Tungsten alloy plating bath
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A method of treating iron contain- ing substrates so as to simulta- neously clean and prevent the for- mation of flash rust comprising contacting with an aqueous solu- tion consisting essentially of car- bonate salts in amounts of from 0.01 to 10% by weight, bicarbon- ate salts in amounts of from 0.1 to lo%, at least one surfactant, and an alkali metal salt of an interme- diate chain length linear mono- carboxylic fatty acid, wherein the aqueous solution has a pH range of 8 to 11.0. TUNGSTEN ALLOY PLATING BATH U.S. Patent 5,853,556. Dec. 29, 1998 W. J. Wieczerniak, assignor to Enthone-OMI Inc., Warren, Mich. A process for continued electro- plating of tungsten alloys with greater cathode efficiency and producing improved ductile de- posits comprising electroplating from a bath comprising an effec- tive amount of tungsten ions; an effective amount of metal ions se- lected from the group consisting of nickel, iron, cobalt, and mix- tures thereof; an effective amount of a hydroxy carboxylic acid and an effective amount of ammonium ions; and replenishing with tung- sten ions by addition of ionic tung- sten complexed with a hydroxy carboxylic acid prior to addition to the bath. LOW-FRICTION MULTILAYER ELECTRODEPOSIT QUAllTV SUPPlIER AND SERVICER OF INNOVATIVE CHEMICAL PROCESSES FOR: Anodizing Organic & inorganic Anodizing Dyes Chromating iron Phosphating Paint Booth Coatings Zinc Phosphating Ceramicp~~~~~leaners Waste Treatment SOUTHERN INDUSTRIAL CHEMICALS INC. I 1450 MARIETTA Bl.VD. NW ATLANTA GA 10318 / 404-351.9770 / 800-394-9770 I FAX:404.15 l-9887 e mail: [email protected] I Web he: www.avana.net/-anodize Circle 109 on reader information card Circle 101 on reader information card U.S. Patent 5,853,55?. Dec. 29, 1998 T.R. Souza and A.E. Molvar, assignors to Handy & Harman, North Attleboro, Mass. A method for reducing the force necessary for assembling separa- ble electronic components, which comprises providing mating sur- faces of the components with a surface layer electrodeposited over at least a portion of the com- ponents, said surface layer com- prising tin, lead, silver, or an alloy thereof and at least 5% by weight of codeposited polymeric particles having a diameter of 0.1 to 0.45 pm dispersed throughout, wherein the surface layer has a thickness sufficient to provide an initial, relatively lower coefficient of friction to the electrodeposit, 124 Metal Finishing
Transcript of Tungsten alloy plating bath
A method of treating iron contain- ing substrates so as to simulta- neously clean and prevent the for- mation of flash rust comprising contacting with an aqueous solu- tion consisting essentially of car- bonate salts in amounts of from 0.01 to 10% by weight, bicarbon- ate salts in amounts of from 0.1 to lo%, at least one surfactant, and an alkali metal salt of an interme- diate chain length linear mono- carboxylic fatty acid, wherein the aqueous solution has a pH range of 8 to 11.0.
TUNGSTEN ALLOY PLATING BATH
U.S. Patent 5,853,556. Dec. 29, 1998 W. J. Wieczerniak, assignor to Enthone-OMI Inc., Warren, Mich.
A process for continued electro-
plating of tungsten alloys with greater cathode efficiency and producing improved ductile de- posits comprising electroplating from a bath comprising an effec- tive amount of tungsten ions; an effective amount of metal ions se- lected from the group consisting of nickel, iron, cobalt, and mix- tures thereof; an effective amount of a hydroxy carboxylic acid and an effective amount of ammonium ions; and replenishing with tung- sten ions by addition of ionic tung- sten complexed with a hydroxy carboxylic acid prior to addition to the bath.
LOW-FRICTION MULTILAYER
ELECTRODEPOSIT
QUAllTV SUPPlIER AND SERVICER OF INNOVATIVE CHEMICAL PROCESSES FOR:
Anodizing Organic & inorganic Anodizing Dyes
Chromating iron Phosphating
Paint Booth Coatings Zinc Phosphating
Ceramicp~~~~~leaners
Waste Treatment
SOUTHERN INDUSTRIAL CHEMICALS INC. I 1450 MARIETTA Bl.VD. NW ATLANTA GA 10318 / 404-351.9770 / 800-394-9770 I FAX: 404.15 l-9887
e mail: [email protected] I Web he: www.avana.net/-anodize
Circle 109 on reader information card Circle 101 on reader information card
U.S. Patent 5,853,55?. Dec. 29, 1998 T.R. Souza and A.E. Molvar, assignors to Handy & Harman, North Attleboro, Mass.
A method for reducing the force necessary for assembling separa- ble electronic components, which comprises providing mating sur- faces of the components with a surface layer electrodeposited over at least a portion of the com- ponents, said surface layer com- prising tin, lead, silver, or an alloy thereof and at least 5% by weight of codeposited polymeric particles having a diameter of 0.1 to 0.45 pm dispersed throughout, wherein the surface layer has a thickness sufficient to provide an initial, relatively lower coefficient of friction to the electrodeposit,
124 Metal Finishing
