Transition Socket Specification - Microchip...
Transcript of Transition Socket Specification - Microchip...
2010 Microchip Technology Inc. DS51194S
Transition SocketSpecification
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of ourproducts. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such actsallow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding deviceapplications and the like is provided only for your convenienceand may be superseded by updates. It is your responsibility toensure that your application meets with your specifications.MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS ORIMPLIED, WRITTEN OR ORAL, STATUTORY OROTHERWISE, RELATED TO THE INFORMATION,INCLUDING BUT NOT LIMITED TO ITS CONDITION,QUALITY, PERFORMANCE, MERCHANTABILITY ORFITNESS FOR PURPOSE. Microchip disclaims all liabilityarising from this information and its use. Use of Microchipdevices in life support and/or safety applications is entirely atthe buyer’s risk, and the buyer agrees to defend, indemnify andhold harmless Microchip from any and all damages, claims,suits, or expenses resulting from such use. No licenses areconveyed, implicitly or otherwise, under any Microchipintellectual property rights.
DS51194S-page 2
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their respective companies.
© 2010, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-60932-069-0
2010 Microchip Technology Inc.
Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
Transition Socket Specification
INTRODUCTION
Transition sockets are products that allow headerboards (for next generation in-circuit emulators orin-circuit debuggers) or device adapters (for theMPLAB ICE 2000 in-circuit emulator) to interface tosockets on target applications.
Typically, header boards or device adapters have con-nectors that match development cycle device formats,such as DIP or PLCC. However, target sockets willmatch compact production device formats, such asSOIC, SSOP, QFP, or QFN. The solution is transitionsockets. A transition socket is specifically designed toprovide compatibility between two differing types of ICpackage formats.
Transition sockets are typically composed of two parts:the adapter socket and the adapter header. Theadapter socket is designed to plug into the headerboard or device adapter on one side, and the adapterheader on the other. The adapter header is thensoldered down to the target application.
WHY SHOULD I USE TRANSITION SOCKETS IN MY PRODUCT DESIGN?
There are two very significant advantages to usingtransition sockets:
1. Shorter product development cycle
2. Reduced expense in the design, layout andprototype testing
A typical product design cycle has two importantphases: the prototype design phase and the productiondesign phase. Traditionally, these phases were differ-ent simply because the prototype used a microcon-troller with a different package type. However, with theavailability of the transition sockets, the prototypedesign can be identical to the production designbecause a transition socket can be used to bridgemicrocontroller package differences.
WHAT TRANSITION SOCKETS ARE CURRENTLY AVAILABLE?
Microchip Technology currently offers the transitionsockets listed in the “Table of Contents” following thisintroductory section.
Use the on-line Development Tools Selector (DTS) tofind the transition sockets available for each headerboard or for each device adapter. For more on headerboards or device adapters, see:
• Header Board Specification (DS51292)
• MPLAB® ICE 2000 Processor Module and Device Adapter Specification (DS51140)
• MPLAB® ICE 4000 Processor Module and Device Adapter Specification (DS51298)
Please see the Microchip web site(www.microchip.com) for the DTS and most currentversion of all documents.
HOW CAN I OBTAIN MAXIMUM BENEFIT FROM THE USE OF TRANSITION SOCKETS?
Attention to component placement should beconsidered to provide adequate clearance for thetransition socket interface to the PCB footprint. This isespecially true for any tall components such as connec-tor headers, radial components or voltage regulators.Refer to the transition socket mechanical drawings fordimensions.
2010 Microchip Technology Inc. DS51194S-page 3
Transition Socket Specification
TRANSITION SOCKET APPLICATIONS – COMMENTSAND SUGGESTIONS
Attention to component placement should be consid-ered in mating the adapter sockets to the SOIC/SSOPheaders.
The placement of vias around the Surface MountTechnology (SMT) layout area should be examined.Vias immediately adjacent to the end of a SMT padmay inadvertently come into contact with the headerleads. Vias should be placed along the center line ofthe SMT pad to lessen the chance of pin-to-pin shortswhile soldering.
Care should be taken when soldering some transitionsockets to target boards. See the releated section forspecific instructions.
For information on packaging dimensions, please referto the Packaging Specification (DS00049).
GLOSSARY
Terms used in this document:
DFN – Dual Flat No lead
DIP – Dual In-line Package
MQFP – Metric Quad Flat Pack
PDIP – Plastic Dual In-line Package
PLCC – Plastic Leaded Chip Carrier
QFN – Quad Flat No lead
QFP – Quad Flat Pack
SOIC – Small Outline IC
SOT – Small Outline Transistor
SSOP – Shrink Small Outline Package
TQFP – Thin Quad Flat Pack
DS51194S-page 4 2010 Microchip Technology Inc.
Table of Contents
Current SocketsSOIC Transition Socket
XLT08SO-18-lead DIP to 8-lead SOIC ............................................................................................................................................. 9
XLT08SN-18-lead DIP to 8-lead SOIC (Narrow) ............................................................................................................................ 10
XLT14SO-114-lead DIP to 14-lead SOIC ....................................................................................................................................... 10
XLT18SO-118-lead DIP to 18-lead SOIC ....................................................................................................................................... 11
XLT20SO1-120-lead DIP to 20-lead SOIC ....................................................................................................................................... 11
XLT28SO-128-lead DIP to 28-lead SOIC ....................................................................................................................................... 12
SSOP Transition Socket
XLT14SS-114-lead DIP to 14-lead SSOP ...................................................................................................................................... 13
XLT20SS-118-lead DIP to 20-lead SSOP ...................................................................................................................................... 14
XLT20SS1-120-lead DIP to 20-lead SSOP ...................................................................................................................................... 14
XLT28SS-128-lead DIP to 28-lead SSOP ...................................................................................................................................... 15
XLT28SS2-128-lead DIP to 28-lead SSOP (PIC16X55/57) ............................................................................................................. 15
PLCC Transition Socket
XLT44L244-lead PLCC (0.050”) ................................................................................................................................................. 16
QFP Transition Socket
XLT44PT344-lead QFP (0.8 mm) ................................................................................................................................................. 18
XLT64PT5, XLT80PT364/80-lead QFP (0.5 mm) ............................................................................................................................................ 18
XLT80PT280-lead QFP (0.65 mm) ............................................................................................................................................... 19
SOT/DFN/QFN Transition Sockets
XLT06SOT14-lead DIP to 6-lead SOT-23 ..................................................................................................................................... 22
XLT08DFN214-lead DIP to 8-lead DFN ........................................................................................................................................... 22
2010 Microchip Technology Inc. DS51194S-page 5
Transition Socket Specification
XLT16QFN1, XLT28QFN3, XLT28QFN4, XLT44QFN2, XLT44QFN3, XLT44QFN4, XLT44QFN5Multi-lead DIP to Multi-lead QFN, Top View ................................................................................................................. 23Multi-lead DIP to Multi-lead QFN, Side View ................................................................................................................ 23Multi-lead DIP to Multi-lead QFN Cables ..................................................................................................................... 23
XLT20QFN-120-lead DIP Adapter Socket ......................................................................................................................................... 2420-lead QFN Header (Surface Foot) ............................................................................................................................ 24XLT20QFN-1 Soldering Suggestions ........................................................................................................................... 25
DS51194S-page 6 2010 Microchip Technology Inc.
