TLV320AIC3263EVM-U User Guide - TI

TLV320AIC3263EVM-U Evaluation Module

User's Guide

Literature Number: SLAU528

June 2013

Contents

1 EVM Overview .................................................................................................................... 41.1 Features ...................................................................................................................... 41.2 Introduction .................................................................................................................. 41.3 Getting Started .............................................................................................................. 4

2 AIC3263 CC Software ........................................................................................................... 52.1 Installation .................................................................................................................... 52.2 Graphical User Interface (GUI) ............................................................................................ 6

2.2.1 Main panel window ................................................................................................ 62.2.2 Typical Configuration .............................................................................................. 62.2.3 Command Line Interface Panel .................................................................................. 82.2.4 Register Inspector .................................................................................................. 9

A TLV320AIC3263EVM-U Default Jumper Locations .................................................................. 11

B TLV320AIC3263EVM-U EVM Schematics .............................................................................. 13

C TLV320AIC3263EVM-U EVM Layout Views ............................................................................ 19

D TLV320AIC3263EVM-U Bill of Materials ................................................................................ 22

E Writing Scripts .................................................................................................................. 28

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List of Figures

2-1. Main Panel ................................................................................................................... 6

2-2. Example Configurations Window ......................................................................................... 7

2-3. Analog Outputs Window ................................................................................................... 7

2-4. Command Line Window.................................................................................................... 8

2-5. Command Line Window.................................................................................................... 9

2-6. Register Inspector Window ................................................................................................ 9

B-1. TLV320AIC3263YZF ...................................................................................................... 13

B-2. TAS1020B USB Controller ............................................................................................... 14

B-3. Data, Sample Rate Converter ........................................................................................... 14

B-4. Data and Clocks ........................................................................................................... 15

B-5. LDO Supplies, Analog Supplies, Digital Supplies, and Analog Inputs.............................................. 16

B-6. Headphone Amplifier, Class D Amplifier, and Receiver Amplifier................................................... 17

B-7. Digital ....................................................................................................................... 18

B-8. Analog and Digital Interface Connectors ............................................................................... 18

C-1. Silkscreen Top ............................................................................................................. 19

C-2. Silkscreen Bottom ......................................................................................................... 20

C-3. Routing...................................................................................................................... 21

PurePath is a trademark of Texas Instruments.Windows is a registered trademark of Microsoft Corporation.I2C is a trademark of Philips Semiconductor Corp.

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Chapter 1SLAU528–June 2013

EVM Overview

This user’s guide describes the operation, use, features and characteristics of the TLV320AIC3263EVM-U.

1.1 Features

• Full featured EVM with the TLV320AIC3263 Audio Codec

• USB connection to PC provides power, control and streaming audio for quick evaluation

• Easy-to-use AIC3263 Codec Control (CC) software provides graphical user interface to configure andcontrol AIC3263

1.2 Introduction

This specific evaluation module (EVM) is a programmable USB audio device that features theTLV320AIC3263 Audio Codec with miniDSP.

1.3 Getting Started

1. Download the CC software located in the EVM product folder on the web.

2. Connect the EVM to USB port, LED lights LED1 and LED2 should illuminate once the EVM is detectedby Windows® PC. Also, in the Windows Device Manager, the EVM should be recognized as a USBcomposite device, a USB audio device and an HID-compliant device.

3. Connect the headphones to jack J14.

4. Open CodecControl.exe and click View → Example Configurations…

5. Select HP Playback and click ProgramCodec.

• The list of I2C™ commands for this configuration is available in the Script tab.

6. Play audio through any media tool. Make sure that the playback (and recording) device is USB-miniEVM in the Windows control panel.

• To adjust playback volume, open Sound in control panel, select the USB-miniEVM device and clickproperties.

• Similarly, the other example configurations can be tried and sound can be recorded using themicrophone available on the board.

7. Install jumpers on the EVM as per the requirements to make the right signal connections.

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Chapter 2SLAU528–June 2013

AIC3263 CC Software

This section provides setup instructions for the AIC3262 EVM control software.

2.1 Installation

1. Download the AIC3263 EVM control software located in the TLV320AIC3263 product folder.

2. Open the self-extracting installation file, and extract contents to a known folder.

3. Install the software by double clicking the CodecControl.exe and follow the directions.

4. Connect the EVM to a USB port using a cable and open up the control software. If prompted, selectthe appropriate EVM name.

5SLAU528–June 2013 AIC3263 CC SoftwareSubmit Documentation Feedback



Refresh button

Status

Graphical User Interface (GUI) www.ti.com

2.2 Graphical User Interface (GUI)

2.2.1 Main panel window

Figure 2-1. Main Panel

The main panel, shown in Figure 2-1, provides a high-level block diagram of AIC3263. On the main panel,users can configure the analog input and output routings by simply clicking on the switches. The analogsetup, digital setup, audio inputs, audio outputs, DRC, AGC, SAR and headset detection provideadditional control of many registers and other features of the AIC3263. The user can click on the coloredblocks on the main panel to gain access to these categories (intended for advanced users). Left ADC andRight ADC blocks provide the detailed settings for device analog input, whereas Left DAC and Right DACblocks provide the detailed settings for device analog output. The yellow block in the middle providessettings for the digital interface.

The Refresh button on the top reads the current state of the AIC3263 register settings and reflects it onthe user interface. The EVM status, which reflects the hardware connection of the EVM, is shown on thebottom of the main panel. USB Fs reflects the current sample rate of the EVM.

2.2.2 Typical Configuration

The AIC3263 control software provides example scripts for typical playback and record applications.These configurations can be accessed by choosing Example Configurations… under View. Once thetypical configuration is selected, click ProgramCodec to download the script into the EVM.

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www.ti.com Graphical User Interface (GUI)

Figure 2-2. Example Configurations Window

In Figure 2-3, the checked boxes show enabled functions after programming the HP Playback from theabove example configurations. Similarly, if the device is programmed using PurePath™ Studio (a tool forprogramming TI miniDSP enabled devices), these window controls can be updated by pressing theRefresh button in the control software.

Figure 2-3. Analog Outputs Window



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2.2.3 Command Line Interface Panel

Figure 2-4. Command Line Window

The command-line interface allows users to communicate with the TLV320AIC3263 using a simplescripting language (described in Appendix E). The TAS1020B USB controller handles all communicationbetween the PC and the codec. A script is loaded into the command buffer, either by loading a script fileusing the Open button or by pasting text from the clipboard. Click Run to execute the command buffer.

All controls update their status with respect to the register contents in the following conditions:

• Whenever a panel is open by selecting from View menu

• The Run button in the command-line interface is pressed

• The Refresh button on the main panel window is pressed

The Decode function is a feature in the command-line interface. When the Decode button is clicked, thescript is decoded line by line, and the decoded content can be cleared by clicking ClearDecoded. Thisdecode feature provides users an easy method of understanding the script without referring to the registermap.

The Record function is another feature in the command-line interface. The command window records allregister writes sent to the codec when the Record box is checked. The recorded register values along withtheir page numbers are displayed in the command buffer. The recorded register values can also bedecoded by clicking the Decode button on the command-line interface window. Pressing the Clear buttonclears the content of the command buffer.



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www.ti.com Graphical User Interface (GUI)

Figure 2-5. Command Line Window

2.2.4 Register Inspector

Figure 2-6. Register Inspector Window



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The contents of the TLV320AIC3263 register map can be accessed through the Register Inspector. ThePage number control selects the page to be displayed in the register table. The register table containsinformation such as register name, current register value and the bit field of the current register value.Specify the page number when using the register inspector table. Once the page is specified, the registervalue can then be inspected or changed by either entering the hex value of the register or changing thecorresponding bits for that register.



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Appendix ASLAU528–June 2013

TLV320AIC3263EVM-U Default Jumper Locations

Jumper Color Position

W1 Red Shorted

W2 Red Shorted

W4 Red Shorted

W5 Red Shorted

W6 Red Shorted

W7 Red Shorted

W8 Red Not_Installed

W9 Red Shorted

JP1 Black Not_Shorted





W10 Red Shorted

W12 Red Shorted

W13 Red Shorted

JP10 Blue Shorted

JP15 Blue Not_Shorted


JP20 Black Shorted




JP27 Black Shorted

JP39 Black Shorted

JP40 Black Shorted

JP51 Black Shorted


JP60 Black Shorted

JP61 Blue Shorted

JP62 Blue Not_Shorted

J1 Black 1-2

J2 Black 1-2

J17 Blue 2-3

J18 Blue 2-3

J19 Blue 2-3

J20 Blue 2-3

JP28 Blue 2-3

JP29 Blue 2-3

JP30 Blue 2-3

JP31 Blue 2-3

11SLAU528–June 2013 TLV320AIC3263EVM-U Default Jumper LocationsSubmit Documentation Feedback



