Thin Film Technologies for Millimeter-Wave Passives … · Thin Film Technologies for...
Transcript of Thin Film Technologies for Millimeter-Wave Passives … · Thin Film Technologies for...
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Thin Film Technologies for Millimeter-Wave Passives and Antenna Integration
G. Carchon, S. Brebels, A. VasylchenkoIMEC, Kapeldreef 75, B-3001 [email protected]
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Geert Carchon, PhDEuMW 2008, Amsterdam 2
Outline
• Introduction– RF Challenges & Millimeter-Wave Applications
• 60GHz Millimeter-Wave IC & Antenna Constraints• Antenna Interface Technology Options
– PCB Technology
– Thin-film Technology with Embedded Passives
– MEMS Technology
• Conclusions
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Geert Carchon, PhDEuMW 2008, Amsterdam 3
Wireless communicationsSo many applications …
Broadcasting
WLAN
• Mobile handsets• Global positioning systems
• Earth observ. sat.• Fixed and mobile radio services• …
f [GHz]
50402010 30 60 70 80
Long Range Radar (ACC)
Mm-wave imaging
…
Short Range Radar
Large increase in mm-wave applications
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Geert Carchon, PhDEuMW 2008, Amsterdam 4
Introduction: RF Packaging driversMiniaturisation of RF/mm-wave Electronic Systems
RF packaging needs– Lower Cost
– Further miniaturization: size, thickness
– Solve interconnect/packaging bottleneck
– Higher functionality
– Lower power
Enabling Technologies:– IC-integration: RF-SOC
– High density interconnection and packaging technologies: RF-SIP
- Si interposer technology
- 3D Integration (TSV, embedding)
- Passive Integration (R, L, C, MEMS)
- Reconfigurable Functions (MEMS)
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Geert Carchon, PhDEuMW 2008, Amsterdam 5
The Chip-Package “Interconnect Gap”
• Improvement in density of standard interconnection and packaging technologies is much slower than the IC trends
IC scaling
Time
Size
sca
ling PCB scaling
Interconnect Gap
Advanced PCB
Laser via
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Geert Carchon, PhDEuMW 2008, Amsterdam 6
Connecting high density IC’s
PCB•Laminate technology
•Coarse contact pitch :800→300 μm
IC• Peripheral
Pad pitch :100→ 20 μm
• High speed• Cu/low-k
“Interposer”
High densityinterconnect
substrate
IC
InterconnectBoard
Package –“Interposer”
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Geert Carchon, PhDEuMW 2008, Amsterdam 7
Heterogeneous 3D RF System Integration Examples
10GHz Si-IC embedded in Si interposerPurdue Univ.
Reconstructed WaferInfineon
Flex foil (RF foil, UTCP) laminated in flex PCBIMEC
Autonomous wireless modules - IMEC WL-SiP concept - NXP
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Geert Carchon, PhDEuMW 2008, Amsterdam 8
Large increase in mm-wave applications
• Main mm-wave applications– High speed data transfer – indoor/outdoor ( 60 GHz, 80 GHz )
– Typical application scenarios
• Fast download of content from devices such as Wireless Digital Cameras, PDAs and Portable Audio Players
• Streaming uncompressed video: Wireless HDMI• Kiosk downloading, Wireless Desktop• Wireless backhaul networks
– Car radar (77 GHz) – long and short range radar
– Imaging (94 GHz)
• Main drivers towards mm-wave– Congestion of lower frequency bands
• Compared to low-GHz frequency bands, mm-wave offers– more bandwidth, less interference– more antenna gain/unit area thanks to small wavelength & antenna scaling
– Cost reduction enabled by
• CMOS technology allows high integration levels & mass production• Advanced packaging technologies for high level SiP integration
– Specific mm-wave properties
• mm-wave allows seeing through fog (ACR), clothes (weapon detection), …
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Geert Carchon, PhDEuMW 2008, Amsterdam 9
Outline
• Introduction– RF Challenges & Millimeter-Wave Applications
• 60GHz Millimeter-Wave IC & Antenna Constraints• Antenna Interface Technology Options
– PCB Technology
– Thin-film Technology with Embedded Passives
– MEMS Technology
• Conclusions
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Geert Carchon, PhDEuMW 2008, Amsterdam 10
60 GHz might become an established RF frequency for many applications
• Currently foreseen– Wireless HDMI
– Wireless PC interfaces
– Mobile device sync, upload, download
– more applications can evolve
• Several consortia and standardization efforts are active– IEEE802.15.3c
– ECMA TC48
– IEEE802.11-VHT
– Wireless HD
– CoMPA
– NGmS
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Geert Carchon, PhDEuMW 2008, Amsterdam 11
Implementation technologies for mm-wave60 GHz application case
• Should be oriented to the mass market– low cost
– low power
– small form factor
• III-V: very fast, very expensive, limited complexity– e.g. IEDM 2007: fT of 600 GHz, 1 THz
• SiGe(:C) BiCMOS (180–130nm): fT/fmax around 200 GHz• Advanced CMOS: fast and compatible with digital
26533545nm
17524565nm14023090nm
fT (GHz)fmax(GHz)
node low power
many 60 GHz publications show:90nm CMOS consumes lesspower than nowadays’ BiCMOS
from IBM VLSI Symp. 2007
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Geert Carchon, PhDEuMW 2008, Amsterdam 12
Is 90 nm CMOS a viable solution for a 60GHz radio?