Transition Socket Specification
Discontinued SocketsPDIP Transition Socket
XLT28XP (Discontinued)28-lead DIP 0.300-inch Male to 0.600-inch Female ..................................................................................................... 26
SOIC Transition Socket
XLT08SO (Discontinued – see XLT08SO-1 or XLT08SN-1)8-lead DIP to 0.050-inch Adapter Socket ..................................................................................................................... 278-lead SOIC Header .................................................................................................................................................... 27
XLT14SO (Discontinued – see XLT14SO-1)14-lead DIP to 0.050-inch Adapter Socket ................................................................................................................... 2814-lead SOIC Header .................................................................................................................................................. 28
XLT18SO (Discontinued – see XLT18SO-1)18-lead DIP to 0.050-inch Adapter Socket ................................................................................................................... 2818-lead SOIC Header ................................................................................................................................................. 28
XLT20SO1 (Discontinued – see XLT20SO1-1)20-lead DIP to 0.050-inch Adapter Socket ................................................................................................................... 2920-lead SOIC Header ................................................................................................................................................. 29
XLT28SO (Discontinued – see XLT28SO-1)28-lead DIP to 0.050-inch Adapter Socket ................................................................................................................... 2928-lead SOIC Header .................................................................................................................................................. 29
SSOP Transition Socket
XLT14SS (Discontinued – see XLT14SS-1)14-lead DIP to 0.8 mm Adapter Socket ........................................................................................................................ 3014-lead SSOP Header ................................................................................................................................................. 30
XLT20SS (Discontinued – see XLT20SS-1)18-lead DIP to 0.8 mm Adapter Socket ........................................................................................................................ 3120-lead SSOP Header ................................................................................................................................................. 31
XLT20SS1 (Discontinued – see XLT20SS1-1)20-lead DIP to 0.8 mm Adapter Socket ........................................................................................................................ 3120-lead SSOP Header ................................................................................................................................................. 31
XLT28SS (Discontinued – see XLT28SS-1)XLT28SS2 (Discontinued – see XLT28SS2-1)28-lead DIP to 0.8 mm Adapter Socket ........................................................................................................................ 3228-lead SSOP Header ................................................................................................................................................. 32
PLCC Transition Socket
XLT68L1, XLT84L1 (Discontinued)68/84-lead Adapter Socket .......................................................................................................................................... 34
QFP Transition Socket
XLT44PT (Discontinued – see XLT44PT3)44-lead QFP to 0.8 mm Adapter Socket ...................................................................................................................... 35
XLT64PT1 (Discontinued)XLT64PT2 (Discontinued – see XLT64PT5)XLT80PT (Discontinued – see XLT80PT3)64/80-lead QFP to 0.5 mm Adapter Socket ................................................................................................................. 36
XLT64PT3 (Discontinued – see XLT64PT5)64-lead QFP to 0.8mm Adapter Socket ....................................................................................................................... 36
XLT64PT4 (Discontinued – see XLT64PT5)64-lead QFP (0.8 mm) ................................................................................................................................................. 37
2010 Microchip Technology Inc. DS51194S-page 7
Transition Socket Specification
SOT/DFN/QFN Transition Sockets
XLT08DFN (Discontinued – see XLT08DFN2)8-lead DIP to 0.025-inch Adapter Socket ..................................................................................................................... 39
XLT28QFN (Discontinued – see XLT28QFN4)28-lead DIP to 0.025-inch Adapter Socket ................................................................................................................... 39
XLT28QFN2 (Discontinued – see XLT28QFN3)18-lead DIP to 0.025-inch Adapter Socket ................................................................................................................... 40
XLT44QFN (Discontinued – see XLT44QFN2)40-lead DIP to 0.025-inch Adapter Socket ................................................................................................................... 4044-lead QFN Header .................................................................................................................................................... 40
DS51194S-page 8 2010 Microchip Technology Inc.
Transition Socket Specification
CURRENT SOCKETS
The transition sockets in this section are currentlyavailable from Microchip.
SOIC TRANSITION SOCKET
An SOIC transition socket and associated hardware isshown in Figure 1.
FIGURE 1: SOIC TRANSITION SOCKET
There are two components of the SOIC transitionsocket::
1. Adapter socket that connects to the DIP deviceadapter
2. SOIC header that is to be soldered down to thetarget application
Microchip offers the following SOIC transition sockets:
• XLT08SO-1: One 8-lead DIP adapter socket and one 8-lead SOIC header (5.28mm body size)
• XLT08SN-1: One 8-lead DIP adapter socket and one 8-lead SOIC header (3.9mm body size)
• XLT14SO-1: One 14-lead DIP adapter socket and one 14-lead SOIC header
• XLT18SO-1: One 18-lead DIP adapter socket and one 18-lead SOIC header
• XLT20SO1-1: One 20-lead DIP adapter socket and one 20-lead SOIC header
• XLT28SO-1: One 28-lead DIP adapter socket and one 28-lead SOIC header
See the drawings in this section for layout dimensions.
XLT08SO-1
8-lead DIP to 8-lead SOIC
Cable to Processor Module
PDIP Device Adapter
Gold Standoffs/
Adapter Socket
SOIC HeaderTarget/Application Board
SOIC Transition Socket
Adapters
10.16mm[0.400"]
10.16mm[0.400"]
7.62mm[0.300"]
2.54mm [0.100"]
Top View
13.83mm ±0.38mm[0.545" ±0.015"]
10.00mm[0.394"]
1.27mm typ. [0.050"]
assembledassembled
Side View
8.15mm[0.321"]
7.93mm[0.312"]
End View
Tolerances: diameters ±0.03 mm [±0.001"],PCB perimeters ±0.13 mm [±0.005"],PCB thicknesses ±0.18 mm [±0.007"],pitches (from true position) ±0.08 mm [±0.003"],all other tolerances ±0.13 mm [±0.005"] unlessstated otherwise.
2010 Microchip Technology Inc. DS51194S-page 9
Transition Socket Specification
XLT08SN-1
8-lead DIP to 8-lead SOIC (Narrow)
XLT14SO-1
14-lead DIP to 14-lead SOIC
10.16mm[0.400"]
10.16mm[0.400"]
7.62mm[0.300"]
2.54mm [0.100"]
Top View
13.83mm ±0.38mm[0.545" ±0.015"]
10.00mm[0.394"]
1.27mm typ. [0.050"]
assembledassembled
Side View
8.15mm[0.321"]
End View
Tolerances: diameters ±0.03 mm [±0.001"],PCB perimeters ±0.13 mm [±0.005"],PCB thicknesses ±0.18 mm [±0.007"],pitches (from true position) ±0.08 mm [±0.003"],all other tolerances ±0.13 mm [±0.005"] unlessstated otherwise.
5.99mm[0.236"]
10.16mm[0.400"]
18.16mm[0.715"]
7.62mm[0.300"]
2.54mm typ. [0.100"]
13.68mm[0.539"]9.84mm[0.388"]assembled
assembled
1.27mm typ. [0.050"]
5.99mm[0.236"]
8.25mm[0.325"]
Tolerances: diameters ±0.03 mm [±0.001"],PCB perimeters ±0.13 mm [±0.005"],PCB thicknesses ±0.18 mm [±0.007"],pitches (from true position) ±0.08 mm [±0.003"],all other tolerances ±0.13 mm [±0.005"] unlessstated otherwise.
Top View
Side View
End View
DS51194S-page 10 2010 Microchip Technology Inc.