Appendix A www.ti.com

Jumper Color Position

JP32 Red 1-2



JP35 Blue 1-2

JP36 Blue 1-2

JP37 Red 1-2

JP38 Red 2-3

JP41 Blue 2-3

JP42 Blue 2-3

JP43 Blue 2-3

JP44 Blue 2-3

JP45 Blue 2-3

JP46 Blue 2-3

JP47 Blue 2-3

JP49 Blue 2-3

JP50 Red 1-2

JP53 Black 1-2

JP54 Black 1-2

JP55 Red 2-3

JP57 Red 1-2

JP58 Red 2-3

12 TLV320AIC3263EVM-U Default Jumper Locations SLAU528–June 2013Submit Documentation Feedback


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IOVSS

SCL

HPLHPVDD_18

I2C_ADDR/SCLK

SDA

GPIO5

VNEG

HPVSS_SENSE

AVSS2

GPIO6 GPO1

SPI_SELECT

CPFCM

CPVSS

DOUT3

BCLK3

IOVDD3

CPFCP

CPVDD_18

GPIO3

WCLK3

DIN3

LOL AVDD4_18

DIN2

WCLK2

LOR

AVSS4

SPK_V

VBAT

DOUT2

GPIO4

DVDD

SPKP

SVDD SVSS

SPKM

DVDD DVSS

DVSS

BCLK2

IOVDD2

IOVSS

YZF 81 BALL, Top View

TLV320AIC3263YZF

987654321

A

B

C

D

E

F

G

H

J

ANALOGINPUTS

ASI#3

B

A OPTICALAUDIO OUTPUT

SRC #2

OPTICALAUDIO INPUTI2C

SRC4392

6 WIREAUDIO I/F

TAS1020B

SRC4392ASI#2

ASI#1

I2C & SPI

I2C

AUDIO CONTROL

I2C & SPICONTROL INTERFACE

USB CONTROLLER

ANALOGOUTPUTS

OPTICALAUDIO INPUT

SRC #1 OPTICALAUDIO OUTPUT

I2S #1AUDIO INTERFACE

A

B

DVDD

DVSS

AVSS1

RECVSS

AVDD2_18

HPR

IOVDD1

RESETz

DIN1 WCLK1

DVSS

AVSS AVSS3

RECVDD_33

RECM

GPIO2

DOUT1BCLK1

IN2R

IN3L

IN1L_AUX1VREF_SAR IN4R

AVDD1_18

MBIAS_VDD

RECP

GPIO1MCLK

AVDD_18IN2L

IN3R

IN1R_AUX2VREF_AUDIO

IN4L

MICDET

MBIAS_EXT MBIAS



Appendix BSLAU528–June 2013

TLV320AIC3263EVM-U EVM Schematics

Figure B-1. TLV320AIC3263YZF

13SLAU528–June 2013 TLV320AIC3263EVM-U EVM SchematicsSubmit Documentation Feedback



+3.3VIO

SRC1_RXCXO

SRC2_MCLK

SRC1_RDYz

+1.8VIO

TAS_SCL

TAS_SDA

RESETz

SRC1_MCLK

+3.3VIO

+3.3VIO

WCLK2

BCLK2

IOVD2

DIN2

+3.3VIO

SRC1_LOCKz

I2S2_DOUT_SRC

+3.3VIO

SRC2_RXCXO

SRC1_MCLK

SRC2_RDYz

+1.8VIO

SRC2_MCLK

+3.3VIO

+3.3VIO

DOUT3

WCLK3

BCLK3

IOVD3

DIN3

+3.3VIO

SRC2_LOCKz

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

TAS_DIN

TAS_WCLK

TAS_BCLK

DOUT2

WCLK1

BCLK1

IOVD1

DOUT1

+3.3VIO

+3.3VIO

DIN1I2S1_DOUT

I2S3_DOUT_SRC

GN

D

GN

D

GNDGND

GNDGND

GN

D

GND GND GND

GND

GND

GN

D

GN

D

GNDGND

GND

GND

GND

GN

D

GN

D

GN

D

GN

D

GNDGND

GNDGND

GN

D

GND GND

GND

GND

GN

D

GN

D

GNDGND

GND

GNDGND

GND

GN

D

GN

D

0.1ufd/16V

C18

0.1ufd/16V

C9

10ufd/6.3V

C89

0.1ufd/16V

C31

10ufd/6.3V

C94

0.1ufd/16V

C16

0.1ufd/16V

C10

10ufd/6.3V

C88

0.1ufd/16V

C30

0.1ufd/16V

C35

0.1ufd/16V

C39 0.1ufd/16V

C38

10K/5%R43

0

R15

0

R16

0.1ufd/16V

C19

0.1ufd/16V

C11

10ufd/6.3V

C90

0.1ufd/16V

C40

10ufd/6.3V

C100

0.1ufd/16V

C21

0.1ufd/16V

C12

10ufd/6.3V

C91

0.1ufd/16V

C43

0.1ufd/16V

C42

0.1ufd/16V

C45 0.1ufd/16V

C44

10K/5%R115

0

R17

0

R18

4.7

K/5

%R62

10

K/5

%

R25

4.7

K/5

%R60

10ufd/6.3V

C184

GND

10ufd/6.3VC185

1k

R23

1k

R24

GND

GN

D

GN

D

0.1ufd/16V

C186 0.1ufd/16V

C187

10K/5%

R116

13

1

2

3

4

5

6

7

8

9

10

11

12

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

SRC4392IPFBR

U12

1

2

3

TORX147PL(F,T)

U15

OUT

Vcc

GND

SHIELD

3

2

1

U18

TOTX147PL

VCC

INPUT

GND

SHIELD

14

13

12

11

10

9

8 7

6

5

4

3

2

1

U22

TXS0104EPWR

B4

NC

OE GND

NC

A4

B3

B2

B1

VCCB

A1

A2

A3

VCCA

SRC4392IPFBR

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

32

31

30

29

28

27

26

25

24

23

22

21

20

19

18

17

16

15

14

12

11

10

9

8

7

6

5

4

3

2

1

13

U14

TORX147PL(F,T)

