The Introduction of High Thermal Conductivity CEM-3-09 HT...

Nanya Copper Clad Laminate

The Introduction of High Thermal Conductivity CEM-3-09 HT and CEM-3-01 HC (Halogen free)

NAN YA PLASTICS CORP.

ELECTRONIC MATERIALS DIV. COPPER CLAD LAMINATES DEPT.

TAIWAN, R.O.C.

Nanya Copper Clad Laminate Content 1.Development concept 2.The Comparison of Performance for CEM-3-09 and CEM-3-01 HC 3. The Comparison of Surface Temperature Simulation 4.Application of CEM-3-09 and CEM-3-01 HC 5.Conclusion

CEM-3-09 / CEM-3-01 HC Structure


1.Development purpose

*High-Thermal Conductive ( For ASTM E-1461 ) : 2.0W/m.K ( For ASTM D-5470 ) : 1.0W/m.K

*Comparative tracking index (CTI) : More than CTI 600V

*Coefficient of thermal expansion of X and Y : under 20 ppm


2.Performance Summary

Items UNIT CEM-3-09 CEM-3-01 HC CEM-3-98 A社

Thermal Conductivity W/mK 2.0 2.0 0.94 2.0

Resistivity MΩ 3.0*10^8 2.8*10^8 5.0*10^8 2.8*10^8

Tg (DSC) ℃ 130-140 110-120 125-135 125-135

CTE

X-axis

ppm/℃

16 16 24 21

Y-axis 18 18 28 23

Z-axis 22/215 22/215 65/350 30/230

Solder resistance

(PCT*240min+260℃) sec 300 ↑ 300 ↑ 300 ↑ 180-220

Permittivity (1 MHz) -- 5.1 5.1 4.50 5.1

Loss Tangent (1 MHz) -- 0.018 0.018 0.020 0.018

Comparative tracking

index V 600≦ 600 ≦ 600 ≦ 600 ≦

Punchability -- ☆ ☆ ☆ △ Flammability UL94V0 UL94 VO UL94VO UL94V0 UL94V0

☆ : Suitable △ : Acceptable X : Not Suitable Note. The process of TMA measurement (CTE) show as Appendix.2


A. Thermal properties

Characteristice Unit Conditioning SPEC CEM-3-09 CEM-3-01 HC

Thermal conductivity W/m.K ASTM

E-1461 2.0 2.0 2.0

A-288℃ Dipping -- 30-60” 30-60”

A-260℃ Dipping 20”↑ 300”↑ 300”↑

Solder heat resistance

sec PCT*4hr+ 260℃ Dipping -- 300”↑ 300”↑

DSC N/A 134-140 110-120 Glass transition temp ℃

TMA E-2/105

N/A 130 110

X α1= 17 16

Y α1= 18 18 CTE

Z

μm/m℃ E-2/105 N/A

α1/α2= 30/210 30/212

Note1.The average value in the table refers to samles of .062” 1/1 ,Test method per IPC-TM-650 2.Thermal conductivity test by Laser Flash LFA-447 Modify ASTM E-1461 as appendix1. 3.CEM-3-09 and CEM-3-01 HC will possibility increase the reliability of improvement in through-hole ,because lower thermal expansion will decrease the crack generated by thermal stress


B: Electrical properties

Characteristice Unit Condition

ing SPEC CEM-3-09 CEM-3-01 HC

Volume resistivity MΩ-cm C-96/35/90 10^6↑ 3.2*10^9 2.0*10^9

Surface resistivity MΩ C-96/35/90 10^4↑ 3.0*10^8 2.8*10^8

Permittivity (1MHZ) - C-24/23 5.4↓ 5.1 5.1

Dissipation factor(1MHZ) - D-24/23 0.035↓ 0.018 0.018

Dielectric breakdown KV D-48-50 40↑ 59 58


C. Physical & Mechanical properties


Moisture absorption % E-1/105 +

D-24/23 0.30↓ 0.10-0.13 0.10-0.13

Flammability - C-24/23/50 + E24/125 94V0 94V0 94V0

Peel strength (1oz) lb/in 288℃*10” solder float 7↑ 9-11 9-11

Bow&Twist(avg) % (150℃*15’+cooling*5’) *4cycle 1%↓ 0.2-0.40 0.2-0.40

LW A 242↑ 350 360 Flexural strength

CW N/mm2

A 172↑ 250 265


D. Punchability and CTI


MD 1150 1250 Punchability

CD Kg/cm2

Shear strength

ASTM D-732 N/A

1050 1160

Comparative tracking index voltage ASTM D-3638 N/A 600↑ 600↑

Note1.CEM-3-09 Punch condition and quality is similar to conventional CEM-3(as CEM-3-98). 2.CEM-3-09 Punchability is better than R-1787 3. CTI test instrument as appendix1

Nanya Copper Clad Laminate E. Lead-Free Soldering

Note. CEM-3-09/CEM-3-01 HC all can pass through more than 10 times with above IR-Reflow condition


Name Size V mcd nm

Blue Power Chip(4P3N) 1mm*1mm 4.50 1138.5 461.65

Experimental samples : LED chip

Sample Size: 5cm * 5cm, width 3mm (space 2mm), edge with silver glue fixed on the copper line

5cm

5cm

4P3N + － + －

Zoom in Zoom in

3.The Comparison of Surface Temperature Simulation


82.43℃ 96.82℃

Conventional CEM-3 vs. Thermally Conductive CEM-3-09/CEM-3-01 HC(1.6mm)

The Comparison of Surface Temperature Simulation

LED Surface Equilibrium temperature effect Temperature Difference

14.4 ℃


4.Application of CEM-3-09 and CEM-3-01 HC


Appendix1.Installations

Sample

60℃ 60℃

d 1.5 mm

4 ± 0.2 mm

40 mm Platinum electrode

Ammonium Chloride ASTM 385 ± 5 Ω/cm

Thermal Conductivity Laser Flash LFA-447 (ASTM)

Comparative Tracking Index (IEC)


Appendix.2 Process of TMA measurement

TMA INSTRUMENT 1.Put sample on plate,probe touch sample.

2.Measure CTE before Tg & after Tg/delamination time.

sample

Probe


5.Conclusion 1.The performance of CEM-3-09 and CEM-3-01 HC are better than A-社 ,especial in Thermal conductivity ; solder heat resistance ;punchability and X/Y axis CTE.

The Introduction of High Thermal Conductivity CEM-3-09 HT...

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