Thermal Management and Reliability of Power Electronics ... · 2 Importance of Thermal Management...
Transcript of Thermal Management and Reliability of Power Electronics ... · 2 Importance of Thermal Management...
NREL is a national laboratory of the U.S. Department of Energy, Office of Energy Efficiency and Renewable Energy, operated by the Alliance for Sustainable Energy, LLC.
Thermal Management and Reliability of Power Electronics and Electric Machines
Sreekant Narumanchi Organization: National Renewable Energy Laboratory Email: [email protected] Phone: 303-275-4062 NREL Team Members: Kevin Albrecht, Kevin Bennion, Emily Cousineau, Doug DeVoto, Xuhui Feng, Charlie King, Joshua Major, Gilbert Moreno, Paul Paret, Meghan Walters Advancements in Thermal Management Conference Denver, Colorado August 3, 2016 NREL/PR-5400-66754
This presentation does not contain any proprietary or confidential information.
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Importance of Thermal Management and Reliability • Excessive temperature degrades the performance, life, and
reliability of power electronics and electric machines.
• Advanced thermal management technologies enable o Keeping temperature within limits o Higher power densities o Lower-cost materials, configurations, and system o Improve lifetime/reliability
• Predictive lifetime models help in time-and cost-effective design.
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DOE Vehicle Technologies Office Electric Drive Technologies (EDT) Program Targets
(on-road status) • Discrete components • Silicon semiconductors • Rare-earth motor magnets
• Fully integrated components • Wide-bandgap (WBG) semiconductors • Non rare-earth motors
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From DOE EV Everywhere Grand Challenge Blueprint, http://energy.gov/sites/prod/files/2016/05/f31/eveverywhere_blueprint.pdf
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Advanced Packaging Reliability
Electric Machines Thermal
Management
Power Electronics Thermal
Management
NREL EDT Research Focus Areas
Research Focus Areas Will Reduce Cost and Improve Performance and Reliability
Enabling Materials
Photo Credit: Jana Jeffers, NREL
Photo Credits: Doug DeVoto, NREL Photo Credits: Doug DeVoto and Gilbert Moreno, NREL
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Power Electronics Thermal Management
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Power Electronics Thermal Management Strategy • Packages based on WBG devices
require advanced materials, interfaces, and interconnects o Higher temperature capability o Higher effective thermal conductivity
• Low-cost techniques to increase heat transfer rates o Coolants – water-ethylene glycol
(WEG), air, transmission coolant, refrigerants
o Enhanced surfaces o Flow configurations
• System-level thermal management
(capacitor and other passives)
WBG Module Packaging Design with Integrated Cooling
Device
Metalized Substrate Substrate Attach
Integrated Base/Cold Plate
Die Attach
Interconnect Encapsulant
Enclosure Terminal
Coolant Inlet
Coolant Outlet
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The Challenge with Interfaces/Interface Materials • Interfaces can pose a major bottleneck to heat removal.
• Bond materials, such as solder, degrade at higher temperatures and are prone to
thermomechanical failure.
• Problem can become more challenging for configurations employing WBG devices.
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2.5
3
3.5
4
4.5
100 110 120 130 140 150 160Dist
ance
acro
ss th
e Pa
ckag
e (m
m)
Temperature (°C)
New Degraded
Degraded Substrate Attach
132.5°C 156.7°C
Module Packaging Design with Integrated Cooling
Device
Metalized Substrate Substrate Attach
Integrated Base/Cold Plate
Die Attach
Interconnect Encapsulant
Enclosure Terminal
Coolant Inlet
Coolant Outlet
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Thermal Resistance of Various Non-Bonded Thermal Interface Materials (TIMs)
• Red dashed line in the two figures above is the target thermal resistance (3 to 5 mm2K/W).
• Most non-bonded TIMs do not come close to meeting thermal specification of 3 to 5 mm2K/W at approximately 100-μm bond line thickness.