Transition Socket Specification
XLT18SO-1
18-lead DIP to 18-lead SOIC
XLT20SO1-1
20-lead DIP to 20-lead SOIC
22.86mm[0.900"]
10.16mm[0.400"]
7.62mm[0.300"]
2.54mm typ. [0.100"]
13.95mm ±.38mm assembled[0.549" ±0.015"]
1.27mm typ. [0.050"]
0.43mm typ. [0.017"]
10.11mm ±.38mm assembled[0.398" ±0.015"]
8.15mm[0.321"]
9.93mm[0.391"]
Tolerances: diameters ±0.03 mm [±0.001"],PCB perimeters ±0.13 mm [±0.005"],PCB thicknesses ±0.18 mm [±0.007"],pitches (from true position) ±0.08 mm [±0.003"],all other tolerances ±0.13 mm [±0.005"] unlessstated otherwise.
Top View
Side View
End View
Tolerances: diameters ±0.03 mm [±0.001"],PCB perimeters ±0.13 mm [±0.005"],PCB thicknesses ±0.18 mm [±0.007"],pitches (from true position) ±0.08 mm [±0.003"],all other tolerances ±0.13 mm [±0.005"] unlessstated otherwise.
[0.400"]
25.40mm [1.000"]
7.62mm[0.300"]
2.54mm typ. [0.100"]
13.92mm ± 0.381mm[0.548" ± 0.015"] assembled
1.27mm typ. [0.050"]
0.43mm typ. [0.017"]
8.15mm[0.321"]
12.40mm[0.488"]assembled
9.42mm[0.371"]
Top View
Side View
End View
2010 Microchip Technology Inc. DS51194S-page 11
Transition Socket Specification
XLT28SO-1
28-lead DIP to 28-lead SOIC
35.56mm[1.400"]
10.16mm[0.400"]
11.25mm[0.443"]
7.62mm[0.300"]
2.54mm typ. [0.100"]
10.46mm[0.412]
1.27mm typ. [0.050"]
0.43mm typ. [0.017"]
9.93mm[0.391"]
8.15mm[0.321"]
Tolerances: diameters ±0.03 mm [±0.001"],PCB perimeters ±0.13 mm [±0.005"],PCB thicknesses ±0.18 mm [±0.007"],pitches (from true position) ±0.08 mm [±0.003"],all other tolerances ±0.13 mm [±0.005"] unlessstated otherwise.
Top View
Side View
End View
14.29mm ±.38mm [0.563"±0.015"]
DS51194S-page 12 2010 Microchip Technology Inc.
Transition Socket Specification
SSOP TRANSITION SOCKET
An SSOP transition socket and associated hardware isshown in Figure 2.
FIGURE 2: SSOP TRANSITION SOCKET
The SSOP transition sockets are similar to the SOICtransition sockets. There are two parts to the SSOPtransition socket:
1. Adapter socket that connects to the DIP deviceadapter.
2. SSOP header that gets soldered down to thetarget application.
Microchip offers the following SSOP transition sockets:
• XLT14SS-1: One 14-lead DIP adapter socket and one 14-lead SSOP header
• XLT20SS-1: One 18-lead DIP adapter socket and one 20-lead SSOP header
• XLT20SS1-1: One 20-lead DIP adapter socket and one 20-lead SSOP header
• XLT28SS-1: One 28-lead DIP adapter socket and one 28-lead SSOP header
• XLT28SS2-1: One 28-lead DIP adapter socket and one 28-lead SSOP header (PIC16X55/57)
See the drawings in this section for layout dimensionsand clearances for tall components.
XLT14SS-1
14-lead DIP to 14-lead SSOP
Cable to Processor Module
PDIP Device Adapter
Adapter Socket
SSOP HeaderTarget/Application Board
SSOP Transition Socket
Gold Standoffs/Adapters
10.16mm[0.400"]
18.16mm[0.715"]
7.62mm[0.300"]
2.54mm typ. [0.100"]
10.19mm ±0.38mm[0.401" ±0.015"] assembled
6.35mm ±0.38mm[0.250" ±0.015"]
assembled
0.65mm typ.
7.10mm[0.280"]
5.33mm ±0.38mm[0.210" ±0.015"]
Top View
Side View
End View
Tolerances: diameters ±0.03 mm [±0.001"],PCB perimeters ±0.13 mm [±0.005"],PCB thicknesses ±0.18 mm [±0.007"],pitches (from true position) ±0.08 mm [±0.003"],all other tolerances ±0.13 mm [±0.005"] unlessstated otherwise.
2010 Microchip Technology Inc. DS51194S-page 13
Transition Socket Specification
XLT20SS-1
18-lead DIP to 20-lead SSOP
XLT20SS1-1
20-lead DIP to 20-lead SSOP
22.9mm [0.900"]
10mm[0.394"]
7.6mm[0.300"]
0.65mm pitch typ.
2.5mm Typ. [0.100"]
8.3mm ±0.38mm[0.328"±0.015"]
7.6mm ±0.38[0.298"±0.015"]
7mm [0.275"]
7.6mm[0.300"]
11.96mm ±0.38mm[0.471" ±0.015"]
Top View
Side View
End View
Tolerances: diameters ±0.03 mm [±0.001"],PCB perimeters ±0.13 mm [±0.005"],PCB thicknesses ±0.18 mm [±0.007"],pitches (from true position) ±0.08 mm [±0.003"],all other tolerances ±0.13 mm [±0.005"] unlessstated otherwise.
Compatible target board land pattern (not to scale)
A < 0.235B > 0.335
A
B
[0.026"]
assembled
10.2mm
7.6mm
25.4mm [1"]
0.65mm pitch typ.[0.026"]
2.5mm Typ. [0.100"]
11.9mm [0.469"]
Tolerances: diameters ±0.03 mm [±0.001"],PCB perimeters ±0.13 mm [±0.005"],PCB thicknesses ±0.18 mm [±0.007"],pitches (from true position) ±0.08 mm [±0.003"],all other tolerances ±0.13 mm [±0.005"] unlessstated otherwise.
[0.300"]
[0.402"]
Top View
assembled
Side View
7mm [0.275"]
7.6mm[0.300"]
11.96mm ±0.38mm[0.471" ±0.015"]
End View
Compatible target board land pattern (not to scale)
A < 0.235B > 0.335
A
B
assembled
DS51194S-page 14 2010 Microchip Technology Inc.
Transition Socket Specification
XLT28SS-1
28-lead DIP to 28-lead SSOP
XLT28SS2-1
28-lead DIP to 28-lead SSOP (PIC16X55/57)
35.56mm[1.400"]
10.16mm[0.400"]
7.62mm[0.300"]
2.54mm typ. [0.100"]
10.57mm ±.38mm [0.416"±0.015"] 1.27mm
[0.050"]
10.21mm[0.402"]
7.77mm[0.306"]
8.15mm[0.321"]
6.35mm ±.38mm [0.250"±0.015"]
Top View
Side View
End View
Tolerances: diameters ±0.03 mm [±0.001"],PCB perimeters ±0.13 mm [±0.005"],PCB thicknesses ±0.18 mm [±0.007"],pitches (from true position) ±0.08 mm [±0.003"],all other tolerances ±0.13 mm [±0.005"] unlessstated otherwise.
5.26mm [0.207"]
8.78mm [0.346"]min.
max.
Recommended targetPCB land pattern
SF-SO28G-L-01outline
0.65mm typ. [0.026"]
35.56mm[1.400"]
10.16mm[0.400"]
7.62mm[0.300"]
2.54mm typ. [0.100"]
10.57mm ±.38mm [0.416"±0.015"]
0.65mm typ. [0.026"]
1.27mm[0.050"]
10.21mm[0.402"]
7.77mm[0.306"]
8.15mm[0.321"]
6.35mm ±.38mm [0.250"±0.015"]
Top View
Side View
End View
Tolerances: diameters ±0.03 mm [±0.001"],PCB perimeters ±0.13 mm [±0.005"],PCB thicknesses ±0.18 mm [±0.007"],pitches (from true position) ±0.08 mm [±0.003"],all other tolerances ±0.13 mm [±0.005"] unlessstated otherwise.