3

2

1

U16

OUT

Vcc

GND

SHIELD

1

2

3

U19

TOTX147PL

VCC

INPUT

GND

SHIELD

1

2

3

4

5

6

78

9

10

11

12

13

14

U23

TXS0104EPWR

B4

NC

OE GND

NC

A4

B3

B2

B1

VCCB

A1

A2

A3

VCCA

U47

1

2

3

4

5

6

78

9

10

11

12

13

14

TXS0104EPWR

B4

NC

OE GND

NC

A4

B3

B2

B1

VCCB

A1

A2

A3

VCCA

RESETz

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

TAS_MCLK

TAS_WCLK

+3.3VIO

TAS_MISO

TAS_MOSI

TAS_SSz

TAS_SCLK

+3.3VIO

I2S_ENABLE

TAS_SDA

TAS_BCLK

TAS_DIN

+3.3VIO

+3.3VIO

TAS_SCL

ASI_S0

+3.3VIO

ASI_S1

I2S3_DOUT_SRC

+3.3VIO

DUT_RESETz

TAS_DOUT

I2S2_DOUT_SRC

I2S1_DOUT

+5V

GN

D

GND GND

GND

GNDGND

GN

DG

ND

GN

D

GND

GND

GND

GN

D

GN

D

GN

D

GN

DG

ND

GND

GN

DG

ND

GND

GND

GN

D

GND

GND

GND

GND

GN

D

GN

D

GN

D

GND GND

GND

GND

GND

GND

1.50K

R1

27.4

R2

27.4

R3

47pfd/50V

C1

47pfd/50V

C2

100KR4

1.0ufd/16V

C7

12

S4

0.1ufd/16V

C23

0.1ufd/16V

C25

6MHz/3.3V

4

3 2

1Y1

SIT8002AI-13-33E-6.00000T

0.1ufd/16V

C24

0.1ufd/16V

C27

0.1ufd/16VC26

21

S1

0.1

ufd

/50V

C85

10K/5%R8

10K/5%R9

1 2

S2

0.1ufd/16V

C29

0.1

ufd

/50V

C86

21

S3

10K/5%R10

Yellow/2.0V

LE

D1

649R58

Yellow/2.0V

LE

D2

649R59

10K/5%R7

120TAIL

JP10

1 2

0.1ufd/16V

C28

0.1ufd/16V

C41

R63

1000pfd/50V

C102

100pfd/50V

C103

10K/5%R28

2.7K/5%

R88

2.7K/5%

R87

120TAIL

JP15

2

1

0.1

ufd

/50V

C84

10K/5%R29

USB MINIB

11

10

9

8

7

6

5

4

3

2

1

J12

UX60-MB-5ST

4.7K/5%

R103

120TAIL

JP61

1

2

GND

4.7K/5%

R121

SN74LVC1G126DBVR

3

5

4

2

1

U9

16

15

14

13

12

11

10

98

7

6

5

4

3

2

1

U35

SN74CBTLV3253DBQR

U2

TAS1020BPFB

2116 23 242220191817151413

7

8

9

10

11

12

6

5

4

3

2

1

25

26

27

28

29

30

31

32

33

34

35

36

38 3739404142434445464748

512K

U44

8

7

6

54

3

2

1

24FC512-I/MF

DUT RESET

APP

PATCH

USB RESET

USB INPUT

Appendix B www.ti.com

Figure B-2. TAS1020B USB Controller

Figure B-3. Data, Sample Rate Converter

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+3.3VIO

SRC1_LOCKz

SRC1_RDYz

+3.3VIO

SRC2_LOCKz

SRC2_RDYz

+3.3VIO

CLK2_DIV_S0 CLK2_DIV_S1

+3.3VIO

SRC2_MCLK_S0

+3.3VIO

CLK1_DIV_S0 CLK1_DIV_S1

+3.3VIO

SRC1_MCLK_S0

SRC1_MCLK

SRC2_MCLK

TAS_MCLK

+3.3VIO

MCLK_S0

IOVD1

MCLK_S1

MCLK_SEL

SRC2_MCLK_S1

SRC1_MCLK_S1

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

MCLK

SRC1_RXCXO

SRC2_RXCXO

SRC2_MCLK

SRC1_MCLK

TAS_SCL

TAS_SDA

+3.3VIO

RESETz

CLK1_DIV_S0

CLK1_DIV_S1

CLK2_DIV_S0

CLK2_DIV_S1

MCLK_S0

MCLK_S1

MCLK_SEL

SPI_SELECT

6Wire1_EN

I2C_ADDR_SEL

TAS_MCLK

ASI_S0

ASI_S1

SRC1_MCLK_S0

SRC1_MCLK_S1

SRC2_MCLK_S0

SRC2_MCLK_S1

GND

GN

D

GN

D

GN

D

GN

D

GN

D

GN

D

GN

D

GND GND

GND

GN

D

GN

D

GN

D

GN

D

GN

D

GND GND

GND

GN

D

GN

D

GND GNDGND

GN

D

GN

D

GN

D

GND

GND

357

R69

Green/2.0V

LED8

357

R64

Green/2.0V

LED3

357

R65

Green/2.0V

LED4

357

R66

Green/2.0V

LED5

24.576MHz

1

2 3

OSC1

SM7745HSV-24.576M

4

0.1ufd/16V

C53

10K/5%

R31 10K/5%

R30

10K/5%

R51

0.1ufd/16VC56

0.1ufd/16V

C55

10K/5%

R35 10K/5%

R34

10K/5%

R52

22.5792MHz

1

2 3

4

OSC2

SM7745HSV-22.5792M

0.1ufd/16V

C57

0.1ufd/16V

C64

10K/5%

R41

10K/5%R40

0.1ufd/16V

C63

10K/5%

R39

10K

/5%

R38

10K/5%

R32

10K/5%R33

GND

10K/5%R101

0.1ufd/16V

C52

GND

0.1ufd/16V

C51

0.1ufd/16V

C60

GND

GN

D

1

2

3 4

5

6

U25

SN74LVC2G17DBVR

2A

GND VCC

1A 1Y

2Y

6

5

43

2

1

U27

SN74LVC2G17DBVR

2A

GND VCC

1A 1Y

2Y

8

7

6

54

3

2

1

U29

ICS542

1

2

3

4 5

6

7

8

U28

ICS542

1

2

3

4

5

6

7

8 9

10

11

12

13

14

15

16

U36

SN74CBTLV3253DBQR

16

15

14

13

12

11

10

98

7

6

5

4

3

2

1

U37

SN74CBTLV3253DBQR

16

15

14

13

12

11

10

98

7

6

5

4

3

2

1

U38

SN74CBTLV3253DBQR

8

7

6

5

4

3

2

1

U40

SN74LVC2G157DCTR

U30

24

23

22

21

20

19

18

17

16

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

TCA9539PWR

DATA CLOCKS

www.ti.com Appendix B

Figure B-4. Data and Clocks



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AV_ENABLE

DV_ENABLE

AV_ENABLE

DV_ENABLE

DV_ENABLE

DV_ENABLE

IOVD2

+3.3VIO+3.3VIO

IOVD1

+3.3VIO+1.8VIO

IOVD3

+1.8VIO+1.8VIO

IOVD1

IOVD2

IOVD3

IN1L

IN1R

Vsys_ext

IN3L

IN3R

Headset_Mic

MICBIAS_EXT

IN2R

IN2L

MICBIAS

IN4L

IN4R

Vsys_ext

+5V

GN

D

GNDGNDGND

+1.8VA

+5V

GN

D

GNDGNDGND

+1.8VD

+5V

GN

D

GNDGNDGND

+5V

GN

D

GNDGNDGND

+5V

GN

D

GNDGNDGND

+1.8VIO

+5V

GN

D

GNDGNDGND

GND

+1.8VD

GND GND

GND GND

GND GND

GND GND

GND

GND

GND

0.1ufd/16V

C33

10ufd/6.3V

C93

10K/5%

R12

0.1ufd/16V

C32

10ufd/6.3V

C96

10K/5%

R14

0.1ufd/16V

C34

10ufd/6.3V

C95

10K/5%

R11

0.1ufd/16V

C37

10ufd/6.3V

C98

10K/5%

R22

0.1ufd/16V

C36

10ufd/6.3V

C97

10K/5%

R21

0.1ufd/16V

C46

10ufd/6.3V

C99

10K/5%

R13

47ufd/6.3V

C129

47ufd/6.3V