0
50
100
150
200
250
300
350
400
0 0.05 0.1 0.15 0.2Thickness (mm)
Ther
mal
resi
stan
ce (m
m2 K
/W)
Arctic Silver 5
Thermalcote-251G
Wacker Silicone P12
Keratherm KP77
Dow Corning TC5022
Shinetsu-X23-7783D-S
Chomerics XTS8010
Chomerics XTS8030
3M AHS1055M
Honeywell PCM45
172 kPa, ~ 75 C sample temperature TIM thickness in all cases is 100 μm
0
25
50
75
100
125
150
175
200
225
250
275
Ther
mal
cote
25
1G
Wac
ker
Sili
cone
P12
Arc
tic S
ilver
5
Ker
athe
rm
KP
77
Cho
mer
ics
XTS
8010
Cho
mer
ics
XTS
8030
Hon
eyw
ell
PC
M45
Dow
Cor
ning
TC
-502
2
Shi
nets
u X-
23-
7783
D-S
3M A
HS
105
5M
Res
ista
nce
(mm
2 K/W
)
Bulk resistance Contact resistance
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Pump Laser
Function Generator Lock-in Amplifier
Multi-mode optical fiber
Collimation lenses
Lens tube
Modulated pump laser
Optical chopper
Probe laser
Reflecting mirrors
Photodiode
Modulated pump laser
Heat transfer
Probe laser
Probed temperature
variation
Sample
Thermal Resistance of Thermoplastics with Embedded Carbon Fibers
• Thermoplastics with embedded carbon fibers show very good thermal performance
Frequency-domain transient thermoreflectance experiment configuration Thermoplastic
film HM-2
Bondline thickness (µm)
60
Bulk thermal conductivity (W/m·K)
37.5 ± 6.8
Contact resistance (mm2·K/W)
3.1 ± 1.1
Total thermal resistance (mm2·K/W)
7.5 ± 1.9
Photo: Courtesy of BtechCorp
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• Bonded interface resistance in the range of 0.4 to 2 mm2K/W is possible. Materials developed in the DARPA programs are in this range
o Copper nanowires o Boron-nitride nanosheets (0.4 mm2K/W for 30- to 50-µm bondline thickness) o Copper nanosprings (1 mm2K/W for 50-µm bondline thickness with very good reliability) o Graphite solder o Nanotube-based
Other Bonded Interface Materials
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Integrated Module Heat Exchanger
• Up to 100% increase in power per die area
• Up to 34% increase in coefficient of performance (efficiency)
NREL integrated module heat exchanger Patent No.: US 8,541,875 B2
Photo Credit: Kevin Bennion, NREL
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Liquid Jet-Based Plastic Heat Exchanger
Metalized substrate
Base plate
Plastic manifold
Device
Bonded interface material (BIM)
Wire/ribbon bonds
WEG jets
Enhanced surface
• Up to 12% increase in power density
• Up to 36% increase in specific power
Photo Credit: Doug DeVoto, NREL
Photo Credit: Gilbert Moreno, NREL
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Two-Phase Cooling for Power Electronics
Fundamental Research
Module-Level Research
Inverter-Scale Demonstration
Vapor Liquid
Evaporator
Characterized performance of HFO-1234yf and HFC-245fa
Achieved heat transfer rates of up to ~200,000 W/m2-K
Reduced thermal resistance by over 60% using immersion two-
phase cooling of a power module
Quantified refrigerant volume requirements
Dissipated 3.5 kW of heat with only 250 mL of refrigerant
Predicted 58%–65% reduction in thermal resistance via indirect and
passive two-phase cooling
Power electronics modules
Evaporator
Air-cooled condenserPhoto Credit: Bobby To, NREL
Photo Credit: Gilbert Moreno, NREL Photo Credit: Gilbert Moreno, NREL
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WBG Power Electronics Thermal Management
Create thermal models of an automotive inverter
Simulate WBG operation using the inverter model
Explore advanced cooling strategies
Quantify the inverter component temperatures
under elevated device temperatures
Validate the thermal models
Evaluate different module topologies
Experimentally validate some key thermal management
concepts
cold plate
copper copper-molybdenum direct-bond copper
cold plate
Develop thermal management concepts to
enable WBG power electronics
Identify the primary thermal paths through which heat is
conducted from the devices to the other components
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10
20
30
40
50
60
70
