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Transcript of The Evaluation and Development of an Efficient Cooling System for High Performance Computing...
The Evaluation and Development of an Efficient Cooling System for High Performance Computing Applications
Raaghul Senthilkumar and Ronik ShethCURENT, University of Tennessee
Final PresentationJuly 16, 2014
Knoxville, Tennessee
Research Goal
• Early models of Microsoft’s Xbox 360
suffered from such problems stemming
from an improperly designed cooling
scheme.
• The research goal was to evaluate the
cooling system of an Xbox 360 console
and to determine what caused the
console to fail.
3
Background
• Basic Understanding of Hardware
• Thermal Management
• Introduction to Red Ring of Death
4
Integrated Circuits
• A integrated circuit consists of
millions of transistors
• Transistors have two possible
states
6
Central Processing Unit (CPU)
7
• Xenon processorManufactured by IBM
Single Die
• Multi-Core ProcessorThree Cores
Two Threads
• 90 nm Process
Graphics Processing Units (GPU)
• Xenos Processor
Manufactured by AMD
Two Dies
eDRAM
Unified Shader Architecture
• 90 nm Process
• 48 Unified Shaders
Combined Pixel and Vertex Shaders
More Efficient
8
Heat Sinks
• Passive Cooling
• Transfers thermal waste to
the air
• Heat Pipes
• Surface Area
10
Figure 1: Heat SinksUpper Left: 1st Gen CPU; Upper Right: 2nd Gen CPU; Bottom Left: 1st Gen GPU; Bottom Right: 2nd Gen GPU
Intro To Red Ring of Death
• The infamous Red Ring of Death was
caused by flaws in the design of the
cooling scheme.
• Overheating weakened the soldering
connections underneath the chips
12
Methodology
• Different combinations of the heat sinks were then implemented to see
which combination keeps the Xbox 360 running without failure.
• Two different cooling fans were also used to see which fan kept
temperatures low.
• Thermal sensors were used to measure the temperature of the integrated
circuits.
13
Results
14
0 0.5 1 3 3.50
10
20
30
40
50
60
Heat of the Components Over Time with Standard Fans
2nd Generation GPU
1st Generation CPU
Time (minutes)
Temperature
(˚C)
Ends with Red Ring from Over-
heating
Results
15
0 0.5 1 5 8.5 1020
25
30
35
40
45
Heat of the CPU over Time with Improved Fans
1st Generation 2nd Generation
Time (minutes)
Temperature Plateau
(˚C)
Ends with Red Ring from Overheating
Results
16
0 0.5 1 5 7 10 15 20 250
10
20
30
40
50
60
70
Heat of the GPU over Time with Improved Fans
1st Generation 2nd Generation
Time (minutes)
Temperature
Plateau
(˚C)
2nd generation dissipates heat better
Discussions of Thermal Management
• The Xbox 360 manages thermal waste through a system of passive and
active cooling.
• When designing an effective cooling scheme, the implementation of an
efficient ventilation system is necessary. Ventilation enables the heat to be
transferred out from the device.
17
Results
18
FY06Q2 FY06Q3 FY06Q4 FY07Q1 FY07Q2 FY07Q3 FY07Q40
200
400
600
800
1000
1200
1400
Operating Loss (in millions)
Operating Loss (in millions)
Fiscal Quarter
$1.06 billion warrantyextension
Discussion of Economics
• The liabilities stemming from the repairs of Xbox 360 would lower the
profitability of the Xbox 360.
• A properly designed cooling scheme increases would have allowed for
more powerful chips.
• By shortening the “Time to Market”, they were able to reach the market
before the Playstation 3 and keep the cost of development lower.
19
References
• http://www.dailytech.com/New+Xbox+360+Cooling+Hardware+Found+in+Europe/article7667.htm
• http://www.dailytech.com/Microsoft+Insider+Xbox+360+Team+Knowingly+Launched+Faulty+Hardware/article10434.htm
• http://www.ibtimes.com/ps4-vs-xbox-one-ps4-9-million-sold-microsoft-responds-sonys-success-1622396
• http://www.microsoft.com/investor/EarningsAndFinancials/Earnings/PressReleaseAndWebcast/FY14/Q3/default.aspx
• http://techreport.com/news/13974/microsoft-insider-xbox-360-was-rushed-to-market
• http://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=1624324&queryText%3Dxbox+360
• Jeff
20
Acknowledgements
21
Thanks to Terence Randall, Chris Crowder, and Dr. Kamrul Islam
This work was supported primarily by the Engineering Research Center
Program of the National Science Foundation and the Department of Energy
under NSF Award Number EEC-1041877 and the CURENT Industry Partnership
Program.