH .016 DIA. PIN.

9.0 2.5 1.25

STEP 3

(AFTER FIVE SIZINGS WITH .020 DIA. PIN)(BY WEIGhTS)

INSERTION WIITHDRAIIAL RETENTION WITH .016 DIA. PIN

12.0 5.0 1.25

PAGE 33

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0 x

iFF

00

Z X U

+ I 'uUMU

14, j 1 0

40L

t 0z

Ua, M

E E

a L i,, ,1 l t

zz

- -VUU

F R /.-

< : u : -- . u

Page 43: UNCLASSIFIED A D ,410398 · 2018-11-08 · 2.1 Task A-20 Contact :1icroassembly Receptacle 2 2.2 Task B-Encapsulated Microassembly Connector 2 3.0 PUBLICA.IONS, LECTURES, REPORTS

z

W ul *~ -oI

(\J.Iw

a' -

C)* &y9,

at

----------

r4 i z(1x11Iiiz. 0

0

it a-~~1~~ I

Lu

;' -

z .140 u

(5 I

0 cs 0 -

0

VV 2-

* FGUE i- AGEto Z

46 -, r

Page 44: UNCLASSIFIED A D ,410398 · 2018-11-08 · 2.1 Task A-20 Contact :1icroassembly Receptacle 2 2.2 Task B-Encapsulated Microassembly Connector 2 3.0 PUBLICA.IONS, LECTURES, REPORTS

TASK A

TABLE 9

SUBJECT: TEST ON CONTACT APPROACH A-7 (PRELIMINARY)

TEST CONDUCTED BY: CINCH TEST LAB.

TEST SUBMITTED BY: S. MAJEJSKI

DATE OF TEST: APRIL 19, 1963

CONTACT MiATERIAL: PHOSPHOR BRONZE GRAD A HARD

METHOD OF TEST: DROP WEIGHTS: GRADUATED OUNCE WEIGHTS(GRADUATED IN HALF OUNCLS & GRADUATED IN GRAMS)

NOTE: ALL FIGURES QUOTED IN OUNCES, UWLES3 OTHERWISESTIPULATED.

RESULTS:• TEP 1

.016 DIA. PIN

INSERTION WITHDRAWAL RETENTION Wi TH .016 DIA. PIN

11.0 2.2511.0 2.25

7.0 2.256.0 2.256.0 2.0 20 GRAMS

STEP 2

.018 DIA. PIN

INSERTION WITHDRAWAL RETETTION WITH .016 DIA. PIN

26.0 10.026.0 9.024.0 8.020.0 6.022.0 7.0 5 GRAMS

STEP 3

.020 DIA. PIN

INSERTION WITHDRAWAL RETEiTION WITH .016 DIA. PIN

2 .0 6.01 .0 6.016.0 6.0 CONTACT FAILED

15.0 5.015.•0 5.0 PAGE 36

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00

SCD

ILL. :c

K L0 u 4

IfW - Za:

I- 4

-Z ~ *U"ia

a

0 It 0 aW UI

z F20- Jo IL

0 Z

z z*0 - -

Z4 w 4

UK C10

9.0.

a C,

0

2U U C

Page 46: UNCLASSIFIED A D ,410398 · 2018-11-08 · 2.1 Task A-20 Contact :1icroassembly Receptacle 2 2.2 Task B-Encapsulated Microassembly Connector 2 3.0 PUBLICA.IONS, LECTURES, REPORTS

( J g

w 00

o 2

.i 0 0zz

mci,~ ~o 0

z wm .0

; z z o

0 x54 0z a

2 A

rZ

a c,

FI U E AEa

44

Page 47: UNCLASSIFIED A D ,410398 · 2018-11-08 · 2.1 Task A-20 Contact :1icroassembly Receptacle 2 2.2 Task B-Encapsulated Microassembly Connector 2 3.0 PUBLICA.IONS, LECTURES, REPORTS

TASK ATAM =1

SUBJECT: TEST ON CONTACT APPROACH A-9

TEST CONDUCTED BY: H. DWAN

TEST SUBMITTED BY: H. DWAN

DATE OF TEST: APRIL 2, 1963

METHOD OF TEST: GRADUATED OUNCE WEIGHTS. (GRADUATED IN HALF OUNCES)USED TO DETERiIINE INSERTION AND WITHDRAWAL.

