America’s Flexible Hybrid Electronics Manufacturing Institute

Flexible Hybrid Electronics…The

Tipping Point To Drive Printed

Electronics Market Growth

November 7, 2016

Jason Marsh

Director of Technology

AUGUS T 2 8 , 2 0 1 5

What is NextFlex?Established 28 August 2015

Lead FlexTech Alliance

Hub Location San Jose, California

Proposal Contributors 145+ in 27 states

Federal Funding $75 million

Committed Matching $96 million

Government Agencies Engaged 17 DOD & OGAs

Flex. Hybrid Elec.San Jose, CA

Additive Mfg.Youngstown,

OH

ElectronicsRaleigh, NC

Light/Modern Metals

Detroit, MI

Adv. Composites

Knoxville, TN

Albany & Rochester,

NYDigital Mfg &

Design.Chicago, IL

Smart Mfg.for Energy EfficiencyProj. Award TBD

• Nearly $500M Federal funding

catalyzed over $1.2B cost

share from consortia

• Institutes have attracted

hundreds of companies and

universities as active partners

from across the country

National Network of InstitutesNetwork Status

ESTABLISHED INSTITUTES

Revolutionary Fibers & Textiles

Boston, MA

Next Up

MEMBERS (*Founding)

Corporate

Tier 1*

Tier 2* *

Tier 3

Academic / Non-Profit

Tier 1

Tier 2

Tier 3 * *

* *

Honorary

NextFlex FHE Vision

Why FHE?

• Flexible• Stretchable• Conformable• Transparent• Biocompatible• Lightweight• Cost Effective

Photo Source: Phillips

Photo Source: Phillips

Flexible Hybrid Electronics

Integrated System

Integrated System

Application/ Attribute Defined

Semiconductor

Component

Process/Material Defined

DisplayComponent

Function Defined

FHE as a Market

The Challenge with Pure PE• Unimpressive Mobility at Operating Temp• VT Shift• It works in Display?

• 2x10-9

Duty Cycle

• Amorphous Silicon/Metal Oxides• Polymer• Carbon Nanotubes/Graphene

Photo Source: imec HRG

EMS Industry

$-

$0.50

$1.00

$1.50

$2.00

$2.50

$3.00

$3.50

2012 2013 2014 2015 2016

Fixed Assets in USD $BN

Flex Jabil

PC-Laptop-Tablet-Smartphone

39%

8%

4%8% 10%

29%32%

42%

-9%

4%

-8%

19%

37%

-32%

1%

18%

28%

7%

9%3%

-3%-9%

32%

0%-3%

5%10%

0%-2%

2%

-40%

-30%

-20%

-10%

0%

10%

20%

30%

40%

50%

$0

$50

$100

$150

$200

$250

$300

$350

$400

19

87

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1993

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)

Semiconductor Revenue• Semiconductor is estimated to contract

in 2016

• Display is moving to flex or seeing margin

erosion

• Thin Film PV market was impacted by

China and falling Silicon prices in 2009

Source: IHS

Why Is The Market Ready for FHE?

FHE has been hiding in plain sight…

FHE Building Blocks

Printed Antenna

Integrated Si Die

Printed BatteryStrain Gage

Skin Contact

Stretch ConductorCMOS Radio

Die on Stretch Die Thinning

Antenna Print

Trace PrintDie Placement

Integration & Lamination

Sensor

Processor

Memory

Power

Transceiver

Application Specific “Package”

Intelligent Devices

• Perishable Decision Window

Why? Our Time Domain World• When we have gone from manual operation in many process to

automation we have relied too heavily on the time domain…

Time Domain vs Need Domain• We rely far too heavily on the time

domain for automation

• Significant waste can be eliminated by operating in a “need” domain

IOT is about Efficiency• Significant waste can be eliminated by operating in a “need” domain

Photo Source: Intratab

FHE Device Requirements

• Robust ROI (the money is already being spent)

• Product Lifecycle Considerations

• Unobtrusive Form Factor

Test Die #1

Bump Tin-Lead

Bump height 130 μm

Bump diameter 120 μm

Pitch 254 μm (10 mils)

Die size 5 x 5 mm

No. of bumps 64

Wafer size 5”

Test Die #2

Bump Nickel-Gold

Bump height 20 +/-3 μm

Bump dia. 90 μm

Pitch 400 μm (16 mils)

Die size 10 x 10 mm

Wafer size 6”

No of dies ~ 132

Die Bonding to Textile Systems

Accelerate Wound Healing

Source: Purdue Universi ty

Additive Applications

Source: PARC

The resonance frequency is tuned 1) by changing BST loading or

2) by applying bias voltage

7 8 9 10 11 12 13-25

-20

-15

-10

-5

0

Frequency (GHz)|S

11| (d

B)

Measured:er=1

Measured:er=6

Simulated:er=1

Simulated:er=6

Printed two sided Frequency selective surface

on BST-COC-LDPE substrate; Front side (a)

and Back side (b).

Measured Tunability using CRC method

Frequency Tunable Materials

Integrated LinesPrint, Die Placement, Ablation, Etch, Bonding, Plasma, Encapsulation

Mass Customization

Soft Robotics Applications

Resistor Diode Transistor Capacitor

Source: PolyIC

Source: Stratasys Source: WileySource: HeraeusPrinted and organic electronics

Printed Circuit Elements for Basic Structures

Design Rule Check for Printed Active and Passive Circuits

Layout and Schematic Capture

DRC for Printed Components

DRC for CNT Transistor

Strategic Road-mapping FrameworkTPD1 Human Monitoring

TPD2 Asset Monitoring

TPD3 Integrate array antenna systems

TPD4 Soft robotics

Demos 1

Key Features

1.

2.

Demos 1

Key Features

1.

2.

“What” we do• Led by Tech council

• Strong end-user participation

• Demos describe “What” the institute

is doing in manufacturing

• Revised annually

MT1. Device Integration and Packaging

MT2. Materials

MT3. Printed Flexible Components& Microfluidics

MT4. Modeling & Design

MT5. Standards, Test & Reliability

“How” we do it• Industry Led at WG level

• Clear boundaries, detailed

roadmaps and deliverables feeding

into TPDs

• Develop “How” – gap analysis

• Drive Project Calls

• Revised semi-annually

TIME

In March we had 660 attendees at FLEX2016 from Industry, academia, government (FTA run)

Technical Working Groups: 140 participants focused on the Roadmapping

NextFlex HQ

Die Integration

and Assembly

Area(c lass 10,000 C lean Room)

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Seminar, Training and

Workforce Development

Materials

Wearables

Lab

Product

Display

Design

Lab

Materials

Registry

Library

Cubicles

Conf

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nf

Conf

Board

Room

Break Room

Lunch

Room

Screen

Exp

Printing and Additive

Processing Area(class 10,000 Clean Room)

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Conclusions• Market conditions are driving interest in alternative approaches

like FHE

• FHE is well positioned to combine advanced packaging and printed electronics approaches for IoT, wearables and other key growth markets

• You need not sit on the side lines…get involved and help make this market what we want it to be...

More Information

www.NextFlex.us

Contact: Jason Marsh, Director of Technology

Email: jmarsh@nextflex.us