• Pros– 60 GHz circuits in 90 nm offer good performance
– 90 nm cheaper than 65, 45, … nm
• Cons– the complexity of the digital modem will demand the most advanced
CMOS technology (= beyond 90 nm)
– the analog and digital baseband part requires very fast transistors
• 90nm implementation will consume (much) more power than e.g. 45nm implementation
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Geert Carchon, PhDEuMW 2008, Amsterdam 13
Single chip versus multi chip version(RFBW ≥ 1 GHz)
―
dig. BB
ADC, dig. BB
analog baseband (BB) + dig. BB
chip 2 (in “beyond 90nm”) remarkschip 1 (CMOS or BiCMOS)
if respin needed for analog/RF, everything must be redesigned
everything in “beyond 90nm”
chip 1 requires beyond 90nm; high datarate at chip1-chip2 interface
RF (+IF), analog BBincl. ADC
chip 1 also requires beyond 90nm
RF (+ IF),analog BB w/o ADC
output of chip 1 sensitive to interference
RF (+IF)
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Geert Carchon, PhDEuMW 2008, Amsterdam 14
Beamforming with a multiple antenna phased array system
• Benefits for RX:– Immunity against interfering signals
– SNR improvement
• Benefit for TX: relaxed requirement for POUT of PA– MM-wave CMOS PA has low output power and low efficiency
• Implementations: phase shift in signal path or in LO path
Δφ1
Δφ2
Δφ3
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Geert Carchon, PhDEuMW 2008, Amsterdam 15
Boundary conditions of beamforming
• Narrowband transceiver: Time delay compensation approximated with phase shift
• Solution for beamforming required that is compact, low power, modular in #antennas
Programmabletimedelay
signalcombination
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Geert Carchon, PhDEuMW 2008, Amsterdam 16
Antenna & Antenna Interface Problem
System definition
Data rate, range, QoS,Max. output power,
Battery life, Cost & size, Temperature, Lifetime, …
Antenna concept
Antenna type (dipole, patch, Vivaldi, …),
fixed beam/phased array, brick/tile assembly, …
Antenna & Package Technology
Lowcost PCB (FR4, BT, …),μwave PCB (Rogers, …),
LTCC, Thin-film,Antenna on chip, …
Antenna specs
Gain, polarization,bandwidth,
# of beams, …
Package specs
Thermal performanceMechanical performance, Electrical performance, Interconnect density, …
?
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Geert Carchon, PhDEuMW 2008, Amsterdam 17
Antenna & Antenna Interface Requirements
• Millimeter-wave applications use advanced CMOS & SiGe processes– ICs have high IO density and mechanically fragile low K and ultra low-K back-end
– Module implementation may be SoC or SiP approach
• Antenna & Antenna interface requirements– Must be low cost
– IC needs to be close to the antenna to minimize interconnect losses
– Should solve interconnect bottleneck (small pitch connections)
• Should not pose interconnect reliability problems due to CTE mismatch– Should allow low power solutions
• Low interconnect losses, high efficiency antennas• Better antenna interface performance allows to reduce # on-chip power amplifiers• High density flip-chip connections allow to reduce die size
– Ideally offers a scalable solution
• Scalable to larger arrays• Compatible with SOC and SiP approach (multiple Si die, external PA & switch, …)
– Results in miniature, very thin modules
• Offered by high density integration & 3D technology• Embedded passives providing decoupling close to the IC
– Should solve antenna – IC interference problem
– Should take the heat out of the ICs
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Geert Carchon, PhDEuMW 2008, Amsterdam 18
Integrated 60 GHz antenna array architecture
• Brick concept– Greater depth (more room for circuits
or thermal management)
– Higher cost but lower yield allowed (replacement of failing devices)
– Compatible with antennas with larger bandwidth (dipole and flared types of elements)
– Weak compatibility with single RF-IC
– Limited scaling for single RF-IC case
• Tile concept– Higher integration density