C131

47ufd/6.3V

C130

47ufd/6.3V

C134

47ufd/6.3V

C133

47ufd/6.3V

C132

2 1

W5

12

W6

12

W7

1.0ufd/16V

C155

0.1ufd/16V

C135

1.0ufd/16V

C154

0.1ufd/16V

C136

1.0ufd/16V

C151

0.1ufd/16V

C138

2 1

W9

0.1ufd/16V

C160

1.8VD

3.3VIO

1.8VIO

0.1ufd/16V

C140

0.1ufd/16V

C142

12

W1

GND

+1.8VA

GND

0.1ufd/16V

C141

2 1

W2

GND

0.1ufd/16V

C161

12

W4

GND

+1.8VIO

GND GND

1.0ufd/16V

C163

0.1ufd/16V

C159

VREF

1ufd

C110

GN

D

2.1k

R111

1 2

JP20

IN1L

IN1R

GND

MIC11

2

WM-63PRT

2

1

JP27

1kR106

MBIAS

100

R98

1.0ufd/16V

C167

GND

GND

GND GND

1.0ufd/16VC166

0.1ufd/16V

C162

100

R107

1kR102

MBIAS_EXT

MICDET

+3.3VA

JP50

321

JP37

1 2 3

JP32

321

10ufd/10V

C165

+1.8VA

W10

12

VREF_SAR

123

JP57

+3.3VA

EXT_AUX1

EXT_AUX2

IN3L

IN3R

1ufd

C105

1ufd

C106

21

JP51

GND

J13

5

6

3

1

4

23 2 1

JP54

123

JP53

R113

R112

0.1ufd/16V

C175

1ufd

C108

1ufd

C109

0.1ufd/16V

C176

GND GND

EXT_IN1R

IN4L

IN4R

2.1

k

R110

JP19

1 2

IN2R

IN2L

1ufd

C177

1ufd

C178

2.1

k

R95

21

JP52

1ufd

C180

1ufd

C179

R114

0.1ufd/16V

C174

GND

120TAIL

12

JP9

+1.8V_CP

+3.3VIO

JP40

2 1

12

JP39

GND5 GND4 GND1 GND7 GND3 GND2 GND6

1 2 3

W8

+1.8VA

1.8VA

1.8V_CP

3.3VA

W13

1

2

U1

TLV320AIC3263YZF

D5

C1

D1

C3

B1

D4

D3

C4

U1

TLV320AIC3263YZF

C5

C2

A1

E4

E6

E5

A8

C7

U1

TLV320AIC3263YZF

F3

E3

D8

D2VREF_SAR

AVSS

VBAT

AVDD_18

IN3LE2

E1IN3R

IN2LF1

F2IN2R

U1

TLV320AIC3263YZF

J9

D9

H3

H9

E7

J3

J4

G8

F4

H6

1.8V/400mA

5

43

2

1

VR3

TPS73618DBVT

3.3V/400mA

5

43

2

1

VR5

TPS73633DBVT

1.8V/400mA

1

2

3 4

5

VR1

TPS73618DBVT

1.8V/400mA

5

43

2

1

VR2

TPS73618DBVT

1.8V/400mA

5

43

2

1

VR4

TPS73618DBVT

3.3V/400mA

VR61

2

3 4

5

TPS73633DBVT

ANALOG INPUTS

DIGITAL SUPPLIESANALOG SUPPLIES

LDO SUPPLIES


Figure B-5. LDO Supplies, Analog Supplies, Digital Supplies, and Analog Inputs



http://www.ti.com


Headset_Mic

+1.8V_CP

SPKM

SPKP

Vsys_ext

RLOUT

LLOUT

RECP

RECM

+3.3VA

HPR

HPL

GND GND

GND GND

DNP

C117

DNP

C118

2

1

JP1

R77

2200pfd/50V

C127

1

2

JP2

R78

2200pfd/50V

C128

TP22 TP23

120 OHMS/1.5A

FB1 21

120 OHMS/1.5A

FB2 21

HPL

HPR

VSS_SNS

GNDGNDGND

GNDGNDGND

GND

3 2 1

JP34

123

JP33

J1

1 2 3

J2

1 2 3

R79

R80

16.0

R73

32.4

R70

16.0

R74

2200pfd/50V

C1242200pfd/50V

C123

32.4

R71

J14

5

6

3

1

4

2

GND GND

0.1

ufd

/16

V

C137

10

ufd

/10

V

C156

2 1

W12

GND

10

ufd

/10

V

C168

TP72

TP71

GND

C143

2.2ufd

GND

6A/125V

1

2

J15

1.0ufd/16VC153

FB3

BLM18AG601SN1

6A/125V

2

1

J16

120TAIL

1 2 3

JP38

GND

GND GND

GND

+5V

GND

GND

GND GND

1.0ufd/16V

C5

1.0ufd/16V

C6

LLOUT

RLOUT

1 2

JP24

TP26

21

JP25

TP35R91

1k

2200pfd/50V

C157

R92

1k

2200pfd/50V

C158

GND

GND GND

6A/125V

3

2

1

J7

21

JP7

R81

1k

2200pfd/50V

C121

1 2

JP8

R82

1k

2200pfd/50V

C122

TP

27

TP

28

32.4

R721

2

JP26

SPKM

SPKP

RECP

RECM

GND

10

ufd

/10

V

C169

GND

VNEG

GND

0.1

ufd

/16

V

C173

10ufd/10V

C147

GND

0.1

ufd

/16

V

C172

C145

2.2ufd

123

JP55

+1.8VA

220ohms/2A

21FB4

J6

5

6

3

1

4

2

JP

58

321

+1.8VA

J22SJ-435105

3

2

1

4

5

GND

JP60

12

0.1ufd/16V

C164

DNP

R104

U1

TLV320AIC3263YZF

A4

B5

A7

B4

D6

B6

A5

A6

B7

U1

TLV320AIC3263YZF

B9

C8

C9

B8

A9

U1

TLV320AIC3263YZF

A2

A3

B2

B3

C6

D7

RECEIVER AMPLIFIERCLASS D AMPLIFIER

HEADPHONE AMPLIFIER

www.ti.com Appendix B

Figure B-6. Headphone Amplifier, Class D Amplifier, and Receiver Amplifier



http://www.ti.com


TAS_SCL

TAS_SDA

MCLK

BCLK1

WCLK1

DOUT1

DIN1

TAS_MISO

TAS_MOSI

TAS_SSz

TAS_SCLK

RESETz

BCLK2

WCLK2

DOUT2

DIN2

BCLK2

WCLK2

DOUT2

DIN2

TAS_BCLK

TAS_WCLK

TAS_DOUT

TAS_DIN

GPIO3

GPIO4

MICBIAS

MICBIAS_EXT Headset_Mic

+1.8V_CP

GPIO5

GPIO6

GPIO1

GPIO2

GND GND

GND GND

GND GND

GND GND

GND GND

GNDGND

GND

GND

GND

GND

GND

HPR

HPL

GND

SPKP

SPKM

SPKP

SPKM

GNDGND

GND

GND

GND

GND

GND

GND

GND

GND

IN1L

IN2L

GND

GND

GND

GND

GND

GND

GND

GND

IN1R+5V +5V

GND

GND

GND

GND

GND

GND

GND

GND

+1.8VD +1.8IO

DV_ENABLE

GND

GND

GND

GND

GND

GND GND

GND

I2S_ENABLE

GND

GND

GND

GND

GND

GND

GNDGND

IN2R

IN3RIN3L

RECP

LLOUT

RECM

IN4RIN4LVARVDVARVD

+3.3IO +3.0IO

RLOUT

+1.8VA

AV_ENABLE

J9

100

98

96

94

92

90

88

86

84

82

80

78

76

74

72

99

97

95

93

91

89

87

85

83

81

79

77

75

73

71

mfg: JSTp/n: 100P-JMDSS-G-1-TF(LF)(SN)

1

3

5

7

9

11

13

15

17

19

21

23

25

27

29

31

33

35

37

39

41

43

45

47

49

51

53

55

57

59

61

63

65

67

69

2

4

6

8

10

12

14

16

18

20

22

24

26

28

30

32

34

36

38

40

42

44

46

48

50

52

54

56

58

60

62

64

66

68

70

100P-JMDSS-G-1-TF(LF)(SN)

J10


J9


J10

82

80

78

81

79

77

75

mfg: JSTp/n: 100P-JMDSS-G-1-TF(LF)(SN)