5.26mm [0.207"]
8.78mm [0.346"]min.
max.
Recommended targetPCB land pattern
SF-SO28G-L-01outline
2010 Microchip Technology Inc. DS51194S-page 15
Transition Socket Specification
PLCC TRANSITION SOCKET
A PLCC transition socket and associated hardware isshown in Figure 3.
FIGURE 3: PLCC TRANSITION SOCKET
The PLCC transition socket is required for use alongwith the PLCC device adapters. The DAF18-1 deviceadapter is equipped with eight socket strips that inter-face with one of two transition sockets. The DAF18-3device adapter is equipped with four socket strips thatinterface with one transition socket.
The PLCC transition sockets are designed with athreaded insert in the center of the footprint so that a4/40 screw can securely fasten the transition socket tothe device adapter.
The PLCC transition sockets are designed to be sol-dered to the target PCB PLCC surface mount pattern orinserted into a PLCC socket on the target PCB.
Microchip offers the following PLCC transition sockets:
• XLT44L2: One 44-lead PLCC transition socket
RECOMMENDED PCB LAYOUT
XLT44L2
44-lead PLCC (0.050”)
Note: To avoid solder bridging, do not place viaswithin 0.025-inch of the PLCC footprint.Also, any vias near the PLCC should bedirectly on the centerline of the pad.
Cable to Processor Module
PLCC Device Adapter
PLCC Transition Socket
Target/Application Board
0.865”
0.024”
0.050” 0.074”
27.94mm [1.100”]
TOP VIEW
*Caution: Pin 1 on the device adapter side (top of socket)is 180 degrees from pin 1 on the target side (bottom ofsocket).
VIEWFRONT/SIDE
27.94mm[1.100”]
2.79mmx45° [0.110”]
20.32mm[0.800”]
1.27mm typ. [0.050”]
1.27mm typ. [0.050”] 0.43mm typ. [0.017”]
21.93mm[0.863”]
14.94mm[0.588”]
DS51194S-page 16 2010 Microchip Technology Inc.
Transition Socket Specification
QFP TRANSITION SOCKET
QFP (MQFP, TQFP, PQFP) transition sockets andassociated hardware are shown below.
FIGURE 4: QFP TRANSITION SOCKET
The QFP transition socket is required for use along withthe QFP device adapter. The device adapter isequipped with four socket strips that interface with thetransition socket.
There are two parts to the QFP transition socket:
1. Adapter socket that connects to the QFP deviceadapter
2. QFP header that gets soldered down to thetarget application
Microchip offers the following QFP transition sockets:
• XLT44PT3: One 44-lead QFP adapter socket and one 44-lead QFP header (0.8 mm)
• XLT64PT5: One 64-lead QFP adapter socket and one 64-lead QFP header (0.5 mm)
• XLT80PT2: One 80-lead QFP adapter socket and one 80-lead QFP header (0.65 mm)
• XLT80PT3: One 80-lead QFP adapter socket and one 80-lead QFP header (0.5 mm)
See the drawings in this section for layout dimensionsand clearances for tall components.
QFP TRANSITION SOCKET SOLDERING TIPS
• Use controlled soldering iron tip temperatures between 300C and 325C (570F to 615F)
• If possible, use a PACE mini wave soldering iron tip or an equivalent tip design.
• Plan to solder one (1 of 4) side first, then the opposite side, then the remaining two sides.
• Soldering iron tip movement should be in the direction of the leads (backward and forward), not across the leads; dragging the tip across the leads may cause lead damage.
• Use generous amounts of soldering flux to aid in the solder flow action.
Note: To avoid solder bridging, do not place viaswithin 0.025-inch of the QFP footprint.Also, any vias near the QFP should bedirectly on the centerline of the pad.
Cable to Processor Module
QFP Device Adapter
QFP Transition Socket
Target/Application Board
2010 Microchip Technology Inc. DS51194S-page 17
Transition Socket Specification
XLT44PT3
44-lead QFP (0.8 mm)
XLT64PT5, XLT80PT3
64/80-lead QFP (0.5 mm)
1.100
1.100
TOPVIEW
1
11
44 34
12 22
33
23
QFPPIN 1
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES.
0.352
0.225
0.80 mm
0.018 0.050
0.800
SIDEVIEW
FRONT/
0.065
Refer to the “Package Specification” forPCB footprint dimensions (DS00049).
0.300
0.300
A
A
TOPVIEW
A B
XLT64PT5 1.250 0.960
XLT80PT3 1.450 1.160
17
52
18 34
51
35
QFPPIN 1
1
68
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES.
Drawing shown is for 64-lead.
0.352
0.225
0.50 mm
0.018 0.050
B
SIDEVIEW
FRONT/
0.065
Refer to the “Package Specification” forPCB footprint dimensions (DS00049).
DS51194S-page 18 2010 Microchip Technology Inc.
Transition Socket Specification
XLT80PT2
80-lead QFP (0.65 mm)
A
A
TOPVIEW
21
64
22 42
63
43
QFPPIN 1
1
84
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES.
0.65mm
0.018
0.352
0.225
A B
1.450 1.160
0.050
B
SIDEVIEW
FRONT/
0.065
Refer to the “Package Specification” forPCB footprint dimensions (DS00049).
TABLE 1: DVA/DAF INTERFACE SPECIFICATION FOR QFP PACKAGES
Socket Package Style*DVA/DAF Interface
Specification**
XLT44PT3 44PT TQFP44PQ MQFP44KW PQFP
DVA-44PL
XLT64PT5 64PT DVA-68PL
XLT80PT2 80PF DVA-84PL
XLT80PT3
* Refer to the “Package Specification” for PCB footprint dimensions (DS00049).
** Refer to the processor module and device adapter specification for interface and dimensions to DVA/DAF (ICE 2000: “MPLAB® ICE 2000 Processor Module and Device Adapter Specification” (DS51140); ICE 4000: “MPLAB® ICE 4000 Processor Module and Device Adapter Specification” (DS51298)).
2010 Microchip Technology Inc. DS51194S-page 19
Transition Socket Specification
SOT/DFN/QFN TRANSITION SOCKETS
SOT/DFN/QFN transition sockets and associatedhardware are shown below.
FIGURE 5: SOT TRANSITION SOCKET WITH CABLE
FIGURE 6: DFN TRANSITION SOCKET WITH CABLE
FIGURE 7: QFN TRANSITION SOCKET WITH CABLE
FIGURE 8: QFN TWO-PART TRANSITION SOCKET
Two-part transition sockets consist of:
1. Adapter socket that connects to the DIP deviceadapter
2. QFN header that is to be soldered down to thetarget application
Microchip offers the following SOT/DFN/QFN transitionsockets:
• XLT06SOT: One 14-lead DIP to 6-lead SOT-23 transition socket with cable
• XLT08DFN2: One 14-lead DIP to 8-lead DFN transition socket with cable
• XLT16QFN1: One 14-lead DIP to 16-lead QFN transition socket with cable
• XLT20QFN-1: One 20-lead DIP adapter socket and one 20-lead QFN header
• XLT28QFN3: One 18-lead DIP to 28-lead QFN transition socket with cable
• XLT28QFN4: One 28-lead DIP to 28-lead QFN transition socket with cable
• XLT44QFN2: One 40-lead DIP to 44-lead QFN transition socket with cable
• XLT44QFN3: One 28-lead DIP to 44-lead QFN transition socket with cable
• XLT44QFN4: One 28-lead DIP to 44-lead QFN transition socket with cable
• XLT44QFN5: One 18-lead DIP to 44-lead QFN transition socket with cable
See the drawings in this section for layout dimensions.