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90
100
0 2 4 6 8 10 12 14 16
Spec
ific
ther
mal
resi
stan
ce: R
" th
,j-l (m
m2 -
K/W
)
Flow rate (liters per minute)
Experiment
Model: maximum
Model: average
Photo Credit: Scot Waye, NREL
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Advanced Packaging Reliability
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Bonded Interface Material Reliability
• Thermoplastics yield very good reliability
• Reliability of
sintered silver is better than solder
Photo Credit: Doug DeVoto, NREL
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Bonded Interface Material Reliability
• Thermoplastics yield very good reliability
• Reliability of
sintered silver is better than solder
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Bonded Interface Material Finite Element Modeling
-80
-40
0
40
80
120
160
0 2000 4000 6000 8000 10000 12000 14000
Tem
pera
ture
(°C)
Time (s)
Temperature Cycling Profile • Temperature cycling parameters: – -40°C to 150°C – 5°C/minute ramp rate – 10 minute dwell/soak time
• Anand viscoplastic material model applied to solder layer
• Temperature-dependent elastic material properties incorporated for base plate and substrate
Quarter Symmetry Model
Substrate
Solder
Base Plate
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Strain Energy Density
Top view of strain energy density contour plot in the solder layer
Corner fillet region
• Volume-averaged strain energy density/cycle (ΔW) in the corner fillet region is the final output
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Impact of Geometric Variations on Reliability
Profile Joint Thickness (µm) ΔW (MPa) Predicted experimental
cycles to failure – Nf
Thermal cycle
50 2.65 465
100 1.36 1,400
150 0.93 2,600
• Joint Thickness
• Substrate Variation
Profile Substrate CTE (x 10-6/°C) ΔW (MPa)
Predicted experimental
cycles to failure – Nf
Thermal cycle
Si3N4 2.8 1.36 1,400
AlN 4.5 1.08 2,000
Al2O3 8.1 0.44 9,000
Predictive Lifetime Model, Nf = 2312.5 (ΔW)-1.645
CTE: coefficient of thermal expansion Si3N4 : silicon nitride AlN: aluminum nitride Al2O3: aluminum oxide
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Electric Machines Thermal Management
22 DOE APEEM FY14 Kickoff Meeting
Stator Laminations
Slot Winding
Rotor Laminations Rotor
Hub
Case
Air Gap
Stator-Case Contact
Nozzle/Orifice
ATF Impingement
Shaft ATF Flow
ATF Flow
Stator Cooling Jacket
End Winding
Motor Axis
Electric Machines Thermal Management Strategy
Problem • Multiple factors impacting heat
transfer are not well quantified or understood.
Contributing Factors 1. Direction-dependent thermal
conductivity of lamination stacks 2. Direction-dependent thermal
conductivity of slot windings and end windings
3. Thermal contact resistances (stator-case contact, slot-winding interfaces)
4. Convective heat transfer coefficients for ATF cooling
5. Cooling jacket performance
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1
1
2
3
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Motor Cooling Section View
ATF: Automatic Transmission Fluid
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Transmission Oil Jet Heat Transfer Characterization
Heat transfer coefficients of all target surfaces at 50°C inlet temperature
• Surface features increase heat transfer
18 AWG surface target
Note: Heat transfer coefficient calculated from the base projected area (not wetted area)
Top View
Side View 50°C Inlet Temperature
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2000
4000
6000
8000
10000
12000
0 2 4 6 8 10 12
Heat
Tra
nsfe
r Coe
ffici
ent [
W/m
2 K]
Velocity [m/s]
18 AWG22 AWG26 AWGBaseline
Photo Credits: Gilbert Moreno, NREL
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• Enclosure allows direct impingement on motor for heat transfer measurements and flow visualization
Stator Thermal Management with Transmission Oil
Enclosure with stator and ATF cooling Jet impingement on target surface
Photo Credits: Kevin Bennion, NREL