1

3

5

7

9

11

13

15

17

19

21

23

25

27

29

31

33

35

37

39

41

43

45

47

49

51

53

55

57

59

61

63

65

67

69

71

73

83

85

87

89

91

93

95

97

99

2

4

6

8

10

12

14

16

18

20

22

24

26

28

30

32

34

36

38

40

42

44

46

48

50

52

54

56

58

60

62

64

66

68

70

72

74

76

84

86

88

90

92

94

96

98

100


0.5in

SO33480

0.5in

SO23480

0.5in

SO53480

0.5in

SO43480

0.5in

SO73480

0.5in

SO13480

0.5in

SO63480

0.5in

SO83480

RESERVED

I2S_2

RESET

SPI

MCLK

RESERVEDSPKGNDSPKGND

SPKVDDSPKVDD

HPVDDHPGND

RESERVED

HPGNDHPVDD

AV_ENABLE

DIGITAL INTERFACE CONNECTOR

BREAK-OUT CONNECTIONS BREAK-OUT CONNECTIONS

+5VAAGND+3.3VA

AGND+1.8VAAGND

AGNDVARVA

AGND+1.8V_CP

AGND

+3.3VAAGND+5VA

STANDOFFS

ANALOG INTERFACE CONNECTOR

BREAK-OUT CONNECTIONS BREAK-OUT CONNECTIONS

VARVAAGND

LINEOUTPUTS

OUT1GNDOUT1-

OUT2-OUT2GNDOUT3-OUT3GND

AGND

HEADSETOUTPUTS

HP1L

OUT4GNDOUT4-

HP1R

HP2RHP2L

AGND

OUT4+OUT4GND

OUT3GNDOUT3+

OUT2GNDOUT2+

OUT1+OUT1GND

LINEOUTPUTS

HPGNDHPGND

HPGNDHPGND

HEADSETGROUND

SPK1+SPK1-SPK2+SPK2-

CLASS-DSPEAKEROUTPUT

CLASS-DSPEAKEROUTPUT

SPK2-SPK2+SPK1-SPK1+

AGNDAGND

AGND

AGND

AGND

AGND

AGND

AGND

AGND

AGNDMICBIAS

IN2+

IN1+

IN3+

IN4+

IN5+

IN6+

IN7+

IN8+

AGND

AGND

AGND

AGND

AGND

AGND

AGND

AGNDMICDET

IN2-

IN1-

IN3-

IN4-

IN5-

IN6-

IN7-

IN8-

+5VD +5VDDGND

DGND

DGND

DGND

DGND

DGND

DGND

DGND

+3.0IO+3.3IO

+1.8IO+1.8VD

VARVDVARVD

DV_ENABLE

RESERVEDRESERVED

I2C

MCLK

DGND

I2S1

DGND

I2S_ENABLE

DGND

GPIO

I2S_3

I2S_4

RESERVED

RESERVED

BCLK1

WCLK1

DIN1

DOUT1

MCLK

BCLK2

WCLK2

DIN2

DOUT2

BCLK3

WCLK3

DIN3

DOUT3

TAS_SCL

TAS_SDA

IOVD1+3.3VIO

+3.3VIO

+3.3VIO

TAS_MOSI

TAS_SSz

DUT_RESETz

IOVD1

GPIO2

GPIO5

GPIO6

TAS_WCLK

+3.3VIO

IOVD2

TAS_BCLK

GPIO3

GPIO4

AIC_RESETz

TAS_SCLK

TAS_MISO

IOVD1+3.3VIO

+3.3VIO IOVD1

+3.3VIO

I2C_ADDR_SEL AIC_ADDRESS

+3.3VIO

6Wire1_EN

+3.3VIO

SPI_SELECT

IOVD1

AIC_SCLK

AIC_SCLK

AIC_ADDRESS

GPIO1

GNDGND

GND

GND

MCLK

BC

LK

1

WC

LK

1

DIN

1

DO

UT

1

1 2 3

JP44

321

JP28

321

JP45

1 2 3

JP29

DO

UT

2

DIN

2

WC

LK

2

BC

LK

2

GND

GND

GND

GND

GND

GND

GND

GND

321

JP47

1 2 3

JP31

1 2 3

JP46

321

JP30

GND

GND

GNDGND

GNDGND

GND

GND

GND

GND

GND

+5V

GND

GND GND

GN

D

GND

C17

0.1ufd/16V

R85

2.7

K/5

%

R86

2.7

K/5

%

C22

0.1ufd/16V

R89

200K/5%

806k

R90

C66

0.1ufd/16V

C65

0.1ufd/16V

C68

0.1ufd/16V

R49

10K/5%

C67

0.1ufd/16V

C70

0.1ufd/16V

R56

10K/5%

C80

0.1ufd/16V

1 2

3 4

5 6

J21

75869-131LF GND

6

5

4

3

2

1

MIC3

SPM0423HD4H-WB

GND

GNDGND

GNDGNDGND

IOVD1

GND

C79

0.1ufd/16V

C82

0.1ufd/16V

1

2

3

4

5

6MIC2

SPM0423HD4H-WB

123

JP43

3 2 1

JP42

123

JP41

GND

GND

GN

D

C78

0.1ufd/16V

C77

0.1ufd/16V

GP

IO1

GP

IO2

GP

IO5

GP

IO6

BC

LK

3

WC

LK

3

DIN

3

DO

UT

3

SB_CLKSB_DATA

SPI_SELRESET

AD

/SC

LK

SC

L/S

SZ

SD

A/M

OS

I

GP

01/M

ISO

GPIO3GPIO4

GND

GND

GND

GNDGND

C171

0.1ufd/16V

C170

0.1ufd/16V

GND

GN

D

GN

D

C69

0.1ufd/16V

C720.1ufd/16V

R42

10K/5%

GND

JP49

3 2 1

R109

10K/5%

GND

TP110

R5710K/5%

GND

GND GND GND

R1001k

JP35

321

120TAIL

123

JP36

120TAIL

GNDGND

123

J17 J18

3 2 1

J19

3 2 1

J20

3 2 1

GND

1

JP62

2

R117357

LED9

Green/2.0V

GND

GNDGND

GNDGNDGND

IOVD1

GND

C189

0.1ufd/16V

C188

0.1ufd/16V

1

2

3

4

5

6

MIC5

SPM0423HD4H-WB

6

5

4

3

2

1

MIC4SPM0423HD4H-WB

GN

D

GN

D

C190

0.1ufd/16V

GN

D

R118

GND

R120

0

R119

0

8

7

6

5 4

3

2

1

U31

PCA9306DCTR

SDA2

SCL2

VREF2

EN

SDA1

GND

VREF1

SCL1

10

9

8

76

5

4

3

2 1

U32

SN74AVC2T245RSWR

6

5

43

2

1

U33

TXB0101DBVR

OE

VCCB

B

GND

VCCA

A

SN74LVC1G126DBVR

3

5

4

2

1

U6

1 2 3 45678

U41

TXB0102DCUR

B2

A2

VC

CA

GN

D

B1

VC

CB

OE

A1

6

5

4 3

2

1

U45

SN74LVC2G04DBVR

1

2

3

4

5

6

78

9

10

11

12

13

14

U24

TXS0104EPWR

B4

NC

OE GND

NC

A4

B3

B2

B1

VCCB

A1

A2

A3

VCCA

U46

10

9

8

76

5

4

3

2 1

SN74AVC2T245RSWR

U1

TLV320AIC3263YZF

G6

G2

G3

G5

H5

H7

J6

J7

G7

F7

F8

H8

F6

F5

H4

J5

G4

H1

J2

J1

G9

J8

E8

G1

H2

E9

F9

U488

7

6

5

4

3

2

1

SN74LVC2G157DCTR

J23

7

6

5

4

3

2

1

5607-4200-SH

GND

B+

B-

GND

A+

GND

A-

Case

for SPI:

Install JP62


Figure B-7. Digital

Figure B-8. Analog and Digital Interface Connectors



http://www.ti.com


MASTER_RESETAIC_RESET

TLV320AIC3263EVM-U REVB

FOR MEASUREMENT

LINE OUT

MIC INPUT

HEADPHONE OUT

SR

C2

_T

xS

RC

1_

Tx

SR

C1

_R

xS

RC

2_

Rx

APP

PATCH

+

SPKM

SPKP

3.3VIO

GP01/MISO

SB_CLK

SDA/MOSI

C132

LED3

LED5

1.8VD

LED8

AD/SCLK

LED4

JP50

1.8VA

JP44

R120

JP29

JP30

GND1

VSS_SNS

W13

GPIO6

C79

U1RESET

C55

JP55

MBIAS

SCL/SSZ

DIN1 GPIO2

BCLK1

JP9

MBIAS_EXT

JP27

JP1

IN4L

MICDET

JP20

JP51

DOUT1

GND2

C188

1.8V_CP

JP24

JP54EXT_AUX1

JP39

JP38

JP33

TP26

MIC2

R22

VR5

1.8VIO

J23

R65

C82

C3

6

C131

GND3

C5

2C

51

S3

C3

2

U25

U27

GND5

LED1

BCLK2

SPI_SEL

DOUT3

JP37

R117

LED2

GPIO4

DOUT2

DIN3

WCLK2

JP32

LED9

U45

C24

JP36

JP

10

SO4

JP61

JP15

TP110

GP

IO5

C63

U40 R101

RLOUTJP

31

GPIO3

MIC5

W7

W2 W12

VNEG

JP41

GPIO1

R118

J19J18

W5W10

OS

C2

JP26

WCLK1

TP

23

JP

58

MIC4

R52

J20

IN4R

IN2L

C53R51

IN1L IN1R

IN3R

IN2R

VREF_SAR

IN3L

VR

6

C133

3.3VA

JP19

R13

C4

6

JP57

JP53

JP52

JP40

C9

3

VR

2

C129C130

JP25

EXT_IN1R

C3

4

JP60

EXT_AUX2

J2

J1

TP28

TP27

MIC1

TP71

JP34

TP35

HPL

GND4

TP72

HPR

GND7

C189

J15

RECM

J22

SO5

SO6

RECP

U15

U16

SO7

U18

U19

C134

SO8

J12

C3

7MIC3

C9

8

R64

R69

R66

VR4

VR1

C96

R14

C9

7R

21

SB

_D

ATA

DIN2

J21

JP45

C6

5

Y1

S4

R121

R119

W8

JP46

JP28

SO3

WC

LK

3

S2

LLO

UT

BC

LK

3

W4

JP

47

S1

W1

JP

42

JP35

W6W9

JP43

JP62

JP2

JP

49

MCLK

VR

EF

TP

22

J17

SP

KM

SO1

SP

KP

OS

C1

SO2

C9

9

JP7

C3

3V

R3

JP8

R12

C9

5

GND6

R11

J14

J16

J7

J6

J13

Appendix CSLAU528–June 2013

TLV320AIC3263EVM-U EVM Layout Views

Figure C-1. Silkscreen Top

19SLAU528–June 2013 TLV320AIC3263EVM-U EVM Layout ViewsSubmit Documentation Feedback



R10C84

C35

R58

U22

C184

C42

R100

U30

C142

C174

C145

C167

C179

R38

R114

C106

C177

R91

C122

C157

C109C175

C108

C123

C124

C10

C31

C94

C88R16

R18

C186

R115

R24

R25

C41

U12

R23

C45

R116

C23

R7

R8

U46

C190

R57

U41

R85

C7

R59

C85

C86R9

C38

C30

C187U47

C44

U6

R86

R63

C80

R2

C27R87

U44

C28

C67C69

C70

R90

C164

C163

C5

C147

C153

C159C161

C136

C72

C118

C160

C60

C168

C140

C173

C169

C172

C165

C64

R35

C128

R107

C178C105

C57 U36

C127

R31

R32

U37

R82

R95

R110

R33

C176

C121

R73

R92

R112

R113

FB3

R104

R71

R74

C89

R17

C90

C9

R15

C11

C91

R28

C100

U14

C40

C12

C39

C18

C19

U35

C16

R43

U23

C21

R29

R62

R60

C77

C78

R4

C171

C43C185

U48

U2

C29

C170

R3

C2

C1

C26

C22

U31

C25

R1

U32

C66

R56

C102

C103

U9

U33

C68

C17

R89

R88

R42

J10

R49

R103

U24

C154

R109

C6

C117

FB1

FB2

C151

C138

R34

R40

C135

R72

C156

C143

C110

C155

U38

R98

C166

C141

C137

C162

R41

U28

R78

C180

R30

R77

U29

J9

R39

R106

R102

C56

R111

R81

R79

R70

FB4

C158

R80

Appendix C www.ti.com

Figure C-2. Silkscreen Bottom

20 TLV320AIC3263EVM-U EVM Layout Views SLAU528–June 2013Submit Documentation Feedback


http://www.ti.com


BOTTOM COPPER

INNER LAYER #2

INNER LAYER#1

TOP COPPER

U14

U12

U48

U2

C137

C140

C110

C162

U

4

1

U

3

1

R90

R103

C142

C174C159

C161

C136

C141

C173

C145

C160

C138

C172

C143

C135

C177

C105

C180

C106

C179

C178

C109

C108

R102

R104

U40 R101

www.ti.com Appendix C

Figure C-3. Routing

21SLAU528–June 2013 TLV320AIC3263EVM-U EVM Layout ViewsSubmit Documentation Feedback


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Appendix DSLAU528–June 2013

TLV320AIC3263EVM-U Bill of Materials

ITEM QTY REFERENCES VALUE PART NUMBER DESCRIPTION COMPANY BAUFORM

1 2 C1, C2 47 pF GRM1885C1H470JA0 CAP, SMD, 0603, CERM, MURATA 0603 COG1D 47 PFD, 50 V, 5%, COG,

ROHS

2 3 C5, C6, C7 1 µF C1608X7R1C105K CAP, SMD, 0603, CERM, TDK 0603 X7R1 UFD, 16 V, 10%, X7R,ROHS

3 62 C9, C10, C11, C12, 0.1 µF GRM155R71C104KA8 CAP, SMD, 0402, CERM, MURATA 0402 X7RC16, C17, C18, 8D 0.1 UFD, 16 V, X7R, 10%,C19, C21, C22, ROHSC23, C24,C25, C26,C27, C28, C29,C30, C31, C32,C33, C34, C35,C36, C37, C38,C39, C40, C41,C42, C43, C44,C45, C46, C51,C52, C53, C55,C56, C57, C60,C63, C64, C65,C66, C67, C68,C69, C70, C72,C77, C78, C79,C80, C82, C170,C171, C186, C187,C188, C189, C190

4 3 C84, C85, C86 0.1 µF C1608X7R1H104K CAP, SMD, 0603, CERM, TDK 0603 X7R0.1 UFD, 50 V, 10%, X7R,ROHS

5 14 C88, C89, C90, 10 µF GRM188R60J106ME4 CAP, SMD, 0603, CERM, MURATA 0603 X5RC91, C93, C94, 7D 10 UFD, 6.3 V, 20%, X5R,C95, C96, C97, ROHSC98, C99, C100,C184, C185