– Lower cost when high yield can be realised (e.g. wafer level processing)
– Relatively narrow-band antennas (patch and printed dipole)
– Better compatibility with single RF-IC
– Limited scaling for single RF-IC case
Preferred
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Geert Carchon, PhDEuMW 2008, Amsterdam 19
Integrated planar 60 GHz antenna array
• Why we prefer a low dielectric antenna substrate (air, styrofoam, teflon, quartz, …)– Best bandwidth-efficiency product
– Low surface wave loss and hence a larger scan range
– Problem: have good radiation efficiency & broadband operation @ low cost
Efficiency of square patch antenna Bandwidth of square patch antenna
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Geert Carchon, PhDEuMW 2008, Amsterdam 20
Patch antennas are narrowband
• How to realize a 20% bandwidth while preserving efficiency?– Stacked patch topology
– Low dielectric substrates
• Homogeneous low–dielectric substrate: – e.g. Rogers Duroid 5880 (epsr=2.2), quartz etc …
• Higher dielectric substrate (e.g. Silicon) with air cavities
[Gauthier G. et al., A 94-GHz Aperture-CoupledMicromachined Microstrip Antenna]
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Geert Carchon, PhDEuMW 2008, Amsterdam 21
Outline
• Introduction– RF Challenges & Millimeter-Wave Applications
• 60GHz Millimeter-Wave IC & Antenna Constraints• Antenna Interface Technology Options
– PCB Technology
– Thin-film Technology with Embedded Passives
– MEMS Technology
• Conclusions
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Geert Carchon, PhDEuMW 2008, Amsterdam 22
Antenna design on PCBMany material possibilities
• PCB materials for antenna with high bandwidth-efficiency product require– Low dielectric substrate (εr<4)
– Low dielectric losses (losstangent <0.01)
– Antenna feeding using microstrip lines (substrate height<λ/10)
260 μm0.0083.750 μmNelco *
…
0.0009
0.0027
0.0013
Losstangent@ 10 GHz
337 μm2.2127 μmRogers RT5880
272 μm3.38203 μmRogers RO4003C
289 μm3127 μmRogers RO3003
λ/10 @ 60GHz
εr@ 10 GHz
Minimum substrate height
Substrate
* Dielectric properties are dependent on actual laminate build-up (resin content)
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Geert Carchon, PhDEuMW 2008, Amsterdam 23
• Single element on Rogers RT5880 @ 61 GHz– Matching
– H-plane radiation pattern Radiation efficiency= 81%
Antenna design on PCBVarious performances
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Geert Carchon, PhDEuMW 2008, Amsterdam 24
Antenna design on PCBVarious performances
• Slot coupled patch antenna with two stacked patches on Nelco@ 61 GHz– Matching
– H-plane radiation pattern Radiation efficiency= 50%
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Geert Carchon, PhDEuMW 2008, Amsterdam 25
Interconnect design on PCBDifferent constraints
• Manufacturability of routing layers on PCB materials selected as antenna material– A potential problem is the different thermal expansion of CMOS
chip (CTESi=3 ppm/oC) and the PCB material
6012-15.512-15.5Nelco
48
14
17
CTE y [ppm/oC]
23748Rogers RT5880
4614Rogers RO4003C
2417Rogers RO3003
CTE z [ppm/oC]
CTE x [ppm/oC]
Substrate
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Geert Carchon, PhDEuMW 2008, Amsterdam 26
Interconnect design on PCBDifferent constraints
• Manufacturability of routing layers on PCB materials selected as antenna material– Not all PCB materials allow manufacturing of 100 um diameter
substrate vias
• minimum via diameter is typically larger than substrate height
50 μmNelco
127 μmRogers RT5880
203 μmRogers RO4003C
127 μmRogers RO3003
Minimum substrate height
Substrate
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Geert Carchon, PhDEuMW 2008, Amsterdam 27
Interconnect design on PCBDifferent constraints
• Manufacturability of routing layers on PCB materials selected as antenna material– Adding microvia layers could be a solution for realizing smaller
diameter vias. Teflon based materials are however not compatible with standard microvia layers.