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• Performing thermal analysis on passive thermal materials
Motor Passive Thermal Materials Characterization
Slot windings
Slot liner or ground insulation
Stator laminations
Measure cross-slot winding thermal conductivity
Measure winding-to-liner thermal contact resistance
Measure liner-to-stator thermal contact resistance
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Lamination Stack Effective Thermal Conductivity
Measured Stack Thermal Resistance
Lamination-to-Lamination Thermal Contact Resistance
Effective Through-Stack Thermal Conductivity
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
0 200 400 600
Asym
ptot
ic S
tack
The
rmal
Con
duct
ivity
[W
/m-K
]
Pressure [kPa]
M19 26 Gauge
M19 29 Gauge
HF10
Arnon7
Error bars represent 95% confidence level
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Transverse Winding Thermal Conductivity
0.00.20.40.60.81.01.21.41.61.8
3 4 5 6 7
Ther
mal
Con
duct
ivity
[W/m
-K]
Sample Thickness [mm]
22 AWG Transverse
data
FEA
0.00.20.40.60.81.01.21.41.61.8
3 4 5 6 7
Ther
mal
Con
duct
ivity
[W/m
-K]
Sample Thickness [mm]
19 AWG Transverse
data
FEA
• Error bars represent 95% measurement uncertainty (U95)
• Finite element analysis (FEA) model results based on measured sample copper fill factor
• FEA assumes hexagonal or closed-pack wire pattern
Photo Credit: Emily Cousineau, NREL
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Slot Liner Paper and Thermal Interface Resistances
• Limited sample size for measurements
• Slot liner paper thermal conductivity of 0.18 W/m-K (thickness 0.29 mm)
• Winding thermal conductivity measured to be 0.88 ± 0.11 W/m-K (U95)
• FEA estimate of thermal conductivity is 0.99 W/m-K for measured copper fill factor
0
1000
2000
3000
Slot Liner Paper Paper to Windingbond
Paper to Flat Copper
Laye
r The
rmal
Res
ista
nce
[mm
²K/W
]
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• Industry-led inverter development with VTO and AMO funding – Delphi inverter (VTO) – GM inverter (VTO) – Wolfspeed WBG inverter (VTO) – John Deere WBG inverter (AMO)
• UQM Technologies motor development (VTO funding)
Participation in Industry-Led Projects
AMO: Advanced Manufacturing Office VTO: Vehicle Technologies Office
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Summary
• Low-cost, high-performance thermal management technologies are helping meet aggressive power density, specific power, cost, and reliability targets for power electronics and electric machines.
• NREL is working closely with numerous industry and research partners to help influence development of components that meet aggressive performance and cost targets through: o Development and characterization of cooling technologies o Thermal characterization and improvements of passive stack materials and interfaces.
• Thermomechanical reliability and lifetime estimation models are important
enablers for industry in cost- and time-effective design.
NREL is a national laboratory of the U.S. Department of Energy, Office of Energy Efficiency and Renewable Energy, operated by the Alliance for Sustainable Energy, LLC.
For more information, contact:
NREL APEEM Section Supervisor Sreekant Narumanchi [email protected] Phone: (303) 275-4062
Acknowledgments:
Susan Rogers and Steven Boyd EDT Program Vehicle Technologies Office Advanced Manufacturing Office U.S. Department of Energy
Industry and Research Partners Industry OEMs Ford, GM, FCA, John Deere, Tesla, Toyota
Suppliers/Others 3M, NBETech, Curamik, DuPont, GE Global Research, Semikron, Kyocera, Sapa, Delphi, Btechcorp, ADA Technologies, Remy/BorgWarner, Heraeus, Henkel, Wolverine Tube Inc., Wolfspeed, Kulicke & Soffa, UQM Technologies, nGimat LLC
Agencies DARPA
National Laboratories Oak Ridge National Laboratory, Ames Laboratory
Universities Virginia Tech, University of Colorado Boulder, University of Wisconsin, Carnegie Mellon University, Texas A&M University, North Carolina State University, Ohio State University, U.S. Naval Academy