6 1 C102 0.001 µF C1608C0G1H102J CAP, SMD, 0603, CERM, TDK CORP. 0603 COG1000 PFD, 50 V, 5%,COG, ROHS

7 1 C103 100 pF GRM1885C1H101JA0 CAP, SMD, 0603, CERM, MURATA 0603 COG1D 100 PFD, 50 V, 5%, COG,

ROHS

8 9 C105, C106, C108, 1 µF GRM188R60J105KA0 CAPACITOR, SMT, 0603, CAP, SMT,C109, C110, C177, 1D CERAMIC, 1 µF, 10 V, 0603C178, C179, C180 10%, X5R

9 2 C117, C118 C1206_DNP C1206_DNP DNI 1206

10 8 C121, C122, C123, 0.0022 µF GRM188R71H222KA0 CAP, SMD, 0603, CERM, MURATA 0603 X7RC124, C127, C128, 1D 2200 PFD, 50 V, 10%,C157, C158 X7R, ROHS

11 6 C129, C130, C131, 47 µF JMK212BJ476MG-T CAP, SMD, 0805, CERM, TAIYO YUDEN 0805 X5RC132, C133, C134 47 UFD, 6.3 V, 20%, X5R,

ROHS

22 TLV320AIC3263EVM-U Bill of Materials SLAU528–June 2013Submit Documentation Feedback



www.ti.com Appendix D


12 17 C135, C136, C137, 0.1 µF GRM188R71C104KA0 CAP, SMD, 0603, CERM, MURATA 0603 X7RC138, C140, C141, 1D 0.1 UFD, 16 V, 10%, X7R,C142, C159, C160, ROHSC161, C162, C164,C172, C173, C174,C175, C176

13 2 C143, C145 2.2 µF GRM188C81A225KE3 CAPACITOR, SMT, 0603, CAP, SMT,4D CERAMIC, 2.2 µF, 10 V, 0603

10%, X6S

14 5 C147, C156, C165, 10 µF GRM21BR71A106KE5 CAP, SMD, 0805, CERM, MURATA 0805 X7RC168, C169 1L 10 UFD, 10 V, 10%, X7R,

ROHS

15 7 C151, C153, C154, 1 µF EMK107B7105KA-T CAP, SMD, 0603, CERM, TAIYO YUDEN 0603 X7RC155, C163, C166, 1 UFD, 16 V, 10%, X7R,C167 ROHS

16 27 DIN1, DIN2, DIN3, 5004 PC TESTPOINT, KEYSTONE YellowBCLK1, BCLK2, YELLOW, ROHS ELECTRONICSBCLK3, DOUT1,DOUT2, DOUT3,GPIO1, GPIO2,GPIO3, GPIO4,GPIO5, GPIO6,TP123, TP124,WCLK1, WCLK2,WCLK3, SB_CLK,AD/SCLK,SB_DATA,SCL/SSZ, SPI_SEL,SDA/MOSI,GP01/MISO

17 2 FB1, FB2 BLM15EG121SN1D FERRITE BEAD, SMD, MURATA 4020402, 120 Ω, 1.5 A, ROHS

18 1 FB3 600 Ω BLM18AG601SN1 FERRITE BEAD, SMT, FERRITE0603, 600 Ω @ 100 MHz, BEAD, SMT,25%, 200 mA 0603

19 1 FB4 220 Ω MPZ1608S221A FERRITE CHIP, 220 Ω, 2 TDK 603A ,100 MHZ, SMD. 0603,ROHS

20 7 GND1, GND2, 5011 PC TESTPOINT, BLACK, KEYSTONE BlackGND3, GND4, 063, HOLE, ROHS ELECTRONICSGND5, GND6,GND7

21 30 IN1L, IN1R, IN2L, 5002 PC TESTPOINT, WHITE, KEYSTONE WhiteIN2R, IN3L, IN3R, ROHS ELECTRONICSIN4L, IN4R, TP22,TP23, TP26, TP27,TP28, TP35, TP71,TP72, TP110,TP111, TP112,TP113, TP114,TP115, TP116,TP117, TP118,TP119, VSS_SNS,EXT_AUX1,EXT_AUX2,EXT_IN1R

22 32 J1, J2, W8, J17, PBC03SAAN HEADER THRU MALE, 3 SULLINS 100LSJ18, J19, J20, JP28, PIN, 100LS, 120 TAIL,JP29, JP30, JP31, GOLD, ROHSJP32, JP33, JP34,JP35, JP36, JP37,JP38, JP41, JP42,JP43, JP44, JP45,JP46, JP47, JP49,JP50, JP53, JP54,JP55, JP57, JP58

23SLAU528–June 2013 TLV320AIC3263EVM-U Bill of MaterialsSubmit Documentation Feedback


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Appendix D www.ti.com


23 3 J6, J13, J14 SJ-43516-SMT JACK AUDIO-STEREO CUI STACK 3.5 mmMINI (3.5 mm, 4-CONDSMT-RA ROHS)

24 1 J7 ED555/3DS TERMINAL BLOCK, 3 PIN, ON SHORE GRAY6 A / 125 V, GRAY, 3.5 TECHNOLOGYmm PITCH, 16-28 AWG,ROHS

25 2 J9, J10 100P-JMDSS-G-1- PLUG, SMD, 2x50, JST SMD - 0.5TF(LF)(SN) FEMALE, JMDSERIES, mm

0.5 mm LS, GOLD, ROHS

26 1 J12 UX60-MB-5ST JACK USB, MINIB SMT- HIROSERA, 5 PIN, ROHS

27 2 J15, J16 ED555/2DS TERMINAL BLOCK, 2 PIN, ON SHORE GRAY6 A / 125 V, GRAY, 3.5 TECHNOLOGYmm PITCH, 16-28 AWG,ROHS

28 1 J21 Config build DNI 75869-131LF HEADER SHROUDED, FCIforTLV320AIC3263 100LS, MALE, GOLD, 2x3YZF PINS, ROHS

29 1 J22 SJ-435105 JACK AUDIO MINI (3.5 CUI STACK 3.5 mmmm, 4-COND SMT-RAROHS)

30 1 J23, Config build for DNI 5607-4200-SH CONNECTOR-SATA, 7 3M SATATLV320AIC3263YZ PIN, SMT-RA SERIES,F 5607, ROHS

31 2 LED1, LED2 SML-LXT0805YW-TR LED, YELLOW, 2 V, SMD, LUMEX OPTO 8050805, ROHS

32 5 LED3, LED4, LED5, SML-LXT0805GW-TR LED, GREEN, 2 V, SMD, LUMEX OPTO 805LED8, LED9 0805, ROHS

33 1 MIC1 WM-63PRT MICROPHONE PANASONIC ELECTRETELECTRET,OMNIDIRECTIONALDUAL BAND, 2 PIN,ROHS

34 4 MIC2, MIC3, MIC4, SPM0423HD4H-WB MIC DIGITAL, MIMI- KNOWLES Mini SiSonicMIC5 SISONIC, HALOGEN

FREE, 6 PIN, ROHS

35 1 OSC1 24.576M SM7745HSV-24.576M OSCILLATOR, SMT, 3.3 PLETRONICS SM77HV, SM77H SERIES, 24.576MHz, ROHS

36 1 OSC2 22.5792M SM7745HSV- OSCILLATOR, SMT, 3.3 PLETRONICS SM77H22.5792M V, SM77H SERIES,

22.5792 MHz, ROHS

37 1 R1 1.5 kΩ ERJ-3EKF1501V RESISTOR, SMD, 0603, PANASONIC 6031.50 kΩ, 1%, THICK FILM,1/10 W, ROHS

38 2 R2, R3 27.4 Ω ERJ-3EKF27R4V RESISTOR, SMD, 0603, PANASONIC 60327.4 Ω, 1%, 1/10 W,ROHS

39 1 R4 100 kΩ ERJ-3EKF1003V RESISTOR, SMD, 0603, PANASONIC 603100 kΩ, 1%, THICK FILM,1/10 W, ROHS

40 34 R7, R8, R9, R10, 10 kΩ ERJ-3GEYJ103V RESISTOR, SMD, 0603, PANASONIC 603R11, R12, R13, 10K, 5%, 1/10 W, ROHSR14, R21, R22,R25, R28, R29,R30, R31, R32,R33, R34, R35,R38, R39, R40,R41, R42, R43,R49, R51, R52,R56, R57, R101,R109, R115, R116



http://www.ti.com




41 4 R15, R16, R17, R18 0 Ω ERJ-3GEY0R00V RESISTOR, 0 Ω, 1/10 W, PANASONIC 603JUMP, 0603, SMD

42 13 R23, R24, R77, 1 kΩ ERJ-3GSYJ102 RESISTOR, SMT, 0603, RES, SMT,R78, R79, R80, 5%, 1/10 W, 1K 0603R81, R82, R91,R92, R100, R102,R118