NoNelco
YesRogers RT5880
NoRogers RO4003C
YesRogers RO3003
Teflon based ?Substrate
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Geert Carchon, PhDEuMW 2008, Amsterdam 28
Measurement result on PCB interconnect
• Low loss microstrip interconnections possible– 0.35dB/mm interconnect loss in microvia/core layers
– 0.45dB/mm interconnect loss for CPW
– Better performance possible on Rogers
Prepreg μvia
Core
18 um Cu metallization Plated Au finish6mm line
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Geert Carchon, PhDEuMW 2008, Amsterdam 29
Outline
• Introduction– RF Challenges & Millimeter-Wave Applications
• 60GHz Millimeter-Wave IC & Antenna Constraints• Antenna Interface Technology Options
– PCB Technology
– Thin-film Technology with Embedded Passives
– MEMS Technology
• Conclusions
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Geert Carchon, PhDEuMW 2008, Amsterdam 30
Thin Film Integrated Passive Devices (IPD)
• Several Technologies Possible:– Ceramic / Laminate / Thin-film / … -based MCM
• IMEC Thin film MCM-D offers– 8” Wafer-level Processing
– Photo-lithography defined features
• Excellent control over lateral dimensions• High repeatability• High degree of miniaturization
– Thin film deposited resistor & dielectric layers
• High density• High precision, repeatable, small tolerances
– IC design style possible
• Substrate choice– AF45 Glass
• low cost, good RF properties– HR-Si
• thermal advantages• micro-machining (cavities, TSV)
Glass SiPBeyne, ISSCC2004
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Geert Carchon, PhDEuMW 2008, Amsterdam 31
RF-IPD Technology Multilayer Thin Film with Integrated Passives
• Substrate: glass or HR-Si (8”)
• 3 metal planes : Al / Cu / Cu-Ni-Au
• Coplanar waveguide (CPW) lines– Electroplated Cu : 3-5 μm thick
– Smallest feature size : width/spacing: down to 5 μm / 7.5 μm
• Resistors : TaN (25 Ω/ )
• Capacitors : Ta2O5 (0.75 nF/mm2) & BCB (6.5 pF/ mm2) & interdigital
• Inductors : 0.6 to 80 nH, Q : 30 - 150
• Flip-chip / wirebond interconnections
• Integrated vias on HR-Si
2 m metalμ Ti/Cu 5 m μ BCB
5 m μ BCB3 m metalμ Ti/Cu/Ti
1 m bottom Alμ contact metalTaN- resistor
Ni/Au component layer
700 m substrate
μ Glass 1 m top Alμ contact metal
Ta O capacitor2 5
Main Features
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Geert Carchon, PhDEuMW 2008, Amsterdam 32
RF-IPD on AF45 Passive Circuits & Demonstrator Modules
31-60GHzCoupler
3-5GHz Balun
5.2GHz BPFilter
30GHz BP Filter
2.45GHzBP Filter
Passives
2.4GHz RF Radio 5.2GHz WLAN Front-End
Modules
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Geert Carchon, PhDEuMW 2008, Amsterdam 33
1990 1995 2000 2005 2010 2015
Roadmap RF-IPD technology
Ceramic20µm
Glass20µm Glass
10µm GlassHigh-ρ Si
10µm
Laminate20µm Laminate
10µm
3D
Increasing frequency
5µm
High-K caps
Embedded Actives
Integrated RF-MEMS
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Geert Carchon, PhDEuMW 2008, Amsterdam 34
RF-IPD Technology with Through-Si vias
•RF-IPD with Through Si-Vias–Dimensions :
• Bottom D=100µm• Top D=50µm
–Allows for :• Use of substrate back-side as ground-
plane• Microstrip line configurations
100um HRSi
C R L
Via
Cu/Ni/Au Cu Al
HR-SI RF-IPDwafer (100µm)
SiO2 layer
Metal 1RF-IPD(1µm Al thick)
Polymerlayer
Electroplated Cu layer
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Geert Carchon, PhDEuMW 2008, Amsterdam 35
RF-IPD on HR-SiSurface passivation improves performance
• Surface passivation oxide-HRSi interface– fixed charges in oxide cause DC dependancy & performance spread
– Ar implantation
• increased performance• lower spread• lower DC-bias dependancy
+30V
+20V-30V-20V
0V
CPW on HR-Siwithout implantation
CPW on HR-Siwith Ar implantation
HRSi
SiO2
Best Student PaperEuMIC 2006
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Geert Carchon, PhDEuMW 2008, Amsterdam 36
Multiple RF feedthrough optionsCPW to CPW / MS to CPW / Vialess
• CPW to CPW– CPW on BCB 50um/25um
• 0.14dB/mm• Backside CPW probably lower loss
(75um/30um)– <0.1 dB per transition @40GHz
• MS to CPW– MS line
• 0.07dB/mm @ 40GHz– CPW on BCB
• 0.14dB/mm @ 40GHz– ~0.1dB per transition @40GHz
• CPW to MS vialess– Narrowband transition, only for micro/mm-
wave
– Size related to frequency
– <0.1dB per transition @ 40GHz
0.4mm 0.4mm0.3mm
0.5mm 0.5mm0.3mm
400x400um
0.4mm 0.4mm0.3mm