SOT Transition Socket
Target/Application Board
Cables
Cable to Processor Module
PDIP Device Adapter
Gold Standoffs/Adapters
DFN Transition Socket
Target/Application Board
Cables
Cable to Processor Module
PDIP Device Adapter
Gold Standoffs/Adapters
QFN Transition Socket
Target/Application Board
Cables
Cable to Processor Module
PDIP Device Adapter
Gold Standoffs/Adapters
QFN Transition Socket
Target/Application Board
Cable to Processor Module
PDIP Device Adapter
Gold Standoffs/Adapters
DS51194S-page 20 2010 Microchip Technology Inc.
Transition Socket Specification
RECOMMENDED INSTALLATION OF TRANSITION SOCKETS WITH CABLES
For transition sockets that use a cable, follow theseinstructions for installing your transition socket on thetarget board.
PCB Layout Considerations:
Make sure you leave enough room on the PCB toaccommodate the cable, i.e., space your target padsfor each device far enough apart so that the cable fromone pad group will not interfere with another pad group.
6-Pin SOT Solder Instructions:
1. Remove protective cable covering from end ofcable.
2. Position cables on target board (see below).Tape down to prevent movement.
3. Solder each lead to target pad.
4. Remove tape and clean.
8-Pin DFN Solder Instructions:
1. Prepare leads by trimming narrowest portion to0.10-inch maximum in length (see below).
2. Position cables on target board (see below).Tape down to prevent movement.
3. Solder each lead to target pad.
4. Remove tape and clean.
8-Pin DFN Assembly Instructions:
1. Start with cable associated with pin 1.
2. Fold cable up and over, forming a radius.
3. Mate with the header on the side of the transitionsocket assembly, making sure pin 1 mates withthe pin labeled “DFN Pin 1”.
4. Fold over and mate the other cable.
16-Pin QFN Solder Instructions:
1. Remove protective cable jacket from strippedend of cable.
2. Lay out the four cables in a “+” pattern (seebelow).
3. Center each cable on the footprint (see below).Tape down each cable to prevent movement.
4. Solder each lead to target pad.
5. Remove tape and clean
16-Pin QFN Assembly Instructions:
1. Start with cable associated with pin 1.
2. Fold cable up and over, forming a radius.Header pins will now be facing upwards.
3. Mate with the socket on the underside of thetransition socket assembly, making sure pin 1mates with the pin labeled “QFN Pin 1”.
4. Fold over and mate the other cables.
28/44-Pin QFN Solder Instructions:
1. Remove protective cable jacket from strippedend of cable.
2. Lay out with long cables opposing each otherand short cables opposing each other (seebelow).
3. Place center lead (6th lead for 44-pin, 4th leadfor 28-pin) on center target pad to center eachcable on the footprint (see below). Tape downeach cable to prevent movement.
4. Solder each lead to target pad.
5. Remove tape and clean
28/44-Pin QFN Assembly Instructions:
1. Start with cable associated with pin 1.
2. Fold cable up and over, forming a radius.Header pins will now be facing upwards.
3. Mate with the socket on the underside of thetransition socket assembly, making sure pin 1mates with the pin labeled “QFN Pin 1”.
4. Fold over and mate the other cables.
pin 1
trim leads
pin 1
pin 1
header pinsfacing down
center cableon target footprint
pin 1
use center leadto center cableon target footprint
short short
lon
glo
ng
header pinsfacing down
2010 Microchip Technology Inc. DS51194S-page 21
Transition Socket Specification
RECOMMENDED PCB LAYOUT
The recommended target board footprint layout fordifferent pin-counts is shown here.
FIGURE 9: 6-PIN SOT, 8-PIN DFN
FIGURE 10: 16-PIN QFN
FIGURE 11: 20-PIN QFN
FIGURE 12: 28-PIN QFN
FIGURE 13: 44-PIN QFN
XLT06SOT
14-lead DIP to 6-lead SOT-23
XLT08DFN2
14-lead DIP to 8-lead DFN
16 mils
24 mils
50 mils
24 mils11 mils
26 mils
28 mils11 mils
19 mils
24 mils11 mils
26 mils
16 mils13 mils
26 mils
DV
A P
in 10.90
0.80
0.30
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES.
TOPVIEW
SIDEVIEW
1.50
DVA Pin 1DFN Pin 1
0.90
1.35
0.30
0.30
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES.
TOPVIEW
SIDEVIEW
0.24
2.37
0.09
DVA Pin 1: Location of 14-lead DIP pin 1
DS51194S-page 22 2010 Microchip Technology Inc.
Transition Socket Specification
XLT16QFN1, XLT28QFN3, XLT28QFN4, XLT44QFN2, XLT44QFN3, XLT44QFN4, XLT44QFN5
Multi-lead DIP to Multi-lead QFN, Top View
Multi-lead DIP to Multi-lead QFN, Side View
Multi-lead DIP to Multi-lead QFN Cables
DV
A P
in 1
QFN Pin 1
1.15
2.45
DV
A P
in 1
1.15
2.45
XLT28QFN3 – 18L DIP to 28L QFN (Shown)
XLT44QFN2 – 40L DIP to 44L QFN
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES.
XLT28QFN4 – 28L DIP to 28L QFN (Shown)XLT44QFN3 – 28L DIP to 44L QFN
DIP
1
DV
A P
in 1
QFN Pin 1
1.15
1.25XLT16QFN1 – 14L DIP to 16L QFN
TOP VIEW
TOP VIEW
TOP VIEW
XLT44QFN4 – 28L DIP to 44L QFN
XLT44QFN5 – 18L DIP to 44L QFN
DV
A P
in 1
QFN Pin 1
1.15
2.45
TOP VIEW
QFN Pin 1
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES.
SIDEVIEW
0.56
cable C
XLT16QFN1 1-4 1.30
XLT28QFN3/4 1,2 1.30
3,4 2.00
XLT44QFN2/3XLT44QFN4/5
1,2 1.30
3,4 2.00
TOPVIEW
0.40
0.85
0.40SIDEVIEW
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES.
Drawing shown is for 28-lead DIP.
BOTTOMVIEW
C
2010 Microchip Technology Inc. DS51194S-page 23
Transition Socket Specification
XLT20QFN-1
20-lead DIP Adapter Socket
20-lead QFN Header (Surface Foot)
11.4mm
2.5mm[0.100"]
7.6mm
26.6mm
[0.300"]
[0.450"]
[1.049"]
Top View
Side View
Bottom View
3.3mm [0.130"]
2.3mm [0.093"]
4.2mm [0.165"]
SF-MLF20A-A-02F(included)
1.2mm [0.047"] *
3.9mm [0.154"] *
* Assembled
2.7mm [0.105"]7.8mm [0.307"] *
Tolerances: diameters ±0.03 mm [±0.001"],PCB perimeters ±0.13 mm [±0.005"],PCB thicknesses ±0.18 mm [±0.007"],pitches (from true position) ±0.08 mm [±0.003"],all other tolerances ±0.13 mm [±0.005"] unlessstated otherwise.