43 2 R58, R59 649 Ω RC0603FR-07649RL RESISTOR, SMD, 0603, YAGEO 603THICK FILM, 649 Ω, 1%,1/10 W, ROHS

44 4 R60, R62, R103, 4.7 kΩ ERJ-3GEYJ472V RESISTOR, SMD, 0603, PANASONIC 603R121 4.7 kΩ, 5%, 1/10 W, ROHS

45 1 R63 3.09 kΩ CRCW06033091F RESISTOR, SMT, 0603, RES, SMT,1%, 1/10 W,3.09K 0603

46 5 R64, R65, R66, 357 Ω ERJ-3EKF3570V RESISTOR, SMD, 0603, PANASONIC 603R69, R117 357 Ω, 1%, THICK FILM,

1/10 W, ROHS

47 3 R70, R71, R72 32.4 Ω RC1206FR-0732R4L RESISTOR, SMD, 1206, YAGEO 1206 1/4 W32.4 Ω, 1%, 1/4 W, ROHS

48 2 R73, R74 16 Ω CRCW120616R0JNEA RESISTOR, SMT, 1206, VISHAY 120616 Ω, 5%, 1/4 W,ROHS

49 4 R85, R86, R87, R88 2.7 kΩ ERJ-3GEYJ272V RESISTOR, SMD, 0603, PANASONIC 6032.7 kΩ, 5%, 1/10 W, ROHS

50 1 R89 200 kΩ ERJ-3GEYJ204V RESISTOR, SMD, 0603, PANASONIC 603200 kΩ, 5%, 1/10 W,ROHS

51 1 R90 806 kΩ ERJ-2RKF8063X RESISTOR, SMT, 0402, RES, SMT,806K, 1%, 1/16 W 0402

52 3 R95, R110, R111 2.1 kΩ CRCW06032101F RESISTOR, SMT, 0603, RES, SMT,1%, 1/10 W, 2.10K 0603

53 2 R98, R107 100 Ω ERJ-3EKF1000V RESISTOR, SMD, 0603, PANASONIC 603100, 1%, THICK FILM,1/10 W, ROHS

54 1 R104 R0603_DNP R0603_DNP 603

54A 2 R119, R120, Config 0 Ω ERJ-3GSYJ000 RESISTOR, SMT, 0603, PANASONIC 603build for 5%, 1/10 W, 0 ΩTLV320AIC3263YZF

55 1 R106 1.1 kΩ ERJ-3GSYJ112 RESISTOR, SMT, 0603, RES, SMT,5%, 1/10 W, 1.1K 0603

56 3 R112, R113, R114 200 Ω ERJ-3GSYJ201 RESISTOR, SMT, 0603, RES, SMT,5%, 1/10 W, 200 0603

57 8 SO1, SO2, SO3, 3480 & PMS 440 0025 STANDOFF, 4-40, 0.5 in, KEYSTONESO4, SO5, SO6, PH 0.25 dia, ALUM RND, F-F, ELECTRONICSSO7, SO8 ROHS, & 4-40 PHILLIPS

MACHINE SCREW

58 4 S1, S2, S3, S4 TL1015AF160QG SWITCH, MOM, 160G, E-SWITCHSMT, 4X3 mm, ROHS

59 1 U1 TLV320AIC3263YZF CODEC WCSP81-YZF TEXAS WCSP81-ROHS INSTRUMENTS YZF

60 1 U2 TAS1020BPFB USB STREAMING TEXAS TQFP48-CONTROLLER, TQFP48- INSTRUMENTS PFBPFB, ROHS

61 2 U6, U9 SN74LVC1G126DBVR SINGLE BUS BUFFER TEXAS SOT23-GATE WITH 3-STATE INSTRUMENTS DBV5OUTPUT, SOT23-DBV5,ROHS

62 2 U12, U14 SRC4392IPFBR 2 CHAN, ASYNC, BURR-BROWN TQFP48-SAMPLE RATE CONV PFBW/DIG AUDIOREC/XMTR, ROHS



http://www.ti.com


Appendix D www.ti.com


63 2 U15, U16 TORX147PL(F,T) TOSLINK RECEIVER, 3.3 TOSHIBAV, 15MB SHUTTER,ROHS

64 2 U18, U19 TOTX147PL TOSLINK TRANSMITTER, TOSHIBA3.3 V, 15MB SHUTTER,ROHS

65 4 U22, U23, U24, U47 TXS0104EPWR 4-BIT BIDIR LEVEL TEXAS TSSOP14-TRANSLATOR, TSSOP14- INSTRUMENTS PWPW, ROHS

66 2 U25, U27 SN74LVC2G17DBVR DUAL SCHMITT- TEXAS SOT23-TRIGGER BUFFER, INSTRUMENTS DBV6SOT23-DBV6, ROHS

67 2 U28, U29 ICS542 CLOCK DIVIDER, SOP8- IDT SOP8-DD, ROHS

68 1 U30 TCA9539PWR REMOTE, 16B, I2C TEXAS TSSOP24-SMBUS, LO PWR, IO INSTRUMENTS PWEXPNDR, INT, OUT,TSSOP24-PW, ROHS

69 1 U31 PCA9306DCTR DUAL BIDIR, I2C BUS TEXAS SSOP8-DCTAND SMBUS VOLT INSTRUMENTSLEVEL TRANS, SSOP8-DCT, ROHS

70 2 U32, U46 SN74AVC2T245RSW 2BIT, XCVR, TEXAS QFN10-RSWR CONFIGURABLE INSTRUMENTS

TRANSLATION, 3-STATEOUTS, QFN10-RSW,ROHS

71 1 U33 TXB0101DBVR 1-BIT, BIDIR, LEVEL TEXAS SOT23-TRANSLATOR, SOT23- INSTRUMENTS DBV6DBV6, ROHS

72 4 U35, U36, U37, U38 SN74CBTLV3253DBQ LO VOLT, DUAL 1OF4 TEXAS SSOP16-DBR FET, MUX/DEMUX, INSTRUMENTS

SSOP16-DB, ROHS

73 2 U40, U48 SN74LVC2G157DCTR MUX/DATA SELECTOR, 2 TEXAS SSOP8-DCTTO 1, SSOP8-DCT, ROHS INSTRUMENTS

74 1 U41 TXB0102DCUR 2-BIT, BIDIR, LEVEL TEXAS VSSOP8-TRANSLATOR, VSSOP8- INSTRUMENTS DCUDCU, ROHS

75 1 U44 24FC512-I/MF 512K, I2C SERIAL MICROCHIP DFN8-MFEEPROM, DFN8-MF,ROHS

76 1 U45 SN74LVC2G04DBVR DUAL INVERTER GATE, TEXAS SOT23-SOT23-DBV6, ROHS INSTRUMENTS DBV6

77 4 VR1, VR2, VR3, TPS73618DBVT VOLT REG, 1.8 V, 400 TEXAS SOT230DBVVR4 mA, LDO CAP, FREE INSTRUMENTS 5

NMOS, SOT23-DBV5,ROHS

78 2 VR5, VR6 TPS73633DBVT VOLT REG, 3.3 V, 400 TEXAS SOT230DBVmA, LDO CAP, FREE INSTRUMENTS 5NMOS, SOT23-DBV5,ROHS

79 30 W1, W2, W4, W5, PBC02SAAN HEADER THRU MALE, 2 SULLINS 100LSW6, W7, W9, JP1, PIN, 100LS, 120 TAIL,JP2, JP7, JP8, JP9, GOLD, ROHSW10, W12, W13,JP10, JP15,JP19,JP20, JP24,JP25, JP26, JP27,JP39, JP40, JP51,JP52, JP60, JP61,JP62

80 1 Y1 SIT8002AI-13-33E- OSCILLATOR, SMT, 6 SITIME SMT-80026.00000T MHz, 3.3 V, OUT-

ENABLE, ROHS



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81 11 1.8VA, 1.8VD, 5000 PC TESTPOINT, RED, KEYSTONE Red3.3VA, TP120, ROHS ELECTRONICSTP121, TP122,1.8VIO, 3.3VIO,1.8V_CP,VREF_SAR,MBIAS_EXT

82 18 See the list for 382811-9 RED No. 382811-9 Shuntlocations

83 22 See the list for 382811-6 BLACK No. 382811-6locations Shunt

84 22 See the list for 382811-2 BLUE No. 382811-2 Shuntlocations



http://www.ti.com


Appendix ESLAU528–June 2013

Writing Scripts

A script is simply a text file that contains data to send to the serial control buses.

Each line in a script file is one command. No provision is made for extending lines beyond one line, exceptfor the > command. A line is terminated by a carriage return.

The first character of a line is the command. Commands are:

I— Set interface bus to use

r— Read from the serial control bus

w— Write to the serial control bus

>— Extend repeated write commands to lines below a w

#— Comment

b— Break

d— Delay

f— Wait for Flag

The first command, I, sets the interface to use for the commands to follow. This command must befollowed by one of the following parameters:

i2cstd— Standard mode I2C bus

i2cfast— Fast mode I2C bus

spi8— SPI bus with 8-bit register addressing

spi16— SPI bus with 16-bit register addressing

For example, if a fast mode I2C bus is to be used, the script begins with:

I i2cfast— A double-quoted string of characters following the b command can be added to provideinformation to the user about each breakpoint. When the script is executed, the software'scommand handler halts as soon as a breakpoint is detected and displays the string of characterswithin the double quotes.

The Wait for Flag command, f, reads a specified register and verifies if the bitmap provided with thecommand matches the data being read. If the data does not match, the command handler retries for up to200 times. This feature is useful when switching buffers in parts that support the adaptive filtering mode.The command f syntax follows:f [i2c address] [register] [D7][D6][D5][D4][D3][D2][D1][D0]

where 'i2c address' and 'register' are in hexadecimal format

and 'D7' through 'D0' are in binary format with values of 0,

1 or X for don't care.8

Anything following a comment command # is ignored by the parser, provided that it is on the same line.

The delay command d allows the user to specify a time, in milliseconds, that the script pauses beforeproceeding. Note: The delay time is entered in decimal format.

