TTM Optical PCB - PhoxTroTOptical PCB Technology for In-Chassis Interconnects – H-V Fabricator’s...
Transcript of TTM Optical PCB - PhoxTroTOptical PCB Technology for In-Chassis Interconnects – H-V Fabricator’s...
Optical PCB Technology for In-Chassis Interconnects – H-V Fabricator’s View
Marika Immonen, Hui Yuan Jan, Long Xiu Zhu,
Shi Xing Hong, Xiao L. Ren, Guoqiu Yan, Laixin Jiang, May Zhou
Advanced Development – Corporate Technology 4th Optical Interconnect in Data Centers
Symposium
ECOC Dusseldorf
September 19, 2016
Session 2: Bringing Technology to Market I
Contents
• TTM Optical PCB technology – Motivation: High speed system and RF PCB Challenges
– On-board Optical Application Scenarios
– TTM Optical PCB Process and Materials
– Waveguide Functional Characteristics
– OE PCB Challenges in Production
• PhoxTrot project – flash of results – Demonstrators: PhoxDem09.01; PhoxDem09.02
– Dual WG layer technology
– Glass OPCB technology
– PhoxDem09.03 in progress
• Summary and Key Takeaways
Proprietary and Confidential 2
TTM PCB Product Spectrum
Proprietary and Confidential 3
Multilayer up to 60+
layers
Embedded passives
Heavy copper up to 10
oz.
Over 50 UL approved
laminates
Thickness up to .450“
Panel Size up to 30"x 54"
Thin core dielectrics
Mixed Dielectric (Hybrid)
Constructions
RF and High
Performance Designs
Buried Resistance and
Capacitance
Constrained Core MLB
HDI Microwave
RIGID PCBS
Military and
Aerospace
Certifications
1 - 68 Layers
High Frequency
(RF) Bandwidth
Designs
Buried Metal
Core
Construction
Surface
Mounted
Heatsinks
SPECIALTY FLEX & RIGID-FLEX
Type 2, 3 and 4
(double sided,
multilayer and
rigid-flex)
30+ layers
Dimensions up to
24" x 48“
Acrylic, epoxy and
adhesive-less
polyimide flex
materials
Over 50 rigid
material options
Thickness up .300"
MIL-SPEC & UL
Qualified
Custom Surface
Finishes Available
Up to 12L "anylayer"
stacked uVia Structure
1.6 / 2.0 mil line /
space
Wide material and
surface finish
selections
14 mil, 6L ultra thin
structure
3/7 mil uVia / Pad size
0.4 mm pitch BGA
with 2 traces fanout
Embedded, distributed
and discrete passive
components
HDI (HIGH DENSITY)
High frequency /
bandwidth
designs
Planar and
screened
resistors
Dimensions up to
24" x 48“
Mixed dielectrics
(hybrids)
Dielectric foam
Conductive paste
Plated cavities
Formed
(conformal) PCBs
Optical machining
RF / MICROWAVE
2,4,6 Layers
(2+2+2
stacked via)
BT material
Wire bonding
(ENEPIG,
Soft gold,
Hard gold)
IC PACKAGES
High Speed PCB Loss Reduction Requirements
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COMPUTING AND COMMUNICATIONS – SYSTEMS PCB’S : Conventional, backplane, power, system rigid-flex/flex
RF PCB’s : antenna, base station power amplifier, microwave
Development for On-board Interconnections: Application Scenarios and Solution Space
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DEFINITIONS
LR = Long reach 1m/ 39”
MR = Medium reach 50cm/ 20”
SR = Short reach 20cm/ 8”
VSR = Very short reach 10-15cm/ 4”-6”
XSR = Extra short reach ≤ 5cm
USR = Ultra short reach ≤ 1cm
Image source: OIF CEI56G
Glass interposer for optical IC
IBM 2013
Polymer WG on carrier
Flexible PWG links C2C
Flexible PWG links C2M
Fiber flex plane backplanes
Sumitomo
Molex
TTM Optical/Electrical Circuit Board Technology
Company Confidential 6
Hybrid PCB w/ optical and copper signal layers
Copper for power distribution and low speed
Optical layers for high speed signals
Embedded WGs, rigid/flex or flex OE PCBs
Multimode
waveguides
