Thermal Interface Materials LTM6300 Phase Change Material · 2020. 6. 16. · Japan:...
Transcript of Thermal Interface Materials LTM6300 Phase Change Material · 2020. 6. 16. · Japan:...
Thermal Interface Materials
Thermal Interface MaterialsThermal Interface Materials
LTM6300 Phase Change Material
Thermal Interface Materials
Honeywell TIMs Serve Multiple Applications
Consumer Electronics
Telecomm
IT/Enterprise
Automotive & Power
High-Brightness LED
LTM6300-SPHigh Thermal Conductivity Phase Change Material for Low Power Applications
F E AT U R E S & B E NE F I T S
• High thermal conductivity
• Phase change at 45°C
• Ease of application • Superior handling and reworkability
• Superior reliability performance
• Available in paste/printable format
Honeywell’s LTM6300-SP phase change material (PCM) is specifically
formulated for applications such as LED and other low power density
devices. The patented* material is provided in paste/printable format.
It has a tailored filler size that provides exceptional performance.
LTM6300-SP thermal interface material changes phase at 45˚C to ensure
maximum surface conformance and hence minimal contact resistance.
Use of LTM6300-SP provides longer life and good device stability while
keeping product cost low.
LTM6300-SP Thermal Impedance (TI) vs. Pressure
LTM6300-SP
is well-suited for
devices with low
power density.
0.00
0.02
0.04
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0.10
0.12
0.14
0.16
0.18
0 5 10 15 20 25 30 35 40 45
Imp
ed
en
ce
(°C
cm
2/W
)
Pressure (PSI)
Honeywell Electronic MaterialsUSA: 1-509-252-2102
China: 86-21-50203266
Germany: 49-5137-999-9199
Japan: 81-3-6730-7092
Korea: 82-2-3483-5076
Singapore: 65-6580-3593
www.electronicmaterials.com
MORE HONEYWELL TIMsLTM6300 is part of Honeywell’s TIM Solutions
family of phase change materials. Whatever the
thermal challenge, we offer a TIM product that
provides just the right characteristics for your
application. Find out more about:
PTM7000 Series PTM6000 Series
PTM5000 Series PCM45 Series
TCM11/12 Series LTM Series
By visiting: electronicmaterials.com
LTM6300-SP
printed on LED
modules.
LTM6300-
SP may be
provided in
jars or cans.
LTM6300-SP Thermal
Impedance vs. Bond
Line Thickness
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0.10
0.20
0.30
0.40
0.50
0.60
0.70
0 1 2 3 4 5 6
Imp
ed
en
ce
(°C
cm
2/W
)
Bond Line Thickness (mils)
LTM6300 Technical Information
Although all statements and information contained herein are believed to be accurate and reliable, they are presented without guarantee or warranty of any kind, express or implied. Information provided herein does not relieve the user from the responsibility of carrying out its own tests and experiments, and the user assumes all risks and liability for use of the information and results obtained. Statements or suggestions concerning the use of materials and processes are made without representation or warranty that any such use is free of patent infringement and are not recommendations to infringe any patent. The user should not assume that all toxicity data and safety measures are indicated herein or that other measures may not be required.
Physical Properties Unit Test Method LTM6300-SP
Thermal Conductivity W/m·K ASTM D5470 ≥2.03
Thermal Impedance ˚Ccm2/W ASTM D5470 Modified ≤0.40
Specific Gravity g/cm3 ASTM D374 1.8
Viscosity Pa·s @2 1/s, 25˚C RehometerHON <150,000
Volume Resistivity Ω·cm ASTM D257-700 ≥3.0x1015
Typical No Shim Bond Line @ 40 psi mil NA 0.5
THERMAL IMPEDANCE POST RELIABILITY (ASTM E1461)
End of Line 0.25˚C-cm2/WTemperature Cycling “B” 0.17˚C-cm2/W
(-55˚C to +125˚C, 1000 cycles)1000 hrs @ 85˚C & 85% RH 0.23˚C-cm2/WHAST, 96h 0.23˚C-cm2/W1000 hrs @ 150˚C 0.18˚C-cm2/W
Mail: [email protected]
LTM6300-SP Printing GuidelinesThermal managemenT Technical bulleTin:
Application of LTM6300-SP• TheapplicationofLTM6300-SPissuitableforvariousLEDapplicationsinbacklight,generallightingandillumination
Different shapes of LTM6300-SP are possible depending on the screen print design.
