Graeme MaxwellTyndall National Institutegraeme.maxwell@tyndall.ie

Tyndall 2025 – Core equipment upgrade and transition towards Smart ManufacturingENRIS 2019 – Enschede 16th - 18th June 2019

Where Are we?

Tyndall – Infrastructure numbers

• 18,000 m2 of buildings.

• 1,200 m2 of cleanrooms.

• Pumping 250 l/s of fluid.

• Conditioning 120 m³/s of fresh air.

• Exhausting 40 m³/s of air.

• Approximately 11 GW energy pa

• 7.8 M kWhrs for electricity

• 3.2 M kWhrs for gas

Tyndall - Operational numbers

• 500+ researchers & engineers, students, support staff

o Approx 250 staff, the rest are students/ postdocs

• 51 nationalities

• ca. €38M Income each year

o 85% of which is competitively won

o 25% industry funding

• Over 200 industry partnerships and customers worldwide

• 230+ peer reviewed publications pa

• 22 EU H2020 projects

• 20 Industry Researchers-in-Residence

• ISO 9001; ISO 500001; ISO 17025

Tyndall Growth Plan

• Identified as part of the National Development Plan

• Involves ~ €50M capital upgrade and the construction of an addition building

• Designed to facilitate a doubling in size as part of Tyndall 2025 strategic plan

“We will … upgrade and expand the Tyndall National Institute in Cork to stay at the forefront of new technologies and build on its successful industry engagement model in sectors such as health and life sciences, ICT, energy and agri-tech.”

- Government of Ireland, National Develop Plan 2018 - 2027

Elements of the core equipment upgrade plan

1. Building the case – need simple message2. Clarifying existing and identifying emerging research

themes and alignment with national thematic centres –eg CONFIRM – Smart Manufacture

