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UMC Automotive Solutions

Teng Tang YangTechnical Manager

Corporate MarketingMay 2015

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Outline

• Market Trends And Requirements• UMC Automotive Solutions• Success and Summary

2

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The Strongest Growing Segment in IC Market

3Source: IC Insights

• Automotive IC market is forecast the strongest average annual revenue growth rate through 2018

10.8%

5.5%

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Megatrends in Automotive Technology

Smarter

Greener

• Driving Aids / Automated Driving• Smart Vehicle Access• Personal Media

• Driving Aids / Automated Driving• Smart Vehicle Access• Personal Media

• Fuel Efficiency• Car Electrification• Fuel Efficiency• Car Electrification

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Necessary Supports from Foundry

5

LiabilityCapacity

ProductivityReliability

QualityLongevity

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Outline

• Market Trends and Responses• UMC Automotive Solutions• Success Stories and Summary

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UMC’s Role & Solutions in Auto Value Chain

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Specification Design Production

High temp. PDK (150C)

SPICE Model

Library

Memory

AEC Q-100 Platform

Grade-1, eFlash (4Q16)

Grade-0, BCD (4Q15)

Porting Service

Automotive Service

Package (ASP)

Turnkey Service

Screening (part of ASP)

Statistical Yield Limit

Statistical Bin Limit

Part Average Test

Dynamic V-Stress

Verification System

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UMC’s Role & Solutions in Auto Value Chain

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Specification Design Production

High temp. PDK (150C)

SPICE Model

Library

Memory

AEC Q-100 Platform

Grade-1, eFlash (4Q16)

Grade-0, BCD (4Q15)

Porting Service

Automotive Service

Package (ASP)

Turnkey Service

Screening (part of ASP)

Statistical Yield Limit

Statistical Bin Limit

Part Average Test

Dynamic V-Stress

Verification System

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High Temperature FDK for Auto IC Designs

9

Note:Tj: junction temp.Ta: ambient temp.

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Opportunities from Automotive Electrification

• Recommended CMOS processes: 55nm eFlash & 0.18um BCD

Electrical Train System Key IC Component

• Battery Management • Power Control• Charging System • Motor Control

• MCU• Battery Charger• Motor Driver• DC-DC Converter

Motor control

Battery Management

Power Control Charger

Charging Spot

Charging Spot

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M

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55nm eFlash1.2V/2.5V

1Q15 2Q15 3Q15 4Q15 1Q16 2Q16 3Q16 4Q16

Automotive SST eFlash Solution

Note:*: 1st lot qualification 11

+ SST Cust. Macro

T/O

SSTQual.*

AEC Q100 Grade-1 Qualification Temperature range: -40oC ~ 125oC (Ta)

I/O Lib.

Standard Cell Lib.

SP SRAM1PRF

DP SRAM2PRF

SiReport

SiReport

SiReport

SiReport

SiReport

SiReport

SiReport

SiReportVia ROM

SiReport

SiReport

IPDS

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0.18um BCD Value Propositions

Cost

Diversity

Integration

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• 5V~100V wide range support• Deep Trench Isolation• Thick Plated Copper ( 21um)

• 1.8V core (110Kgate/mm2)• eFuse/OTP/MTP• 175oC (Tj) Model/IPs

• Modular process• Competitive mask count• State of art RonArea

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0.18um BCD1.8V/5V/HV **

1Q15 2Q15 3Q15 4Q15 1Q16 2Q16 3Q16 4Q16

IP Portfolio for Value-added Integration

Note: *: Preliminary Tape-Out Kit**: HV operation voltage support up to 100V

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I/O Lib.I/O Lib.

SiReport

SiReport

T/OKitT/OKitStandard Cell Lib.Standard Cell Lib.

OTPOTP

eFuseeFuse

MTPMTP

SiReport

SiReport

T/OKitT/OKit

SiReport

SiReport

T/O*Kit

T/O*Kit

SiReport

SiReport

T/O*Kit

T/O*Kit

SiReport

SiReport

T/O*Kit

T/O*Kit

AEC Q100 Grade-0 Qualification Temperature range: -40oC ~ 150oC (Ta)

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UMC’s Role & Solutions in Auto Value Chain

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Specification Design Production

High temp. PDK (150C)

SPICE Model

Library

Memory

AEC Q-100 Platform

Grade-1, eFlash (4Q16)

Grade-0, BCD (4Q15)

Porting Service

Automotive Service

Package (ASP)

Turnkey Service

Screening (part of ASP)

Statistical Yield Limit

Statistical Bin Limit

Part Average Test

Dynamic V-Stress

Verification System

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Proven Porting Flow for IDM Customers

Gap Analysis FMEA Kick-off Meeting

Preparation

Stage - 1

Physical Matching Electrical Matching Cross Fab Verification

Validation

Stage - 2

BKM Process Wafer Level Qual. Product Level Qual.

Qualification

Stage - 3

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Success on Porting and JDP Projects

• Tremendous successes demonstrated on diversified technology nodes for emb-NVM and Power IC/Discrete products

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Automotive Production Goal: Zero Defect

• Prevention: avoid the creation of defective parts• Detection: avoid the outflow of defective parts

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Prevention DetectionZeroDefectPrevention DetectionZeroDefect

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UMC’s Automotive Service Package

Production Control

• Tighten SPC

• Preferred tools

• Defect scanning

• Tighten WAT

• AVI

• Q-Time Control

• Rescreen

• Rework

System Management

• Identification

• Data retention

• PCM

• 8D report

• MRB

• Early Alert

• Audit

Defective Part Screening

• SYL

• SBL

• PAT

• DVS

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Turnkey Service with Backend Ecosystem

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• Experienced geographic OSATs turnkey management for customersJ-Device Amkor STATSChipPAC

ChipBond UTAC Ardentec GT

ASE Amkor SPIL KYEC

SPIL ChipMore KLT UTAC

JCET / jcap NFME ASE Amkor

ASEArdentecPTI

BumpWLP CP Package FT

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Outline

• Market Trends and Responses• UMC Automotive Solutions• Success Stories and Summary

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Successful Automotive Partnership

• Advanced Logic• Application processors in ADAS for US auto manufacturers

• BCD• Adopted by major European automakers

• Grade-0 for chassis control• PMICs for major Japanese/Korean automotive OEMs.

• CIS• Adopted by key Korean and European suppliers

• For ADAS application • With good performance in low light condition

• Others: eFlash, eHV, MEMS,…21

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The growth of product TO coincides the market trend.

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Accelerating Automotive Tape-outs at UMC

~2X

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Summary

• Automotive market experiencing strongest growth compared to others sectors, requiring more foundry industry involvement.

• UMC commits to Automotive excellence with solutions that meet AEC guidelines/specification

• Automotive Service Package offered to reduce process variation and outliers for low DPPM goal

• Electrifying growth of automotive business at UMC• >100% growth on automotive product tape-outs since 2013• Looking forward to helping Japan Market benefit

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Thank You!