Top View
Side View
Bottom View
3
4
5
6
7 8 910
11
12
13
14
15
16
17
18
19
20
0.80mm typ.
4.72mm[0.186"]
4.72mm [0.186"]
3.20mm[0.126"]
3.20mm [0.126"]
Gnd/indexpin
12
3
4
5
6
7 8 910
11
12
13
14
15
16
17
18
19
20
1
20
2.13mm[0.084"]
2.75mm[0.108"]
2.13mm [0.084"]
2.75mm [0.108"]
4.00mm [0.157"]
4.00mm[0.157"]
0.50mm typ. [0.020"]
3.30mm[0.130"]
12
Tolerances: diameters ±0.03 mm [±0.001"],PCB perimeters ±0.13 mm [±0.005"],PCB thicknesses ±0.18 mm [±0.007"],pitches (from true position) ±0.08 mm [±0.003"],all other tolerances ±0.13 mm [±0.005"] unlessstated otherwise.
DS51194S-page 24 2010 Microchip Technology Inc.
Transition Socket Specification
XLT20QFN-1 Soldering Suggestions
This socket is difficult to solder since the device pinsare not exposed, but embedded, into the socket’sSurface Foot (SF).
1. To start, add tack flux to the target land pattern.
2. Visually align the QFN SF with the target landpattern. Then solder two opposite SF pins to thetarget lands so that the SF does not movearound.
3. Finish soldering the rest of the SF pins.
4. If the SF has a middle ground pin, feed solderthrough the bottom side of hte target board viaholes. This will connect the center QFN SF pinto the target board.
5. Check each solder connection on the QFN SFpins.
You are now ready to attach the QFN header to the SF.
2010 Microchip Technology Inc. DS51194S-page 25
Transition Socket Specification
DISCONTINUED SOCKETS
The transition sockets in this section are discontinuedand may no longer be ordered from Microchip. Theyare kept in this document as a reference for customerswho still have these sockets.
PDIP TRANSITION SOCKET
A PDIP transition socket and associated hardware isshown in Figure 1.
FIGURE 1: PDIP TRANSITION SOCKET
The PDIP transition socket is a 0.300-inch Male to0.600-inch Female adapter socket.
Microchip offers the following PDIP transition socket:
• XLT28XP: One 28-lead DIP transition socket and two 28-lead gold standoffs
See the drawings in this section for layout dimensions.
XLT28XP (Discontinued)
28-lead DIP 0.300-inch Male to 0.600-inch Female
Cable to Processor Module
PDIP Device Adapter
Gold Standoffs/Adapters
0.300-inch Male to 0.600-inch Female Adapter Socket
Target/Application Board
(PDIP Transition Socket)
0.300"
0.100"
0.600"
1.400"
0.700"TOPVIEW
SIDEVIEW
REARVIEW
FRONT/
DS51194S-page 26 2010 Microchip Technology Inc.
Transition Socket Specification
SOIC TRANSITION SOCKET
An SOIC transition socket and associated hardware isshown in Figure 2.
FIGURE 2: SOIC TRANSITION SOCKET
There are two components of the SOIC transitionsocket:
1. Adapter socket that connects to the PDIP deviceadapter
2. SOIC header that is to be soldered down to thetarget application
The following SOIC transition sockets have been dis-continued:
• XLT08SO: One adapter socket and three 8-lead SOIC headers
• XLT14SO: One adapter socket and three 14-lead SOIC headers
• XLT18SO: One adapter socket and three 18-lead SOIC headers
• XLT20SO1: One adapter socket and three 20-lead SOIC headers
• XLT28SO: One adapter socket and three 28-lead SOIC headers
See the drawings in this section for layout dimensions.
XLT08SO (Discontinued – see XLT08SO-1 or XLT08SN-1)
8-lead DIP to 0.050-inch Adapter Socket
8-lead SOIC Header
Note: The SOIC header is designed for SOICbody width of 0.300-inch. The adapterleads should be cut to fit the 0.150-inchand 0.208-inch SOIC body widths.
Cable to Processor Module
PDIP Device Adapter
Gold Standoffs/
Adapter Socket
SOIC HeaderTarget/Application Board
SOIC Transition Socket
Adapters
TOPVIEW
SIDEVIEW
REARVIEW
FRONT/BOTTOMVIEW
A
B
C
D
E
F
G
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES.
The SOIC header is designed for an SOIC body width of 0.300-inch.
The adapter leads should be cut to fit the 0.150-inch and 0.208-inch SOIC body widths.
TOPVIEW
SIDEVIEW
FRONT/REARVIEW
A B C D E F G
0.060 0.410 0.050 0.075 0.178 0.050 0.050
2010 Microchip Technology Inc. DS51194S-page 27
Transition Socket Specification
XLT14SO (Discontinued – see XLT14SO-1)
14-lead DIP to 0.050-inch Adapter Socket
14-lead SOIC Header
XLT18SO (Discontinued – see XLT18SO-1)
18-lead DIP to 0.050-inch Adapter Socket
18-lead SOIC Header
TOPVIEW
SIDEVIEW
REARVIEW
FRONT/BOTTOMVIEW
A
B
C
D
E
F
G
TOPVIEW
SIDEVIEW
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES.
The SOIC header is designed for an SOIC body width of 0.300-inch.
The adapter leads should be cut to fit the 0.150-inch and 0.208-inch SOIC body widths.
FRONT/REARVIEW
A B C D E F G
0.060 0.410 0.050 0.075 0.178 0.050 0.050
TOPVIEW
SIDEVIEW
REARVIEW
FRONT/
BOTTOMVIEW
A
B
C
D
E
F
G
TOPVIEW
SIDEVIEW
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES.
The SOIC header is designed for an SOIC body width of 0.300-inch.
The adapter leads should be cut to fit the 0.150-inch and 0.208-inch SOIC body widths.
FRONT/REARVIEW
A B C D E F G
0.060 0.410 0.050 0.075 0.178 0.050 0.050
DS51194S-page 28 2010 Microchip Technology Inc.
Transition Socket Specification
XLT20SO1 (Discontinued – see XLT20SO1-1)
20-lead DIP to 0.050-inch Adapter Socket
20-lead SOIC Header
XLT28SO (Discontinued – see XLT28SO-1)
28-lead DIP to 0.050-inch Adapter Socket
28-lead SOIC Header
TOPVIEW
SIDEVIEW
REARVIEW
FRONT/
BOTTOMVIEW
A
B
C
D
E
F
G
TOPVIEW
SIDEVIEW
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES.
The SOIC header is designed for an SOIC body width of 0.300-inch.
The adapter leads should be cut to fit the 0.150-inch and 0.208-inch SOIC body widths.
FRONT/REARVIEW
A B C D E F G
0.060 0.410 0.050 0.075 0.178 0.050 0.050
TOPVIEW
SIDEVIEW
REARVIEW
FRONT/
BOTTOMVIEW
AB
C
D
E
F
G
TOPVIEW
SIDEVIEW
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES.
The SOIC header is designed for an SOIC body width of 0.300-inch.
The adapter leads should be cut to fit the 0.150-inch and 0.208-inch SOIC body widths.
FRONT/REARVIEW
A B C D E F G
0.060 0.410 0.050 0.075 0.178 0.050 0.050
2010 Microchip Technology Inc. DS51194S-page 29
Transition Socket Specification
SSOP TRANSITION SOCKET
An SSOP transition socket and associated hardware isshown in Figure 3.