NOTE: LLL FIGURES QUOTED ARE IN OU.CES.

CONTACT MATERIAL: BERYLLIUM COPPER ALLOY 25 - HALF HARD

RESULTS:

STEP 1 STEP 2

.016 DIA. PIN .018 DIA. PIN

INSERTION - RETENTION INSERTION - RETENTION

3. 2 3 1.53 2 3.5 23.5 2 3 1.53.5 2 3.5 1.53.5 2 3.5 1.5

STEP 3 STEP 4

.020 DIA. PIN .016 DIA. PIN

INSERTION - RETENTION INSERTION - RETENTION

5 2.5 2.5 24.5 2.5 3 1.55 2.5 2.5 1.55 2 2.5 25 3 3 2

PAGE 39

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a ,iU P(a

0

u o.0

z C

z 0u Cz ,o

k.,

>

CL U za

Page 49: UNCLASSIFIED A D ,410398 · 2018-11-08 · 2.1 Task A-20 Contact :1icroassembly Receptacle 2 2.2 Task B-Encapsulated Microassembly Connector 2 3.0 PUBLICA.IONS, LECTURES, REPORTS

40K

o k,

1 (19

wcm z4' +i -

.t - . a 0

'o 0& 44' 0~

Uz o O -o

o

z o~

4 0~ 0rar, i '. +1 1, <

z .J O.Z -2

4 0

LL.

4 ot

4 t Ut

v zoz :E 0

- FIGRE Z PAGE 41 s

Page 50: UNCLASSIFIED A D ,410398 · 2018-11-08 · 2.1 Task A-20 Contact :1icroassembly Receptacle 2 2.2 Task B-Encapsulated Microassembly Connector 2 3.0 PUBLICA.IONS, LECTURES, REPORTS

TASK A

TABLE 11

SUBJECT: TEST ON CONTACT APPROACH A-9-1 (IMODIFIED AS NOTED

BELOW).

TEST CONDUCTED BY: H. DWAN

TEST SUBMITTED BY: H. DWAN

DATE OF TE6T: APRIL 2, 1963

METHOD OF TEST: GRADUATED OUNCE WEIGHTS, (GRADUATED IN HALF OUNCES)USED TO DETERMINE INSERTION AND WITHDRAW,'kL.

NOTE: ALL FIGURES UOTED ARE IN OUNCES.

CONi2ACT MATERIAL: BERYLLIUM COPPER ALLOY 25 - HALF HARD.

RESULTS:STEP 1 STEP 2

.016 DIA. PIN .018 DIA. PIN

INSERTION - RETENTION INSERTION - RETER1,TIOU

5 3.5 6 35 3.5 7 36 3.5 6 2.55.5 3.5 5 35 3 6 3

STEP 3 STEP 4

.020 DIA. PIN ..016 DIA. PIN

INSERTION - RETENTION INSERTION - RETL.WJIOIT

8.5 6 4.5 39 6 4 3.59 5.5 4.5 38 5.5 4 39 5.5 4 2.5

NOTE: This contact is similar to A-9 except that it is not cutpart way down at the fold.

PAGE 42

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z <0

0

-uU

0' z* 0

w 0<

0 F-'I wI -L

0 :0 0 itfllf z u u

'0 z >o o

o4 4 x 4 0 0

cc0

00

ol 00 '

F/GUE I PG E4 L i T

Page 52: UNCLASSIFIED A D ,410398 · 2018-11-08 · 2.1 Task A-20 Contact :1icroassembly Receptacle 2 2.2 Task B-Encapsulated Microassembly Connector 2 3.0 PUBLICA.IONS, LECTURES, REPORTS

F-7

LL:D

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DISTRIBUTION LIST

Copies

OASD (R&E)ATTN: Technical LibraryRoom 3E1065The PentagonWashington 25, D.C.