High density arrays Splitters, combiners
and NxN couplers
Low radius bendings,
crossings
Fan in/out structures and Connectors
Out-of-plane turns and vertical routings Optical connector
interface
Low-Loss Optical Materials and Process Optical Waveguide Components and Layer Integration
Channel termination
Pluggable optical connectors
Passive optical alignment
Density over fiber connections
Waveguides
Passive components
High density routings
Waveguide and OE PCB Fabrication Flow
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Optical layer steps
Electrical layering steps
Electrical
Electrical
Optical
Substrate or sub-
core
CLAD2
Deposition and
patterning of core
Deposition and
patterning of clad
Lamination with copper layers
and finalization of O/E PCB
CLAD1 CORE
Deposition and
patterning of clad
OPTICAL
CLAD2 CLAD1 CORE
ELECTRICAL OPTICAL ELECTRICAL
TTM MM optical layer fab process utilize existing infrastructure: No need of specialized equipment
TTM Polymer Waveguides on PCB
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OPCB fabrication in 16”x20” production panel : Panel scale fabrication capability
After clad1 layering (coating, soft bake, flood exposure, PEB)
After waveguide core patterning (coating, softbake, imaging, PEB,
development)
Product Example: 20L + 1 Opt Embedded
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RoC:
0.5…50m
m L1…. mm
L2…. mm
90Bend
18x
• Product with optical layers
• 20 electrical layers with 1 optical layer
• Dimension (WxH): 277 x 312 mm (10”x12”)
• Material: EMC EM-285 HF
• Thickness: 2.8mm (+/- 0.300)mm
• QUALIFICATION
• Process qualifications: drilling (via optical layer, high dense via
arrays), plating, peel strong in customer existing product
• Reflow 4x 260̊ C; Thermal shock: solder float
• Optical layer
• Optical layers b/w L10/11
• Core: 50µm, 250µm pitch
• Optical patterns: straight,
diagonal, 90 bends
MM-PWG Functional Chacteristics (λ= 850nm) INSERTION LOSS
IL: < 0.05 dB/cm at 850nm (MMF)
TL: 0.03-0.05 dB/cm at 850nm (MMF)
TL: 0.4 dB/cm at 1310nm (MMF)
CROSSING LOSS
< 0.057 dB/X (MMF) 90
< 0.046 dB/X (SMF) 90
< 0.17 dB/X (MMF) 45
< 0.17 dB/X (SMF) 45
Light
BEND LOSS
RoC 5mm < 1.9 dB (MMF) < 1.2dB (SMF)
RoC 10mm < 1 dB (MMF) < 1.2 dB (SMF)
CROSSTALK
Waveguide length =20cm (8”)
L/S 50/200µm
Spacing 200µm (8mil) aggressor
Crosstalk isolation: -32 dB
Results – Reliability Tests: Solder Reflow (Tpeak=260°C,
5x), Temp/Humidity (85%RH/85°C), T/C (-40°C/+125°C)
SOLDER REFLOW
Temperature humidity
Test condition:
85%RH/85C
2000 hours
Sample:
Waveguides on silicon
substrate
Results:
No measureable (< 10-5
dB/cm*h) change in
attenuation
Thermal cycles
Test condition:
-40C/+125C
500 cycles
Sample:
Waveguides on
silicon substrate
Results:
No measureable
change in
attenuation
(± 0.005dB/cm)
TEMPERATURE HUMIDITY THERMAL CYCLING
Solder reflow
Test condition:
260C in air
5 cycles
Sample:
Waveguides on silicon
substrate
Results:
Increase of 0.016 ±
0.005 dB/cm (pass
telcordia requirements)
2.4Tbps Waveguide Demonstrator with 25Gbps Embedded Optical Links
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• Two OBTs in the link prototype. Launching to WGs via fiber jumpers
• Electrical I/O we use 6 MXP connectors (Huber-Suhner)
• The OBTs are controlled through the I2C interface
Connector for power supply
OBT
OBT
Interface to
waveguides
USB Interface RF I/O
Power supply test Embedded
waveguide links 8x 12 WG ch sets/
board
Total: 96 ch/board
Capacity: 2.4Tbps
• Board: 284 x 311 mm.