3. Mapping to capability requirements4. Prioritisation5. Procurement6. Review and revise

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Capital status in fab areas

Capital item YOP 2012 2013 2014 2015 2016 2017 2018 2019 2020 2021 2022

Wafer / device pre- and post conditioning

Semitool SRD 1991

6" Semitool <1995

4" Semitool <1995

Rapid thermal Anealler AST SHS 1000 RTP 1991

Bio Rad benchtop furnace <1995

Carbolite Furnace 1991

KARL SUSS SCRIBER 1991

Semitool SAT (Spray Acid Tool) 2004

Jet first rapid Thermal Annealer (Jet first 150) 2010

Laser Dicer 2013

Material deposition

ELECTROTECH DELTA PECVD 1992

Nordiko Sputterer 2550 1991

Furnace A STACK 1991

FURNACE B STACK 1991

FURNACE C STACK 1991

Furnace D STACK 1991

Ion Implanter 1991

Nordiko Sputterer <1995

PECVD, STS 310 PC , Doped and undoped oxides 2001

STS Multiplex CVD 2005

Sputterer - PlasmalabSystem400 - Oxford Instrument 2005

Temscal 2005

Fiji F202DCS System ALD 2009

EVG 501 Bonder 2009

Thermco 6" Furnace 2010

AML Bonder 2010

EVG 301 Cleaner bonder 2012

SCIL Embosser 2012

Temescal installed in 2012 2012

Leybold Optics Syrus Pro Evaporator 2013

Wafer / device patterning

Canon 600 aligner Main Fab 1991

Ultratech 1500 1X Stepper 1991

Mask Plate Cleaner 1991

DNS Resist Develop Tracks 1991

DNS SOG Tracks 1991

SUSS MICROTEK- Mask Aligner MA 1006 III-V <1995

IMP Direct write <1995

DNS Tracks <1995

EVG 420 <1995

JEOL JBX6000 FS/E electron beam lithography tool 2001

Suss MA6 DUV aligner III-V 2010

Material removal

Matrix Asher 1992

PLASMOD ASHER IIIV-E33 <1995

Trikon ICP Etcher Metal Etch 2001

Trikon M0RI Etch Silicon and Oxide 2001

Trikon PERIE Etcher Nitride and Oxide 2001

Multiplex Ion Etcher (ICP) 2005

STS ASE / AOE 2005

CHEMICAL DELAYERING & PLANARIZATION (LOGITECH) 2007

ICP - PlasmalabSystem100 - Oxford Instruments 2009

PLA Asher 2010

Diener Asher 2011

Oxford PlasmaPro ICP Etcher 2013

Material / device metrology & analysis

CV Plotter 1998

Prometrix Omnimap RS35 1991

Profileometer P-15 1991

Nanospec <2000

Nanometrics Thin Film AB63+AB55 III-V <2000Tencor Surfscan 4500 2000

Nanospec 3000 2002

Gaertner Elipsometer in Fab 2008

Nikon Line Measurement Equipment 2008

Dektak Profiler 2009

Woollman Ellipsometer 2010

SEM in Block C Cleanroom 2011Dektak (Mems) 2011

Jeol SEM 6610LV 2012

JEOL SEM 6490LV 2012

Material / device functional test

Cascade semi-automatic prober 2006

Precision oscilloscope 2006

Autogarde cascade prober 2007PNA & Multimeter Head Controller 2007

Picofox automatic spectrometer 2008

Manual prober 2008

Device Forensics - reliability, packaging, DPA, analysis

Reliability Test equipment 1995

Royce Pull Tester 1995

Microsectioning equipment 2000

Decapsulation tool 2001

Logitech PM5 Grinder 2002

Dicing Saw 2004

Scanning acoustic microscope 2015

CT scanning X-ray 2015

Infrastructure

Spectron Gas Cabinets 1991

DI plant - various vintage on parts. <1999

Block A air handling units almost at full capacity - limited ability for new tools2008

Age Service status

Being depreciated - less than 7 years old Full backup available

Out of warranty but servicable - 5 year window Some backup available

Old / Obsolete - over 12 years old No or very limited backup available

Capital status in fab areas

Capital item YOP 2012 2013 2014 2015 2016 2017 2018 2019 2020 2021 2022

Wafer / device pre- and post conditioning

Semitool SRD 1991

6" Semitool <1995

4" Semitool <1995

Rapid thermal Anealler AST SHS 1000 RTP 1991

Bio Rad benchtop furnace <1995

Carbolite Furnace 1991

KARL SUSS SCRIBER 1991

Semitool SAT (Spray Acid Tool) 2004

Jet first rapid Thermal Annealer (Jet first 150) 2010

Laser Dicer 2013

Material deposition

ELECTROTECH DELTA PECVD 1992

Nordiko Sputterer 2550 1991

Furnace A STACK 1991

FURNACE B STACK 1991

FURNACE C STACK 1991

Furnace D STACK 1991

Ion Implanter 1991

Nordiko Sputterer <1995

PECVD, STS 310 PC , Doped and undoped oxides 2001

STS Multiplex CVD 2005

Sputterer - PlasmalabSystem400 - Oxford Instrument 2005

Temscal 2005

Fiji F202DCS System ALD 2009

EVG 501 Bonder 2009

Thermco 6" Furnace 2010

AML Bonder 2010

EVG 301 Cleaner bonder 2012

SCIL Embosser 2012

Temescal installed in 2012 2012

Leybold Optics Syrus Pro Evaporator 2013

Wafer / device patterning

Canon 600 aligner Main Fab 1991

Ultratech 1500 1X Stepper 1991

Mask Plate Cleaner 1991

DNS Resist Develop Tracks 1991

DNS SOG Tracks 1991

SUSS MICROTEK- Mask Aligner MA 1006 III-V <1995

IMP Direct write <1995

DNS Tracks <1995

EVG 420 <1995

JEOL JBX6000 FS/E electron beam lithography tool 2001

Suss MA6 DUV aligner III-V 2010

Age Service status

Being depreciated - less than 7 years old Full backup available

Out of warranty but servicable - 5 year window Some backup available

Old / Obsolete - over 12 years old No or very limited backup available

Equipment audit & obsolescence

Thanks to Kay Gastinger at NTNU for the format

Inputs to capability requirements

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#2 Current & upcomingproject activities -

defines 1-5 yearrequirements

#1 Equipment audit & obsolescence

Immediate – 5 year view

#3 Stakeholder input& roadmapping -

outlines 5-10 year time horizon

Tooling choices1-5 years procurement

horizon1-15 year operational

horizon

Current capability areas

• 3 lines in 2 cleanroomso CMOS – 4” line, cassette to cassette operationo MEMs line – 4” with some 6” tooling. Manual wafer processingo Compound Semiconductor (III-V) line – pieces, 2”, 3” wafers and 6”-

8” Si for heterogeneous integration. Manual processing

• Flexible fabrication protocols but needs strict rules on traffic flow through/from the different lines

o Direction of traffic is CMOS ↔ MEMs → III-V

• Decision to move tooling to 8“ capableo Better tooling available – 4” & 6” tooling becoming legacy product or

nicheo Supports higher TRL agenda o Aligns with commercial partners – ease of downstreaming and direct

wafer exchangeo Does not preclude processing smaller wafers if necessaryo 4” silicon becoming harder to source

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Input #2 Current & upcoming project activities

• Existing programmes (1- 4 year time horizon)o EU & ERCo SFI PI awards and new/existing centreso EI – Enterprise Irelando Commercial

• Currently >250 research contracts with combined value >€150M

• Submitted proposals (2-6 year time horizon)o EU & ERCo SFI PI awards and renewal of existing centres

• 80 proposals submitted and awaiting a funding decision with a value of >€62M

• Provides themes for existing programmes (1-5 years)

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Input #3 Roadmapping activities

• Tyndall engagement:

o White Papers of EARTO, European Association of RTOso EC Reports on Digital Innovation Hubs and Digital Platformso Photonics 21 Roadmap