FIGURE 3: SSOP TRANSITION SOCKET
The SSOP transition sockets are similar to the SOICtransition sockets. There are two parts to the SSOPtransition socket:
1. Adapter socket that connects to the PDIP deviceadapter.
2. SSOP header that gets soldered down to thetarget application.
The following SSOP transition sockets have been dis-continued:
• XLT14SS: One adapter socket and three 14-lead SSOP headers
• XLT20SS: One adapter socket and three 20-lead SSOP headers
• XLT20SS1: One adapter socket and three 20-lead SSOP headers
• XLT28SS: One adapter socket and three 28-lead SSOP headers
• XLT28SS2: One adapter socket and three 28-lead SSOP headers for PIC16C55/57
See the drawings in this section for layout dimensionsand clearances for tall components.
XLT14SS (Discontinued – see XLT14SS-1)
14-lead DIP to 0.8 mm Adapter Socket
14-lead SSOP HeaderNote: To keep the leads straight during assembly
and shipping, the SSOP headers areshipped with break-away tabs attached tothe leads. Please remove the break-awaytabs before applying power to the targetsystem. Be careful not to bend the leadsprior to soldering to the target application.
Cable to Processor Module
PDIP Device Adapter
Adapter Socket
SSOP HeaderTarget/Application Board
SSOP Transition Socket
Gold Standoffs/Adapters
TOPVIEW
SIDEVIEW
REARVIEW
FRONT/
BOTTOMVIEW
AB
C
D
E
F
G
Shipped with break-away tabs attached to leads
Remove prior to providing power
* Top drawing shown with clip-on shrouds installed
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES.
Break-away tabs are to be removed prior to providing power.
TOPVIEW
SIDEVIEW
FRONT/REARVIEW
A B C D E F G
0.035 0.300 0.023 0.080 0.186 0.043 0.025
DS51194S-page 30 2010 Microchip Technology Inc.
Transition Socket Specification
XLT20SS (Discontinued – see XLT20SS-1)
18-lead DIP to 0.8 mm Adapter Socket
20-lead SSOP Header
XLT20SS1 (Discontinued – see XLT20SS1-1)
20-lead DIP to 0.8 mm Adapter Socket
20-lead SSOP Header
TOPVIEW
SIDEVIEW
REARVIEW
FRONT/
BOTTOMVIEW
AB
C
D
E
F
G
Shipped with break-away tabs attached to leads
Remove prior to providing power
* Top drawing shown with clip-on shrouds installed
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES.
Break-away tabs are to be removed prior to providing power.
TOPVIEW
SIDEVIEW
FRONT/REARVIEW
A B C D E F G
0.040 0.295 0.026 0.075 0.190 0.047 0.0315
TOPVIEW
SIDEVIEW
REARVIEW
FRONT/
BOTTOMVIEW
AB
C
D
E
F
G
Shipped with break-away tabs attached to leads
Remove prior to providing power
* Top drawing shown with clip-on shrouds installed
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES.
Break-away tabs are to be removed prior to providing power.
TOPVIEW
SIDEVIEW
FRONT/REARVIEW
A B C D E F G
0.040 0.295 0.026 0.075 0.190 0.047 0.0315
2010 Microchip Technology Inc. DS51194S-page 31
Transition Socket Specification
XLT28SS (Discontinued – see XLT28SS-1)XLT28SS2 (Discontinued – see XLT28SS2-1)
28-lead DIP to 0.8 mm Adapter Socket
28-lead SSOP Header
TOPVIEW
SIDEVIEW
REARVIEW
FRONT/
BOTTOMVIEW
A
B
C
D
E
F
G
Shipped with break-away tabs attached to leads
Remove prior to applying power.
* Top drawing shown with clip-on shrouds installed
TOPVIEW
FRONT/REAR
SIDEVIEW
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES.
Break-away tabs are to be removed prior to applying power.
VIEW
A B C D E F G
0.040 0.295 0.026 0.075 0.190 0.047 0.0315
DS51194S-page 32 2010 Microchip Technology Inc.
Transition Socket Specification
PLCC TRANSITION SOCKET
A PLCC transition socket and associated hardware isshown in Figure 4.
FIGURE 4: PLCC TRANSITION SOCKET
The PLCC transition socket is required for use alongwith the PLCC device adapters. The DAF18-1 deviceadapter is equipped with eight socket strips that inter-face with one of two transition sockets. The DAF18-3device adapter is equipped with four socket strips thatinterface with one transition socket.
The PLCC transition sockets are designed with athreaded insert in the center of the footprint so that a4/40 screw can securely fasten the transition socket tothe device adapter.
The PLCC transition sockets are designed to be sol-dered to the target PCB PLCC surface mount pattern orinserted into a PLCC socket on the target PCB.
The following PLCC transition sockets have beendiscontinued:
• XLT68L1: One 68-lead PLCC transition socket
• XLT84L1: One 84-lead PLCC transition socket
RECOMMENDED PCB LAYOUT
Note: To avoid solder bridging, do not place viaswithin 0.025-inch of the PLCC footprint.Also, any vias near the PLCC should bedirectly on the centerline of the pad.
Cable to Processor Module
PLCC Device Adapter
PLCC Transition Socket
Target/Application Board
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES.
Drawing shown is for 68-lead.
A
0.024
0.050 0.074
A
68-lead 1.025
84-lead 1.225
2010 Microchip Technology Inc. DS51194S-page 33
Transition Socket Specification
XLT68L1, XLT84L1 (Discontinued)
68/84-lead Adapter Socket
Tooling hole with#4-40 threaded insert.
A
B A
TOP VIEW
A B
68-lead 1.300 0.960
84-lead 1.400 1.160
*Caution: Pin 1 on the device adapter side (top of socket)is 180 degrees from pin 1 on the target side (bottom ofsocket).
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES.
Drawing shown is for 68-lead.
0.050 0.018
0.050 0.018
0.850 0.580
SIDEVIEW
FRONT/
DS51194S-page 34 2010 Microchip Technology Inc.
Transition Socket Specification
QFP TRANSITION SOCKET
QFP (MQFP, TQFP, PQFP) transition sockets andassociated hardware are shown below.
FIGURE 5: QFP TRANSITION SOCKET
The QFP transition socket is required for use along withthe QFP device adapter. The device adapter isequipped with four socket strips that interface with thetransition socket.
The following QFP transition sockets have beendiscontinued:
• XLT44PT: One 44-lead QFP transition socket, 0.80 mm
• XLT64PT1: One 64-lead QFP transition socket, 0.5 mm (PIC16C92X)
• XLT64PT2: One 64-lead QFP transition socket, 0.5 mm (PIC17CXXX)
• XLT64PT3: One 64-lead QFP transition socket, 0.8 mm (dsPIC30F)
• XLT64PT4: One 64-lead QFP adapter socket and one 64-lead QFP header (0.8 mm)
• XLT80PT: One 80-lead QFP transition socket, 0.5 mm
QFP TRANSITION SOCKET SOLDERING TIPS
• Before soldering, consider keeping the break-away tabs in place during soldering.
• Use controlled soldering iron tip temperatures between 300C and 325C (570F to 615F)
• If possible, use a PACE mini wave soldering iron tip or an equivalent tip design.
• Plan to solder one (1 of 4) side first, then the opposite side, then the remaining two sides.
• Soldering iron tip movement should be in the direction of the leads (backward and forward), not across the leads; dragging the tip across the leads may cause lead damage.
• Use generous amounts of soldering flux to aid in the solder flow action.
• If the break-away tabs are removed after solder-ing (using a dental pick or equivalent), any solder bridging between leads can be repaired by simply gently touching the soldering tip to the lead tip.