• Construction: 6L+1Optical
• No # of WGs: 96 ch (8 x 12 ch)/ board
M.Immonen, R.Zhang, M.Press, H.Tang, W. Lei, J.Wu, H. J.Yan , L.X.Zhu, M.Serbay, “End-to-end Optical 25Gb/s Link
Demonstrator with Embedded Waveguides, 90°Out-of-Plane Connector and On-board Optical Transceivers”
JOINT DEVELOPMENT
Th.2.P2.SC4.13
M.Immonen, R.Zhang, M.Press, H.Tang, W. Lei, J.Wu, H. J.Yan , L.X.Zhu, M.Serbay, “End-to-end Optical 25Gb/s Link
Demonstrator with Embedded Waveguides, 90°Out-of-Plane Connector and On-board Optical Transceivers”
Results – Link Traffic Measurements at 25Gbps
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Th.2.P2.SC4.13
PhoxTrot – EU FP7 FHG-IZM, Seagate, Compass
Networks, Mellanox with partners [10.2014-09.2016]
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PhoxTroT is a large-scale European research effort focusing on
optical interconnects across the different hierarchy levels in Data
Center and High-Performance Computing Systems:
on-board,
board-to-board and
rack-to-rack
http://www.phoxtrot.eu
Fraunhofer IZM (DE)
Fraunhofer HHI (DE)
Vertilas GmbH (DE)
Seagate Technology Ltd (UK)
ams AG (AT)
TTM Technologies (HK)
AMO GmbH (DE)
ICCS/NTUA (EL)
DAS Photonics SL (ES)
Phoenix BV (NL)
CERTH (EL)
Compass Networks (IL)
Bright Photonics BV (NL)
CTI (EL)
CNRS-UB (FR)
CNRS-LPN (FR)
KIT (DE)
SDU (DK)
UPVLC (ES)
IMEC (BE)
Mellanox (IL)
TTM is developing: polymer waveguide PCBs and interface solutions
Storage Controller Card Emulator with Embedded Optical Layer
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PhoxTrot Demonstrator [PhoxDem09.01]
M. Immonen, J.Wu, H. J. Yan, L. X. Zhu, P.Chen, T.Rapala-Virtanen, “Development of electro-
optical PCBs with embedded waveguides for data center and high performance computing
applications”, Proc. of SPIE 8991, Optical Interconnects XIV, 899113. 8 Mar, 2014.
Electro-Optical Router with Optical Waveguide Connectivity
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PhoxDem09.02 Physical Specifications
Board outline: 190 mm x 420 mm
Stack-up: 16L +1Opt (b/w L8 and L9)
14+14 embedded TX-RX channels @ 8Gbp/s -> 112 Gbps via board embedded polymer WGs
Max capacity: 1.34Tbps with 168 I/O’s; or 4.2 Tbps @ 25 Gbps/ch
Two CEOS ASICs with on-chip optical interconnects
52×52mm BGA with 4000 electrical pins
a router traffic manager incl. a switch fabric, queuing manager and egress processing. PhoxDem09.02 scaled down of functions of router chips e.g., not running L3 and switch fabric logic
C2C link: 15cm length. Density: 4ch/mm with 250µm pitch
Capacity: 16ch/mm 62.5µm pitch
2x12-ch mid-board MTP connectors (PhoxPlug02)
90 chip-on-board (3.6x0.5x0.2mm)
12-ch lensed MT (TE)
The power budget ~ 8-10dB
Waveguides Waveguides
Fibre-to-Board connector sockets
Chip-to-board optical connector
• Two router chips communicating via 2×14 WG arrays
• Two MTP connectors communicating with router chip via 2×12 WG arrays
• PCB: 16 layers, optical layer embedded into the board stack
HLC OE PCB : 16L + 1Opt (Embedded)
• First complex HLC EOPCB with embedded MM polymer waveguide layer
• Besides optical waveguides, the board contains all required electrical layers and via structures (PTHs, n-PTH, stacked and buried microvias) built around optical cores
Proprietary and Confidential
Fabricated 16L + 1Opt unit - Top side
2.03 mm +/- 0.2mm
Cross-section
Assembled [PhoxDem09.02] Demonstrator Showcased at OFC 2016 (Anaheim 03’2016)
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Compass Networks finished assembly of two CEOS ASICs (OE- router chips) and MTP fiber
connector on TTM 16L+1Opt OPCB (Nov/2015)
Two CEOS ASICs with on-chip optical interconnects.
52×52mm BGA with 4000 electrical pins
a router traffic manager incl. a switch fabric, queuing
manager and egress processing.
