UCB Update

Jason McPhate & Sharon JelinskyLAPP Tuesday Telecon

29 March 2011

J. McPhate – LAPP Tuesday Telecon 2

New 33mm, 20µm INCOM Substrates

• Dramatic improvement over previous substrates!• Triple points and voids seem to have been eliminated

(or certainly greatly reduced)• Pore crush zone near multi-fiber boundaries reduced

– appears to affect only one pore either side• No apparent striping within the multis from single

stacking• Photos and more details forthcoming – need to verify

INCOM is okay with content being posted

29 March 2011

J. McPhate – LAPP Tuesday Telecon 3

33mm MCP Transport

• One of two substrates arrived with marring from the transport retainer spring

• Likely caused by non-flatness of laser-cut inner parts (spacers and springs) making it difficult to stack without the possibility of shifting

• Also, laser-cut edges are rough and serrated• We have priced out making these parts via photo-chemical

milling (etching) and found the pricing rather low• Pricing for XX sets (each set is 2 springs, 2 spacers)

– Set of 10: $1650 ($165 /set)– Set of 100: $1966 ($19.66 /set)– Set of 1000: $8750 ($8.75 /set)

29 March 2011

J. McPhate – LAPP Tuesday Telecon 4

High-temp Life Test Setup

• Nearly all the parts for 2 each XDL and phosphor detectors with the capability of full temp bakeout are in house.

• Need flanges and adapter rings (all in fab now) for phosphor.

• All parts for 1 XDL detector in house• Have begun bakeout testing of one of the detector

pots on the life test octopus

29 March 2011

J. McPhate – LAPP Tuesday Telecon 5

High-temp Life Test (cont)

29 March 2011

Empty detector pot with heater bands

on VariacsHigh-temp detector pot,

with thermal blanketLow-temp life test still

running (for now)

J. McPhate – LAPP Tuesday Telecon 6

8” Photocathode Chamber

29 March 2011

• Change from small cathodes to large cathodes continues to progress

• New chamber for 8” cathodes mounted on oven base

• Needs more vacuum plumbing and manipulators

• Chimney and window nest parts are out for fabrication

J. McPhate – LAPP Tuesday Telecon 7

Bits and Pieces

• Received first OFHC copper indium well for 8” tube– Looks good to first order– Some issues with parting, leaves tabs behind– Stamper has resolved this for further parts– Will run remaining material – about 100 parts

• Will be running a smaller batch from Kovar– We believe this will be the most likely material final tube– Better CTE match to ceramic– About 20 parts

29 March 2011

J. McPhate – LAPP Tuesday Telecon 8

Bits and Pieces

29 March 2011

• First-off, 8.66” indium well (OFHC copper)

• 4.5”, .100” thick ceramic anode test blank with SMA feedthrough holes

• 2 sent to Hervé for impedance, cross talk, dissipation, etc. testing.

A cleanly cut corner, minimal burrs

Bad part – big tab