XLT44PT (Discontinued – see XLT44PT3)
44-lead QFP to 0.8 mm Adapter Socket
Note: To avoid solder bridging, do not place viaswithin 0.025-inch of the QFP footprint.Also, any vias near the QFP should bedirectly on the centerline of the pad.
Note: The XLT64PT1 for the PIC16C92X is notsymmetrical. Please note Pin 1 orientationprior to soldering to the target system.
Cable to Processor Module
QFP Device Adapter
QFP Transition Socket
Target/Application Board
TOPVIEW
1ST92X
Pin 1
CAUTION
The 64 and 80-pin QFP headers are very delicate and can be easily damaged!
0.90TOPVIEW
0.90
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES.
0.300
0.130
0.80
0.65
0.55
0.365
0.05
0.80 mm
SIDEVIEW
FRONT/
2010 Microchip Technology Inc. DS51194S-page 35
Transition Socket Specification
XLT64PT1 (Discontinued)XLT64PT2 (Discontinued – see XLT64PT5)XLT80PT (Discontinued – see XLT80PT3)
64/80-lead QFP to 0.5 mm Adapter Socket
XLT64PT3 (Discontinued – see XLT64PT5)
64-lead QFP to 0.8mm Adapter Socket
A
A
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES.
Drawing shown is for 64-lead.
This drawing shown with break-away tabs attached to the leads.
Break-away tabs are to be removed prior to applying power.
TOPVIEW
B
D
C
0.05
0.5 mm
0.330
0.100
A B C D
XLT64PT1XLT64PT2
1.25 0.95 0.400 0.500
XLT80PT 1.45 1.15 0.475 0.575
SIDEVIEW
FRONT/
Break-AwayTabs
1.05TOPVIEW
1.05
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES.
0.300
0.140
0.95
0.80
0.70
0.50
0.05
0.80 mm
SIDEVIEW
FRONT/
DS51194S-page 36 2010 Microchip Technology Inc.
Transition Socket Specification
XLT64PT4 (Discontinued – see XLT64PT5)
64-lead QFP (0.8 mm)
1.250
1.250
TOPVIEW
1
17
68 52
18 34
51
35
QFPPIN 1
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES.
0.355
0.225
0.80 mm
0.018 0.050
0.960
SIDEVIEW
FRONT/
0.065
Refer to the “Package Specification” forPCB footprint dimensions (DS00049).
TABLE 1: DVA/DAF INTERFACE SPECIFICATION FOR QFP PACKAGES
Socket Package Style*DVA/DAF Interface
Specification**
XLT44PT 44PT TQFP44PQ MQFP44KW PQFP
DVA-44PL
XLT64PT1 64PT special – PIC16C923/4, PIC16C925/6 only
DVA-68PL2
XLT64PT2 64PT DVA-68PL
XLT64PT3
XLT64PT4
XLT80PT 80PT DVA-84PL
* Refer to the “Package Specification” for PCB footprint dimensions (DS00049).
** Refer to the processor module and device adapter specification for interface and dimensions to DVA/DAF (ICE 2000: “MPLAB® ICE 2000 Processor Module and Device Adapter Specification” (DS51140); ICE 4000: “MPLAB® ICE 4000 Processor Module and Device Adapter Specification” (DS51298)).
2010 Microchip Technology Inc. DS51194S-page 37
Transition Socket Specification
SOT/DFN/QFN TRANSITION SOCKETS
SOT/DFN/QFN transition sockets and associatedhardware are shown below.
FIGURE 6: DFN/QFN TWO-PART TRANSITION SOCKET
FIGURE 7: QFN TRANSITION SOCKET
The following SOT/DFN/QFN transition sockets havebeen discontinued:
• XLT08DFN: One 8-lead DFN transition socket. (Replaced by XLT08DFN2.)
• XLT28QFN: One 28-lead QFN transition socket. (Replaced by XLT28QFN4.)
• XLT28QFN2: One 28-lead QFN transition socket. (Replaced by XLT28QFN3.)
• XLT44QFN: One 44-lead QFN two-part transition socket. (Replaced by XLT44QFN2.)
See the drawings in this section for layout dimensions.
RECOMMENDED PCB LAYOUT
The recommended target board footprint layout fordifferent pin-counts is shown here.
FIGURE 8: 8-PIN DFN
FIGURE 9: 28-PIN QFN
FIGURE 10: 44-PIN QFN
DFN/QFN Transition Socket
Target/Application Board
Cable to Processor Module
PDIP Device Adapter
Gold Standoffs/Adapters
QFN Transition Socket
Target/Application Board
Cable to Processor Module
PDIP Device Adapter
Gold Standoffs/Adapters
16 mils
24 mils
50 mils
24 mils11 mils
26 mils
16 mils13 mils
26 mils
DS51194S-page 38 2010 Microchip Technology Inc.
Transition Socket Specification
XLT08DFN (Discontinued – see XLT08DFN2)
8-lead DIP to 0.025-inch Adapter Socket
XLT28QFN (Discontinued – see XLT28QFN4)
28-lead DIP to 0.025-inch Adapter Socket
40
0 m
ilsDIP socket
Solder
PCB pads
400 mils
250 mils
170 mils
62 mils
160 mils
TOPVIEW
SIDEVIEW
1400 mils
600 m
ils
DIP socket
Solder
PCB pads
480 m
ils425 m
ils
TOPVIEW
SIDEVIEW
2010 Microchip Technology Inc. DS51194S-page 39
Transition Socket Specification
XLT28QFN2 (Discontinued – see XLT28QFN3)
18-lead DIP to 0.025-inch Adapter Socket
XLT44QFN (Discontinued – see XLT44QFN2)
40-lead DIP to 0.025-inch Adapter Socket
44-lead QFN Header
TOPVIEW
0.900
0.600
SIDEVIEW
0.236
0.026
0.480 0.875
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES.
BOTTOMVIEW
TOPVIEW
2.058
0.695
SIDEVIEW
0.50 0.730
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES.
BOTTOMVIEW
DIP
1
DIP 1
Pin 1 of QFN
TOPVIEW
SIDEVIEW
0.026
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES.
BOTTOMVIEW
0.195
0.315
0.315
Solder
PCB pads
DS51194S-page 40 2010 Microchip Technology Inc.
2010 Microchip Technology Inc. DS51194S-page 41
Transition Socket Specification
APPENDIX A: REVISION HISTORY
A.1 Revision N (February 2006)
The following is a list of modifications:
1. Added Appendix A: Revision History.
2. Removed “Preliminary” from the document’sfooter.
3. Added notes referring user to the “PackagingSpecification” (DS00049) for PCB footprintdimensions in the “Two-Part QFP Sockets” section.
A.2 Revision P (September 2006)
The following is a list of modifications:
1. Removed “MPLAB ICE 2000/4000” from thename of the document. This document nowapplies to multiple tools, and the document titlewas renamed to reflect this.
2. Updated document to reflect support of 4 tools.
3. Updated document to include break-away tabinformation for XLT64PT1, XLT64PT2 andXLT80PT.
A.3 Revision Q (July 2008)
The following is a list of modifications:
1. Update for new SOIC, SSOP and QFN sockets.
A.4 Revision R (July 2009)
The following is a list of modifications:
1. Updated the first paragraph in the “Introduction” section.
A.5 Revision S (March 2010)
The following is a list of modifications:
1. Obsoleted XLT28XP and XLT64PT4
2. Added XLT44QFN4 and XLT44QFN5.
DS51194S-page 42 2010 Microchip Technology Inc.
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