Chief of Research and DevelopmentOCS, Department of the ArmyWashington 25, D.C.

Commanding GeneralU.S. Array Materiel CommandATTN: R & D DirectorateWashington 25, D.C.

Commanding GeneralU.S. Army Electronics CommandATTN: AhiSZ -ADFort Mlonmouth, New Jersey

Director, U.S. Naval Research LaboratoryATTN: Code 2027Washington 25, D.C.

Commander, Aeronautical Systems DivisionATTU : ASAPRLWright-Patterson Air Force Base, Ohio 1

Hq, Electronic Systems DivisionATTN: ESALL.G. Hanscom FieldBedford, iassachusetts

Commander, Air Force Cambridge Research LaboratoriesATTN: CR0L.G. Hanscom FieldBedford, Massachusetts

Commander, Air Force Command & Control Development DivisionATTN: CRZCL. G. Hanscom FieldBedford, Mlassachusetts

Commander, Rome Air Development CenterATTN: RAALDGriffiss Air Force Base, New York

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|Copies

Connandor, Armod Services Tochnical Information AgoncyThe Dofcnso Docurlontation Center HeadquartersCavioron StationAloxandria, Virginia 10

j Chief, U.S. Army Security AgencyArlington Hall StationArlington 12, Virginia 2

Deputy PresidentU.S. Army Security Agency BoardArlington Hall StationArlington 12, Virginia 1

Commanding OfficerHarry Diamond LaboratoriesATTN: Library, Room 211, Building 92Washington 25:- D.C. 1

Corps of Engineers Liaison OfficeU.S. Army Electronics Research and Development LaboratoryFort Monmouth, New Jersey 1

AFSC Scientific/Technical Liaison OfficeU.S. Naval Air Development CenterJohnsville, Pennsylvania 1

USAELRDL Liaison OfficeRome Air Development CenterATTN: RAOLGriffiss Air Force Base, New York 1

Commanding OfficerU.S. Army Electronics Materiel Support AgencyATTN: SELN S-ADJFort Tiontzouth, New Jersey

Marine Corps Liaison OfficeU.S. Army Electronics Research and Development LaboratoryATTN: SELRA/LNRFort~o:> New Jersey 1

Commanding OfficerU.S. Army Electronics Research and Development LaboratoryATTN: Director of Researzh or EngineeringFort -Ion-iouth. New Jersey 1

Commanding OfficerU.S. Army Electronics Research and Development LaboratoryATTN: Technical Documents CenterFort Monmouth, New Jersey 1

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Copie

Commanding OfficerU.S. Army Electronics Research and Development LaboratoryATTN: SELRA/ADJ (FU #1)Fort Monmouth, New Jersey 1

Advisory Group on Electron Devices346 BroadwayNew York 13, New York 2

Commanding OfficerU.S. Army Electronics Research and Development LaboratoryATTN: SELRA/TNRFort Monmouth, New Jersey 3

(FOR RETRANSMITTAL TO ACCREDITED BRITISH AND CANADIAN GOViRN1,ENTREPRESE"TATIVES)

Commanding GeneralU.S. Army Combat Development CommandATTN: CDCMR-EFort Belvoir, Virginia 1

Commanding OfficerU.S. Army Combat Developments Command,Communications-Electronics AgencyFort Huachuca,, Arizona

Director, Fort Monmouth OfficeU.S. Army Combat Developments CommandCommunications -Electrouics AgencyBuilding 410Fort Monmouth, New Jersey

AFSC Scientific/Technical Liaison OfficeU.S. Army Electronics Research and Development LaboratoryFort Monmouth, New Jersey

Commanding Officer and DirectorU.S. Navy Electronics LaboratorySan Diego 52, California 1

Commanding OfficerUSAELRDLFort Monmouth, N. J.ATTN: SELRA/PEP (Lano) 33

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