• ECS SRA, Electronic Components and Systems Strategic Research Agenda • EPoSS SRA, Strategic Research Agenda of European Platform of Smart Systems • AENEAS SRA, Strategic Research Agenda of Association for European

Nanoelectronics Activitieso ESFRI Roadmap, European Science Forum for Research Infrastructureso ETP Nanomedicineo NEREID-European Nanoelectronics Roadmap o AIOTI White Papers, Alliance of Internet Of Things Innovationo ESTHER Medtech initiative Roadmapo EPIC Reports, European Photonics Industry Consortium

• IRDS, International Roadmap for Devices & Systemso PSMA Roadmap, Power Sources Manufacturers Associationo iNEMI Roadmap, International Electronics Manufacturing Initiativeo Roadmap on Si Photonicso Photonics Packaging Standards

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Distillation & consistency check

• Nano-scale integration o Wafer surface pre-and post conditioning criticalo E-beam lithography fundamentalo FIB / SEM / TEM upgrades & tooling

• Heterogeneous functionalities, technologies, processes & deviceso Deposition & etch toolingo ALD & ALE for 2D material processingo Wafer bonding & release processeso In line metrology tooling o Cryogenic measurement capability

• Smart system-in-package technologieso TSVo BEOL technologies – material & device integrationo Plating & wet etch systemso Device and sub-system characterisationo Device Forensics

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2017/2018 Capital items procured

Ebeam - Elionix Awaiting lab refurb – expect Q3 2019

AlN / AlScN cluster tool - Evatec Awaiting block C refurb –expect Q4 2019

Plasma etchers - SPTS & Oxford for III/V Awaiting block C refurb –expect Q4 2019

AFM & Nano-indenter - Bruker Operational – OACF & FW lab

Ferrotec Temescal ebeam evaporator Operational – block C

Linewidth measurement tool - Promicron Operational – block C

Mask aligners – III/V & silicon Operational – blocks A&C

Profilometers – Tencor for III/V, silicon & MEMS Operational – blocks A&C

HF vapour etcher – Memsstar for MEMS, silicon, III/V Awaiting block C refurb –expect Q4 2019

EVG coater – CMOS line Operational – block A

2019/2020 Capital items in process & plannedPECVD tool – III/V Tender spec under review Block C

RTA for III/V Tender spec under review Block C

Resist lines for MEMS & III/V & Ebeam incvapour priming

Tender spec under review Block C & ebeam lab

O2 plasma asher for silicon / MEMS Tender complete. Contract being processed

Silicon fab

200mm clean wafer cleaning systems – SAT, SOT, SRD

Tender being generated Blocks A & C

Dielectric Deposition System – MEMS & silicon

Vendor discussions Block A

Plasma / 3 beam FIB Vendor discussions New lab

Helium free SQUID-VSM with combined DC/vibrating magnetometer

Vendor discussions Replace existing

Peripheral equipment for ebeam lab Tenders being generated Ebeam lab

All cleanroom build costs, HVAC, water, waste, gas installations etc

Tenders being generatedVarious

Environmental TEM - inc EELs &HAADFLaser spike annealCryoprobe station – Quantum - III/V

Specs being discussed New labs required

>2020 capital items identified, but will be reviewed in 2020

€47 million funding36 investigators42 industry partners8 core RPO’s8 national research and technology centres16 international collaborators

Alignment to Smart Manufacturing Agenda – SFI funded thematic centre

Tyndall provides testbed facility for Smart Manufacturing targeted projectsthrough the fabrication facility and associated infrastructure.

Targeted Project Example – Predictive Maintenance Testbed

• Resonates with all manufacturing organisations - significant opportunity for rapid ROI

• Sensorising plant room equipment and electrical distribution panels feeding new and existing equipment with industrial partners AnalogDevices Inc. and Verdigris Technologies

o All sensors have wireless connectivity and data managed in the cloud

• Monitor equipment signatureso Electrical current signature - hardware and AI to disaggregate signals on

distribution boards to deliver virtual meters on downstream machines

o Vibration signature – three axis vibration analysis using modules fixed to motors / pumps

• Project aims to assess benefits of sensors acting in isolation and value of sensor data fusion in terms of accuracy of signatures for predictive maintenance

• Started Q2 2019 – currently rolling out hardware

Motor Current Signature Analysis

• System monitors energy usage (cost), phase balance, harmonic distortion, power factor etc

• AI system learns behaviours of the tools and canalarm on deviations / trends

Vibration sensors

Vibration excursion identifiedand tracked over 2 month period• Sensor ID - mcsvu2hdd on chillerpump PU7001

Summary

• Introduced Tyndall National Institute

• Outlined the approach taken for a major capital refresh and scale up to 8” wafer capability

• Highlighted start of activities in predictive maintenance as part of Smart Manufacturing programme

Tyndall National Institute,Lee Maltings, Dyke Parade, Cork, Ireland.T12 R5CP

t: +353 21 490 4177 e: info@tyndall.ie tyndall.ie