PhoxDem09.02 scaled down of functions of router
chips e.g., not running L3 and switch fabric logic
Development of multilayer (dual-layer) OPCBs
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a b c e
f g h i
MM Dual-WG OPCB development
First dual-layer units complete
Varying core sizes: width 20’ 35’ 50’ 60 µmx height 45-90µm
Excellent layer-to-layer registration < +/-5µm
2L OPCB fabrication in 16”x20” production panel
PhoxTrot09.03 / HDP Joint Eco-System Demonstrator Complete demonstrator platform including chassis and cards
OE2.LC1 - Logic card
(not shown)
OE2.TD1 - Test daughtercard
OE2 - OE2.BP1 - backplane
(HDPuG)
OE2.MC1 - Mezzanine card
with Ultracomm engine and high speed
RF connectors
Features 1. Electro-optical backplane with embedded waveguides (OE2.BP1) 2. Separate, interchangeable flexible waveguides with optical ferrule terminations 3. Backplane connector receptacles (commercial and proprietary) 4. Out-of-plane coupling elements for MPO cables 5. Pluggable Test Daughtercard with embedded waveguides and out-of-plane MPO couplers (OE2.TD1) 6. Pluggable Mezzanine Card to house optical engine and high speed RF connectors 7. Optical fibre or waveguide connection between optical engine and backplane connector plug
TTM Proprietary and Confidential 20
JOINT EFFORT with HDP Optical Interconnect Phase 2
PhoxDem09.03 Demonstrator Technologies
Proprietary and Confidential 21
Huber Suhner
MXP array
connectors
FCI OBT
optical engine
Polymer WG Backplane
(PhoxDem09.03.BP3)
Glass WG Backplane
(PhoxDem09.03.BP2)
Polymer WG Daughter Card
(PhoxDem09.03.TD1B) Mezzanine Card
(PhoxDem09.03.MC2A)
Polymer WG Flex BP
PhoxTrot Optical Fiber-to-PCB waveguide interfaces
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PhoxPlug05 with 90° MLA
assembled in PhoxTest05.03 board
PhoxPlug04 - Multimode waveguide
out-of-plane coupling interface (narrow)
PhoxPlug05 - Multimode waveguide
out-of-plane coupling interface (wide)
PhoxPlug03 - Multimode waveguide
In-plane coupling interface (narrow)
TTM FHG Glass Optical PCB Technology Core Technology Development [Q1/2016-Q4/2016]
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Glass OE PCB
Polymer WG tech, optics integration, connectors
Glass WG PCBs (MM-Glass, SM-Glass) for 1310nm, 1550nm
PhoxDem09.03.BP2 – Backplane w/ Glass WGs
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Glass waveguides
FTG0208-02A DMC PN:021457A
Characterization: Cross-section of WGs with white light illumination (as built)
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Core w1 Core w2
ch1 ch2 ch3...
Measurement data from FHG
IZM for as-built WGs
• Gradient-index glass waveguides – Wavelength range is 850…1550nm
– Low dispersion (graded index)
– Direct seamless access to external fiber networks
– Mechanical and thermal stable during PCB embedding
– Manufacturing on panel formats
– Glass is substrate material (direct die attachment)
Flexible Polymer Waveguides
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Photonic Packages and Single Mode Waveguide OPCBs for Silicon Photonics • Motivation: Emerging packages with silicon photonics chip
and optical transcever co-packaged with ASIC. – Strategic direction by various companies
– Optical IO with fibers or waveguides off package
– Intra package (/interposer or carrier) links with optical waveguide
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1. Polymer WGs on carrier 2. Polymer WGs on-module
IBM 2013 IBM 2015
3. Polymer WG ”fly over” flexes off-pkg and C2C
Summary and Key Take Away
• TTM Optical Electrical PCB today
– TTM has panel scale WG fab process to support standard form factors in production environment – low cost, high volume, existing infrastructure
– TTM has technology on polymer waveguide, glass waveguides, flexible WGs
– TRL level and maturity varies per optical technology & eco-system
– TTM OPCBs with MM waveguides show low loss WGs < 0.05 dB/cm and ability to produce complex WG structures: Bends, over-crossings, cascades
– Optical polymer materials with shown compliance in HLC product (chemistries, drilling, plating) and reliability (reflow, thermal cycling)
– Connectors with various partners. Focus on scaling number of channels t and connector assembly routines
• Future steps
– Single mode waveguide technology on package & board level
– Single mode connectors with new set of challenges: novel solutions required (self aligning structures,..)
– Chip-to-WG interface connectors/interface needs more solutions
Proprietary and Confidential 28
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Acknowledgements: TTM Technologies
X.H. Shi, X.L. Ren, G. Yan, L. Jiang, M. Zhou, R.S. Zhi, L. Liu
Dow Corning Corp.
K. Weidner, J. deGroot, B. Swatowski, M. Mohamed
Financial support from European Commission through FP7-ICT project PhoxTroT
under Contract 318240
http://www.phoxtrot.eu/
Please visit us at Booth #350