28 Writing Scripts SLAU528–June 2013Submit Documentation Feedback



www.ti.com Appendix E

A series of byte values follows either a read or write command. Each byte value is expressed inhexadecimal, and each byte must be separated by a space. Commands are interpreted and sent to theTAS1020B by the program.

The first byte following an r (read) or w (write) command is the I2C slave address of the device (if I2C isused) or the first data byte to write. (If SPI is used, note that SPI interfaces are not standardized onprotocols, so the meaning of this byte varies with the device being addressed on the SPI bus.) Thesecond byte is the starting register address that data will be written to (again, with I2C; SPI varies).Following these two bytes are data, if writing; if reading, the third byte value is the number of bytes toread, (expressed in hexadecimal).

For example, to write the values 0xAA 0x55 to an I2C device with a slave address of 0x30, starting at aregister address of 0x03, the user writes:#example script

I i2cfast

w 30 03 AA 55

r 30 03 02e

This script begins with a comment, specifies that a fast I2C bus is used, then writes 0xAA 0x55 to the I2Cslave device at address 0x30, writing the values into registers 0x03 and 0x04. The script then reads backtwo bytes from the same device starting at register address 0x03. Note that the slave device value doesnot change. It is unnecessary to set the R/W bit for I2C devices in the script; the read or write commandsdoes that.

If extensive repeated write commands are sent and commenting is desired for a group of bytes, the >command can be used to extend the bytes to other lines that follow. A usage example for the > commandfollows:#example script for '>' command

I i2cfast

# Write AA and BB to registers 3 and 4, respectively

w 30 03 AA BB

# Write CC, DD, EE and FF to registers 5, 6, 7 and 8, respectively

> CC DD EE FF

# Place a commented breakpoint

b "AA BB CC DD EE FF was written, starting at register 3"

# Read back all six registers, starting at register 3

r 30 03 06b

The following example demonstrates usage of the Wait for Flag command, f:#example script for 'wait for flag' command

I i2cfast

# Switch to Page 44

w 30 00 2C

# Switch buffer

w 30 01 05

# Wait for bit D0 to clear. 'x' denotes a don't care.

29SLAU528–June 2013 Writing ScriptsSubmit Documentation Feedback


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f 30 01 xxxxxxx0

Any text editor can be used to write these scripts; jEdit is an editor that is highly recommended for generalusage. For more information, go to: www.jedit.org.

Once the script is written, it can be used in the command window by running the program, and thenselecting Open Script File... from the File menu. Locate the script and open it. The script then is displayedin the command buffer. The user also can edit the script once it is in the buffer and save it by selectingSave Script File... from the File menu.

Once the script is in the command buffer, it can be executed by pressing the Execute Command Bufferbutton. If breakpoints are in the script, the script executes to that point, and the user is presented with adialog box with a button to press to continue executing the script. When ready to proceed, the userpushes that button and the script continues.

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STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or

documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.Acceptance of the EVM is expressly subject to the following terms and conditions.1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility

evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are notfinished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. Forclarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditionsset forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software

1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or productionsystem.

2 Limited Warranty and Related Remedies/Disclaimers:2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software

License Agreement.2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM

to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatmentby an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in anyway by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications orinstructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or asmandated by government requirements. TI does not test all parameters of each EVM.

2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during thewarranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects torepair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shallbe warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) daywarranty period.

3 Regulatory Notices:3.1 United States

3.1.1 Notice applicable to EVMs not FCC-Approved:This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kitto determine whether to incorporate such items in a finished product and software developers to write software applications foruse with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unlessall required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not causeharmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit isdesigned to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority ofan FCC license holder or must secure an experimental authorization under part 5 of this chapter.3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:

CAUTIONThis device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may notcause harmful interference, and (2) this device must accept any interference received, including interference that may causeundesired operation.Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority tooperate the equipment.

FCC Interference Statement for Class A EVM devicesNOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 ofthe FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment isoperated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if notinstalled and used in accordance with the instruction manual, may cause harmful interference to radio communications.Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required tocorrect the interference at his own expense.

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FCC Interference Statement for Class B EVM devicesNOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 ofthe FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residentialinstallation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordancewith the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interferencewill not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, whichcan be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or moreof the following measures:

• Reorient or relocate the receiving antenna.• Increase the separation between the equipment and receiver.• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.• Consult the dealer or an experienced radio/TV technician for help.

3.2 Canada3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210

Concerning EVMs Including Radio Transmitters:This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:(1) this device may not cause interference, and (2) this device must accept any interference, including interference that maycause undesired operation of the device.

Concernant les EVMs avec appareils radio:Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitationest autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doitaccepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Concerning EVMs Including Detachable Antennas:Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna typeand its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary forsuccessful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna typeslisted in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibitedfor use with this device.

Concernant les EVMs avec antennes détachablesConformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type etd'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillageradioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotroperayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Leprésent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans lemanuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antennenon inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation del'émetteur

3.3 Japan3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に

輸入される評価用キット、ボードについては、次のところをご覧ください。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page

3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certifiedby TI as conforming to Technical Regulations of Radio Law of Japan.

If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law ofJapan to follow the instructions below with respect to EVMs:1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal

Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule forEnforcement of Radio Law of Japan,

2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect toEVMs, or

3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japanwith respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please notethat if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.

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http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page


【無線電波を送信する製品の開発キットをお使いになる際の注意事項】開発キットの中には技術基準適合証明を受けていないものがあります。技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用

いただく。2. 実験局の免許を取得後ご使用いただく。3. 技術基準適合証明を取得後ご使用いただく。

なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。日本テキサス・イ

ンスツルメンツ株式会社東京都新宿区西新宿６丁目２４番１号西新宿三井ビル

3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page

SPACER4 EVM Use Restrictions and Warnings:

4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOTLIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.

4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handlingor using the EVM, including without limitation any warning or restriction notices. The notices contain important safety informationrelated to, for example, temperatures and voltages.

4.3 Safety-Related Warnings and Restrictions:4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user

guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable andcustomary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to inputand output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, orproperty damage. If there are questions concerning performance ratings and specifications, User should contact a TIfield representative prior to connecting interface electronics including input power and intended loads. Any loads appliedoutside of the specified output range may also result in unintended and/or inaccurate operation and/or possiblepermanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting anyload to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuitcomponents may have elevated case temperatures. These components include but are not limited to linear regulators,switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using theinformation in the associated documentation. When working with the EVM, please be aware that the EVM may becomevery warm.

4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with thedangers and application risks associated with handling electrical mechanical components, systems, and subsystems.User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronicand/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safelylimit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility andliability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors ordesignees.

4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes allresponsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility andliability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and localrequirements.

5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurateas possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites asaccurate, complete, reliable, current, or error-free.

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SPACER6. Disclaimers:

6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THEDESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHERWARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANYTHIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.

6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS ANDCONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANYOTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRDPARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANYINVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OFTHE EVM.

7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITSLICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANYHANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATIONSHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANYOTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.

8. Limitations on Damages and Liability:8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,

INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESETERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HASBEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITEDTO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODSOR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALLBE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.

8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATIONARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVMPROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDERTHESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCEOF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS ANDCONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.

9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not ina resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicableorder, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),excluding any postage or packaging costs.

10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating tothese terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive reliefin any United States or foreign court.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2015, Texas Instruments Incorporated

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IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and otherchanges to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latestissue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of salesupplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s termsand conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessaryto support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarilyperformed.TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products andapplications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, orother intellectual property right relating to any combination, machine, or process in which TI components or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty orendorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of thethird party, or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alterationand is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altereddocumentation. Information of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or servicevoids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirementsconcerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or supportthat may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards whichanticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might causeharm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the useof any TI components in safety-critical applications.In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is tohelp enable customers to design and create their own end-product solutions that meet applicable functional safety standards andrequirements. Nonetheless, such components are subject to these terms.No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the partieshave executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use inmilitary/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI componentswhich have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal andregulatory requirements in connection with such use.TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use ofnon-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products ApplicationsAudio www.ti.com/audio Automotive and Transportation www.ti.com/automotiveAmplifiers amplifier.ti.com Communications and Telecom www.ti.com/communicationsData Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computersDLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-appsDSP dsp.ti.com Energy and Lighting www.ti.com/energyClocks and Timers www.ti.com/clocks Industrial www.ti.com/industrialInterface interface.ti.com Medical www.ti.com/medicalLogic logic.ti.com Security www.ti.com/securityPower Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defenseMicrocontrollers microcontroller.ti.com Video and Imaging www.ti.com/videoRFID www.ti-rfid.comOMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.comWireless Connectivity www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2015, Texas Instruments Incorporated

http://www.ti.com/audio

http://www.ti.com/automotive

http://amplifier.ti.com

http://www.ti.com/communications

http://dataconverter.ti.com

http://www.ti.com/computers

http://www.dlp.com

http://www.ti.com/consumer-apps

http://dsp.ti.com

http://www.ti.com/energy

http://www.ti.com/clocks

http://www.ti.com/industrial

http://interface.ti.com

http://www.ti.com/medical

http://logic.ti.com

http://www.ti.com/security

http://power.ti.com

http://www.ti.com/space-avionics-defense

http://microcontroller.ti.com

http://www.ti.com/video

http://www.ti-rfid.com

http://www.ti.com/omap

http://e2e.ti.com

http://www.ti.com/wirelessconnectivity

TLV320AIC3263EVM-U User Guide - TI

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