Thermal Analysis of Outer Tracker Modules and Rod

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Thermal Analysis of Outer Tracker Modules and Rod Susanne Kyre UCSB 2/8/2010 1 Susanne Kyre UCSB

description

Thermal Analysis of Outer Tracker Modules and Rod. Susanne Kyre UCSB. TK Module design parameters from Nov 2009 TUPO presentation by Hans Postema. 2.5 cm strip length Sensor glued on 2 TPG strips TPG strips on the backplane side TPG strips connected to cooling block on cooling pipe - PowerPoint PPT Presentation

Transcript of Thermal Analysis of Outer Tracker Modules and Rod

Page 1: Thermal Analysis of Outer Tracker Modules and Rod

Susanne Kyre UCSB 1

Thermal Analysis of Outer Tracker Modules and Rod

Susanne KyreUCSB

2/8/2010

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TK Module design parametersfrom Nov 2009 TUPO presentation by Hans Postema

• 2.5 cm strip length• Sensor glued on 2 TPG strips• TPG strips on the backplane

side• TPG strips connected to

cooling block on cooling pipe• Hybrid with apv’s glued on

sensor, strip side, above the TPG strip

• DC-DC converter glued on the TPG strip of the sensor.

• One DC-DC converter powers 2 hybrids

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Dimensions and MaterialsPart Material Area [mm2] Thickness [mm]

thermal conductivity [W/mK] Power [mW]

Sensor Silicon 84.5 x 100.3 0.2 148 310

Chip Silicon 10 x 12 0.2 148 125

DC-DC coil Silicon 12 x 12 9 148 225

Hybrid G10 and copper85 x 14

107 x 30 (ears) 0.830.8 in plane;

0.37 out of plane

Support strip TPG 116 x 14 11500 in plane; 20 out of plane

Epoxythermally conductive

epoxy all glue joints .05 1.5

Cooling Block Beryllium Oxide13.5 x 14

1.7mm cooling tube dia. 4 248

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Module FEA

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Result of steady state thermal analysisMaximum Temperature: -27.0°C (at center readout chips on hybrid #2)

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Result of steady state thermal analysisMaximum Sensor temperature: -28.3°C

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TK Rod design parameters• 12 Modules per rod (6 facing up, 6 facing down)• One cooling loop per rod• Cooling block temperature at inlet: -30°C• Cooling block temperature at outlet: -25°C• Sensor, DC-DC and Readout chip power as in Module analysis

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Cooling block temperatures• From Module analysis: Heat flux through cooling block-pipe

interface differs with cooling block location• • Assume: ΔT between cooling blocks is proportional to

difference in heat flux between cooling blocks

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mmmW 9.9

231 mmmW9.12

22 mmmW

24 1.11

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Rod FEA

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Result of steady state thermal analysisMaximum Temperature: -24.0°C at hybrid #2 on module closet to inlet/outlet

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Max. Temp

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Result of steady state thermal analysisMaximum Sensor temperature:-25.1°C at sensor closest to inlet/outletThis sensor also has the largest temperature gradient: 3.0°C across the sensor

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