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Geert Carchon, PhDEuMW 2008, Amsterdam 37
Filters at various frequencies (measurements) demonstrated
Initial measurements – no parylene
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Geert Carchon, PhDEuMW 2008, Amsterdam 38
RF-IPD on HR-Si Coupled line & cavity filters at 60GHz
• Coupled line filter– 4.2% BW
– 2dB IL
• Cavity filter– 6.4% Bandwidth
– 1.6dB Insertion loss
RL (dB)IL (dB)
Measurement
Simulation
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Geert Carchon, PhDEuMW 2008, Amsterdam 39
Antenna Design
• Micromachined Si antenna– Allows high radiation efficiency as ultra low loss material is used (air)
– No stacked patches needed to obtain sufficient bandwidth
– BUT: expensive substrate
• HR-Si with air cavity (simulated)– Slot coupling to primary rectangular patch
– 10dB Return loss, Gain 7.1dB
– Backward radiation through coupling slot to active circuits
– Efficiency > 90%
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Geert Carchon, PhDEuMW 2008, Amsterdam 40
Si Interposer advantages for mm-wave applications
• Si interposer advantages– Solves interconnect bottleneck (compatible with small pitch connections
according to ITRS roadmap)
– Results in low power IC solutions by using
• High efficiency antennas (decoupling interconnect & antenna substrate for larger arrays)
• Lower interconnect losses (reduced pad pitch, higher quality substrate)• Lower IC power (ant. interface improves IC Tx/Rx chain constraints)
– Results in smaller ICs
• Better antenna interface performance allows to reduce # on-chip power amplifiers
• High density flip-chip connections allow to reduce die size– Results in scalable solutions
• Scalable to larger arrays• Compatible with SOC and SiP approach (multiple Si die, external PA &
switch, …)– Results in miniature, very thin modules
• Offered by high density integration & 3D technology• Embedded passives providing decoupling close to the IC
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Geert Carchon, PhDEuMW 2008, Amsterdam 41
Outline
• Introduction– RF Challenges & Millimeter-Wave Applications
• 60GHz Millimeter-Wave IC & Antenna Constraints• Antenna Interface Technology Options
– PCB Technology
– Thin-film Technology with Embedded Passives
– MEMS Technology
• Conclusions
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Geert Carchon, PhDEuMW 2008, Amsterdam 42
RF-MEMS
• Possible applications– Adaptive antenna matching
– Phase shifters
– Adaptive antenna
– Micromachined cavities for high Q resonators
• Potentially tunable– Micromachined antennas Slot
coupling
Carrier substrate
GND
Feeding line GND via
SiSiVtune
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Geert Carchon, PhDEuMW 2008, Amsterdam 43
Mm-wave Hybrid Integration on HR-Si MCM-D
• 0/1-level packaged 3mm 50ΩCPW line
• 0/1-level packaged 3mm 50ΩCPW line with embedded SPST
Cap
4 k .cm SiΩ
MEMS
-40
-30
-20
-10
0
0 20 40 60 80 100
Frequency (GHz)
Ret
urn
Loss
(dB
)
-4
-3
-2
-1
0
Insertion Loss (dB)
-40
-30
-20
-10
0
0 20 40 60 80 100
Frequency (GHz)
Ret
urn
Loss
(dB
)
-4
-3
-2
-1
0
Insertion Loss (dB)
• mm-wave packaging using BCB-bonding
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Geert Carchon, PhDEuMW 2008, Amsterdam 44
Conclusions
• Large increase in millimeter-wave interest due to– Continued CMOS scaling
– Advanced packaging technology
• Antenna & antenna interface– PCB
• allows high performance antennas & interconnects (low K, low tanδ)• has lower density interconnects, relatively large microvias and limited
passive integration (interconnect bottleneck) (150um pitch FC IO)• low K and low loss PCB <> dense interconnect PCB <> low cost PCB
– Si interposer
• Allows high performance antennas & interconnects• Interconnect bottleneck can be solved, hence, scalable to SoC and SiP
integration• Passive integration for reduced size• Potential cost issues
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Geert Carchon, PhDEuMW 2008, Amsterdam 45
Acknowledgement
• IMEC thin-film integration team• IMEC assembly team• IMEC antenna design team• IMEC IC design team
• European Space Agency – 3D Microwave module packaging (contract number 19346/05/NL/Sfe)
• 3DμTune– EU 6th FW project number 027768
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Geert Carchon, PhDEuMW 2008, Amsterdam 46