• LTM6300-SPwilldryafterapproximately15hoursatambienttemperatureswithathicknessof10to12mils*
• LTM6300-SPdrytimecanalsobeacceleratedinaforcedexhaustovenorsimilarequipmentat50˚Cfor3.5hours
% Weight Loss of Carrier Fluid @ RT
Carrierfluidevaporationvtimeinopenair@25˚Cfora20mmX20mm,10milsample
% Weight Loss of Carrier Fluid @ 50˚C
Carrierfluidevaporationvtimeinopenair@50˚Cfora20mmX20mm,10milsample
*Dry time may vary depending on environment temperature and ventilation conditions
Suggested Measurement of Dried LTM6300-SP Thickness
Rework of LTM6300-SP• IfreworkisrequiredsimplyremoveLTM6300-SPfromtheheatsinksurfaceanduseanappropriatecleaningsol-ventsuchasacetone,IPAortoluenetoremoveanyresidue
• Solventcanbeappliedtosoftenandremovethedriedapplications.Ahardplasticedgemaybeappliedtoassisttheremovalofdriedapplicationaswell
• ReapplyLTM6300-SPonthenewlycleanedsurface
1. Zero the drop gauge reading on application surface (e.g. heat sink)
2. Measure the LTM layer thickness
Dry LTM
Flat Tip
Although all statements and information contained herein are believed to beaccurateandreliable,theyarepresentedwithoutguaranteeorwarrantyofanykind,expressorimplied.Informationprovidedhereindoesnotrelievetheuserfromtheresponsibilityofcarryingout itsowntestsandexperiments,andtheuser assumes all risks and liability for use of the information and resultsobtained.Statementsorsuggestionsconcerningtheuseofmaterialsandpro-cessesaremadewithoutrepresentationorwarrantythatanysuchuseisfreeofpatent infringementandarenotrecommendationsto infringeanypatent.Theusershouldnotassumethatalltoxicitydataandsafetymeasuresareindicatedhereinorthatothermeasuresmaynotberequired. TB1470310Rev2©2010HoneywellInternationalInc.
Honeywell Electronic Materials
Customer&TechnicalSupport
Hotline:509-252-2102
Fax:509-252-8617
www.honeywell.com/sm/em
86-21-50203266
WORLDWIDE DEVELOPMENT, MANUFACTURING AND SUPPORT
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Morristown, New Jersey
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Asia Shanghai, China Jincheon, Korea Tokyo, Japan Yaita, Japan Chonburi, Thailand Hsinchu, Taiwan Singapore
E
EE
E Research & Development Site Manufacturing Site N Support Site
Although all statements and information contained herein are believed to be accurate and reliable, they are presented without guarantee or warranty of any kind, express or implied. Information provided herein does not relieve the user from the responsibility of carrying out its own tests and experiments, and the user assumes all risks and liability for use of the information and results obtained. Statements or suggestions concerning the use of materials and pro-cesses are made without representation or warranty that any such use is free of patent infringement and are not recommendations to infringe any patent. The user should not assume that all toxicity data and safety measures are indicated herein or that other measures may not be required. August 2016 Rev1©2016 Honeywell International Inc.
Honeywell Electronic MaterialsUSA: 1-509-252-2102China:Germany: 49-5137-999-9199Japan: 81-3-6730-7092Korea: 82-2-3483-5076Singapore: 65-6580-3593Mail:www.electronicmaterials.com
HONEYWELL TIM ADVANTAGES
Quality• Industry-leading reliability over
device lifetime
• More than twenty years specializing in TIM materials R&D and manufac-turing
• Proprietary formulations optimized for the needs of specific applications
• Proven, long-standing supplier with multiple worldwide quality certifica-tions
Customer Focused• Serving diverse range of customers
• TIMs offered in both pad and paste formats for ease of application
• Superior global technical support
• Portfolio of other materials, such as thermal spreaders, electrical
interconnect and pure metals
Find out more by visiting: electronicmaterials.com